GB8515048D0 - Metal plating - Google Patents

Metal plating

Info

Publication number
GB8515048D0
GB8515048D0 GB858515048A GB8515048A GB8515048D0 GB 8515048 D0 GB8515048 D0 GB 8515048D0 GB 858515048 A GB858515048 A GB 858515048A GB 8515048 A GB8515048 A GB 8515048A GB 8515048 D0 GB8515048 D0 GB 8515048D0
Authority
GB
United Kingdom
Prior art keywords
metal plating
plating
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB858515048A
Other versions
GB2181743A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAZUO KAY
Original Assignee
KAZUO KAY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAZUO KAY filed Critical KAZUO KAY
Publication of GB8515048D0 publication Critical patent/GB8515048D0/en
Publication of GB2181743A publication Critical patent/GB2181743A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0753—Reversing fluid direction, e.g. in holes
GB08515048A 1985-07-16 1985-06-13 Metal plating of through holes in printed circuit boards Withdrawn GB2181743A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853525342 DE3525342A1 (en) 1985-07-16 1985-07-16 PLATING METHOD FOR A WIRING SUBSTRATE WITH CONTINUOUS HOLES

Publications (2)

Publication Number Publication Date
GB8515048D0 true GB8515048D0 (en) 1985-07-17
GB2181743A GB2181743A (en) 1987-04-29

Family

ID=6275887

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08515048A Withdrawn GB2181743A (en) 1985-07-16 1985-06-13 Metal plating of through holes in printed circuit boards

Country Status (2)

Country Link
DE (1) DE3525342A1 (en)
GB (1) GB2181743A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112481670A (en) * 2020-11-27 2021-03-12 常德力元新材料有限责任公司 Foam metal electroplating device and electroplating method
CN112495926A (en) * 2020-12-02 2021-03-16 盛青永致半导体设备(苏州)有限公司 Device and method for chemical plating or cleaning

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
DE4106333C1 (en) * 1991-02-28 1992-07-16 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
ATE143422T1 (en) * 1992-08-01 1996-10-15 Atotech Deutschland Gmbh METHOD FOR ELECTROLYTICALLY TREATING PARTICULARLY FLAT ITEMS TO BE TREATED, AND ARRANGEMENT, IN PARTICULAR FOR IMPLEMENTING THIS METHOD

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798136A (en) * 1972-06-09 1974-03-19 Ibm Method for completely filling small diameter through-holes with large length to diameter ratio
NL8005427A (en) * 1980-09-30 1982-04-16 Veco Beheer Bv METHOD FOR MANUFACTURING SCREEN MATERIAL, SCREENING MATERIAL OBTAINED AND APPARATUS FOR CARRYING OUT THE METHOD

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112481670A (en) * 2020-11-27 2021-03-12 常德力元新材料有限责任公司 Foam metal electroplating device and electroplating method
CN112481670B (en) * 2020-11-27 2023-11-03 常德力元新材料有限责任公司 Foam metal electroplating device and electroplating method
CN112495926A (en) * 2020-12-02 2021-03-16 盛青永致半导体设备(苏州)有限公司 Device and method for chemical plating or cleaning
CN112495926B (en) * 2020-12-02 2024-02-20 盛青永致半导体设备(苏州)有限公司 Device and method for chemical plating or cleaning

Also Published As

Publication number Publication date
GB2181743A (en) 1987-04-29
DE3525342A1 (en) 1987-01-22

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)