CN112635415A - 一种用于三维封装系统散热的装置 - Google Patents
一种用于三维封装系统散热的装置 Download PDFInfo
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- CN112635415A CN112635415A CN202011502056.9A CN202011502056A CN112635415A CN 112635415 A CN112635415 A CN 112635415A CN 202011502056 A CN202011502056 A CN 202011502056A CN 112635415 A CN112635415 A CN 112635415A
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 239000007787 solid Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 11
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- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 238000011161 development Methods 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011502056.9A CN112635415B (zh) | 2020-12-17 | 2020-12-17 | 一种用于三维封装系统散热的装置 |
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CN202011502056.9A CN112635415B (zh) | 2020-12-17 | 2020-12-17 | 一种用于三维封装系统散热的装置 |
Publications (2)
Publication Number | Publication Date |
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CN112635415A true CN112635415A (zh) | 2021-04-09 |
CN112635415B CN112635415B (zh) | 2024-04-09 |
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CN202011502056.9A Active CN112635415B (zh) | 2020-12-17 | 2020-12-17 | 一种用于三维封装系统散热的装置 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040190251A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
US20100187683A1 (en) * | 2008-05-28 | 2010-07-29 | Georgia Tech Research Corporation | 3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES |
US20130308278A1 (en) * | 2012-05-21 | 2013-11-21 | International Business Machines Corporation | Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package |
CN111081665A (zh) * | 2019-10-31 | 2020-04-28 | 中南大学 | 一种用于多热源器件散热的装置 |
CN111403348A (zh) * | 2020-03-27 | 2020-07-10 | 华中科技大学 | 一种含微通道的陶瓷基板及其制备方法 |
-
2020
- 2020-12-17 CN CN202011502056.9A patent/CN112635415B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040190251A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
US20100187683A1 (en) * | 2008-05-28 | 2010-07-29 | Georgia Tech Research Corporation | 3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES |
US20130308278A1 (en) * | 2012-05-21 | 2013-11-21 | International Business Machines Corporation | Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package |
CN111081665A (zh) * | 2019-10-31 | 2020-04-28 | 中南大学 | 一种用于多热源器件散热的装置 |
CN111403348A (zh) * | 2020-03-27 | 2020-07-10 | 华中科技大学 | 一种含微通道的陶瓷基板及其制备方法 |
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CN112635415B (zh) | 2024-04-09 |
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Effective date of registration: 20240129 Address after: East, 2nd floor, building C, Lugu high level Talents Innovation and entrepreneurship Park, 1698 Yuelu West Avenue, Changsha hi tech Development Zone, Hunan 410000 Applicant after: Changsha Anmuquan Intelligent Technology Co.,Ltd. Country or region after: China Address before: East, 2nd floor, building C, Lugu high level Talents Innovation and entrepreneurship Park, 1698 Yuelu West Avenue, Changsha hi tech Development Zone, Hunan 410000 Applicant before: Changsha Anmuquan Intelligent Technology Co.,Ltd. Country or region before: China Applicant before: CENTRAL SOUTH University |
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