CN112567520A - 显示基板及其制造方法、显示装置 - Google Patents
显示基板及其制造方法、显示装置 Download PDFInfo
- Publication number
- CN112567520A CN112567520A CN201980000843.2A CN201980000843A CN112567520A CN 112567520 A CN112567520 A CN 112567520A CN 201980000843 A CN201980000843 A CN 201980000843A CN 112567520 A CN112567520 A CN 112567520A
- Authority
- CN
- China
- Prior art keywords
- area
- substrate
- display
- layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 251
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 282
- 239000012044 organic layer Substances 0.000 claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000011368 organic material Substances 0.000 claims abstract description 20
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 19
- 239000011147 inorganic material Substances 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims description 64
- 230000002093 peripheral effect Effects 0.000 claims description 48
- 239000011229 interlayer Substances 0.000 claims description 44
- 230000004888 barrier function Effects 0.000 claims description 38
- 238000005452 bending Methods 0.000 claims description 22
- 230000000903 blocking effect Effects 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 12
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229920001621 AMOLED Polymers 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000000059 patterning Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 206010027146 Melanoderma Diseases 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
提供了一种显示基板及其制造方法、显示装置。由于衬底基板(01)的边缘区域(A2)内不仅包括贯穿至少一个无机膜层(02)的多个第一凹槽(C1)，而且还包括覆盖于多个第一凹槽(C1)上的有机层(03)，形成有机层(03)的有机材料的硬度相对于形成无机膜层(02)的无机材料的硬度较大。因此通过软硬搭配方式有效提高了显示基板的抗冲击能力，有效避免了裂缝延伸至封装区域(A1)造成封装失效的问题，保证了显示基板的品质。并且，通过使多个第一凹槽(C1)在衬底基板(01)上的正投影与绑定区域(A21)不重叠，可以避免通过刻蚀工艺形成第一凹槽(C1)时，位于绑定区域(A21)的金属走线裸露出来而被腐蚀，确保了显示基板的良率。
Description
PCT国内申请，说明书已公开。
Claims (22)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/091354 WO2020248246A1 (zh) | 2019-06-14 | 2019-06-14 | 显示基板及其制造方法、显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112567520A true CN112567520A (zh) | 2021-03-26 |
Family
ID=73780714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980000843.2A Pending CN112567520A (zh) | 2019-06-14 | 2019-06-14 | 显示基板及其制造方法、显示装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US11495772B2 (zh) |
| EP (1) | EP3985725A4 (zh) |
| CN (1) | CN112567520A (zh) |
| WO (1) | WO2020248246A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112567520A (zh) * | 2019-06-14 | 2021-03-26 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示装置 |
| CN116458279A (zh) * | 2021-10-22 | 2023-07-18 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
| CN114822266B (zh) * | 2022-05-17 | 2024-01-12 | 昆山国显光电有限公司 | 一种显示模组以及显示装置 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG142140A1 (en) * | 2003-06-27 | 2008-05-28 | Semiconductor Energy Lab | Display device and method of manufacturing thereof |
| EP1655790B1 (en) * | 2004-10-21 | 2010-08-04 | LG Display Co., Ltd. | Organic electroluminescent device and method of manufacturing the same |
| CN102255056A (zh) * | 2011-07-12 | 2011-11-23 | 上海大学 | 一种增强玻璃料密封oled器件密封性能的方法 |
| KR102153394B1 (ko) * | 2013-07-29 | 2020-09-08 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| KR102118676B1 (ko) * | 2014-02-05 | 2020-06-04 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
| KR20160017273A (ko) * | 2014-08-01 | 2016-02-16 | 삼성디스플레이 주식회사 | 디스플레이 장치와, 이의 제조 방법 |
| KR102396296B1 (ko) * | 2015-03-06 | 2022-05-11 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
| JP6608201B2 (ja) * | 2015-07-10 | 2019-11-20 | 株式会社ジャパンディスプレイ | 自発光表示装置 |
| JP6606432B2 (ja) * | 2016-01-06 | 2019-11-13 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| KR102586676B1 (ko) * | 2016-05-12 | 2023-10-10 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이 패널, 이의 제조방법 및 이를 포함하는 플렉서블 디스플레이 장치 |
| KR101974086B1 (ko) * | 2016-09-30 | 2019-05-02 | 삼성디스플레이 주식회사 | 표시모듈 |
| CN106876328B (zh) * | 2017-02-20 | 2020-07-03 | 京东方科技集团股份有限公司 | Oled显示面板及其制备方法、显示装置 |
| CN107068715B (zh) * | 2017-03-28 | 2019-12-20 | 上海天马微电子有限公司 | 一种有机发光显示面板、有机发光显示装置以及有机发光显示面板的制备方法 |
| WO2018179168A1 (ja) * | 2017-03-29 | 2018-10-04 | シャープ株式会社 | 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置、成膜装置 |
| US10559772B2 (en) | 2017-03-31 | 2020-02-11 | Sharp Kabushiki Kaisha | Display device and production method thereof |
| KR102333671B1 (ko) * | 2017-05-29 | 2021-12-01 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| CN107195794B (zh) | 2017-06-06 | 2019-07-30 | 京东方科技集团股份有限公司 | 一种柔性显示基板及其制作方法、显示面板、显示装置 |
| WO2019030887A1 (ja) * | 2017-08-10 | 2019-02-14 | シャープ株式会社 | 電気光学装置およびその製造方法 |
| KR102392707B1 (ko) * | 2017-08-18 | 2022-04-29 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN108010921B (zh) * | 2017-11-30 | 2021-03-23 | 上海天马微电子有限公司 | 一种柔性显示面板及显示装置 |
| JP6868904B2 (ja) * | 2018-01-11 | 2021-05-12 | 株式会社Ｊｏｌｅｄ | 有機ｅｌ表示パネルの製造方法 |
| TWI673556B (zh) * | 2018-03-08 | 2019-10-01 | 友達光電股份有限公司 | 顯示面板 |
| CN108428804A (zh) * | 2018-04-19 | 2018-08-21 | 武汉华星光电技术有限公司 | Oled显示面板及其封装方法 |
| CN108598287B (zh) * | 2018-06-29 | 2020-08-11 | 上海天马微电子有限公司 | 柔性触控显示面板及其制作方法、柔性触控显示装置 |
| US20210288286A1 (en) * | 2018-08-02 | 2021-09-16 | Sharp Kabushiki Kaisha | Display device and method of manufacturing same |
| CN109103234A (zh) * | 2018-08-31 | 2018-12-28 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
| KR102684270B1 (ko) * | 2018-10-05 | 2024-07-12 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR20200046221A (ko) * | 2018-10-23 | 2020-05-07 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 디스플레이 장치를 제조하기 위한 마스크 |
| CN111128010B (zh) * | 2018-11-01 | 2021-10-29 | 京东方科技集团股份有限公司 | 显示面板及其制造方法及显示装置 |
| CN109564986B (zh) * | 2018-11-02 | 2021-08-27 | 京东方科技集团股份有限公司 | 显示基板、显示设备和制造显示基板的方法 |
| CN109801953B (zh) * | 2019-02-15 | 2021-02-26 | 京东方科技集团股份有限公司 | 有机发光二极管显示基板、其制备方法及装置 |
| KR20200120804A (ko) * | 2019-04-11 | 2020-10-22 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| EP3985735A4 (en) * | 2019-06-14 | 2022-12-28 | Boe Technology Group Co., Ltd. | DISPLAY SUBSTRATE AND DISPLAY DEVICE |
| CN112567520A (zh) * | 2019-06-14 | 2021-03-26 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示装置 |
| CN111261643B (zh) * | 2020-02-10 | 2022-12-06 | 武汉华星光电半导体显示技术有限公司 | 柔性显示面板及制备方法 |
-
2019
- 2019-06-14 CN CN201980000843.2A patent/CN112567520A/zh active Pending
- 2019-06-14 WO PCT/CN2019/091354 patent/WO2020248246A1/zh active Application Filing
- 2019-06-14 EP EP19932902.0A patent/EP3985725A4/en active Pending
- 2019-06-14 US US16/958,949 patent/US11495772B2/en active Active
-
2022
- 2022-09-26 US US17/952,845 patent/US11956988B2/en active Active
-
2024
- 2024-02-28 US US18/589,950 patent/US20240206223A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240206223A1 (en) | 2024-06-20 |
| US20210408473A1 (en) | 2021-12-30 |
| US20230016921A1 (en) | 2023-01-19 |
| EP3985725A1 (en) | 2022-04-20 |
| EP3985725A4 (en) | 2022-12-28 |
| WO2020248246A1 (zh) | 2020-12-17 |
| US11495772B2 (en) | 2022-11-08 |
| US11956988B2 (en) | 2024-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107799550B (zh) | 柔性显示器 | |
| CN108538897B (zh) | 具有微盖层的显示装置及其制造方法 | |
| CN112602199B (zh) | 显示基板及显示装置 | |
| CN108878687B (zh) | 一种显示面板和电子设备 | |
| US9478594B2 (en) | Organic electroluminescence display device and method of manufacturing organic electroluminescence display device | |
| CN107706220B (zh) | 柔性显示面板及其制作方法和显示装置 | |
| US11956988B2 (en) | Display substrate and method for manufacturing same, and display device | |
| CN107887339B (zh) | 阵列基板 | |
| CN112805771B (zh) | 显示基板及显示装置 | |
| US11133488B2 (en) | Display substrate, display apparatus, and method of fabricating display substrate having enclosure ring in buffer area | |
| CN211238254U (zh) | 显示基板、显示基板母板及显示装置 | |
| KR102482986B1 (ko) | 유기 발광 표시 장치 및 그의 제조 방법 | |
| US20220278300A1 (en) | Display substrate, fabrication method thereof and display panel | |
| US11895864B2 (en) | Display device including a first dam and a second dam disposed in the peripheral area | |
| KR20160073531A (ko) | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 | |
| CN112838110A (zh) | 一种显示面板及显示装置 | |
| JP2019109291A (ja) | 表示装置 | |
| KR101778364B1 (ko) | 디스플레이 디바이스 | |
| CN114171553A (zh) | 显示装置和用于制造显示装置的方法 | |
| CN114287063A (zh) | 显示基板及显示装置 | |
| CN115050787A (zh) | 显示面板、制作方法和显示装置 | |
| CN115275044A (zh) | 显示面板 | |
| CN113437087A (zh) | 显示基板、显示基板母板及其制作方法、显示装置 | |
| JP5182600B2 (ja) | アレイ基板の製造方法 | |
| CN110858602A (zh) | 显示装置及柔性显示面板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |