CN112495926A - Device and method for chemical plating or cleaning - Google Patents

Device and method for chemical plating or cleaning Download PDF

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Publication number
CN112495926A
CN112495926A CN202011393142.0A CN202011393142A CN112495926A CN 112495926 A CN112495926 A CN 112495926A CN 202011393142 A CN202011393142 A CN 202011393142A CN 112495926 A CN112495926 A CN 112495926A
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China
Prior art keywords
cavity
product
liquid
groove body
communicated
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Granted
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CN202011393142.0A
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Chinese (zh)
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CN112495926B (en
Inventor
许书鸣
萧标颖
王彦智
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Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
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Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
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Publication of CN112495926A publication Critical patent/CN112495926A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The invention discloses a device and a method for chemical plating or cleaning. The device comprises a groove body and a product placing frame which is detachably inserted into the groove body, the device has a working state, when the device is in the working state, the product placing frame is inserted into the groove body, a first cavity is formed on one side of the product placing frame, a second cavity is formed on the other side of the product placing frame, and the first cavity and the second cavity can be communicated through a through hole in a product; the device still includes: a liquid flow mechanism having a liquid inlet and a liquid outlet; one of the first cavity and the second cavity is communicated with the liquid inlet, and the other one is communicated with the liquid outlet; when the device is in the working state, a pressure difference exists between the first cavity and the second cavity. The invention aims at the chemical plating and cleaning of the product with the through hole with the high aspect ratio, solves the problem that the chemical plating solution or cleaning solution is difficult to enter the through hole with the high aspect ratio, and improves the quality of the plated film.

Description

Device and method for chemical plating or cleaning
Technical Field
The invention belongs to the field of chemical plating, and relates to a device and a method for chemical plating or cleaning.
Background
Circuit boards are one of the key components of electronic products, and it is usually necessary to provide internal conductive structures (e.g., conductive vias) in the circuit boards to establish electrical connection between internal circuits or between internal circuits and external circuits. However, as electronic products increasingly emphasize miniaturization and multi-functional design, the size of the circuit board, which is connected with its circuitry and internal conductive structures, must also be continuously reduced. Existing electroless plating techniques still face challenges in forming high aspect ratio internal conductive structures. For example, as the aperture of the via is smaller and the aspect ratio is larger, the electroless plating solution is difficult to enter the via by diffusion, and even more, the via is usually air-blocked.
In order to solve the above problems, although the conventional electroless plating techniques mostly adopt jet flow, bubble generation and other methods to disturb the electroless plating solution, the disturbance range generated by these methods is too small, the electroless plating solution is not easy to enter the through hole for plating metal, and the conductive structure in the through hole has defects (the conductive structure is discontinuous). In the cleaning process, the problem that cleaning liquid is difficult to enter into the through holes with high aspect ratio also exists, and the cleaning effect is not ideal.
Therefore, an innovative electroless plating technology is needed to ensure that electroless plating solution or cleaning solution enters the through hole with high aspect ratio to obtain a high-quality through hole product with high aspect ratio.
Disclosure of Invention
In view of the above technical problems, an object of the present invention is to provide an apparatus and a method for electroless plating or cleaning, which solves the problem that an electroless plating solution or a cleaning solution is difficult to enter a through hole with a high aspect ratio for electroless plating and cleaning of a product with a through hole with a high aspect ratio, and improves the quality of a plated film.
In order to achieve the purpose, the invention adopts the technical scheme that:
a device for chemical plating or cleaning comprises a groove body and a product placing frame detachably inserted into the groove body, and has a working state, when the device is in the working state, the product placing frame is inserted into the groove body, a first cavity is formed on one side of the product placing frame, a second cavity is formed on the other side of the product placing frame, and the first cavity and the second cavity can be communicated through holes on products; the device further comprises:
a liquid flow mechanism having a liquid inlet and a liquid outlet;
one of the first cavity and the second cavity is communicated with the liquid inlet, and the other one is communicated with the liquid outlet;
when the device is in the working state, a pressure difference exists between the first cavity and the second cavity.
Preferably, the liquid flow mechanism comprises a first liquid flow mechanism and a second liquid flow mechanism, the first liquid flow mechanism is provided with a first liquid inlet communicated to the first cavity and a first liquid discharge port communicated to the second cavity, and the second liquid flow mechanism is provided with a second liquid inlet communicated to the second cavity and a second liquid discharge port communicated to the first cavity.
Preferably, the liquid flow mechanism further comprises a liquid inlet pipe and a liquid outlet pipe, the liquid inlet is formed on the liquid inlet pipe, and the liquid outlet is formed on the liquid outlet pipe.
More preferably, the liquid flow mechanism further comprises a drain valve disposed on the drain pipe.
Preferably, the liquid flowing mechanism further comprises a plurality of flushing nozzles for spraying the plating solution or the cleaning liquid to the products on the product placement frame.
Preferably, the product placing frame is slidably inserted into the groove wall of the groove body, and a sealing plate is arranged on the product placing frame; the first cavity is formed between one side surface of the product placing rack and the groove body, and the second cavity is formed between the other side surface of the product placing rack and the groove body.
Preferably, the device further comprises additional means for applying pressure to the liquid in the chamber at the higher level.
More preferably, the additional mechanism comprises an oscillation source disposed on or within the tank body. The oscillation source includes, but is not limited to, an ultrasonic oscillation generator.
More preferably, the additional mechanism comprises a piston movably arranged in the first cavity or the second cavity and a driving mechanism for driving the piston to move.
Further, the groove body comprises an outer groove body and an inner groove body movably arranged in the outer groove body, the piston is located in the inner groove body, when the device is in a working state, the inner groove body is tightly attached to one side surface of the product placing frame to form the first cavity or the second cavity, the liquid inlet is formed in the inner groove body, and the liquid outlet is formed in the outer groove body.
The invention also adopts the following technical scheme:
a method for electroless plating or cleaning comprising the steps of:
A. providing a product having a through hole;
B. mounting the product to a product mounting bracket;
C. inserting a product placing rack provided with products into a groove body, so that a first cavity is formed between one side of the product placing rack and the groove body, and a second cavity is formed between the other side of the product placing rack and the groove body;
D. introducing a plating solution or a cleaning solution into the first cavity, and allowing the plating solution or the cleaning solution to flow into the second cavity through the through hole on the product by pressure difference to discharge the plating solution or the cleaning solution in the second cavity;
E. and introducing a plating solution or a cleaning solution into the second cavity, and allowing the plating solution or the cleaning solution to flow into the first cavity through the through hole on the product by pressure difference to discharge the plating solution or the cleaning solution in the first cavity.
Preferably, in the step D, a vibration wave or a thrust force toward the second cavity is further applied to the plating solution or the cleaning solution in the first cavity. The vibration waves include, but are not limited to, ultrasonic waves.
Preferably, in the step E, a vibration wave or a thrust force toward the first cavity is further applied to the plating solution or the cleaning solution in the second cavity. The vibration waves include, but are not limited to, ultrasonic waves.
Herein, products include, but are not limited to, substrates, wafers, PCBs, and glass, the products having through-holes with aspect ratios greater than or equal to 20.
In the present invention, the pressure difference includes a hydraulic pressure difference formed by a liquid level difference, and may further include a pressure difference formed by an oscillation source, a thrust force, or the like.
Compared with the prior art, the invention has the following advantages by adopting the scheme:
in the device and the method, the plating solution or the cleaning solution is driven by the pressure difference to alternately pass through the through hole on the product from left to right and from right to left, so that the problem that the liquid flow is difficult to enter the through hole with the high depth-width ratio of the product can be effectively solved, the coating quality is improved, and the condition that the coating thickness is not uniform or the coating is disconnected discontinuously is avoided.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic perspective view of an apparatus according to example 1 of the present invention;
FIG. 2 is a front view of an apparatus according to embodiment 1 of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is an enlarged view of a portion of FIG. 3 at B;
fig. 5 is a schematic structural view of a product placement frame according to embodiment 1 of the present invention;
fig. 6 is a cross-sectional view of an apparatus according to embodiment 2 of the present invention.
Wherein:
10. a trough body; 101. a first cavity; 102. a second cavity; 11. placing a product rack; 111. a guide piece; 112. a sealing plate; 113. hooking; 12. producing a product; 13. a fluid flow mechanism; 130. a first liquid inlet pipe; 131. a second liquid inlet pipe; 132. a first liquid inlet; 133. a second liquid inlet; 134. flushing the nozzle; 135. a first drain pipe; 136. a second drain pipe; 137. a drain valve; 14. an oscillation source; 141. a seal ring; 15. liquid level;
20. a trough body; 201. a first cavity; 202. a second cavity; 203. an outer tank body; 204. a first inner tank body; 205. a second inner tank body; 206. an inner groove seal ring; 207. an inner groove driving cylinder; 21. placing a product rack; 231. a first liquid inlet; 232. a second liquid inlet; 233. a liquid discharge port; 234. a gap; 251. a first piston; 252. a second piston; 253. a piston seal ring; 254. the piston drives a cylinder.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the invention may be more readily understood by those skilled in the art. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
It should be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used primarily to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
Example 1
The embodiment provides an electroless plating device which is used for performing electroless plating on a product and cleaning the product after a metal layer is formed, wherein the product is provided with a through hole with an aspect ratio of more than or equal to 20. Products in this embodiment include, but are not limited to, substrates, wafers, PCBs, and glass.
Referring to fig. 1 to 5, the chemical plating apparatus includes a bath body 10 and a product rack 11 detachably inserted in the bath body 10. The electroless plating apparatus has an operating state and a standby ready state. When the chemical plating device is in a working state, the product placing frame 11 is inserted into the tank 10, the products 12 are placed in the product placing frame 11, a first cavity 101 is formed on one side of the product placing frame 11, a second cavity 102 is formed on the other side of the product placing frame 11, the first cavity 101 and the second cavity 102 are spaced apart through the product placing frame 11 and the products 12 thereon, and the first cavity 101 and the second cavity 102 can be communicated through holes in the products 12. More preferably, the product placing frame 11 and the trough 10 are sealed, the product 12 and the product placing frame 11 are sealed, and the first cavity 101 and the second cavity 102 can only be communicated through a through hole on the product 12. When the electroless plating apparatus is in the standby ready state, the product placement frame 11 is detached from the tank 10, thereby facilitating the loading and unloading of the products 12.
The electroless plating apparatus further includes a liquid flow mechanism 13 through which the plating solution or the cleaning solution flows. The liquid flow mechanism 13 has a liquid inlet and a liquid outlet. One of the first cavity 101 and the second cavity 102 is communicated with the liquid inlet, and the other is communicated with the liquid outlet; moreover, when the electroless plating apparatus is in an operating state, a pressure difference exists between the first chamber 101 and the second chamber 102 (e.g., a pressure difference is formed due to a liquid level difference), so as to drive the plating solution or the cleaning solution to flow through the through hole of the product 12. As shown in fig. 3, the plating solution or the cleaning solution enters the first chamber 101 such that the liquid level 15 of the first chamber 101 is higher than that of the second chamber 102, flows into the second chamber 102 through the through hole under the action of the pressure difference, and is then discharged from the second chamber 102. Or, the plating solution or the cleaning solution enters the second cavity 102 to make the liquid level of the second cavity 102 higher than that of the first cavity 101, flows into the first cavity 101 through the through hole under the action of the pressure difference, and is then discharged from the first cavity 101.
Further, the fluid mechanism 13 of the present embodiment includes a first fluid mechanism corresponding to the first cavity 101 and a second fluid mechanism corresponding to the second cavity 102. The first liquid flow mechanism has a first liquid inlet 132 communicated to the first cavity 101 and a first liquid discharge port communicated to the second cavity 102. The second liquid flow mechanism has a second liquid inlet 133 communicated to the second cavity 102 and a second liquid outlet communicated to the first cavity 101. The first and second flow means operate alternately, i.e. one of the flow means 13 is operated and the other flow means 13 is stopped. The first liquid flow mechanism further includes a first liquid inlet pipe 130 and a first liquid discharge pipe 135, the first liquid inlet 132 is formed on the first liquid inlet pipe 130, and the first liquid discharge port is formed on the first liquid discharge pipe 135. The second fluid flowing mechanism further comprises a second fluid inlet pipe 131 and a second fluid outlet pipe 136, wherein the second fluid inlet pipe 133 is formed on the second fluid inlet pipe 131, and the second fluid outlet is formed on the second fluid outlet pipe 136. The liquid flow mechanism 13 further includes a liquid discharge valve 137 provided in each of the first liquid discharge pipe 135 and the second liquid discharge pipe 136. The drain valves 137 are electrically connected with a controller of the chemical plating apparatus, and the controller automatically controls the opening and closing of the two drain valves 137.
The liquid flow mechanism 13 further comprises a plurality of flushing nozzles 134, a part of the flushing nozzles 134 being located in the first chamber 101 and another part of the flushing nozzles 134 being located in the second chamber 102. Further, the plurality of washing nozzles 134 in each cavity are arranged at equal intervals, each washing nozzle 134 has a liquid outlet which faces the product placement frame 11 and faces obliquely downward, and an included angle (for example, 45 degrees) smaller than 90 degrees is formed between the center line of the liquid outlet and the plane where the product placement frame 11 is located. The liquid inlet may be in communication with a rinse nozzle 134 for spraying a plating solution or cleaning solution into the chamber.
In this embodiment, the product placing rack 11 is slidably inserted into the slot wall of the slot body 10. After the product placing frame 11 is inserted into the groove body 10, the groove body 10 is divided into a left cavity and a right cavity, namely: the first cavity 101 is formed between the left side surface of the product placement frame 11 and the left side slot 10, and the second cavity 102 is formed between the right side surface of the product placement frame 11 and the right side slot 10.
As shown in fig. 5, a hollow portion for accommodating the product 12 is provided at the middle portion of the product placement frame 11, the product 12 is fixed at the hollow portion, and at least a portion of the left side surface and the right side surface is exposed to contact with the plating solution or the cleaning solution. The front and rear sides of the product rack 11 are respectively formed with guide pieces 111 extending in the vertical direction, the front and rear sides of the tank 10 are respectively provided with slots, and the guide pieces 111 at both sides are respectively inserted into the slots in a detachable manner. Further, a sealing plate 112 is provided on the product placement frame 11 to seal between the trough 10 and the product placement frame 11, and between the product 12 and the product placement frame 11. In addition, the product placement frame 11 may be a hanger, and a hook 113 is provided at an upper portion thereof.
The electroless plating apparatus also includes an additional mechanism for further applying pressure to the liquid in the higher pressure (i.e., higher liquid level) chamber. The additional mechanism comprises one or more oscillation sources 14, the oscillation sources 14 emit vibration waves (such as ultrasonic waves), the vibration waves act on the plating solution or the cleaning solution, and the oscillation sources 14 can be arranged on the tank body 10 or in the tank body 10. As shown in fig. 1, 3 and 4, the number of the oscillation sources 14 is plural, wherein one part of the oscillation sources corresponds to the first cavity 101 for oscillating the liquid in the first cavity 101, and the other part corresponds to the second cavity 102 for oscillating the liquid in the second wall. For example, four oscillation sources 14 are uniformly arranged on the left side wall of the tank 10, and the other four oscillation sources 14 are uniformly arranged on the right side wall of the tank 10. Further, the oscillation source 14 is provided on the left/right side groove walls of the groove body 10 via a seal ring 141.
The embodiment also provides an electroless plating method which can adopt the electroless plating device. The chemical plating method comprises the following steps:
s100, providing a product 12 with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s101, mounting the product 12 on a product 12 mounting rack;
s102, inserting the product placement rack 11 provided with the products 12 into the trough body 10, so that a first cavity 101 is formed between one side of the product placement rack 11 and the trough body 10, and a second cavity 102 is formed between the other side of the product placement rack 11 and the trough body 10;
s103, introducing a plating solution into the first cavity 101, applying vibration waves to the plating solution in the first cavity 101, allowing the plating solution to flow into the second cavity 102 through the through holes in the product 12 by using pressure difference, and discharging the plating solution (flowing along the arrow in FIG. 3) in the second cavity 102;
s104, introducing a plating solution into the second cavity 102, applying vibration waves to the plating solution in the second cavity 102, enabling the plating solution to flow into the first cavity 101 through the through holes in the product 12 through pressure difference, and discharging the plating solution in the first cavity 101.
The above steps S103 and S104 may be sequentially and cyclically performed a plurality of times.
The embodiment also provides a cleaning method, which can adopt the chemical plating device. The cleaning method comprises the following steps:
s200, providing a product 12 with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s201, mounting the product 12 on a product 12 mounting frame;
s202, inserting the product placement rack 11 provided with the products 12 into the trough body 10, so that a first cavity 101 is formed between one side of the product placement rack 11 and the trough body 10, and a second cavity 102 is formed between the other side of the product placement rack 11 and the trough body 10;
s203, introducing cleaning liquid into the first cavity 101, applying vibration waves to the cleaning liquid in the first cavity 101, enabling the cleaning liquid to flow into the second cavity 102 through the through holes in the product 12 through pressure difference, and discharging the cleaning liquid in the second cavity 102 (along the flow direction shown by the arrow in FIG. 3);
s204, introducing the cleaning liquid into the second cavity 102, applying vibration waves to the cleaning liquid in the second cavity 102, enabling the cleaning liquid to flow into the first cavity 101 through the through holes in the product 12 through pressure difference, and discharging the cleaning liquid in the first cavity 101.
The above steps S203 and S204 may be sequentially and cyclically performed a plurality of times.
In the device and the method of the embodiment, the liquid flow (plating solution or cleaning solution) is driven by the pressure difference to alternately pass through the through hole on the product from left to right and from right to left, and the vibration wave is further matched, so that the problem that the liquid flow is difficult to enter the through hole with the high depth-to-width ratio of the product can be effectively solved, and the coating quality is improved.
Example 2
The embodiment provides an electroless plating device which is used for performing electroless plating on a product and cleaning the product after a metal layer is formed, wherein the product is provided with a through hole with an aspect ratio of more than or equal to 20. Products in this embodiment include, but are not limited to, substrates, wafers, PCBs, and glass.
Referring to fig. 6, the electroless plating apparatus includes a tank 20 and a product rack 21 detachably inserted in the tank 20. The electroless plating apparatus has an operating state and a standby ready state. When the chemical plating device is in an operating state, the product placing frame 21 is inserted into the tank body 20, the product is placed in the product placing frame, a first cavity 201 is formed on one side of the product placing frame 21, a second cavity 202 is formed on the other side of the product placing frame 21 (one of the cavities is a closed cavity which is only communicated with the outside through a through hole in the product, and the other cavity is an open cavity), and the first cavity 201 and the second cavity 202 can be communicated through the through hole in the product. When the chemical plating apparatus is in a standby ready state, the product placement frame 21 is separated from the tank body 20, thereby facilitating the loading and unloading of the product. The structure of the product placement frame 21 is the same as that of embodiment 1.
As shown in fig. 2, the tank 20 includes an outer tank 203 and an inner tank movably disposed in the outer tank 203. The inner tank body specifically comprises a first inner tank body 204 and a second inner tank body 205 which are arranged oppositely, the first inner tank body 204 can be arranged on the left side of the outer tank body 203 in a left-right moving mode, and the second inner tank body 205 can be arranged on the right side of the outer tank body 203 in a left-right moving mode. When the chemical plating device is in a working state, the first inner tank body 204 is tightly attached to the left side surface of the product placement frame 21 to form a first cavity 201, a second cavity 202 is formed between the second inner tank body 205 and the right side surface of the product placement frame 21, and a gap 234 can be formed between the second inner tank body 205 and the right side surface of the product placement frame 21, so that plating solution or cleaning solution entering the second cavity 202 flows into the outer tank body 203; or, the second inner tank body 205 is tightly attached to the right side surface of the product placement frame 21 to form the second cavity 202, the first cavity 201 is formed between the first inner tank body 204 and the left side surface of the product placement frame 21, and a gap may be formed between the first inner tank body 204 and the left side surface of the product placement frame 21, so that the plating solution or the cleaning solution entering the first cavity 201 flows into the outer tank body 203.
The chemical plating device also comprises a liquid flow mechanism for the circulation of plating solution or cleaning solution. The liquid flow mechanism is provided with a liquid inlet and a liquid outlet. One of the first cavity 201 and the second cavity 202 is communicated with the liquid inlet, and the other is communicated with the liquid outlet (specifically communicated through the gap); moreover, when the electroless plating apparatus is in an operating state, a pressure difference exists between the first cavity 201 and the second cavity 202, so that the plating solution or the cleaning solution is driven to flow through the through hole on the product. The plating solution or the cleaning solution enters the first cavity 201 to make the liquid level of the first cavity 201 higher than that of the second cavity 202, flows into the second cavity 202 through the through hole under the action of pressure difference, and is then discharged from the second cavity 202. Or, the plating solution or the cleaning solution enters the second cavity 202 to make the liquid level of the second cavity 202 higher than that of the first cavity 201, flows into the first cavity 201 through the through hole under the action of the pressure difference, and is then discharged from the first cavity 201.
Further, a first liquid inlet 231 is formed in the first inner tank 204, a second liquid inlet 232 is formed in the second inner tank 205, and the first liquid inlet 231 and the second liquid inlet 232 alternately operate, that is, when one of the liquid inlets is filled with liquid, the other liquid inlet stops being filled with liquid. The liquid outlet is arranged on the outer groove body 203 and is communicated with the second cavity 202 through a gap between the second inner groove body 205 and the product placing frame 21 or communicated with the first cavity 201 through a gap between the first inner groove body 204 and the product placing frame 21.
The electroless plating apparatus also includes an additional mechanism for further applying pressure to the liquid in the chamber at the higher liquid level. The additional mechanism comprises a piston movably arranged in the first cavity 201 or the second cavity 202 and a driving mechanism for driving the piston to move. As shown in fig. 6, the first inner groove 204 is provided with a first piston 251, and the second inner groove 205 is provided with a second piston 252. The driving mechanism comprises piston driving cylinders 254 respectively arranged on the groove walls of the first inner groove body 204 and the second inner groove body 205, and piston rods of the piston driving cylinders 254 are respectively connected with the first piston 251/the second piston 252.
The end faces of the first inner tank body 204 and the second inner tank body 205 are respectively provided with an inner tank sealing ring 206, and the inner tank sealing ring 206 is in a closed ring shape and is used for sealing the first inner tank body 204 and the product placing frame 21 to form a first cavity 201 or sealing the second inner tank body 205 and the product placing frame 21 to form a second cavity 202. A piston sealing ring 253 is arranged between the first piston 251 and the inner wall of the first inner groove body 204; a piston seal 253 is arranged between the second piston 252 and the inner wall of the second inner groove body 205.
The chemical plating device also comprises a plurality of inner groove driving cylinders 207 for driving the first inner groove body 204 or the second inner groove body 205 to move. Part of the inner groove driving cylinders 207 are disposed on the left side groove wall of the outer groove body 203 and the piston rods thereof are connected with the first inner groove body 204, and the other part of the inner groove driving cylinders 207 are disposed on the right side groove wall of the outer groove body 203 and the piston rods thereof are connected with the second inner groove body 205.
The embodiment also provides an electroless plating method which can adopt the electroless plating device. The chemical plating method comprises the following steps:
s300, providing a product with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s301, mounting a product on a product mounting rack;
s302, inserting the product placement frame 21 with the products installed between the first inner trough body 204 and the second inner trough body 205;
s303, driving the first inner trough body 204 to move towards the product placement frame 21, so that a cavity on one side of the product placement frame 21 is substantially sealed by the first inner trough body 204 to form a first cavity 201, and a cavity between the other side of the product placement frame 21 and the trough body 20 is an open second cavity 202;
s304, introducing a plating solution into the first cavity 201, driving the first piston 251 to move towards the product placement frame 21 to apply thrust to the plating solution in the first cavity 201, so that the plating solution flows into the second cavity 202 through the through hole on the product, and is discharged through the gap 234 between the second inner tank body 205 and the product placement frame 21 and the liquid discharge port 233 on the outer tank body 203;
s305, driving the first inner slot 204 to be away from the product placement frame 21 and have a gap (i.e., the first cavity 201 is an open cavity), and driving the second inner slot 205 to move toward the product placement frame 21, so that the cavity on the other side of the product placement frame 21 is substantially sealed by the second inner slot 205 to form the second cavity 202;
s306, introducing a plating solution into the second cavity 202, driving the second piston 252 to move towards the product placement frame 21 so as to apply thrust to the plating solution in the second cavity 202, so that the plating solution flows into the first cavity 201 through the through hole on the product, and the plating solution is discharged through the gap between the first inner tank body 204 and the product placement frame 21 and the liquid discharge port on the outer tank body 203.
The above steps S303 to S306 may be performed sequentially and cyclically a plurality of times.
The embodiment also provides a cleaning method, which can adopt the chemical plating device. The cleaning method comprises the following steps:
s400, providing a product with a through hole, wherein the depth-to-width ratio of the through hole is greater than or equal to 20;
s401, mounting a product on a product mounting rack;
s402, inserting the product placing rack 21 with the products into the space between the first inner trough body 204 and the second inner trough body 205;
s403, driving the first inner trough body 204 to move towards the product placement frame 21, so that the cavity on one side of the product placement frame 21 is substantially sealed by the first inner trough body 204 to form a first cavity 201, and the cavity between the other side of the product placement frame 21 and the trough body 20 is an open second cavity 202;
s404, introducing a cleaning solution into the first cavity 201, driving the first piston 251 to move towards the product placement frame 21 so as to apply a thrust to the cleaning solution in the first cavity 201, so that the cleaning solution flows into the second cavity 202 through the through hole in the product, and the cleaning solution is discharged through the gap 234 between the second inner trough body 205 and the product placement frame 21 and the liquid discharge port 233 on the outer trough body 203;
s405, driving the first inner trough body 204 to be far away from the product placement frame 21 and have a gap (namely, the first cavity 201 is an open cavity), and driving the second inner trough body 205 to move towards the product placement frame 21, so that the cavity on the other side of the product placement frame 21 is substantially sealed by the second inner trough body 205 to form a second cavity 202;
s406, introducing a cleaning solution into the second cavity 202, driving the second piston 252 to move toward the product placement frame 21 to apply a pushing force to the cleaning solution in the second cavity 202, so that the cleaning solution flows into the first cavity 201 through the through hole on the product, and the cleaning solution is discharged through the gap between the first inner trough body 204 and the product placement frame 21 and the liquid discharge port 233 on the outer trough body 203.
The above steps S403 to S406 may be performed sequentially and cyclically a plurality of times.
In the device and the method of the embodiment, the liquid flow (plating solution or cleaning solution) is driven by the pressure difference to alternately pass through the through hole on the product from left to right and from right to left, and the thrust exerted by the piston is further matched, so that the problem that the liquid flow is difficult to enter the through hole with the high depth-to-width ratio of the product can be effectively solved, and the coating quality is improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are preferred embodiments, which are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (10)

1. The utility model provides a be used for chemical plating or abluent device, includes cell body and can liftoff insert locate the product rack in the cell body which characterized in that: the device has a working state, when the device is in the working state, the product placing rack is inserted into the groove body, a first cavity is formed on one side of the product placing rack, a second cavity is formed on the other side of the product placing rack, and the first cavity and the second cavity can be communicated through a through hole in a product; the device further comprises:
a liquid flow mechanism having a liquid inlet and a liquid outlet;
one of the first cavity and the second cavity is communicated with the liquid inlet, and the other one is communicated with the liquid outlet;
when the device is in the working state, a pressure difference exists between the first cavity and the second cavity.
2. The apparatus of claim 1, wherein: the liquid flow mechanism comprises a first liquid flow mechanism and a second liquid flow mechanism, the first liquid flow mechanism is provided with a first liquid inlet communicated to the first cavity and a first liquid discharge port communicated to the second cavity, and the second liquid flow mechanism is provided with a second liquid inlet communicated to the second cavity and a second liquid discharge port communicated to the first cavity.
3. The apparatus of claim 1 or 2, wherein: the liquid flow mechanism further comprises a liquid inlet pipe and a liquid discharge pipe, the liquid inlet is formed on the liquid inlet pipe, and the liquid discharge port is formed on the liquid discharge pipe.
4. The apparatus of claim 1, wherein: the product placing frame is slidably inserted into the groove wall of the groove body, and a sealing plate is arranged on the product placing frame; the first cavity is formed between one side surface of the product placing rack and the groove body, and the second cavity is formed between the other side surface of the product placing rack and the groove body.
5. The apparatus of claim 1, wherein: the device further comprises additional means for applying pressure to the liquid in the chamber where the liquid level is high.
6. The apparatus of claim 5, wherein: the additional mechanism comprises an oscillation source which is arranged on the tank body or in the tank body.
7. The apparatus of claim 5, wherein: the additional mechanism comprises a piston movably arranged in the first cavity or the second cavity and a driving mechanism used for driving the piston to move.
8. The apparatus of claim 7, wherein: the groove body comprises an outer groove body and an inner groove body movably arranged in the outer groove body, the piston is located in the inner groove body, when the device is in a working state, the inner groove body is tightly attached to one side surface of the product placing frame to form the first cavity or the second cavity, the liquid inlet is arranged on the inner groove body, and the liquid outlet is arranged on the outer groove body.
9. A method for electroless plating or cleaning, comprising the steps of:
A. providing a product having a through hole;
B. mounting the product to a product mounting bracket;
C. inserting a product placing rack provided with products into a groove body, so that a first cavity is formed between one side of the product placing rack and the groove body, and a second cavity is formed between the other side of the product placing rack and the groove body;
D. introducing a plating solution or a cleaning solution into the first cavity, and allowing the plating solution or the cleaning solution to flow into the second cavity through the through hole on the product by pressure difference to discharge the plating solution or the cleaning solution in the second cavity;
E. and introducing a plating solution or a cleaning solution into the second cavity, and allowing the plating solution or the cleaning solution to flow into the first cavity through the through hole on the product by pressure difference to discharge the plating solution or the cleaning solution in the first cavity.
10. The method according to claim 9, wherein step D further comprises applying a vibration wave or a pushing force towards the second chamber to the plating solution or the cleaning solution in the first chamber; and/or applying a vibration wave or a thrust force towards the first cavity to the plating solution or the cleaning solution in the second cavity in the step E.
CN202011393142.0A 2020-12-02 2020-12-02 Device and method for chemical plating or cleaning Active CN112495926B (en)

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Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8515048D0 (en) * 1985-07-16 1985-07-17 Kazuo Kay Metal plating
JPS60177195A (en) * 1984-02-22 1985-09-11 Sukeo Kai Plating method of wiring board having through-hole
JPS62136588A (en) * 1985-12-06 1987-06-19 Yamaha Motor Co Ltd High-speed electroplating method
US4734296A (en) * 1982-09-27 1988-03-29 Etd Technology, Inc. Electroless plating of through-holes using pressure differential
JPH02241088A (en) * 1989-03-15 1990-09-25 Hitachi Ltd Treatment in hole and device therefor
JPH0610194A (en) * 1992-06-30 1994-01-18 Nec Corp Plating device
JPH0881799A (en) * 1994-09-14 1996-03-26 Ibiden Co Ltd Electroplating method, electroplating device and electroplating rack
JP2000064088A (en) * 1998-08-11 2000-02-29 Ebara Yuujiraito Kk Plating device of printed circuit board
JP2005144230A (en) * 2003-11-11 2005-06-09 Takenaka Komuten Co Ltd Filtration device
US20070151845A1 (en) * 2005-12-29 2007-07-05 Chieh-Kai Chang Apparatus for forming metal film
CN201729900U (en) * 2010-05-11 2011-02-02 上海元豪表面处理有限公司 Plating bath for high-speed plating of microelectronic element framework
WO2011105072A1 (en) * 2010-02-24 2011-09-01 住友ベークライト株式会社 Substrate treating method and substrate treating apparatus
JP2011176085A (en) * 2010-02-24 2011-09-08 Sumitomo Bakelite Co Ltd Substrate treating method, and substrate treating apparatus
JP2011256444A (en) * 2010-06-10 2011-12-22 Sumitomo Bakelite Co Ltd Substrate treating method and substrate treating apparatus
CN102791085A (en) * 2012-08-24 2012-11-21 电子科技大学 Method for electro-coppering through hole of printed circuit board
CN104028022A (en) * 2014-05-27 2014-09-10 大庆高新区百世环保科技开发有限公司 Pulse backflushing bag-type sewage fine filter device
CN104843636A (en) * 2015-03-20 2015-08-19 华东师范大学 Method and device for liquid flow deposition of film on inner wall of silicon micro-channel by utilizing improved differential pressure method
CN105080196A (en) * 2015-07-16 2015-11-25 中国中元国际工程有限公司 Energy-storage backblowing filter, and filtration and filtration-regeneration method thereof
JP2015229146A (en) * 2014-06-05 2015-12-21 栗田工業株式会社 Cleaning method of membrane module
CN106492248A (en) * 2016-12-27 2017-03-15 郑州搜趣信息技术有限公司 A kind of medical apparatus and instruments wash cycles decontaminating apparatuss
CN206467319U (en) * 2017-01-22 2017-09-05 深圳市永利电镀制品有限公司 Electroplate the telescopic electroplating unit of tank
CN206631290U (en) * 2017-04-05 2017-11-14 邯郸鑫盛能源科技有限公司 A kind of backwash filter
CN108295529A (en) * 2018-03-01 2018-07-20 同济大学 Seawater filtering device is cleaned in energy storage
CN207872665U (en) * 2017-12-18 2018-09-18 力瑞信（深圳）科技有限公司 A kind of steel mesh cleaning machine
US20180291521A1 (en) * 2017-04-07 2018-10-11 Ebara Corporation Electroplating apparatus and cleaning method in electroplating apparatus
JP2019099845A (en) * 2017-11-29 2019-06-24 株式会社トクヤマ Electrolysis cell
CN210788464U (en) * 2019-09-11 2020-06-19 首钢集团有限公司 Pipeline slag removal device
CN214052876U (en) * 2020-12-02 2021-08-27 盛青永致半导体设备(苏州)有限公司 Device for chemical plating or cleaning

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734296A (en) * 1982-09-27 1988-03-29 Etd Technology, Inc. Electroless plating of through-holes using pressure differential
JPS60177195A (en) * 1984-02-22 1985-09-11 Sukeo Kai Plating method of wiring board having through-hole
GB8515048D0 (en) * 1985-07-16 1985-07-17 Kazuo Kay Metal plating
JPS62136588A (en) * 1985-12-06 1987-06-19 Yamaha Motor Co Ltd High-speed electroplating method
JPH02241088A (en) * 1989-03-15 1990-09-25 Hitachi Ltd Treatment in hole and device therefor
JPH0610194A (en) * 1992-06-30 1994-01-18 Nec Corp Plating device
JPH0881799A (en) * 1994-09-14 1996-03-26 Ibiden Co Ltd Electroplating method, electroplating device and electroplating rack
JP2000064088A (en) * 1998-08-11 2000-02-29 Ebara Yuujiraito Kk Plating device of printed circuit board
JP2005144230A (en) * 2003-11-11 2005-06-09 Takenaka Komuten Co Ltd Filtration device
US20070151845A1 (en) * 2005-12-29 2007-07-05 Chieh-Kai Chang Apparatus for forming metal film
WO2011105072A1 (en) * 2010-02-24 2011-09-01 住友ベークライト株式会社 Substrate treating method and substrate treating apparatus
JP2011176085A (en) * 2010-02-24 2011-09-08 Sumitomo Bakelite Co Ltd Substrate treating method, and substrate treating apparatus
CN201729900U (en) * 2010-05-11 2011-02-02 上海元豪表面处理有限公司 Plating bath for high-speed plating of microelectronic element framework
JP2011256444A (en) * 2010-06-10 2011-12-22 Sumitomo Bakelite Co Ltd Substrate treating method and substrate treating apparatus
CN102791085A (en) * 2012-08-24 2012-11-21 电子科技大学 Method for electro-coppering through hole of printed circuit board
CN104028022A (en) * 2014-05-27 2014-09-10 大庆高新区百世环保科技开发有限公司 Pulse backflushing bag-type sewage fine filter device
JP2015229146A (en) * 2014-06-05 2015-12-21 栗田工業株式会社 Cleaning method of membrane module
CN104843636A (en) * 2015-03-20 2015-08-19 华东师范大学 Method and device for liquid flow deposition of film on inner wall of silicon micro-channel by utilizing improved differential pressure method
CN105080196A (en) * 2015-07-16 2015-11-25 中国中元国际工程有限公司 Energy-storage backblowing filter, and filtration and filtration-regeneration method thereof
CN106492248A (en) * 2016-12-27 2017-03-15 郑州搜趣信息技术有限公司 A kind of medical apparatus and instruments wash cycles decontaminating apparatuss
CN206467319U (en) * 2017-01-22 2017-09-05 深圳市永利电镀制品有限公司 Electroplate the telescopic electroplating unit of tank
CN206631290U (en) * 2017-04-05 2017-11-14 邯郸鑫盛能源科技有限公司 A kind of backwash filter
US20180291521A1 (en) * 2017-04-07 2018-10-11 Ebara Corporation Electroplating apparatus and cleaning method in electroplating apparatus
JP2019099845A (en) * 2017-11-29 2019-06-24 株式会社トクヤマ Electrolysis cell
CN207872665U (en) * 2017-12-18 2018-09-18 力瑞信（深圳）科技有限公司 A kind of steel mesh cleaning machine
CN108295529A (en) * 2018-03-01 2018-07-20 同济大学 Seawater filtering device is cleaned in energy storage
CN210788464U (en) * 2019-09-11 2020-06-19 首钢集团有限公司 Pipeline slag removal device
CN214052876U (en) * 2020-12-02 2021-08-27 盛青永致半导体设备(苏州)有限公司 Device for chemical plating or cleaning

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
崔春亮;雷建花;阿不都沙拉木;: "自主研发的自动清洗网式过滤器", 节水灌溉, no. 10 *
谢波;刘云怒;: "QDQ2-1型水电解装置的自动化设计改造", 内江科技, no. 01 *

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