JPS62136588A - High-speed electroplating method - Google Patents
High-speed electroplating methodInfo
- Publication number
- JPS62136588A JPS62136588A JP27566485A JP27566485A JPS62136588A JP S62136588 A JPS62136588 A JP S62136588A JP 27566485 A JP27566485 A JP 27566485A JP 27566485 A JP27566485 A JP 27566485A JP S62136588 A JPS62136588 A JP S62136588A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- plating solution
- chamber
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は短時間でめっきがなされるようにした高速電
気めっき方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a high-speed electroplating method that allows plating to be performed in a short time.
（従来の技術）
従来、電気めっきをする場合には、被めっき物をめっき
液中に浸漬させて行っていたが、単なる浸漬では時間が
かかるため、上記めっき液を流動させながら電気めっき
をする高速の電気めっき方法が提案されている（例えば
、この出願人の出願に係る特公昭６０−１９５８号公報
）。(Conventional technology) Conventionally, when electroplating was performed, the object to be plated was immersed in a plating solution, but since mere immersion takes time, electroplating is performed while the plating solution is flowing. High-speed electroplating methods have been proposed (for example, Japanese Patent Publication No. 1988-1958 filed by the same applicant).
（発明が解決しようとする問題点）
上記のようなめっき方法を例えばプリント配線基板を構
成する被めっき板材に適用すると、この被めっき板材の
各表面に沿って流れるめっき液により、これら表面には
短時間に所定のめっきが施されることとなる。ところで
、被めっき板材には電気部品端子の接続等のために径の
小さい多数の貫通孔が形成されており、この貫通孔は被
めっき板材の表面にほぼ直交するよう形成されている。(Problems to be Solved by the Invention) When the above-mentioned plating method is applied to plate materials constituting, for example, printed wiring boards, the plating solution flowing along each surface of the plate materials causes damage to these surfaces. Predetermined plating will be applied in a short time. By the way, a large number of small diameter through holes are formed in the plate material to be plated for connection of electrical component terminals, etc., and these through holes are formed to be substantially perpendicular to the surface of the plate material to be plated.
このため、上記めっき方法では貫通孔内でめっき液が澱
んでしまい、この貫通孔内周面に所定のめっきを施そう
とするには長時間を要するという不都合を生じる。For this reason, in the above-mentioned plating method, the plating solution stagnates inside the through-hole, resulting in the inconvenience that it takes a long time to apply a predetermined plating to the inner peripheral surface of the through-hole.
（発明の目的）
この発明は、上記のような事情に注目してなされたもの
で、プリント配線基板を構成するような多数の貫通孔を
有する被めっき板材をめっきするに際し、貫通孔内周面
にも短時間で所定のめっきがなされるようにすることを
目的とする。(Objective of the Invention) The present invention was made in view of the above-mentioned circumstances, and when plating a plate material having a large number of through holes such as a printed wiring board, the inner circumferential surface of the through holes is The purpose is to enable a specified plating to be performed in a short time.
（発明の構成）
上記目的を達成するためのこの発明の特徴とするところ
は、めっき室を被めっき板材にて２室に区画し、この被
めっき板材で仕切られた両室のめっき液間に液圧差を生
じさせる点にある。(Structure of the Invention) A feature of the present invention for achieving the above object is that the plating chamber is divided into two chambers by the plate material to be plated, and the plating liquid in both chambers is separated by the plate material to be plated. The point is that it creates a hydraulic pressure difference.
（実施例） 以下、この発明の実施例を図面により説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
まず、第１０図により、完成したプリント配線基板ｌに
ついて説明する。First, the completed printed wiring board 1 will be explained with reference to FIG.
図において、上記プリント配線基板ｌはガラス！ａ維強
化エポキシ樹脂製の基板材２と、この基板材２の両面に
形成される配線回路部３と、上記基板材２を貫通して再
配線回路部３．３を接続する接続回路部４とを有してい
る。上記基板材２の両面はＩＣ等の部品類を接続するラ
ンド５を残して耐熱性樹脂のソルダレジスト６により覆
われている。このソルダレジスト６は、上記部品類をプ
リント配線基板１上にハンダ付けする際に、ハンダがラ
ンド５以外に無用に付くことを防止すると共に、このプ
リント配線基板１の絶縁性を向上させる。In the figure, the printed wiring board l is glass! A substrate material 2 made of fiber-reinforced epoxy resin, a wiring circuit section 3 formed on both sides of this substrate material 2, and a connection circuit section 4 that penetrates the substrate material 2 and connects the rewiring circuit section 3.3. It has Both surfaces of the substrate material 2 are covered with a heat-resistant resin solder resist 6, leaving lands 5 for connecting parts such as ICs. This solder resist 6 prevents solder from adhering to areas other than the lands 5 unnecessarily when the above-mentioned components are soldered onto the printed wiring board 1, and also improves the insulation properties of the printed wiring board 1.
上記配線回路部３は基板材２の両面にそれぞれめっきさ
れる薄い第１銅層８と、この各第１銅層８上にそれぞれ
めっきされこの第１銅層８と一体化される厚い第２銅層
９と、これら第１銅層８゜第２銅層９を覆いハンダを促
進するハンダ層１０とを有している。また、上記接続回
路部４は基板材２に形成される貫通孔１３を有し、この
貫通孔１３の内周面には上記配線回路部３と同様に第１
銅層８．第２銅層９及びハンダ層１０が設けられる。The wiring circuit section 3 includes a thin first copper layer 8 plated on both sides of the substrate material 2, and a thick second copper layer 8 plated on each of the first copper layers 8 and integrated with the first copper layer 8. It has a copper layer 9 and a solder layer 10 that covers the first copper layer 8 and the second copper layer 9 to promote soldering. Further, the connection circuit section 4 has a through hole 13 formed in the substrate material 2, and the inner peripheral surface of the through hole 13 has a first
Copper layer 8. A second copper layer 9 and a solder layer 10 are provided.
次に、第３図から第１Ｏ図を参照して上記プリント配線
基板ｌの製作手順を説明する。このプリント配線基板ｌ
の製作方法はセミアディティブ法といわれるものである
。Next, the manufacturing procedure of the printed wiring board 1 will be explained with reference to FIGS. 3 to 1O. This printed wiring board
The manufacturing method is called a semi-additive method.
第３図において基板材２は還元性物質の触媒人積層板で
ある。そして、この基板材２の表面には二元性物質によ
りパラジウム等が吸着され、これによりめっき前処理と
しての活性化が与えられる。In FIG. 3, the substrate material 2 is a catalytic laminate of a reducing substance. Then, palladium or the like is adsorbed onto the surface of the substrate material 2 by the binary substance, thereby providing activation as a plating pretreatment.
次に、第４図で示すように、上記基板材２の表面には無
電解銅めっきにより第１銅層８が析出して密着し、これ
によって第１中間成形品１４が成形される。この場合、
上記第１銅層８の厚さは２〜５ルであり、これによりこ
の第１中間成形品１４の表面には導電性が与えられる。Next, as shown in FIG. 4, a first copper layer 8 is deposited and adhered to the surface of the substrate material 2 by electroless copper plating, whereby a first intermediate molded product 14 is formed. in this case,
The thickness of the first copper layer 8 is 2 to 5 μl, thereby imparting electrical conductivity to the surface of the first intermediate molded product 14.
また、上記貫通孔１３内周面に対するめっきにより、こ
こに新たな貫通孔１３′が形成される。Further, by plating the inner peripheral surface of the through hole 13, a new through hole 13' is formed here.
次に、第５図で示すように、上記第１中間成形品１４の
両面に感光性ドライフィルム１５．１５が加熱加圧によ
り圧着される。また、前記配線回路部３に対応する回路
パターンをこれら両ドライフィルム１５．１５に露光、
現像することにより、これら両ドライフィルム１５．１
５に回路パターン溝１６．１６がそれぞれ形成される。Next, as shown in FIG. 5, photosensitive dry films 15.15 are bonded to both surfaces of the first intermediate molded product 14 by heating and pressing. Further, a circuit pattern corresponding to the wiring circuit section 3 is exposed on both of these dry films 15 and 15,
By developing both these dry films 15.1
5 are formed with circuit pattern grooves 16 and 16, respectively.
そして、これは被めっき板材たる第２中間成形品１８で
ある。This is the second intermediate molded product 18 which is a plate material to be plated.
次に、第６図で示すように、電解銅めっきにより上記第
２中間成形品１８の回路パターン溝１６の第１銅層８上
、及び、貫通孔１３′内周面の第１銅層８上に第２銅層
９が析出して密着する。これは第３中間成形品１９であ
る。Next, as shown in FIG. 6, electrolytic copper plating is applied to the first copper layer 8 of the circuit pattern groove 16 of the second intermediate molded product 18 and the first copper layer 8 of the inner peripheral surface of the through hole 13'. A second copper layer 9 is deposited on top and adheres closely. This is the third intermediate molded product 19.
次に、第７図で示すように、電気ハンダめっきにより上
記第３中間成形品１９の第２銅層９上にハンダ層１０が
析出して密着し、これは第４中間成形品２０である。Next, as shown in FIG. 7, a solder layer 10 is deposited and adhered to the second copper layer 9 of the third intermediate molded product 19 by electro-solder plating, and this is the fourth intermediate molded product 20. .
次に、第８図で示すように、苛性ソーダにより上記第４
中間成形品２０からドライフィルム１５が剥離され１次
いで、上記ドライフィルム１５の剥離部分の第１銅層８
が塩化第２銅等の水溶液によりエツチング除去される。Next, as shown in FIG.
The dry film 15 is peeled off from the intermediate molded product 20, and then the first copper layer 8 is removed from the peeled portion of the dry film 15.
is removed by etching with an aqueous solution of cupric chloride or the like.
これは第５中間成形品２１である。This is the fifth intermediate molded product 21.
次に、第９図で示すように、上記第５中間成形品２１が
加熱されてハンダ層１０が溶融され、このハンダ層１０
は上記第１銅層８と第２銅層９を覆っている。Next, as shown in FIG. 9, the fifth intermediate molded product 21 is heated to melt the solder layer 10.
covers the first copper layer 8 and the second copper layer 9.
そして、既に説明した第１０図で示すように、上記第５
中間成形品２１の基板材２両面に前記ドライフィルム１
５と同様にしてランド５用の孔が形成されたソルダレジ
スト６が圧着される。これによって、プリント配線基板
ｌの製作が終了する。Then, as shown in FIG. 10 already explained, the fifth
The dry film 1 is applied to both sides of the substrate material 2 of the intermediate molded product 21.
The solder resist 6 in which holes for the lands 5 are formed is crimped in the same manner as in 5. This completes the production of the printed wiring board l.
第１図及び、第２図により上記プリント配線基板１の製
作手順中における第２中間成形品１８の電解銅めっきに
ついて詳しく説明する。The electrolytic copper plating of the second intermediate molded product 18 during the manufacturing procedure of the printed wiring board 1 will be explained in detail with reference to FIGS. 1 and 2.
まず、上記めっきに使用される装置について説明する。First, the apparatus used for the above plating will be explained.
第２図は電解銅めっき装置２４のフローシートを示すも
のである。この電解銅めっき装置２４には上記波めっき
板材たる第２中間成形品１８を電気めっきする本体部２
５と、この本体部２５にめっき液タンク２６の硫酸銅等
の酸性鋼めっき液Ｐを供給するめっき液供給手段２７と
が設けられる。FIG. 2 shows a flow sheet of the electrolytic copper plating apparatus 24. This electrolytic copper plating device 24 has a main body portion 2 for electroplating the second intermediate molded product 18 which is the wave plated plate material.
5, and a plating solution supply means 27 for supplying an acidic steel plating solution P such as copper sulfate from a plating solution tank 26 to the main body portion 25.
上記めっき液供給手段２７はポンプ２８を有し、このポ
ンプ２８の吸入側が上記めっき液タンク２６に連結され
ると共に、ポンプ２８の吐出側には供給側ヘッダー３０
が連絡される。この供給側へフグ−３０と上記本体部２
５のめっき液Ｐ入口側とは第１供給通路３１及び第２供
給通路３２により連通している。また、この本体部２５
のめっき液Ｐ出口側は第１排出通路３３及び第２排出通
路３４により排出側ヘッダー３５に連結され、この排出
側ヘッダー３５は上記めっき液タンク２６に連結される
。The plating solution supply means 27 has a pump 28 , and the suction side of the pump 28 is connected to the plating solution tank 26 , and the discharge side of the pump 28 has a supply header 30 .
will be contacted. To this supply side, the blowfish 30 and the main body part 2
It communicates with the plating solution P inlet side of No. 5 through a first supply passage 31 and a second supply passage 32. In addition, this main body portion 25
The outlet side of the plating solution P is connected to a discharge side header 35 through a first discharge passage 33 and a second discharge passage 34, and this discharge side header 35 is connected to the plating solution tank 26.
また、上記第１供給通路３１の中途部には、この第１供
給通路３１を全開全閉する第１電磁弁３７が設けられる
と共に、上記第１供給通路３１の開度を調整する第１手
動弁３８が上記供給側ヘッダー３０と第１電磁弁３７の
間に設けられる。３９は上記第１供給通路３１内のめっ
き液Ｐの流量を計測する第１流量計である。Further, a first solenoid valve 37 for fully opening and fully closing the first supply passage 31 is provided in the middle of the first supply passage 31, and a first manual valve 37 for adjusting the opening degree of the first supply passage 31 is provided. A valve 38 is provided between the supply header 30 and the first solenoid valve 37 . Reference numeral 39 denotes a first flow meter that measures the flow rate of the plating solution P in the first supply passage 31.
一方、上記第２供給通路３２の中途部にも上記と同様に
第２電磁弁４０、第２手動弁４１及び第２流量計４２が
設けられる。On the other hand, a second electromagnetic valve 40, a second manual valve 41, and a second flow meter 42 are also provided in the middle of the second supply passage 32 in the same manner as described above.
また、第１図により上記本体部２５について説明する。Further, the main body portion 25 will be explained with reference to FIG.
上記本体部２５のハウジング４３内がめつき室４９であ
り、このめっき室４９内には一対の電極４４．４４が設
けられ、これら両電極４４は陽極（第１図生得号■図示
）となるように図示しない電源装置に接続される。上記
電極４４．４４は所定の間隔を置いて配置され、これら
電極４４，４４間の間隙は本体部２５内のめっき液Ｐ入
口側と出口側とを結ぶように延びている。また、上記ハ
ウジング４３内には第２中間成形品１８を支持する支持
金具４５．４５が配設され、これら両支持金具４５．４
５は陰極である（第１図生得号θ図示）。そして、上記
第２中間成形品１８は電極４４．４４間のほぼ中央で上
記支持金具４５．４５によりめっき室４９を第１めっき
室４６と第２めっき室４７とに仕切るように装着される
。Inside the housing 43 of the main body part 25 is a plating chamber 49, and a pair of electrodes 44, 44 are provided in the plating chamber 49, and these electrodes 44 are designed to serve as anodes (as shown in FIG. 1). It is connected to a power supply device (not shown). The electrodes 44, 44 are arranged at a predetermined interval, and the gap between these electrodes 44, 44 extends so as to connect the inlet side and the outlet side of the plating solution P in the main body 25. Furthermore, a support fitting 45.45 for supporting the second intermediate molded product 18 is disposed within the housing 43, and both of these support fittings 45.4
5 is a cathode (illustrated in Fig. 1). The second intermediate molded product 18 is mounted approximately at the center between the electrodes 44, 44 so that the plating chamber 49 is partitioned into a first plating chamber 46 and a second plating chamber 47 by the support fittings 45, 45.
上記第１めっき室４６には上記第１供給通路３１と第１
排出通路３３とが連結され、他方の第２めっき室４７に
は上記第２供給通路３２と第２排出通路３４とが連結さ
れる。The first plating chamber 46 includes the first supply passage 31 and the first plating chamber 46 .
The second supply passage 32 and the second discharge passage 34 are connected to the other second plating chamber 47 .
そして、上記ポンプ２８の駆動によりめっき液タンク２
６から第１供給通路３１及び第２供給通路３２を介して
本体部２５にめっき液Ｐを供給すると、めっき液Ｐは上
記第２中間成形品１８の表面に沿って流動する。The plating solution tank 2 is then driven by the pump 28.
When plating solution P is supplied from 6 to main body portion 25 through first supply passage 31 and second supply passage 32, plating solution P flows along the surface of second intermediate molded product 18.
また、上記第１めっき室４６と第２めっき室４７のめっ
き液Ｐの間には液圧差が生じさせられている。即ち、前
記第１手動弁３８の操作により第１供給通路３１の開度
が大きくされる。そのため、この第１供給通路３１を流
れるめっき掖Ｐの流量は大きく、このときの流速は例え
ば４ ｒａｇｓである（図中符号Ｆ１図示）、この場合
、第１手動弁３８での圧力損失は小さいために、このめ
っき液Ｐの圧力は大きく保たれる。Further, a liquid pressure difference is created between the plating solution P in the first plating chamber 46 and the second plating chamber 47. That is, by operating the first manual valve 38, the opening degree of the first supply passage 31 is increased. Therefore, the flow rate of the plating tank P flowing through this first supply passage 31 is large, and the flow rate at this time is, for example, 4 rags (indicated by reference numeral F1 in the figure). In this case, the pressure loss at the first manual valve 38 is small. Therefore, the pressure of this plating solution P is kept high.
一方、上記第２手動弁４１の操作により第２供給通路３
２の開度は小さくされている。そのため、この第２供給
通路３２を流れるめっき液Ｐの流量は小さく、このとき
の流速は例えば３．０ｍ／ｓである（図中符号Ｆ２図示
）。この場合、第２手動弁４１での圧力損失は大きいた
めに、上記めっき液Ｐの圧力は小さくなる。On the other hand, by operating the second manual valve 41, the second supply passage 3
The opening degree of No. 2 is set small. Therefore, the flow rate of the plating solution P flowing through the second supply passage 32 is small, and the flow velocity at this time is, for example, 3.0 m/s (indicated by reference numeral F2 in the figure). In this case, since the pressure loss at the second manual valve 41 is large, the pressure of the plating solution P becomes small.
すると、第１めっき室４６と第２めっき室４７とでは圧
力が相違するため、圧力が高い第１めっき室４６から圧
力が低い第２めっき室４７へ貫通孔１３’ を通ってめ
っき液Ｐが流動することになる（図中符号Ｆ３図示）。Then, since the pressures are different between the first plating chamber 46 and the second plating chamber 47, the plating solution P passes through the through hole 13' from the first plating chamber 46 where the pressure is high to the second plating chamber 47 where the pressure is low. It will flow (indicated by reference numeral F3 in the figure).
よって、上記第２中間成形品１８の表面においてドライ
フィルム１５で覆われていない第１銅層８表面が全体的
に新しいめっき液Ｐと接触することになる。よって、こ
の第２中間成形品１８の表面へ電解銅めっきをする場合
、この第２中間成形品１８の回路パターン溝１６の第１
銅層８上、及び貫通孔１３′の第１銅層８内周面上に短
時間で同程度の厚さの第２銅層９がめっきされる。Therefore, the entire surface of the first copper layer 8 that is not covered with the dry film 15 on the surface of the second intermediate molded product 18 comes into contact with the new plating solution P. Therefore, when performing electrolytic copper plating on the surface of this second intermediate molded product 18, the first part of the circuit pattern groove 16 of this second intermediate molded product 18
A second copper layer 9 having a similar thickness is plated on the copper layer 8 and on the inner peripheral surface of the first copper layer 8 in the through hole 13' in a short time.
（発明の効果）
この発明によれば、めっき液を被めっき板材の表面に沿
って流動させたため、被めっき板材の両面が短時間でめ
っきされる。また、被めっき板材で仕切られた両めっき
液間に液圧差を生じさせたため、めっき液は被めっき板
材で仕切られた両めっき液間の圧力の高い側から圧力の
低い側へ貫通孔を通って流動することになる。このため
、被めっき板材の貫通孔内周面においても電気めっきが
促進される。(Effects of the Invention) According to the present invention, since the plating solution is made to flow along the surface of the plate material to be plated, both sides of the plate material to be plated can be plated in a short time. In addition, because a liquid pressure difference was created between the two plating solutions separated by the plate material, the plating solution passed through the through hole from the high pressure side to the low pressure side between the two plating solutions separated by the plate material. Therefore, it will flow. Therefore, electroplating is promoted also on the inner peripheral surface of the through hole of the plate material to be plated.
図はこの発明の実施例を示し、第１図は電解銅めっき装
置の本体部の拡大断面図、第２図は電解銅めっき装置の
フローシート、第３図から第１０図はプリント配線基板
の製作手順の説明図である。
１３′ ・・貫通孔、１８・・第２中間成形品（被めっ
き板材）、２４Φ・電解銅めっき装置、２５・・本体部
、４９・・めっき室、Ｐ・・めっき液。The figures show an embodiment of the present invention, in which Fig. 1 is an enlarged sectional view of the main body of an electrolytic copper plating apparatus, Fig. 2 is a flow sheet of the electrolytic copper plating apparatus, and Figs. 3 to 10 are diagrams of a printed wiring board. It is an explanatory diagram of a manufacturing procedure. 13'... Through hole, 18... Second intermediate molded product (plate material to be plated), 24Φ, electrolytic copper plating device, 25... Main body, 49... Plating chamber, P... Plating solution.
Claims (1)
ためっき液に浸漬すると共にこのめっき液を流動させな
がらこの被めっき板材に電気めっきするに際し、上記め
っき室を被めっき板材にて２室に区画し、この被めっき
板材で仕切られた両室のめっき液間に液圧差を生じさせ
ることを特徴とする高速電気めっき方法。1. When electroplating a plate material to be plated having a through hole in the plating solution stored in the plating chamber and flowing the plating solution, the plate material to be plated is placed in the plating chamber. A high-speed electroplating method characterized by dividing the plating solution into chambers and creating a liquid pressure difference between the plating solutions in both chambers separated by the plate material to be plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60275664A JPH0765209B2 (en) | 1985-12-06 | 1985-12-06 | Electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60275664A JPH0765209B2 (en) | 1985-12-06 | 1985-12-06 | Electroplating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136588A true JPS62136588A (en) | 1987-06-19 |
| JPH0765209B2 JPH0765209B2 (en) | 1995-07-12 |
Family
ID=17558626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60275664A Expired - Fee Related JPH0765209B2 (en) | 1985-12-06 | 1985-12-06 | Electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0765209B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0599416A1 (en) * | 1992-11-23 | 1994-06-01 | Sergio Sala | Electroplating plant with opposed electrolitic cells and continuous feed of the surfaces to be treated |
| EP1087844A1 (en) * | 1998-05-13 | 2001-04-04 | Tyco Printed Circuit Group, Inc. | Apparatus and method for coating a multilayer article |
| JP2011256444A (en) * | 2010-06-10 | 2011-12-22 | Sumitomo Bakelite Co Ltd | Substrate treating method and substrate treating apparatus |
| JP2014516121A (en) * | 2011-06-09 | 2014-07-07 | ユニヴェルシテ・ドゥ・レンヌ・１ | Processing method of felt element percolation by electrodeposition |
| CN112495926A (en) * | 2020-12-02 | 2021-03-16 | 盛青永致半导体设备(苏州)有限公司 | Device and method for chemical plating or cleaning |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540676A (en) * | 1978-09-07 | 1980-03-22 | Oce Andeno Bv | Manufacture of proline derivative |
| JPS6013096A (en) * | 1983-07-04 | 1985-01-23 | Sawa Hyomen Giken Kk | Method and device for high speed electroplating |
-
1985
- 1985-12-06 JP JP60275664A patent/JPH0765209B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5540676A (en) * | 1978-09-07 | 1980-03-22 | Oce Andeno Bv | Manufacture of proline derivative |
| JPS6013096A (en) * | 1983-07-04 | 1985-01-23 | Sawa Hyomen Giken Kk | Method and device for high speed electroplating |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0599416A1 (en) * | 1992-11-23 | 1994-06-01 | Sergio Sala | Electroplating plant with opposed electrolitic cells and continuous feed of the surfaces to be treated |
| EP1087844A1 (en) * | 1998-05-13 | 2001-04-04 | Tyco Printed Circuit Group, Inc. | Apparatus and method for coating a multilayer article |
| EP1087844A4 (en) * | 1998-05-13 | 2006-10-11 | Tyco Printed Circuit Group Inc | Apparatus and method for coating a multilayer article |
| JP2011256444A (en) * | 2010-06-10 | 2011-12-22 | Sumitomo Bakelite Co Ltd | Substrate treating method and substrate treating apparatus |
| JP2014516121A (en) * | 2011-06-09 | 2014-07-07 | ユニヴェルシテ・ドゥ・レンヌ・１ | Processing method of felt element percolation by electrodeposition |
| CN112495926A (en) * | 2020-12-02 | 2021-03-16 | 盛青永致半导体设备(苏州)有限公司 | Device and method for chemical plating or cleaning |
| CN112495926B (en) * | 2020-12-02 | 2024-02-20 | 盛青永致半导体设备(苏州)有限公司 | Device and method for chemical plating or cleaning |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0765209B2 (en) | 1995-07-12 |
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