TWI824051B - 偏光性光學功能薄膜積層體之雷射切割加工方法 - Google Patents

偏光性光學功能薄膜積層體之雷射切割加工方法 Download PDF

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Publication number
TWI824051B
TWI824051B TW108139648A TW108139648A TWI824051B TW I824051 B TWI824051 B TW I824051B TW 108139648 A TW108139648 A TW 108139648A TW 108139648 A TW108139648 A TW 108139648A TW I824051 B TWI824051 B TW I824051B
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TW
Taiwan
Prior art keywords
polarizing
film
laser
optical functional
functional film
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TW108139648A
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English (en)
Chinese (zh)
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TW202106426A (zh
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日商日東電工股份有限公司
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Publication of TW202106426A publication Critical patent/TW202106426A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
TW108139648A 2018-11-02 2019-11-01 偏光性光學功能薄膜積層體之雷射切割加工方法 TWI824051B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018207452 2018-11-02
JP2018-207452 2018-11-02

Publications (2)

Publication Number Publication Date
TW202106426A TW202106426A (zh) 2021-02-16
TWI824051B true TWI824051B (zh) 2023-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139648A TWI824051B (zh) 2018-11-02 2019-11-01 偏光性光學功能薄膜積層體之雷射切割加工方法

Country Status (5)

Country Link
JP (1) JP7316297B2 (ja)
KR (1) KR102433467B1 (ja)
CN (1) CN112969939B (ja)
TW (1) TWI824051B (ja)
WO (1) WO2020091065A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220149510A (ko) * 2020-03-16 2022-11-08 수미토모 케미칼 컴퍼니 리미티드 적층 시트 및 그 제조 방법
KR20210125127A (ko) * 2020-04-07 2021-10-18 삼성디스플레이 주식회사 전자 장치 제조 방법 및 전자 장치
JP7221256B2 (ja) * 2020-09-14 2023-02-13 日東電工株式会社 偏光板、位相差層付偏光板、ならびに、該偏光板または該位相差層付偏光板を含む画像表示装置

Citations (5)

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JPH10206633A (ja) * 1997-01-22 1998-08-07 Casio Comput Co Ltd 偏光板およびその製造方法
US20090068598A1 (en) * 2007-06-27 2009-03-12 Sony Corporation Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel
JP2009294649A (ja) * 2008-05-07 2009-12-17 Nitto Denko Corp 偏光板、およびその製造方法
TWI367353B (en) * 2009-08-06 2012-07-01 Sumitomo Chemical Co Method for manufacturing polarizing plate
WO2018190181A1 (ja) * 2017-04-13 2018-10-18 日東電工株式会社 画像表示装置の製造方法および画像表示装置

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JP2921345B2 (ja) 1993-07-20 1999-07-19 株式会社大林組 橋桁のダンパー装置
JPH08146219A (ja) 1994-11-25 1996-06-07 Sekisui Chem Co Ltd 反射偏光板
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
JP4690697B2 (ja) * 2004-11-01 2011-06-01 古河電気工業株式会社 半導体チップの製造方法
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
JP2011022202A (ja) * 2009-07-13 2011-02-03 Sumitomo Chemical Co Ltd 偏光板およびそれを用いた画像表示装置
JP5764430B2 (ja) * 2011-08-22 2015-08-19 花王株式会社 積層体の製造方法
CN103212855B (zh) * 2012-01-19 2016-02-24 昆山思拓机器有限公司 含同轴水射流结构的激光切割机
JP2015009250A (ja) * 2013-06-27 2015-01-19 昭和電工株式会社 レーザー加工方法
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
CA2957234C (en) * 2016-02-12 2020-12-15 Kondex Corporation Laser clad cutting edge for agricultural cutting components
KR20170098569A (ko) * 2016-02-22 2017-08-30 주식회사 엘지화학 편광필름 및 그 제조방법
JP6887759B2 (ja) 2016-05-17 2021-06-16 日東電工株式会社 光学積層体、ならびに該光学積層体を用いた光学フィルム片の製造方法
JP6899721B2 (ja) 2016-07-22 2021-07-07 日東電工株式会社 偏光板の製造方法およびその製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10206633A (ja) * 1997-01-22 1998-08-07 Casio Comput Co Ltd 偏光板およびその製造方法
US20090068598A1 (en) * 2007-06-27 2009-03-12 Sony Corporation Laser processing apparatus and laser processing method, debris collection mechanism and debris collection method, and method for producing display panel
JP2009294649A (ja) * 2008-05-07 2009-12-17 Nitto Denko Corp 偏光板、およびその製造方法
TWI367353B (en) * 2009-08-06 2012-07-01 Sumitomo Chemical Co Method for manufacturing polarizing plate
WO2018190181A1 (ja) * 2017-04-13 2018-10-18 日東電工株式会社 画像表示装置の製造方法および画像表示装置

Also Published As

Publication number Publication date
CN112969939A (zh) 2021-06-15
WO2020091065A1 (ja) 2020-05-07
KR20210066909A (ko) 2021-06-07
KR102433467B1 (ko) 2022-08-18
JPWO2020091065A1 (ja) 2021-10-07
CN112969939B (zh) 2022-09-30
JP7316297B2 (ja) 2023-07-27
TW202106426A (zh) 2021-02-16

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