CN1129648C - 用于环氧固化体系的潜伏催化剂 - Google Patents

用于环氧固化体系的潜伏催化剂 Download PDF

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Publication number
CN1129648C
CN1129648C CN98802989A CN98802989A CN1129648C CN 1129648 C CN1129648 C CN 1129648C CN 98802989 A CN98802989 A CN 98802989A CN 98802989 A CN98802989 A CN 98802989A CN 1129648 C CN1129648 C CN 1129648C
Authority
CN
China
Prior art keywords
epoxy resin
composition according
acid
resin composition
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN98802989A
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English (en)
Chinese (zh)
Other versions
CN1249772A (zh
Inventor
J·甘
J·P·埃弗雷特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Blue Cube IP LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26310844&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1129648(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GBGB9701294.2A external-priority patent/GB9701294D0/en
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Publication of CN1249772A publication Critical patent/CN1249772A/zh
Application granted granted Critical
Publication of CN1129648C publication Critical patent/CN1129648C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN98802989A 1997-01-21 1998-01-20 用于环氧固化体系的潜伏催化剂 Expired - Lifetime CN1129648C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3594897P 1997-01-21 1997-01-21
US60/035,948 1997-01-21
GBGB9701294.2A GB9701294D0 (en) 1997-01-22 1997-01-22 Latent catalysts for epoxy curing systems
GB9701294.2 1997-01-22

Publications (2)

Publication Number Publication Date
CN1249772A CN1249772A (zh) 2000-04-05
CN1129648C true CN1129648C (zh) 2003-12-03

Family

ID=26310844

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98802989A Expired - Lifetime CN1129648C (zh) 1997-01-21 1998-01-20 用于环氧固化体系的潜伏催化剂

Country Status (9)

Country Link
EP (1) EP0954553B2 (enExample)
JP (1) JP4080546B2 (enExample)
KR (1) KR100569617B1 (enExample)
CN (1) CN1129648C (enExample)
AT (1) ATE273348T1 (enExample)
DE (1) DE69825561T3 (enExample)
MY (1) MY128727A (enExample)
TW (1) TW503246B (enExample)
WO (1) WO1998031750A1 (enExample)

Cited By (1)

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CN101341181B (zh) * 2005-12-22 2013-09-04 陶氏环球技术有限责任公司 可固化环氧树脂组合物及由其制造的层压材料

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JP5485487B2 (ja) * 1999-12-13 2014-05-07 ダウ グローバル テクノロジーズ エルエルシー 難燃性リン元素含有エポキシ樹脂組成物
US6641923B2 (en) 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
US6617400B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
EP1418206B1 (de) * 2002-10-19 2004-10-13 LEUNA-Harze GmbH Härtbare Epoxidharzzusammensetzung
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
CN103554184A (zh) 2004-05-28 2014-02-05 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
KR100970020B1 (ko) * 2005-09-27 2010-07-16 스미토모 베이클리트 컴퍼니 리미티드 잠복성 촉매의 제조 방법 및 에폭시 수지 조성물
RU2470954C2 (ru) * 2007-06-11 2012-12-27 Басф Се Катализатор для отверждения эпоксидов
US9018321B2 (en) 2007-07-26 2015-04-28 Ajinomoto Co., Inc. Resin composition
JP5144572B2 (ja) * 2009-03-26 2013-02-13 太陽ホールディングス株式会社 熱硬化性樹脂組成物
SG176923A1 (en) * 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
US8980376B2 (en) 2009-11-06 2015-03-17 Dow Global Technologies Llc Storage stable epoxy resin compositions for electrical laminates
CN102031082B (zh) * 2010-12-10 2013-04-03 东华大学 苯并咪唑二胺固化型环氧胶粘剂及其制备方法
EP2705090A1 (en) * 2011-05-02 2014-03-12 Dow Global Technologies LLC Trimethyl borate in epoxy resins
EP2814802B1 (en) * 2012-02-17 2020-12-16 Huntsman Advanced Materials Americas LLC Mixture of benzoxazine, epoxy and anhydride
DK2695903T3 (en) * 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
DK2695727T3 (en) 2012-08-08 2018-02-12 Siemens Ag Process for accelerating the curing process in resino overflow systems for use in casting processes and resino overflow containers
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
US11550220B2 (en) 2019-10-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Negative tone photoresist for EUV lithography
CN113278251A (zh) * 2021-04-26 2021-08-20 厦门理工学院 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备
DE102024103231A1 (de) 2024-02-06 2025-08-07 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung und dafür geeignete Härtersysteme
CN119285906B (zh) * 2024-10-25 2025-10-14 厦门艾贝森电子有限公司 一种生物质阻燃环氧电子封装材料及其制备方法
CN119661811A (zh) * 2024-12-02 2025-03-21 江南大学 基于酸酐-叔胺动态离子对潜伏型促进剂及其制法和用途

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US3732332A (en) † 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3997499A (en) * 1974-08-29 1976-12-14 Gulf Oil Corporation Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
US4873273A (en) * 1986-03-20 1989-10-10 James River-Norwalk, Inc. Epoxide coating composition
JPH072829B2 (ja) † 1987-11-04 1995-01-18 株式会社日立製作所 積層板
ATE143986T1 (de) * 1988-02-12 1996-10-15 Dow Chemical Co Verwendung eines katalysators für epoxyharz- zusammensetzungen
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
EP0458502B1 (en) † 1990-05-21 2003-06-18 Dow Global Technologies Inc. Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
ZA913801B (en) * 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
EP0729484B1 (en) † 1993-11-02 2000-03-01 The Dow Chemical Company Cure inhibited epoxy resin compositions and laminates prepared from the compositions
CN1062874C (zh) † 1994-09-08 2001-03-07 阿克佐诺贝尔公司 含有烯属不饱和酸酐和乙烯系化合物的共聚物的含烯丙基环氧树脂组合物
GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341181B (zh) * 2005-12-22 2013-09-04 陶氏环球技术有限责任公司 可固化环氧树脂组合物及由其制造的层压材料

Also Published As

Publication number Publication date
DE69825561D1 (de) 2004-09-16
EP0954553B2 (en) 2008-12-10
MY128727A (en) 2007-02-28
KR20000070360A (ko) 2000-11-25
KR100569617B1 (ko) 2006-04-11
DE69825561T2 (de) 2005-08-11
WO1998031750A1 (en) 1998-07-23
CN1249772A (zh) 2000-04-05
JP2001508828A (ja) 2001-07-03
EP0954553A1 (en) 1999-11-10
HK1023586A1 (en) 2000-09-15
EP0954553B1 (en) 2004-08-11
DE69825561T3 (de) 2009-07-09
ATE273348T1 (de) 2004-08-15
TW503246B (en) 2002-09-21
JP4080546B2 (ja) 2008-04-23

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Patentee after: Blue cube IP LLC

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CX01 Expiry of patent term

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