CN112495926B - Device and method for chemical plating or cleaning - Google Patents
Device and method for chemical plating or cleaning Download PDFInfo
- Publication number
- CN112495926B CN112495926B CN202011393142.0A CN202011393142A CN112495926B CN 112495926 B CN112495926 B CN 112495926B CN 202011393142 A CN202011393142 A CN 202011393142A CN 112495926 B CN112495926 B CN 112495926B
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- cavity
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- groove body
- liquid
- placing frame
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- 238000004140 cleaning Methods 0.000 title claims abstract description 70
- 238000007747 plating Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000126 substance Substances 0.000 title abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 135
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 238000007772 electroless plating Methods 0.000 claims abstract description 42
- 238000007599 discharging Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 210000005056 cell body Anatomy 0.000 claims 3
- 238000005406 washing Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 18
- 230000010355 oscillation Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a device and a method for electroless plating or cleaning. The device comprises a groove body and a product placing rack which is detachably inserted in the groove body, wherein the device is in a working state, when the device is in the working state, the product placing rack is inserted in the groove body, a first cavity is formed on one side of the product placing rack, a second cavity is formed on the other side of the product placing rack, and the first cavity and the second cavity can be communicated through a through hole in a product; the apparatus further comprises: a liquid flow mechanism having a liquid inlet and a liquid outlet; one of the first cavity and the second cavity is communicated with the liquid inlet, and the other cavity is communicated with the liquid outlet; when the device is in an operating state, a pressure difference exists between the first cavity and the second cavity. The invention solves the problem that the chemical plating solution or the cleaning solution is difficult to enter the through hole with high depth-to-width ratio, and improves the quality of the plating film.
Description
Technical Field
The invention belongs to the field of chemical plating, and relates to a device and a method for chemical plating or cleaning.
Background
Circuit boards are one of the key components of electronic products, and internal conductive structures (e.g., conductive vias) are often required in circuit boards to establish electrical connection between internal circuits or between internal circuits and external circuits. However, as electronic products increasingly emphasize miniaturization and multi-functional design, the size of the circuit board, which communicates with its circuitry and internal conductive structures, must also be continually reduced. Existing electroless plating techniques still face challenges in forming high aspect ratio internal conductive structures. For example, as the pore size of the via becomes smaller and the aspect ratio becomes larger, electroless plating solutions are difficult to enter the via by diffusion, and in other cases, air is typically blocked in the via.
In order to solve the above problems, the conventional electroless plating technology adopts methods of jet flow, bubble generation and the like to disturb the electroless plating solution, but the disturbance range generated by the methods is too small, so that the electroless plating solution is not easy to enter the through holes to plate metal, and the conductive structures in the through holes have defects (discontinuous conductive structures). In the cleaning step, the problem that the cleaning liquid is difficult to enter is also caused in the through holes with high depth-to-width ratio, so that the cleaning effect is not ideal.
Therefore, there is a need for an innovative electroless plating technique that ensures that electroless plating solutions or cleaning solutions enter into high aspect ratio through holes to produce high quality through hole products with high aspect ratios.
Disclosure of Invention
The invention aims to provide a device and a method for electroless plating or cleaning, which aim at the electroless plating and cleaning of a product with a through hole with a high aspect ratio, solve the problem that electroless plating solution or cleaning solution is difficult to enter the through hole with the high aspect ratio, and improve the quality of a plated film.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the device comprises a tank body and a product placing frame which is detachably inserted into the tank body, wherein the device is in an operating state, when the device is in the operating state, the product placing frame is inserted into the tank body, a first cavity is formed at one side of the product placing frame, a second cavity is formed at the other side of the product placing frame, and the first cavity and the second cavity can be communicated through a through hole in a product; the apparatus further comprises:
a liquid flow mechanism having a liquid inlet and a liquid outlet;
one of the first cavity and the second cavity is communicated with the liquid inlet, and the other cavity is communicated with the liquid outlet;
when the device is in the working state, a pressure difference exists between the first cavity and the second cavity.
Preferably, the fluid flow mechanism comprises a first fluid flow mechanism and a second fluid flow mechanism, wherein the first fluid flow mechanism is provided with a first fluid inlet communicated with the first cavity and a first fluid outlet communicated with the second cavity, and the second fluid flow mechanism is provided with a second fluid inlet communicated with the second cavity and a second fluid outlet communicated with the first cavity.
Preferably, the liquid flow mechanism further comprises a liquid inlet pipe and a liquid discharge pipe, wherein the liquid inlet is formed on the liquid inlet pipe, and the liquid discharge port is formed on the liquid discharge pipe.
More preferably, the liquid flow mechanism further comprises a liquid discharge valve provided on the liquid discharge pipe.
Preferably, the liquid flow mechanism further comprises a plurality of rinse nozzles for spraying plating or cleaning liquid onto the product on the product rack.
Preferably, the product placing frame is slidably inserted into the groove wall of the groove body, and a sealing plate is arranged on the product placing frame; the first cavity is formed between one side surface of the product placing frame and the groove body, and the second cavity is formed between the other side surface of the product placing frame and the groove body.
Preferably, the device further comprises additional means for applying pressure to the liquid in the cavity having a higher liquid level.
More preferably, the additional mechanism includes an oscillation source disposed on or within the tank. The oscillation source includes, but is not limited to, an ultrasonic oscillation generator.
More preferably, the additional mechanism includes a piston movably disposed in the first or second chamber and a driving mechanism for driving the piston to move.
Further, the tank body comprises an outer tank body and an inner tank body movably arranged in the outer tank body, the piston is positioned in the inner tank body, when the device is in a working state, the inner tank body is tightly attached to one side surface of the product placing rack to form the first cavity or the second cavity, the liquid inlet is arranged on the inner tank body, and the liquid outlet is arranged on the outer tank body.
The invention also adopts the following technical scheme:
a method for electroless plating or cleaning comprising the steps of:
A. providing a product having a through hole;
B. mounting the product to a product mounting rack;
C. inserting a product placing frame provided with a product into a groove body, so that a first cavity is formed between one side of the product placing frame and the groove body, and a second cavity is formed between the other side of the product placing frame and the groove body;
D. introducing plating solution or cleaning solution into the first cavity, enabling the plating solution or cleaning solution to flow into the second cavity through the through holes on the product by pressure difference, and discharging the plating solution or cleaning solution in the second cavity;
E. and introducing plating solution or cleaning solution into the second cavity, enabling the plating solution or cleaning solution to flow into the first cavity through the through holes in the product by pressure difference, and discharging the plating solution or cleaning solution in the first cavity.
Preferably, in the step D, a vibration wave or a thrust force toward the second cavity is further applied to the plating solution or the cleaning solution in the first cavity. Vibration waves include, but are not limited to, ultrasonic waves.
Preferably, in the step E, a vibration wave or a thrust force toward the first cavity is also applied to the plating solution or the cleaning solution in the second cavity. Vibration waves include, but are not limited to, ultrasonic waves.
Herein, products include, but are not limited to, substrates, wafers, PCBs, and glasses, the products having through holes with aspect ratios greater than or equal to 20.
In the present invention, the pressure difference includes a hydraulic pressure difference formed by a liquid level difference, and may further include a pressure difference formed by an oscillation source, a thrust force, or the like.
Compared with the prior art, the invention has the following advantages:
according to the device and the method, the plating solution or the cleaning solution is driven by the pressure difference to alternately pass through the through holes in the product from left to right and from right to left, so that the problem that liquid flow is difficult to enter the through holes with high aspect ratio of the product can be effectively solved, the quality of the plating film is improved, and the situation that the thickness of the plating film is uneven or the plating film is disconnected discontinuously is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of an apparatus according to embodiment 1 of the present invention;
fig. 2 is a front view of an apparatus according to embodiment 1 of the present invention;
FIG. 3 is a cross-sectional view taken along the direction A-A in FIG. 2;
FIG. 4 is a partial enlarged view at B in FIG. 3;
fig. 5 is a schematic structural view of a product rack according to embodiment 1 of the present invention;
fig. 6 is a sectional view of an apparatus according to embodiment 2 of the present invention.
Wherein:
10. a tank body; 101. a first cavity; 102. a second cavity; 11. a product placing rack; 111. a guide piece; 112. a sealing plate; 113. a hook; 12. a product; 13. a liquid flow mechanism; 130. a first liquid inlet pipe; 131. a second liquid inlet pipe; 132. a first liquid inlet; 133. a second liquid inlet; 134. flushing the nozzle; 135. a first liquid discharge pipe; 136. a second liquid discharge pipe; 137. a liquid discharge valve; 14. an oscillation source; 141. a seal ring; 15. a liquid level;
20. a tank body; 201. a first cavity; 202. a second cavity; 203. an outer tank; 204. a first inner tank body; 205. a second inner tank body; 206. an inner groove seal ring; 207. an inner groove driving cylinder; 21. a product placing rack; 231. a first liquid inlet; 232. a second liquid inlet; 233. a liquid outlet; 234. a gap; 251. a first piston; 252. a second piston; 253. a piston seal ring; 254. the piston drives the cylinder.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention. In addition, technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
It should be understood that, although terms such as "first," "second," "third," and the like are used herein to describe various components, these components should not be limited by these terms. These terms are used primarily to distinguish one element from another element. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
Example 1
The embodiment provides an electroless plating device for electroless plating a product and cleaning the product after a metal layer is formed, wherein the product has a through hole with an aspect ratio of greater than or equal to 20. Products in this embodiment include, but are not limited to, substrates, wafers, PCBs, and glass.
Referring to fig. 1 to 5, the electroless plating apparatus includes a tank 10 and a product rack 11 detachably inserted into the tank 10. The electroless plating apparatus has an operating state and a standby state. When the electroless plating apparatus is in the operating state, the product placement frame 11 is inserted in the tank body 10, the product 12 is placed in the product placement frame 11, the first cavity 101 is formed on one side of the product placement frame 11, the second cavity 102 is formed on the other side of the product placement frame 11, the first cavity 101 and the second cavity 102 are spaced apart by the product placement frame 11 and the product 12 thereon, and the first cavity 101 and the second cavity 102 can be communicated through the through holes on the product 12. More preferably, the product placing frame 11 and the tank body 10 are sealed, and the product 12 and the product placing frame 11 are sealed, and the first cavity 101 and the second cavity 102 can only communicate through the through holes on the product 12. When the electroless plating apparatus is in a standby state, the product rack 11 is separated from the tank 10, thereby facilitating loading and unloading of the product 12.
The electroless plating apparatus also includes a flow mechanism 13 through which a plating solution or a cleaning solution flows. The liquid flow mechanism 13 has a liquid inlet and a liquid outlet. One of the first cavity 101 and the second cavity 102 is communicated with the liquid inlet, and the other is communicated with the liquid outlet; moreover, when the electroless plating apparatus is in an operating state, a pressure difference is provided between the first cavity 101 and the second cavity 102 (e.g., a liquid level difference is provided therebetween to form a pressure difference), thereby driving the plating solution or the cleaning solution to flow through the through-holes in the product 12. As shown in fig. 3, the plating solution or cleaning solution enters the first cavity 101 so that the liquid level 15 of the first cavity 101 is higher than that of the second cavity 102, flows into the second cavity 102 through the through hole under the action of the pressure difference, and is then discharged from the second cavity 102. Or, the plating solution or the cleaning solution enters the second cavity 102 to enable the liquid level of the second cavity 102 to be higher than that of the first cavity 101, flows into the first cavity 101 through the through hole under the action of pressure difference, and is discharged from the first cavity 101.
Further, the fluid flow mechanism 13 of the present embodiment includes a first fluid flow mechanism corresponding to the first chamber 101 and a second fluid flow mechanism corresponding to the second chamber 102. The first fluid flow mechanism has a first fluid inlet 132 that communicates with the first chamber 101 and a first fluid outlet that communicates with the second chamber 102. The second fluid flow mechanism has a second fluid inlet 133 that communicates with the second chamber 102 and a second fluid outlet that communicates with the first chamber 101. The first flow means and the second flow means are operated alternately, i.e. one of the flow means 13 is operated while the other flow means 13 is stopped. The first liquid flow mechanism further comprises a first liquid inlet pipe 130 and a first liquid outlet pipe 135, wherein a first liquid inlet 132 is formed on the first liquid inlet pipe 130, and a first liquid outlet is formed on the first liquid outlet pipe 135. The second liquid flow mechanism further comprises a second liquid inlet pipe 131 and a second liquid discharge pipe 136, wherein a second liquid inlet 133 is formed on the second liquid inlet pipe 131, and a second liquid discharge port is formed on the second liquid discharge pipe 136. The liquid flow mechanism 13 further includes liquid discharge valves 137 provided in the first liquid discharge pipe 135 and the second liquid discharge pipe 136, respectively. The drain valves 137 are electrically connected to a controller of the electroless plating apparatus, and the controller automatically controls the opening and closing of the two drain valves 137.
The flow mechanism 13 further includes a plurality of rinse nozzles 134, a portion of the rinse nozzles 134 being located within the first chamber 101 and another portion of the rinse nozzles 134 being located within the second chamber 102. Further, the plurality of rinse nozzles 134 in each cavity are arranged at equal intervals, each rinse nozzle 134 has a liquid outlet obliquely downward and facing the product rack 11, and an included angle (for example, 45 degrees) smaller than 90 degrees is formed between the center line of the liquid outlet and the plane where the product rack 11 is located. The liquid inlet may be in communication with the rinse nozzle 134 to spray plating or cleaning liquid into the cavity.
In this embodiment, the product rack 11 is slidably inserted into the groove wall of the groove body 10. After the product rack 11 is inserted into the tank body 10, the tank body 10 is divided into a left cavity and a right cavity, namely: the first cavity 101 is formed between the left side surface of the product rack 11 and the left side channel 10, and the second cavity 102 is formed between the right side surface of the product rack 11 and the right side channel 10.
As shown in fig. 5, the product rack 11 has a hollow portion in the middle for accommodating the product 12, and the product 12 is fixed to the hollow portion and at least portions of the left and right sides are exposed to contact with the plating solution or the cleaning solution. Guide pieces 111 extending in the up-down direction are respectively formed at the front and rear sides of the product placing frame 11, slots are respectively formed on the front and rear side walls of the slot body 10, and the guide pieces 111 at the two sides are respectively detachably inserted into the slots. Further, a sealing plate 112 is provided on the product housing 11 to seal between the tank body 10 and the product housing 11, and between the product 12 and the product housing 11. In addition, the product rack 11 may be a hanger, and a hook 113 is provided at an upper portion thereof.
The electroless plating apparatus also includes additional mechanisms for further applying pressure to the liquid in the higher pressure (i.e., higher level) chamber. The additional mechanism includes one or more oscillation sources 14, the oscillation sources 14 emit oscillation waves (such as ultrasonic waves) which act on the plating solution or cleaning solution, and the oscillation sources 14 can be arranged on the tank body 10 or in the tank body 10. As shown in fig. 1, 3 and 4, the number of the oscillation sources 14 is plural, wherein one part corresponds to the first cavity 101 for oscillating the liquid in the first cavity 101, and the other part corresponds to the second cavity 102 for oscillating the liquid in the second wall. For example, four oscillation sources 14 are uniformly arranged on the left side groove wall of the groove body 10, and the other four oscillation sources 14 are uniformly arranged on the right side groove wall of the groove body 10. In addition, the oscillation source 14 is provided on the left/right side groove walls of the groove body 10 through the seal ring 141.
The embodiment also provides an electroless plating method, which can adopt the electroless plating device. The flow of the electroless plating method is as follows:
s100, providing a product 12 with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s101, mounting a product 12 on a product 12 mounting frame;
s102, inserting a product placing frame 11 provided with a product 12 into a groove body 10, forming a first cavity 101 between one side of the product placing frame 11 and the groove body 10, and forming a second cavity 102 between the other side of the product placing frame 11 and the groove body 10;
s103, introducing a plating solution into the first cavity 101, applying vibration waves to the plating solution in the first cavity 101, enabling the plating solution to flow into the second cavity 102 through the through holes on the product 12 by pressure difference, and discharging the plating solution in the second cavity 102 (along the flow direction shown by the arrow in FIG. 3);
s104, introducing the plating solution into the second cavity 102, applying vibration waves to the plating solution in the second cavity 102, enabling the plating solution to flow into the first cavity 101 through the through holes in the product 12 by pressure difference, and discharging the plating solution in the first cavity 101.
The above steps S103 and S104 may be sequentially and cyclically performed a plurality of times.
The embodiment also provides a cleaning method, which can adopt the electroless plating device. The cleaning method comprises the following steps:
s200, providing a product 12 with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s201, mounting the product 12 on a product 12 mounting frame;
s202, inserting a product placing frame 11 provided with a product 12 into a groove body 10, forming a first cavity 101 between one side of the product placing frame 11 and the groove body 10, and forming a second cavity 102 between the other side of the product placing frame 11 and the groove body 10;
s203, introducing cleaning liquid into the first cavity 101, applying vibration waves to the cleaning liquid in the first cavity 101, enabling the cleaning liquid to flow into the second cavity 102 through the through holes in the product 12 by pressure difference, and discharging the cleaning liquid in the second cavity 102 (along the flow direction shown by the arrow in FIG. 3);
s204, filling the cleaning solution into the second cavity 102, applying vibration waves to the cleaning solution in the second cavity 102, enabling the cleaning solution to flow into the first cavity 101 through the through holes in the product 12 by pressure difference, and discharging the cleaning solution in the first cavity 101.
The above steps S203 and S204 may be sequentially and cyclically performed a plurality of times.
In the device and the method, the liquid flow (plating solution or cleaning solution) is driven by the pressure difference to alternately pass through the through holes on the product from left to right and from right to left, and vibration waves are further matched, so that the problem that the liquid flow is difficult to enter the through holes with high aspect ratio of the product can be effectively solved, and the coating quality is improved.
Example 2
The embodiment provides an electroless plating device for electroless plating a product and cleaning the product after a metal layer is formed, wherein the product has a through hole with an aspect ratio of greater than or equal to 20. Products in this embodiment include, but are not limited to, substrates, wafers, PCBs, and glass.
Referring to fig. 6, the electroless plating apparatus includes a tank 20 and a product rack 21 detachably inserted into the tank 20. The electroless plating apparatus has an operating state and a standby state. When the electroless plating apparatus is in the operating state, the product placement frame 21 is inserted in the groove body 20, the product is placed in the product placement frame, the first cavity 201 is formed on one side of the product placement frame 21, the second cavity 202 is formed on the other side of the product placement frame 21 (one of the cavities is a closed cavity which is communicated with the outside only through the through hole on the product, and the other cavity is an open cavity), and the first cavity 201 and the second cavity 202 can be communicated through the through hole on the product. When the electroless plating apparatus is in a standby state, the product rack 21 is separated from the bath 20, thereby facilitating loading and unloading of the product. The structure of the product rack 21 is the same as that of embodiment 1.
As shown in fig. 2, the tank 20 includes an outer tank 203 and an inner tank movably provided in the outer tank 203. The inner tank body specifically includes a first inner tank body 204 and a second inner tank body 205 that are disposed opposite to each other, the first inner tank body 204 being disposed on the left side of the outer tank body 203 so as to be movable in the left-right direction, and the second inner tank body 205 being disposed on the right side of the outer tank body 203 so as to be movable in the left-right direction. When the electroless plating apparatus is in an operating state, the first inner tank 204 is tightly attached to the left side surface of the product rack 21 to form a first cavity 201, a second cavity 202 is formed between the second inner tank 205 and the right side surface of the product rack 21, and a gap 234 may be formed between the second inner tank 205 and the right side surface of the product rack 21 to allow the plating solution or cleaning solution entering the second cavity 202 to flow into the outer tank 203; or, the second inner tank 205 is closely attached to the right side surface of the product rack 21 to form the second cavity 202, the first cavity 201 is formed between the first inner tank 204 and the left side surface of the product rack 21, and a gap may be formed between the first inner tank 204 and the left side surface of the product rack 21, so that the plating solution or cleaning solution entering the first cavity 201 flows into the outer tank 203.
The chemical plating device also comprises a liquid flow mechanism for flowing the plating solution or the cleaning solution. The liquid flow mechanism is provided with a liquid inlet and a liquid outlet. One of the first cavity 201 and the second cavity 202 is communicated with the liquid inlet, and the other is communicated with the liquid outlet (specifically communicated through the gap); moreover, when the electroless plating apparatus is in an operating state, there is a pressure difference between the first chamber 201 and the second chamber 202, thereby driving the plating solution or the cleaning solution to flow through the through holes on the product. Plating solution or cleaning solution enters the first cavity 201 to enable the liquid level of the first cavity 201 to be higher than that of the second cavity 202, flows into the second cavity 202 through the through holes under the action of pressure difference, and is discharged from the second cavity 202. Or, the plating solution or the cleaning solution enters the second cavity 202 to enable the liquid level of the second cavity 202 to be higher than that of the first cavity 201, flows into the first cavity 201 through the through holes under the action of pressure difference, and is discharged from the first cavity 201.
Further, the first inner tank 204 is provided with a first liquid inlet 231, the second inner tank 205 is provided with a second liquid inlet 232, and the first liquid inlet 231 and the second liquid inlet 232 operate alternately, i.e. when one liquid inlet is fed, the other liquid inlet stops feeding liquid. The liquid drain is arranged on the outer groove 203 and is communicated with the second cavity 202 through a gap between the second inner groove 205 and the product placing frame 21 or is communicated with the first cavity 201 through a gap between the first inner groove 204 and the product placing frame 21.
The electroless plating apparatus also includes an additional mechanism for further applying pressure to the liquid in the higher level chamber. The additional mechanism includes a piston movably disposed within the first cavity 201 or the second cavity 202 and a driving mechanism for driving the piston to move. As shown in fig. 6, a first piston 251 is provided in the first inner tank 204, and a second piston 252 is provided in the second inner tank 205. The driving mechanism includes piston driving cylinders 254 provided on the groove walls of the first and second inner grooves 204, 205, respectively, and piston rods of the piston driving cylinders 254 are connected to the first and second pistons 251, 252, respectively.
An inner groove sealing ring 206 is respectively arranged on the end surfaces of the first inner groove body 204 and the second inner groove body 205, and the inner groove sealing ring 206 is in a closed ring shape and is used for sealing the first inner groove body 204 and the product placing frame 21 to form a first cavity 201 or sealing the second inner groove body 205 and the product placing frame 21 to form a second cavity 202. A piston seal 253 is provided between the first piston 251 and the inner wall of the first inner tank 204; a piston seal 253 is provided between the second piston 252 and the inner wall of the second inner tank 205.
The electroless plating apparatus further includes a plurality of inner bath driving cylinders 207 for driving the first inner bath 204 or the second inner bath 205 to move. A part of the inner tank driving cylinder 207 is provided on the left side tank wall of the outer tank 203 with its piston rod connected to the first inner tank 204, and another part of the inner tank driving cylinder 207 is provided on the right side tank wall of the outer tank 203 with its piston rod connected to the second inner tank 205.
The embodiment also provides an electroless plating method, which can adopt the electroless plating device. The flow of the electroless plating method is as follows:
s300, providing a product with a through hole, wherein the depth-to-width ratio of the through hole is more than or equal to 20;
s301, mounting a product on a product mounting frame;
s302, inserting a product placing rack 21 with products mounted between the first inner tank 204 and the second inner tank 205;
s303, driving the first inner groove 204 to move towards the product placing frame 21, so that the cavity at one side of the product placing frame 21 is substantially sealed by the first inner groove 204 to form a first cavity 201, and the cavity between the other side of the product placing frame 21 and the groove 20 is a second cavity 202 which is open;
s304, plating solution is introduced into the first cavity 201, the first piston 251 is driven to move towards the product placing frame 21 so as to apply thrust to the plating solution in the first cavity 201, the plating solution flows into the second cavity 202 through the through hole on the product, and the plating solution is discharged through the gap 234 between the second inner groove 205 and the product placing frame 21 and the liquid outlet 233 on the outer groove 203;
s305, driving the first inner groove 204 to be far away from the product rack 21 and have a gap (i.e. the first cavity 201 is an open cavity), and driving the second inner groove 205 to move towards the product rack 21, so that the cavity at the other side of the product rack 21 is substantially sealed by the second inner groove 205 to form a second cavity 202;
s306, introducing plating solution into the second cavity 202, driving the second piston 252 to move towards the product placing frame 21 so as to apply thrust to the plating solution in the second cavity 202, enabling the plating solution to flow into the first cavity 201 through the through holes on the product, and discharging the plating solution through the gap between the first inner groove 204 and the product placing frame 21 and the liquid outlet on the outer groove 203.
The above steps S303 to S306 may be sequentially and cyclically performed a plurality of times.
The embodiment also provides a cleaning method, which can adopt the electroless plating device. The cleaning method comprises the following steps:
s400, providing a product with a through hole, wherein the depth-to-width ratio of the through hole is more than or equal to 20;
s401, mounting a product on a product mounting frame;
s402, inserting a product placing rack 21 with products mounted between the first inner tank 204 and the second inner tank 205;
s403, driving the first inner tank 204 to move toward the product rack 21, so that the cavity located at one side of the product rack 21 is substantially sealed by the first inner tank 204 to form a first cavity 201, and the cavity between the other side of the product rack 21 and the tank 20 is a second cavity 202 that is open;
s404, introducing cleaning liquid into the first cavity 201, driving the first piston 251 to move towards the product placing frame 21 so as to apply thrust to the cleaning liquid in the first cavity 201, enabling the cleaning liquid to flow into the second cavity 202 through the through hole on the product, and discharging the cleaning liquid through the gap 234 between the second inner groove 205 and the product placing frame 21 and the liquid outlet 233 on the outer groove 203;
s405, driving the first inner tank 204 to have a gap away from the product rack 21 (i.e. the first cavity 201 is an open cavity), and driving the second inner tank 205 to move toward the product rack 21, so that the cavity on the other side of the product rack 21 is substantially sealed by the second inner tank 205 to form a second cavity 202;
and S406, introducing cleaning liquid into the second cavity 202, driving the second piston 252 to move towards the product placing frame 21 so as to apply thrust to the cleaning liquid in the second cavity 202, enabling the cleaning liquid to flow into the first cavity 201 through the through holes on the product, and discharging the cleaning liquid through the gap between the first inner groove 204 and the product placing frame 21 and the liquid outlet 233 on the outer groove 203.
The above steps S403 to S406 may be sequentially and cyclically performed a plurality of times.
In the device and the method, the liquid flow (plating solution or cleaning solution) is driven by the pressure difference to alternately pass through the through holes on the product from left to right and from right to left, and the thrust force exerted by the piston is further matched, so that the problem that the liquid flow is difficult to enter the through holes with high aspect ratio of the product can be effectively solved, and the coating quality is improved.
The above-described embodiments are provided for illustrating the technical concept and features of the present invention, and are intended to be preferred embodiments for those skilled in the art to understand the present invention and implement the same according to the present invention, not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (6)
1. The utility model provides a device for electroless plating or washing, includes cell body and can break away from the product rack of inserting in locating in the cell body, its characterized in that: the device is in a working state, when the device is in the working state, the product placing frame is inserted into the groove body, a first cavity is formed on one side of the product placing frame, a second cavity is formed on the other side of the product placing frame, and the first cavity and the second cavity can be communicated through a through hole in a product; the apparatus further comprises:
a liquid flow mechanism having a liquid inlet and a liquid outlet;
one of the first cavity and the second cavity is communicated with the liquid inlet, and the other cavity is communicated with the liquid outlet;
when the device is in the working state, a pressure difference exists between the first cavity and the second cavity;
the device also comprises an additional mechanism for applying pressure to the liquid in the cavity with higher liquid level, wherein the additional mechanism comprises a piston movably arranged in the first cavity and the second cavity respectively and a driving mechanism for driving the piston to move;
the groove body comprises an outer groove body and an inner groove body movably arranged in the outer groove body, the inner groove body comprises a first inner groove body and a second inner groove body which are oppositely arranged, the first inner groove body is movably arranged on the left side of the outer groove body along the left-right direction, and the second inner groove body is movably arranged on the right side of the outer groove body along the left-right direction;
when the device is in a working state, the first inner groove body is adhered to the left side surface of the product placing frame so as to form a first cavity, a second cavity is formed between the second inner groove body and the right side surface of the product placing frame, and a gap is formed between the second inner groove body and the right side surface of the product placing frame so as to enable plating solution or cleaning solution entering the second cavity to flow into the outer groove body; or, thereby the laminating of second inside groove body forms the second cavity at the right side surface of product rack, form first cavity between first inside groove body and the left side surface of product rack, just have the clearance between first inside groove body and the left side surface of product rack, in order to supply the plating solution or the washing liquid that get into first cavity to flow into in the outer cell body.
2. The apparatus according to claim 1, wherein: the liquid flow mechanism comprises a first liquid flow mechanism and a second liquid flow mechanism, wherein the first liquid flow mechanism is provided with a first liquid inlet communicated with the first cavity and a first liquid outlet communicated with the second cavity, and the second liquid flow mechanism is provided with a second liquid inlet communicated with the second cavity and a second liquid outlet communicated with the first cavity.
3. The apparatus according to claim 1 or 2, characterized in that: the liquid flow mechanism further comprises a liquid inlet pipe and a liquid discharge pipe, wherein the liquid inlet is formed on the liquid inlet pipe, and the liquid discharge port is formed on the liquid discharge pipe.
4. The apparatus according to claim 1, wherein: the product placing rack is slidably inserted into the groove wall of the groove body, and a sealing plate is arranged on the product placing rack; the first cavity is formed between one side surface of the product placing frame and the groove body, and the second cavity is formed between the other side surface of the product placing frame and the groove body.
5. A method for electroless plating or cleaning, characterized in that a device according to any one of claims 1 to 4 is used, the method comprising the steps of:
A. providing a product having a through hole;
B. mounting the product to a product rack;
C. inserting a product placing frame provided with a product into a groove body, so that a first cavity is formed between one side of the product placing frame and the groove body, and a second cavity is formed between the other side of the product placing frame and the groove body;
D. introducing plating solution or cleaning solution into the first cavity, enabling the plating solution or cleaning solution to flow into the second cavity through the through holes on the product by pressure difference, and discharging the plating solution or cleaning solution in the second cavity;
E. and introducing plating solution or cleaning solution into the second cavity, enabling the plating solution or cleaning solution to flow into the first cavity through the through holes in the product by pressure difference, and discharging the plating solution or cleaning solution in the first cavity.
6. The method of claim 5, wherein step D further applies a pushing force to the plating or cleaning solution in the first chamber toward the second chamber; and in the step E, pushing force towards the first cavity is also applied to the plating solution or the cleaning solution in the second cavity.
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