CN112654859B - 用于缺陷分类的检验系统和方法 - Google Patents

用于缺陷分类的检验系统和方法 Download PDF

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Publication number
CN112654859B
CN112654859B CN201980057650.0A CN201980057650A CN112654859B CN 112654859 B CN112654859 B CN 112654859B CN 201980057650 A CN201980057650 A CN 201980057650A CN 112654859 B CN112654859 B CN 112654859B
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defect
illumination
sample
induced phase
inspection system
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CN112654859A (zh
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A·曾
海伦·刘
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8858—Flaw counting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
CN201980057650.0A 2018-09-04 2019-08-29 用于缺陷分类的检验系统和方法 Active CN112654859B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210550590.XA CN114858809B (zh) 2018-09-04 2019-08-29 用于缺陷分类的多波长干涉法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862726782P 2018-09-04 2018-09-04
US62/726,782 2018-09-04
US16/551,155 US11017520B2 (en) 2018-09-04 2019-08-26 Multi-wavelength interferometry for defect classification
US16/551,155 2019-08-26
PCT/US2019/048680 WO2020051046A1 (en) 2018-09-04 2019-08-29 Multi-wavelength interferometry for defect classification

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CN112654859A CN112654859A (zh) 2021-04-13
CN112654859B true CN112654859B (zh) 2022-05-13

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US (1) US11017520B2 (https=)
JP (1) JP7219818B2 (https=)
KR (1) KR102545425B1 (https=)
CN (2) CN112654859B (https=)
TW (1) TWI804677B (https=)
WO (1) WO2020051046A1 (https=)

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US11017520B2 (en) * 2018-09-04 2021-05-25 Kla Corporation Multi-wavelength interferometry for defect classification
US11713959B2 (en) * 2021-03-17 2023-08-01 Kla Corporation Overlay metrology using spectroscopic phase
US20250012732A1 (en) * 2022-01-12 2025-01-09 Hitachi High-Tech Corporation Surface inspection apparatus
CN115718068B (zh) * 2022-10-21 2025-07-04 华南师范大学 一种动态定量微分干涉相衬显微成像系统及方法
US20250060324A1 (en) * 2023-08-14 2025-02-20 Tokyo Electron Limited Hybrid x-ray and optical metrology and navigation

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WO2014164935A1 (en) * 2013-03-12 2014-10-09 Kla-Tencor Corporation Enhanced inspection and metrology techniques and systems using bright-field differential interference contrast
CN106404174A (zh) * 2016-09-07 2017-02-15 南京理工大学 高通量双折射干涉成像光谱仪装置及其成像方法
CN106415809A (zh) * 2014-06-25 2017-02-15 科磊股份有限公司 用于在衬底上产生多个空间分离的检验区域的方法、设备及系统
CN106575631A (zh) * 2014-07-22 2017-04-19 科磊股份有限公司 用于同步暗场及相位对比检验的系统及方法
CN107533103A (zh) * 2015-05-20 2018-01-02 科磊股份有限公司 在逻辑芯片中基于电压对比的错误及缺陷推导

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WO2014164935A1 (en) * 2013-03-12 2014-10-09 Kla-Tencor Corporation Enhanced inspection and metrology techniques and systems using bright-field differential interference contrast
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Publication number Publication date
TW202033948A (zh) 2020-09-16
CN112654859A (zh) 2021-04-13
CN114858809B (zh) 2025-04-04
JP7219818B2 (ja) 2023-02-08
US11017520B2 (en) 2021-05-25
WO2020051046A1 (en) 2020-03-12
JP2022502676A (ja) 2022-01-11
CN114858809A (zh) 2022-08-05
KR20210041100A (ko) 2021-04-14
US20200074617A1 (en) 2020-03-05
KR102545425B1 (ko) 2023-06-20
TWI804677B (zh) 2023-06-11

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