TWI824051B - 偏光性光學功能薄膜積層體之雷射切割加工方法 - Google Patents
偏光性光學功能薄膜積層體之雷射切割加工方法 Download PDFInfo
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- TWI824051B TWI824051B TW108139648A TW108139648A TWI824051B TW I824051 B TWI824051 B TW I824051B TW 108139648 A TW108139648 A TW 108139648A TW 108139648 A TW108139648 A TW 108139648A TW I824051 B TWI824051 B TW I824051B
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- Prior art keywords
- polarizing
- film
- laser
- optical functional
- functional film
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- OLSOUGWNONTDCK-UHFFFAOYSA-J tetrasodium 5-amino-3-[[4-[4-[(8-amino-1-hydroxy-3,6-disulfonatonaphthalen-2-yl)diazenyl]-3-methoxyphenyl]-2-methoxyphenyl]diazenyl]-4-hydroxynaphthalene-2,7-disulfonate Chemical compound [Na+].[Na+].[Na+].[Na+].C1=C(S([O-])(=O)=O)C=C2C=C(S([O-])(=O)=O)C(N=NC3=CC=C(C=C3OC)C=3C=C(C(=CC=3)N=NC=3C(=CC4=CC(=CC(N)=C4C=3O)S([O-])(=O)=O)S([O-])(=O)=O)OC)=C(O)C2=C1N OLSOUGWNONTDCK-UHFFFAOYSA-J 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018207452 | 2018-11-02 | ||
JP2018-207452 | 2018-11-02 |
Publications (2)
Publication Number | Publication Date |
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TW202106426A TW202106426A (zh) | 2021-02-16 |
TWI824051B true TWI824051B (zh) | 2023-12-01 |
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TW108139648A TWI824051B (zh) | 2018-11-02 | 2019-11-01 | 偏光性光學功能薄膜積層體之雷射切割加工方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7316297B2 (ja) |
KR (1) | KR102433467B1 (ja) |
CN (1) | CN112969939B (ja) |
TW (1) | TWI824051B (ja) |
WO (1) | WO2020091065A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20220149510A (ko) * | 2020-03-16 | 2022-11-08 | 수미토모 케미칼 컴퍼니 리미티드 | 적층 시트 및 그 제조 방법 |
KR20210125127A (ko) * | 2020-04-07 | 2021-10-18 | 삼성디스플레이 주식회사 | 전자 장치 제조 방법 및 전자 장치 |
JP7221256B2 (ja) * | 2020-09-14 | 2023-02-13 | 日東電工株式会社 | 偏光板、位相差層付偏光板、ならびに、該偏光板または該位相差層付偏光板を含む画像表示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10206633A (ja) * | 1997-01-22 | 1998-08-07 | Casio Comput Co Ltd | 偏光板およびその製造方法 |
US20090068598A1 (en) * | 2007-06-27 | 2009-03-12 | Sony Corporation | Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel |
JP2009294649A (ja) * | 2008-05-07 | 2009-12-17 | Nitto Denko Corp | 偏光板、およびその製造方法 |
TWI367353B (en) * | 2009-08-06 | 2012-07-01 | Sumitomo Chemical Co | Method for manufacturing polarizing plate |
WO2018190181A1 (ja) * | 2017-04-13 | 2018-10-18 | 日東電工株式会社 | 画像表示装置の製造方法および画像表示装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2921345B2 (ja) | 1993-07-20 | 1999-07-19 | 株式会社大林組 | 橋桁のダンパー装置 |
JPH08146219A (ja) | 1994-11-25 | 1996-06-07 | Sekisui Chem Co Ltd | 反射偏光板 |
GB2402230B (en) * | 2003-05-30 | 2006-05-03 | Xsil Technology Ltd | Focusing an optical beam to two foci |
JP4690697B2 (ja) * | 2004-11-01 | 2011-06-01 | 古河電気工業株式会社 | 半導体チップの製造方法 |
JP2008073742A (ja) * | 2006-09-22 | 2008-04-03 | Nitto Denko Corp | 光学フィルムの切断方法及び光学フィルム |
JP2011022202A (ja) * | 2009-07-13 | 2011-02-03 | Sumitomo Chemical Co Ltd | 偏光板およびそれを用いた画像表示装置 |
JP5764430B2 (ja) * | 2011-08-22 | 2015-08-19 | 花王株式会社 | 積層体の製造方法 |
CN103212855B (zh) * | 2012-01-19 | 2016-02-24 | 昆山思拓机器有限公司 | 含同轴水射流结构的激光切割机 |
JP2015009250A (ja) * | 2013-06-27 | 2015-01-19 | 昭和電工株式会社 | レーザー加工方法 |
KR101817388B1 (ko) * | 2014-09-30 | 2018-01-10 | 주식회사 엘지화학 | 편광판의 절단 방법 및 이를 이용하여 절단된 편광판 |
CA2957234C (en) * | 2016-02-12 | 2020-12-15 | Kondex Corporation | Laser clad cutting edge for agricultural cutting components |
KR20170098569A (ko) * | 2016-02-22 | 2017-08-30 | 주식회사 엘지화학 | 편광필름 및 그 제조방법 |
JP6887759B2 (ja) | 2016-05-17 | 2021-06-16 | 日東電工株式会社 | 光学積層体、ならびに該光学積層体を用いた光学フィルム片の製造方法 |
JP6899721B2 (ja) | 2016-07-22 | 2021-07-07 | 日東電工株式会社 | 偏光板の製造方法およびその製造装置 |
-
2019
- 2019-11-01 TW TW108139648A patent/TWI824051B/zh active
- 2019-11-01 KR KR1020217013601A patent/KR102433467B1/ko active IP Right Grant
- 2019-11-01 WO PCT/JP2019/043124 patent/WO2020091065A1/ja active Application Filing
- 2019-11-01 CN CN201980071904.4A patent/CN112969939B/zh active Active
- 2019-11-01 JP JP2020554989A patent/JP7316297B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10206633A (ja) * | 1997-01-22 | 1998-08-07 | Casio Comput Co Ltd | 偏光板およびその製造方法 |
US20090068598A1 (en) * | 2007-06-27 | 2009-03-12 | Sony Corporation | Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel |
JP2009294649A (ja) * | 2008-05-07 | 2009-12-17 | Nitto Denko Corp | 偏光板、およびその製造方法 |
TWI367353B (en) * | 2009-08-06 | 2012-07-01 | Sumitomo Chemical Co | Method for manufacturing polarizing plate |
WO2018190181A1 (ja) * | 2017-04-13 | 2018-10-18 | 日東電工株式会社 | 画像表示装置の製造方法および画像表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112969939A (zh) | 2021-06-15 |
WO2020091065A1 (ja) | 2020-05-07 |
KR20210066909A (ko) | 2021-06-07 |
KR102433467B1 (ko) | 2022-08-18 |
JPWO2020091065A1 (ja) | 2021-10-07 |
CN112969939B (zh) | 2022-09-30 |
JP7316297B2 (ja) | 2023-07-27 |
TW202106426A (zh) | 2021-02-16 |
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