CN1126190C - 制造用于电话机的天线体的方法及相应的天线体部件和电话机 - Google Patents
制造用于电话机的天线体的方法及相应的天线体部件和电话机 Download PDFInfo
- Publication number
- CN1126190C CN1126190C CN99126924A CN99126924A CN1126190C CN 1126190 C CN1126190 C CN 1126190C CN 99126924 A CN99126924 A CN 99126924A CN 99126924 A CN99126924 A CN 99126924A CN 1126190 C CN1126190 C CN 1126190C
- Authority
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- China
- Prior art keywords
- antenna
- resin
- injection molding
- dielectric body
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
- H01Q5/364—Creating multiple current paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
- H01Q5/364—Creating multiple current paths
- H01Q5/371—Branching current paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0442—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular tuning means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Inorganic Chemistry (AREA)
- Support Of Aerials (AREA)
- Details Of Aerials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9828364.1 | 1998-12-22 | ||
GB9828364A GB2345194B (en) | 1998-12-22 | 1998-12-22 | Dual band antenna for a handset |
GB9828535.6 | 1998-12-23 | ||
GB9828535A GB2345022B (en) | 1998-12-23 | 1998-12-23 | Method for manufacturing an antenna body for a phone |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1261211A CN1261211A (zh) | 2000-07-26 |
CN1126190C true CN1126190C (zh) | 2003-10-29 |
Family
ID=26314892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99126924A Expired - Lifetime CN1126190C (zh) | 1998-12-22 | 1999-12-21 | 制造用于电话机的天线体的方法及相应的天线体部件和电话机 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6333716B1 (zh) |
EP (1) | EP1020947A3 (zh) |
JP (1) | JP3615680B2 (zh) |
CN (1) | CN1126190C (zh) |
Families Citing this family (45)
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US7268774B2 (en) | 1998-08-18 | 2007-09-11 | Candledragon, Inc. | Tracking motion of a writing instrument |
CN101188325B (zh) | 1999-09-20 | 2013-06-05 | 弗拉克托斯股份有限公司 | 多级天线 |
ATE302473T1 (de) | 2000-01-19 | 2005-09-15 | Fractus Sa | Raumfüllende miniaturantenne |
JP4217938B2 (ja) * | 2000-04-20 | 2009-02-04 | ソニー株式会社 | アンテナ装置及び携帯無線機 |
US6582887B2 (en) * | 2001-03-26 | 2003-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
JP2002314330A (ja) * | 2001-04-10 | 2002-10-25 | Murata Mfg Co Ltd | アンテナ装置 |
JP3678167B2 (ja) | 2001-05-02 | 2005-08-03 | 株式会社村田製作所 | アンテナ装置及びこのアンテナ装置を備えた無線通信機 |
US20030074780A1 (en) * | 2001-05-16 | 2003-04-24 | Ericsson Inc. | Three-dimensional elastomeric connector |
SE522031C2 (sv) * | 2001-07-12 | 2004-01-07 | Perlos Ab | Tvåkomponentsantenn samt förfarande för framställning av sådan |
FR2827310B1 (fr) * | 2001-07-16 | 2004-07-09 | Cit Alcatel | Procede de galvanisation partielle d'une piece obtenue par moulage-injection |
GB0122226D0 (en) * | 2001-09-13 | 2001-11-07 | Koninl Philips Electronics Nv | Wireless terminal |
US6950516B2 (en) * | 2001-10-05 | 2005-09-27 | Nokia Corporation | User changeable electronic device/mobile phone covers and method |
US7257255B2 (en) | 2001-11-21 | 2007-08-14 | Candledragon, Inc. | Capturing hand motion |
US6834181B2 (en) | 2002-03-13 | 2004-12-21 | Nokia Corporation | Mobile communication device and related construction method |
US6839029B2 (en) * | 2002-03-15 | 2005-01-04 | Etenna Corporation | Method of mechanically tuning antennas for low-cost volume production |
US6822609B2 (en) * | 2002-03-15 | 2004-11-23 | Etenna Corporation | Method of manufacturing antennas using micro-insert-molding techniques |
US6710748B2 (en) * | 2002-06-18 | 2004-03-23 | Centurion Wireless Technologies, Inc. | Compact dual band circular PIFA |
DE10232947A1 (de) * | 2002-07-19 | 2004-01-29 | Siemens Ag | Behältnis, insbesondere Gehäuse für ein Telefonmobilteil sowie Verfahren zur Herstellung eines Gehäuseteils |
US6791506B2 (en) * | 2002-10-23 | 2004-09-14 | Centurion Wireless Technologies, Inc. | Dual band single feed dipole antenna and method of making the same |
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US6791500B2 (en) * | 2002-12-12 | 2004-09-14 | Research In Motion Limited | Antenna with near-field radiation control |
EP1441412B1 (en) * | 2003-01-27 | 2015-12-30 | Sony Ericsson Mobile Communications AB | Antenna with distributed ground |
JP2004327306A (ja) * | 2003-04-25 | 2004-11-18 | Sunarrow Ltd | モバイル機器用の多色樹脂成形部品 |
US20040219951A1 (en) * | 2003-04-29 | 2004-11-04 | Holder Helen A | Program controlled apparatus, system and method for remote data messaging and display over an interactive wireless communications network |
US6885347B2 (en) * | 2003-07-28 | 2005-04-26 | Hon Hai Precision Ind. Co., Ltd. | Method for assembling antenna onto plastic base |
DE102004046907A1 (de) * | 2004-09-28 | 2006-04-13 | Robert Bosch Gmbh | Antennengehäuse und Verfahren zur Herstellung eines Antennengehäuses |
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CN101145633B (zh) * | 2007-09-21 | 2013-06-05 | 中兴通讯股份有限公司 | 一种内置式手机天线及其制造方法 |
JP4756020B2 (ja) * | 2007-09-25 | 2011-08-24 | 株式会社東芝 | 筐体及びその製造方法、並びに電子機器 |
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KR100945123B1 (ko) | 2009-04-23 | 2010-03-02 | 삼성전기주식회사 | 안테나 패턴 프레임, 그 제조방법 및 제조금형, 전자장치 |
US20100289701A1 (en) * | 2009-05-15 | 2010-11-18 | Microsoft Corporation | Antenna configured for bandwidth improvement on a small substrate. |
WO2011076080A1 (zh) * | 2009-12-23 | 2011-06-30 | 北京联想软件有限公司 | 移动终端 |
FI20105158A (fi) | 2010-02-18 | 2011-08-19 | Pulse Finland Oy | Kuorisäteilijällä varustettu antenni |
US8508416B2 (en) * | 2010-04-23 | 2013-08-13 | Psion Inc. | Cap assembly |
CN103155275A (zh) * | 2010-10-06 | 2013-06-12 | 诺基亚公司 | 天线装置和方法 |
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CN103029259B (zh) | 2011-09-30 | 2015-11-25 | 苹果公司 | 用于大规模生产的带有集成浇口移除的注射模塑工具 |
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JPS6223603A (ja) * | 1985-03-27 | 1987-01-31 | Furukawa Electric Co Ltd:The | 一次放射器の製造方法 |
IN167760B (zh) | 1986-08-15 | 1990-12-15 | Kollmorgen Tech Corp | |
JPH0660416B2 (ja) | 1986-11-18 | 1994-08-10 | 三共化成株式会社 | プラスチック成形品の製法 |
US4908259A (en) | 1986-11-18 | 1990-03-13 | Sankyo Kasei Kabushiki Kaisha | Molded article with partial metal plating and a process for producing such article |
DE69023846T2 (de) * | 1989-03-20 | 1996-04-11 | Idemitsu Kosan Co | Styrencopolymer und verfahren zur herstellung. |
JPH02307716A (ja) * | 1989-05-23 | 1990-12-20 | Dynic Corp | 合成樹脂板、合成樹脂板の成形方法および合成樹脂板成形用板状中子 |
FR2699740B1 (fr) | 1992-12-23 | 1995-03-03 | Patrice Brachat | Antenne large bande à encombrement réduit, et dispositif d'émission et/ou de réception correspondant. |
AU1892895A (en) * | 1994-03-08 | 1995-09-25 | Hagenuk Telecom Gmbh | Hand-held transmitting and/or receiving apparatus |
FR2718292B1 (fr) | 1994-04-01 | 1996-06-28 | Christian Sabatier | Antenne d'émission et/ou de réception de signaux électromagnétiques, en particulier hyperfréquences, et dispositif utilisant une telle antenne. |
FR2721733B1 (fr) * | 1994-06-22 | 1996-08-23 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé. |
JPH09232855A (ja) | 1996-02-20 | 1997-09-05 | Mitsubishi Electric Corp | 電子部品 |
US5764190A (en) * | 1996-07-15 | 1998-06-09 | The Hong Kong University Of Science & Technology | Capacitively loaded PIFA |
WO1999035708A1 (fr) * | 1998-01-05 | 1999-07-15 | The Furukawa Electric Co., Ltd. | Dispositif d'antenne pour telephone portable et procede de fabrication |
US6040803A (en) * | 1998-02-19 | 2000-03-21 | Ericsson Inc. | Dual band diversity antenna having parasitic radiating element |
US6097339A (en) * | 1998-02-23 | 2000-08-01 | Qualcomm Incorporated | Substrate antenna |
US6110576A (en) * | 1998-10-16 | 2000-08-29 | Lucent Technologies Inc. | Article comprising molded circuit |
-
1999
- 1999-12-16 EP EP99310154A patent/EP1020947A3/en active Pending
- 1999-12-21 CN CN99126924A patent/CN1126190C/zh not_active Expired - Lifetime
- 1999-12-21 JP JP36264799A patent/JP3615680B2/ja not_active Expired - Fee Related
- 1999-12-22 US US09/469,895 patent/US6333716B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1261211A (zh) | 2000-07-26 |
JP2000196326A (ja) | 2000-07-14 |
US6333716B1 (en) | 2001-12-25 |
JP3615680B2 (ja) | 2005-02-02 |
EP1020947A2 (en) | 2000-07-19 |
EP1020947A3 (en) | 2000-10-04 |
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