CN112820718B - 用于获取高温工艺应用中的测量参数的封装仪器化衬底设备 - Google Patents

用于获取高温工艺应用中的测量参数的封装仪器化衬底设备 Download PDF

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Publication number
CN112820718B
CN112820718B CN202011626182.5A CN202011626182A CN112820718B CN 112820718 B CN112820718 B CN 112820718B CN 202011626182 A CN202011626182 A CN 202011626182A CN 112820718 B CN112820718 B CN 112820718B
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substrate
assembly
enclosure
envelope
sensors
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Chinese (zh)
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CN112820718A (zh
Inventor
梅·孙
厄尔·詹森
景·周
刘冉
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KLA Corp
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KLA Tencor Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

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  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
CN202011626182.5A 2016-06-15 2017-06-14 用于获取高温工艺应用中的测量参数的封装仪器化衬底设备 Active CN112820718B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662350688P 2016-06-15 2016-06-15
US62/350,688 2016-06-15
US15/277,792 2016-09-27
US15/277,792 US10460966B2 (en) 2016-06-15 2016-09-27 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
CN201780034833.1A CN109314066B (zh) 2016-06-15 2017-06-14 用于获取高温工艺应用中的测量参数的封装仪器化衬底设备
PCT/US2017/037548 WO2017218701A1 (en) 2016-06-15 2017-06-14 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Related Parent Applications (1)

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Publications (2)

Publication Number Publication Date
CN112820718A CN112820718A (zh) 2021-05-18
CN112820718B true CN112820718B (zh) 2024-12-20

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CN201780034833.1A Active CN109314066B (zh) 2016-06-15 2017-06-14 用于获取高温工艺应用中的测量参数的封装仪器化衬底设备

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Country Status (7)

Country Link
US (2) US10460966B2 (https=)
JP (2) JP6920357B2 (https=)
KR (1) KR102446462B1 (https=)
CN (2) CN112820718B (https=)
SG (1) SG11201807420YA (https=)
TW (1) TWI751172B (https=)
WO (1) WO2017218701A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10460966B2 (en) 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
US20180366354A1 (en) 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
US10900843B2 (en) * 2018-06-05 2021-01-26 Kla Corporation In-situ temperature sensing substrate, system, and method
US10794681B2 (en) * 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11315811B2 (en) 2018-09-06 2022-04-26 Kla Corporation Process temperature measurement device fabrication techniques and methods of calibration and data interpolation of the same
KR102136466B1 (ko) * 2018-09-11 2020-07-22 주식회사 이큐셀 고온 공정 진단이 가능한 웨이퍼 센서
US11054317B2 (en) * 2018-09-28 2021-07-06 Applied Materials, Inc. Method and apparatus for direct measurement of chucking force on an electrostatic chuck
US12074044B2 (en) * 2018-11-14 2024-08-27 Cyberoptics Corporation Wafer-like sensor
US11636948B2 (en) 2019-05-21 2023-04-25 Q Med Innovations, Inc. Instrument kit tracking system
KR102438344B1 (ko) * 2019-10-14 2022-09-01 세메스 주식회사 웨이퍼형 센서 유닛 및 웨이퍼형 센서 유닛의 제조 방법
KR102382971B1 (ko) * 2019-11-05 2022-04-05 이트론 주식회사 반도체 공정 진단을 위한 온도 센서 장치 및 이의 제조 방법
US11668601B2 (en) 2020-02-24 2023-06-06 Kla Corporation Instrumented substrate apparatus
US11589474B2 (en) 2020-06-02 2023-02-21 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US11924972B2 (en) 2020-06-02 2024-03-05 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US20220223441A1 (en) * 2021-01-08 2022-07-14 Kla Corporation Process condition sensing apparatus
US11688614B2 (en) * 2021-04-28 2023-06-27 Kla Corporation Mitigating thermal expansion mismatch in temperature probe construction apparatus and method
US12535363B2 (en) * 2022-07-28 2026-01-27 Applied Materials, Inc. Radical sensor substrate
CN115399913B (zh) * 2022-09-16 2024-05-03 复旦大学附属中山医院 一种高灵敏度柔性人工智能皮肤及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208249A (ja) * 2005-12-13 2007-08-16 Sensarray Corp 処理条件検知ウェハおよびデータ分析システム
JP2012163525A (ja) * 2011-02-09 2012-08-30 Sumitomo Heavy Ind Ltd 温度測定器、成膜装置、及び成膜基板製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1238898A (zh) * 1996-12-06 1999-12-15 康宁股份有限公司 温度敏感平面光学元件的包装
WO1998024695A2 (en) 1996-12-06 1998-06-11 Corning Incorporated Package for temperature-sensitive planar optical components
US6889568B2 (en) 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7757574B2 (en) * 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
US6915589B2 (en) 2003-10-16 2005-07-12 Sensarray Corporation Sensor positioning systems and methods
KR101237782B1 (ko) * 2004-07-10 2013-02-28 온웨이퍼 테크놀로지즈 인코포레이티드 왜곡이 적은 파라미터측정을 위한 방법 및 장치
US7181972B2 (en) * 2004-12-27 2007-02-27 General Electric Company Static and dynamic pressure sensor
JP4809179B2 (ja) * 2005-10-20 2011-11-09 日本碍子株式会社 温度計測用断熱容器
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
US7555948B2 (en) * 2006-05-01 2009-07-07 Lynn Karl Wiese Process condition measuring device with shielding
US7540188B2 (en) 2006-05-01 2009-06-02 Lynn Karl Wiese Process condition measuring device with shielding
US7875812B2 (en) 2008-07-31 2011-01-25 Ge Aviation Systems, Llc Method and apparatus for electrical component physical protection
JP2010229498A (ja) * 2009-03-27 2010-10-14 Shindengen Electric Mfg Co Ltd 温度測定装置、薄膜形成装置、温度測定方法及び半導体装置
TWI391067B (zh) * 2009-08-27 2013-03-21 Taiflex Scient Co Ltd Thermally conductive substrate for electronic component with low thermal resistance, low thermal expansion coefficient and high electrical reliability and manufacturing method thereof
US8889021B2 (en) * 2010-01-21 2014-11-18 Kla-Tencor Corporation Process condition sensing device and method for plasma chamber
JP5533597B2 (ja) * 2010-11-25 2014-06-25 トヨタ自動車株式会社 温度測定装置
JP5712975B2 (ja) * 2012-07-06 2015-05-07 東京エレクトロン株式会社 計測用基板、基板処理装置及び基板処理装置の運転方法
JP2014232668A (ja) * 2013-05-29 2014-12-11 パナソニック株式会社 接点装置、電磁継電器および接点装置の製造方法
CN105358949B (zh) * 2013-05-30 2018-03-02 科磊股份有限公司 用于测量热通量的方法及系统
US9760132B2 (en) * 2013-09-19 2017-09-12 Nvidia Corporation Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
US9642566B2 (en) * 2013-10-04 2017-05-09 General Electric Company Flexible embedded sensor arrays and methods of making the same
ES2930234T3 (es) * 2014-09-17 2022-12-09 Ste Ind S R L Dispositivo y método de transmisión para la transmisión inalámbrica de parámetros medidos
US11150140B2 (en) 2016-02-02 2021-10-19 Kla Corporation Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
US10460966B2 (en) 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007208249A (ja) * 2005-12-13 2007-08-16 Sensarray Corp 処理条件検知ウェハおよびデータ分析システム
JP2012163525A (ja) * 2011-02-09 2012-08-30 Sumitomo Heavy Ind Ltd 温度測定器、成膜装置、及び成膜基板製造方法

Also Published As

Publication number Publication date
TW201810479A (zh) 2018-03-16
CN109314066A (zh) 2019-02-05
US11823925B2 (en) 2023-11-21
US20200203200A1 (en) 2020-06-25
JP7194786B2 (ja) 2022-12-22
TWI751172B (zh) 2022-01-01
CN112820718A (zh) 2021-05-18
US10460966B2 (en) 2019-10-29
JP2019523884A (ja) 2019-08-29
SG11201807420YA (en) 2018-12-28
CN109314066B (zh) 2021-01-15
WO2017218701A1 (en) 2017-12-21
KR20190008578A (ko) 2019-01-24
KR102446462B1 (ko) 2022-09-21
JP6920357B2 (ja) 2021-08-18
US20170365495A1 (en) 2017-12-21
JP2021170034A (ja) 2021-10-28

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