CN112714803B - 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 - Google Patents

不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 Download PDF

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CN112714803B
CN112714803B CN201980055803.8A CN201980055803A CN112714803B CN 112714803 B CN112714803 B CN 112714803B CN 201980055803 A CN201980055803 A CN 201980055803A CN 112714803 B CN112714803 B CN 112714803B
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electrolytic
cathode
anode
electroplating
electrolysis
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CN112714803A (zh
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叶涛
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201980055803.8A 2018-08-27 2019-08-05 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 Active CN112714803B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
CN201810987156 2018-08-27
CN2018109871561 2018-08-27
CN201811165873 2018-09-30
CN2018111658732 2018-09-30
CN201811304990 2018-11-02
CN2018113049902 2018-11-02
CN2019102915652 2019-04-12
CN201910291565 2019-04-12
PCT/CN2019/099192 WO2020042870A1 (fr) 2018-08-27 2019-08-05 Procédé et dispositif de production et de régénération de solution de placage pour électrodéposition de cuivre d'acide anodique insoluble

Publications (2)

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CN112714803A CN112714803A (zh) 2021-04-27
CN112714803B true CN112714803B (zh) 2022-11-08

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CN201980055803.8A Active CN112714803B (zh) 2018-08-27 2019-08-05 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置

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CN (1) CN112714803B (fr)
TW (1) TWI707067B (fr)
WO (1) WO2020042870A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113818055B (zh) * 2020-08-28 2023-06-06 叶涛 一种不溶性阳极的酸性电镀铜镀液或电镀补充液的成分调整方法及装置
CN112553665A (zh) * 2020-11-13 2021-03-26 扬昕科技(苏州)有限公司 电镀方法
CN112981504A (zh) * 2021-02-05 2021-06-18 隽美经纬电路有限公司 一种聚酰亚胺薄膜电解镀铜设备及其使用方法
CN114192771B (zh) * 2021-12-07 2024-05-31 北京有研粉末新材料研究院有限公司 一种具有超低松装密度的海石花状电解铜粉及其制备方法
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
CN114908364B (zh) * 2022-06-15 2024-01-05 昆明理工大学 一种离子膜电解法连续制备硫酸铜晶体的方法
WO2024078627A1 (fr) * 2022-10-14 2024-04-18 叶涛 Procédé et appareil d'optimisation de processus de placage de cuivre anodique insoluble intégré à la dissolution de cuivre électrolytique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480516A (en) * 1993-05-12 1996-01-02 Sterling Pulp Chemicals, Ltd. Electrolytic production of acid
CN101307446A (zh) * 2007-05-17 2008-11-19 先丰通讯股份有限公司 蚀刻废液的回收技术及其装置
WO2022118876A1 (fr) * 2020-12-04 2022-06-09 ディップソール株式会社 Système de placage acide, et cellule d'anode

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Publication number Priority date Publication date Assignee Title
ZA703750B (en) * 1969-06-06 1971-01-27 Australian Iron And Steel Ltd Addition of metal ions to plating bath
CN2269241Y (zh) * 1996-08-05 1997-12-03 柯建信 半渗透式离子析出装置
JPH10121297A (ja) * 1996-10-16 1998-05-12 Nippon Riironaale Kk 不溶性陽極を用いた電気銅めっき装置及びそれを使用する銅めっき方法
JP2001089900A (ja) * 1999-09-20 2001-04-03 Shimonoseki Mekki Kk 不溶性陽極を使用するめっき方法及びその装置
IT1318545B1 (it) * 2000-05-31 2003-08-27 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione.
CN101935862A (zh) * 2010-08-17 2011-01-05 苏州铨笠电镀挂具有限公司 一种阳离子发生装置
CN101962796A (zh) * 2010-08-17 2011-02-02 苏州铨笠电镀挂具有限公司 一种可持续补充镀液中金属阳离子的方法
CN202072769U (zh) * 2011-04-29 2011-12-14 郑州大学 一种制备四甲基氢氧化铵的双膜电解装置
JP2012237050A (ja) * 2011-05-10 2012-12-06 Uingu:Kk 不溶性陽極を用いた硫酸銅めっき方法とそのための装置
WO2018103621A1 (fr) * 2016-12-05 2018-06-14 叶旖婷 Procédé de dépôt électrolytique de cuivre acide utilisant une anode insoluble et équipement associé
CN107641821B (zh) * 2017-09-14 2019-06-07 上海新阳半导体材料股份有限公司 一种硫酸铜电镀液、其制备方法和应用及电解槽

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480516A (en) * 1993-05-12 1996-01-02 Sterling Pulp Chemicals, Ltd. Electrolytic production of acid
CN101307446A (zh) * 2007-05-17 2008-11-19 先丰通讯股份有限公司 蚀刻废液的回收技术及其装置
WO2022118876A1 (fr) * 2020-12-04 2022-06-09 ディップソール株式会社 Système de placage acide, et cellule d'anode

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TW202009330A (zh) 2020-03-01
WO2020042870A1 (fr) 2020-03-05
CN112714803A (zh) 2021-04-27
TWI707067B (zh) 2020-10-11

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