CN112823448B - 连接体的制备方法、各向异性接合薄膜、连接体 - Google Patents

连接体的制备方法、各向异性接合薄膜、连接体 Download PDF

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Publication number
CN112823448B
CN112823448B CN201980068452.4A CN201980068452A CN112823448B CN 112823448 B CN112823448 B CN 112823448B CN 201980068452 A CN201980068452 A CN 201980068452A CN 112823448 B CN112823448 B CN 112823448B
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China
Prior art keywords
anisotropic bonding
anisotropic
resin
bonding film
solid
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CN201980068452.4A
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Chinese (zh)
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CN112823448A (zh
Inventor
石松朋之
阿部智幸
青木正治
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Dexerials Corp
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Dexerials Corp
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Priority claimed from PCT/JP2019/042035 external-priority patent/WO2020090684A1/ja
Publication of CN112823448A publication Critical patent/CN112823448A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
CN201980068452.4A 2018-10-31 2019-10-25 连接体的制备方法、各向异性接合薄膜、连接体 Active CN112823448B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018206058 2018-10-31
JP2018-206058 2018-10-31
PCT/JP2019/042035 WO2020090684A1 (ja) 2018-10-31 2019-10-25 接続体の製造方法、異方性接合フィルム、接続体

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CN112823448A CN112823448A (zh) 2021-05-18
CN112823448B true CN112823448B (zh) 2023-05-23

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JP (2) JP6898413B2 (https=)
KR (1) KR102568476B1 (https=)
CN (1) CN112823448B (https=)
TW (1) TWI843762B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6966659B1 (ja) * 2020-06-05 2021-11-17 デクセリアルズ株式会社 スマートカードの製造方法、スマートカード、及び導電粒子含有ホットメルト接着シート
EP3975049B1 (en) * 2020-06-05 2025-09-03 Dexerials Corporation Production method for smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
KR20250117484A (ko) 2020-10-29 2025-08-04 데쿠세리아루즈 가부시키가이샤 도전성 접착제, 이방성 도전 필름, 접속 구조체, 및 접속 구조체의 제조 방법
CN113555473B (zh) * 2021-07-27 2022-10-11 深圳市思坦科技有限公司 Micro-LED芯片巨量转移方法与系统、以及显示装置
CN116072693A (zh) * 2021-10-29 2023-05-05 重庆康佳光电技术研究院有限公司 导电复合材料、led芯片的键合方法、电路形成方法
JP2023143317A (ja) * 2022-03-25 2023-10-06 味の素株式会社 樹脂組成物および熱硬化型接着シート
JP2024022788A (ja) * 2022-08-08 2024-02-21 積水化学工業株式会社 導電ペースト、導電ペーストの製造方法及び接続構造体
KR102883043B1 (ko) 2023-03-26 2025-11-07 삼성에스디아이 주식회사 배터리 팩
WO2025070620A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法
WO2025070619A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、接合シート、導電性樹脂組成物の製造方法、接合体の製造方法、および、接合体
WO2025070621A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0265212A1 (en) * 1986-10-18 1988-04-27 Japan Synthetic Rubber Co., Ltd. Electroconductive particles and electroconductive adhesive containing said particles

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JP3856233B2 (ja) * 2003-10-15 2006-12-13 日立化成工業株式会社 電極の接続方法
JP2007053187A (ja) * 2005-08-17 2007-03-01 Sumitomo Chemical Co Ltd フレキシブルプリント配線板用金属張積層板及びフレキシブルプリント配線基板
JP4699189B2 (ja) * 2005-12-01 2011-06-08 日東電工株式会社 半導体装置の製造方法及び電子部品
JP4890053B2 (ja) * 2006-03-02 2012-03-07 旭化成イーマテリアルズ株式会社 微細回路検査用異方導電性フィルム
CN101501154B (zh) * 2006-08-25 2013-05-15 住友电木株式会社 粘合带、接合体和半导体封装件
CN103351829A (zh) * 2007-09-05 2013-10-16 日立化成株式会社 粘接剂以及使用该粘接剂的连接结构体
JP5032938B2 (ja) 2007-10-24 2012-09-26 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
CN101897245B (zh) * 2007-12-17 2013-03-13 日立化成工业株式会社 电路连接材料及电路部件的连接结构
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP2011231146A (ja) * 2010-04-23 2011-11-17 Asahi Kasei E-Materials Corp 異方導電性フィルム
JP5297418B2 (ja) * 2010-06-21 2013-09-25 デクセリアルズ株式会社 異方性導電材料及びその製造方法、並びに実装体及びその製造方法
JP2015167106A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 異方導電性フィルム及び接続構造体
JP2017097974A (ja) * 2015-11-18 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、電子部品の接続方法、及び接続構造体の製造方法
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム

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EP0265212A1 (en) * 1986-10-18 1988-04-27 Japan Synthetic Rubber Co., Ltd. Electroconductive particles and electroconductive adhesive containing said particles

Also Published As

Publication number Publication date
JP2021180311A (ja) 2021-11-18
JP2020077870A (ja) 2020-05-21
CN112823448A (zh) 2021-05-18
JP7420764B2 (ja) 2024-01-23
JP6898413B2 (ja) 2021-07-07
TWI843762B (zh) 2024-06-01
KR20210043655A (ko) 2021-04-21
KR102568476B1 (ko) 2023-08-18
TW202035636A (zh) 2020-10-01

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