CN112714803A - 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 - Google Patents

不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 Download PDF

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CN112714803A
CN112714803A CN201980055803.8A CN201980055803A CN112714803A CN 112714803 A CN112714803 A CN 112714803A CN 201980055803 A CN201980055803 A CN 201980055803A CN 112714803 A CN112714803 A CN 112714803A
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electrolytic
electroplating
cathode
anode
solution
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CN112714803B (zh
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叶涛
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

一种不溶性阳极酸性电镀铜工艺的电镀液或电镀补液的生产方法,包括以下步骤:1)设置一电解槽,使用电解槽隔膜(3)将电解槽分隔为电解阳极区(2)和电解阴极区(1);2)分别准备阳极电解液和阴极电解液;3)将阳极电解液加入所述的电解阳极区(2),将阴极电解液加入所述的电解阴极区(1)中;4)将电解阳极(4)浸入所述的阳极电解液中;将电解阴极(5)浸入所述的阴极电解液中;5)将所述的电解阳极(4)和电解阴极(5)分别与电解电源(6)的正极和负极连接,接通电解电源(6),通电开始电解反应,当所述的阳极电解液中的铜离子浓度达到预定数值时,将阳极电解液取出。还公开了实现所述适用于上述不溶性阳极酸性电镀铜工艺的电镀液或电镀补液生产方法的装置。

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PCT国内申请,说明书已公开。

Claims (20)

  1. PCT国内申请,权利要求书已公开。
CN201980055803.8A 2018-08-27 2019-08-05 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置 Active CN112714803B (zh)

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CN2018109871561 2018-08-27
CN201810987156 2018-08-27
CN201811165873 2018-09-30
CN2018111658732 2018-09-30
CN201811304990 2018-11-02
CN2018113049902 2018-11-02
CN201910291565 2019-04-12
CN2019102915652 2019-04-12
PCT/CN2019/099192 WO2020042870A1 (zh) 2018-08-27 2019-08-05 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112981504A (zh) * 2021-02-05 2021-06-18 隽美经纬电路有限公司 一种聚酰亚胺薄膜电解镀铜设备及其使用方法
CN114908364A (zh) * 2022-06-15 2022-08-16 昆明理工大学 一种离子膜电解法连续制备硫酸铜晶体的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113818055B (zh) * 2020-08-28 2023-06-06 叶涛 一种不溶性阳极的酸性电镀铜镀液或电镀补充液的成分调整方法及装置
CN112553665A (zh) * 2020-11-13 2021-03-26 扬昕科技(苏州)有限公司 电镀方法
CN114192771B (zh) * 2021-12-07 2024-05-31 北京有研粉末新材料研究院有限公司 一种具有超低松装密度的海石花状电解铜粉及其制备方法
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
WO2024078627A1 (zh) * 2022-10-14 2024-04-18 叶涛 一种结合电解溶铜的不溶性阳极镀铜工艺优化方法及装置

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CN202072769U (zh) * 2011-04-29 2011-12-14 郑州大学 一种制备四甲基氢氧化铵的双膜电解装置
JP2012237050A (ja) * 2011-05-10 2012-12-06 Uingu:Kk 不溶性陽極を用いた硫酸銅めっき方法とそのための装置
CN107641821A (zh) * 2017-09-14 2018-01-30 上海新阳半导体材料股份有限公司 一种硫酸铜电镀液、其制备方法和应用及电解槽
TW201821654A (zh) * 2016-12-05 2018-06-16 葉旖婷 使用不溶性陽極的酸性電鍍銅製程及其設備
WO2022118876A1 (ja) * 2020-12-04 2022-06-09 ディップソール株式会社 酸性めっきシステム及びアノードセル

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JP2001089900A (ja) * 1999-09-20 2001-04-03 Shimonoseki Mekki Kk 不溶性陽極を使用するめっき方法及びその装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US5480516A (en) * 1993-05-12 1996-01-02 Sterling Pulp Chemicals, Ltd. Electrolytic production of acid
CN2269241Y (zh) * 1996-08-05 1997-12-03 柯建信 半渗透式离子析出装置
JPH10121297A (ja) * 1996-10-16 1998-05-12 Nippon Riironaale Kk 不溶性陽極を用いた電気銅めっき装置及びそれを使用する銅めっき方法
WO2001092604A2 (en) * 2000-05-31 2001-12-06 De Nora Elettrodi S.P.A. Electrolysis cell for restoring the concentration of metal ions in processes of electroplating
CN101307446A (zh) * 2007-05-17 2008-11-19 先丰通讯股份有限公司 蚀刻废液的回收技术及其装置
CN101935862A (zh) * 2010-08-17 2011-01-05 苏州铨笠电镀挂具有限公司 一种阳离子发生装置
CN101962796A (zh) * 2010-08-17 2011-02-02 苏州铨笠电镀挂具有限公司 一种可持续补充镀液中金属阳离子的方法
CN202072769U (zh) * 2011-04-29 2011-12-14 郑州大学 一种制备四甲基氢氧化铵的双膜电解装置
JP2012237050A (ja) * 2011-05-10 2012-12-06 Uingu:Kk 不溶性陽極を用いた硫酸銅めっき方法とそのための装置
TW201821654A (zh) * 2016-12-05 2018-06-16 葉旖婷 使用不溶性陽極的酸性電鍍銅製程及其設備
CN107641821A (zh) * 2017-09-14 2018-01-30 上海新阳半导体材料股份有限公司 一种硫酸铜电镀液、其制备方法和应用及电解槽
WO2022118876A1 (ja) * 2020-12-04 2022-06-09 ディップソール株式会社 酸性めっきシステム及びアノードセル

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112981504A (zh) * 2021-02-05 2021-06-18 隽美经纬电路有限公司 一种聚酰亚胺薄膜电解镀铜设备及其使用方法
CN114908364A (zh) * 2022-06-15 2022-08-16 昆明理工大学 一种离子膜电解法连续制备硫酸铜晶体的方法
CN114908364B (zh) * 2022-06-15 2024-01-05 昆明理工大学 一种离子膜电解法连续制备硫酸铜晶体的方法

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TWI707067B (zh) 2020-10-11
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