CN112338369A - Semiconductor wafer slicing and forming machine tool - Google Patents
Semiconductor wafer slicing and forming machine tool Download PDFInfo
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- CN112338369A CN112338369A CN202011235886.XA CN202011235886A CN112338369A CN 112338369 A CN112338369 A CN 112338369A CN 202011235886 A CN202011235886 A CN 202011235886A CN 112338369 A CN112338369 A CN 112338369A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of new energy machinery, in particular to a semiconductor wafer slicing and forming machine tool, which can effectively improve the working efficiency by carrying out continuous automatic operation on wafer slicing work, can effectively reduce the roughness of a cutting surface by adopting laser to cut, improves the production quality of wafers, effectively avoids the damage of equipment operation to raw materials, conveniently protects the wafers, improves the yield of products, improves the economic benefit and improves the practicability and the reliability; including workstation, four group's landing legs, well accuse case, first ring rail and interior ring gear, four group's landing legs are evenly installed in the bottom outside of workstation, and well accuse case is installed in the top left front side of workstation, and the right side of workstation is provided with the material mouth that runs through from top to bottom, and first ring rail installs on the bottom right side of workstation.
Description
Technical Field
The invention relates to the technical field of new energy machines, in particular to a semiconductor wafer slicing and forming machine tool.
Background
As is known, a wafer is a semiconductor silicon wafer made of silicon, and is called a wafer because the wafer is circular in shape, and wafer slicing is a process operation for cutting a cylindrical silicon rod made of silicon to obtain a circular thin silicon wafer.
Disclosure of Invention
In order to solve the technical problems, the invention provides the semiconductor wafer slicing and forming machine tool which can effectively improve the working efficiency by carrying out continuous automatic operation on wafer slicing work, can effectively reduce the roughness of a cutting surface by adopting laser for cutting, improves the production quality of wafers, effectively avoids the damage of equipment operation to raw materials, conveniently protects wafers, improves the yield of products, improves the economic benefit and improves the practicability and the reliability.
The invention relates to a semiconductor wafer slicing and forming machine tool, which comprises a workbench, four groups of supporting legs, a central control box, a first annular guide rail and an inner toothed ring, wherein the four groups of supporting legs are uniformly arranged at the outer side of the bottom of the workbench, the central control box is arranged at the left front side of the top of the workbench, a vertically penetrating material port is arranged at the right side of the workbench, the first annular guide rail is arranged at the right side of the bottom of the workbench, the position of the first annular guide rail corresponds to the position of the material port, a plurality of groups of sliding blocks are uniformly arranged at the lower side of the first annular guide rail in a sliding manner, the top of the inner toothed ring is fixed at the bottom of the plurality of groups of sliding blocks, an inclined toothed ring is arranged at the bottom of the inner toothed ring, a motor base is arranged at the left side of the first annular guide rail, the top of the motor base is fixed on the workbench, a first motor is arranged at the, six groups of screw sleeves are arranged on the inner side of the first annular guide rail, the six groups of screw sleeves are uniformly and annularly distributed on the outer side of the bottom of the material port, the tops of the six groups of screw sleeves are rotatably arranged on a workbench, a first straight gear is arranged on the outer wall of the upper side of each group of screw sleeves, the outer side wall of each group of first straight gear is meshed with the inner side wall of the inner gear ring, a screw is arranged on the lower side of each group of screw sleeves in a screwed mode, a material platform is arranged on the lower right side of the workbench, the outer sides of the tops of the material platforms are uniformly arranged at the bottoms of the six groups of screw rods, a circular material groove is communicated and arranged in the middle of the top of the material platform, the material groove is in a stepped mode, the diameter of the inner wall of the material groove is gradually reduced from top to bottom, the edge position of each group of steps in the material groove is arranged to be an inclined plane, an, the top of the second annular guide rail is provided with an annular sliding groove in a sliding manner, the top of the annular sliding groove is provided with a fixing ring, three groups of laser generators and three groups of diode photon receivers are uniformly arranged on the upper side of the inner wall of the fixing ring in a staggered manner, the positions of the three groups of laser generators correspond to the positions of the three groups of diode photon receivers respectively, three groups of second motors are uniformly arranged on the outer wall of the annular sliding groove, the lower side output ends of the three groups of second motors are provided with second straight gears, the lower side of the outer wall of the second annular guide rail is provided with an outer gear ring, the three groups of second straight gears are meshed with the outer gear ring, the middle part of the top end of the workbench is provided with a transfer device, the left side of the top of the workbench is provided with; a silicon rod is downwards inserted into a material groove on a material platform through a material opening, the bottom of the silicon rod is clamped on the inner side wall of a ladder in the material groove, an elastic rubber ring on an inclined plane on the corresponding ladder is sleeved on the outer wall of the silicon rod so as to fix the silicon rod, the silicon rod and the material opening are coaxial at the moment, a central control box controls to turn on a first motor, the first motor drives a first bevel gear to rotate through a rotating shaft, the first bevel gear is meshed with an inclined gear ring, the first bevel gear drives the inclined gear ring to rotate, the inclined gear ring drives an inner gear ring to rotate, the inner gear ring drives a plurality of groups of sliding blocks to slide on a first annular guide rail, meanwhile, the inner gear ring is meshed with six groups of first straight gears, the inner gear ring respectively drives six groups of screw sleeves to rotate on a workbench through the six groups of first straight gears, the six groups of screw sleeves are respectively connected with the six groups of screw rods in a screw sleeve mode, six groups of screws synchronously drive the material platform and the silicon rod to move up and down, the silicon rod moves up and down in the material port so as to adjust the height of the silicon rod, the silicon rod is adjusted to the height corresponding to three groups of laser generators according to the thickness requirement of a wafer slice, the central control box controls the first motor to be closed, the central control box controls the transfer device to rotate and adsorb and fix the top of the silicon rod, the central control box controls the three groups of second motors to be opened, the three groups of second motors respectively drive the three groups of second straight gears to rotate, the three groups of second straight gears are all meshed with the outer gear ring, the three groups of second straight gears all roll on the outer gear ring, the three groups of second straight gears respectively drive the three groups of second motors to rotate, the three groups of second motors synchronously drive the annular chutes to rotate, the annular chutes slide on the second annular guide rail, and simultaneously the annular chutes drive the three groups of laser generators, the central control box controls the three groups of laser generators to be opened, plasma lasers are irradiated on the inner sides of the three groups of laser generators and cut the side wall of the silicon rod on the inner side of the fixing ring, the three groups of laser generators synchronously rotate, the three groups of laser generators synchronously cut the side wall of the silicon rod in an annular mode, the cut thin silicon rod is a wafer after the silicon rod is cut, the wafer is adsorbed and fixed on the transfer device, the lasers irradiated by the three groups of laser generators are respectively irradiated on the three groups of diode photon receivers, the three groups of diode photon receivers receive photon signals and transmit the signals to the central control box, the central control box controls the second motor and the three groups of laser generators to be closed, the central control box controls the transfer device to transfer the cut wafer to the layered storage device and enables the transfer device to be restored to the initial position, and controls the silicon rod to move upwards to the specified height through the, well accuse case passes through second motor and three laser generator of group to silicon rod repeated cutting processing, thereby carry out wafer slicing work in succession automatically, through carrying out continuous automatic operation to wafer slicing work, can effectively shorten the required time of section, improve work efficiency, adopt laser to cut, can effectively reduce the roughness of cutting plane, improve wafer production quality, laser cutting is non-contact cutting simultaneously, equipment operation's stability is higher, effectively avoid the equipment operation to the destruction of raw materials, conveniently protect the wafer, improve the yield of product, improve economic benefits, reduce the raw materials waste, and the practicality and reliability are improved.
The invention relates to a semiconductor wafer slicing and forming machine tool, which comprises a bevel gear disc, a third motor, a second bevel gear, four groups of oil cylinder push rods, a rotating plate, a rubber sucker, an air pipe, an electromagnetic valve and an air pump, wherein the bevel gear disc is rotatably arranged at the top of a workbench, the third motor is positioned at the front side of the bevel gear disc, the third motor is arranged at the top of the workbench, the second bevel gear is arranged at the rear output end of the third motor, the lower side wall of the second bevel gear is meshed with the front side wall of the bevel gear disc, the bottoms of the four groups of oil cylinder push rods are uniformly arranged at the top of the bevel gear disc, the rear sides of the tops of the rotating plates are fixed at the tops of the four groups of oil cylinder push rods, the tops of the rubber suckers are arranged at the front sides of the bottoms of the rotating plates, the air pipe is positioned above the rotating plates, the rear output end of the air pipe is arranged on the front input end of the air pump, the output end of the air pump is positioned at the rear side of the air pump, and the central control box is respectively and electrically connected with the third motor, the four groups of oil cylinder push rods, the electromagnetic valve and the air pump; after the silicon rod is adjusted to a specified height, the central control box controls the tops of the four groups of oil cylinder push rods to move upwards through the four groups of oil cylinder push rods, the tops of the four groups of oil cylinder push rods drive the rotating plate, the rubber sucker, the air pipe, the electromagnetic valve and the air pump to move upwards to the specified height, the central control box controls the opening of a third motor, the third motor drives the bevel gear disc to rotate on the workbench through a second bevel gear, the bevel gear disc drives the four groups of oil cylinder push rods, the rotating plate, the rubber sucker, the air pipe, the electromagnetic valve and the air pump to rotate rightwards to be above the silicon rod, the central control box controls the rotating plate and the rubber sucker to move downwards through the four groups of oil cylinder push rods, the bottom of the rubber sucker is contacted with and tightly attached to the top of the silicon rod, the central control box controls the opening of the air pump, the air pump pumps air in the rubber sucker through the electromagnetic valve and the, air pumped by an air pump is discharged to the outside through an output end at the rear side of the air pump, when the air pump is started for a specified time, a central control box controls an electromagnetic valve and the air pump to be closed, the air in an air pipe and a rubber sucker stops flowing, the negative pressure of the air in the air pipe and the rubber sucker meets the specified requirement, when the wafer slicing work is completed, the central control box controls a rotating plate, the rubber sucker, the air pipe, the electromagnetic valve and the air pump to move upwards to the specified position through four groups of oil cylinder push rods, controls the rotating plate, the rubber sucker, the air pipe, the electromagnetic valve and the air pump to rotate forwards to the initial position through a third motor, drives the rotating plate, the rubber sucker and the wafer to move upwards to the upper part of a layered storage device through the four groups of oil cylinder push rods, controls the rubber sucker and the wafer to rotate leftwards through the third motor and enables the position of the wafer to correspond to, the wafer is placed on layering storage device, well accuse case control is opened the solenoid valve and is controlled air pump reverse running, the air pump inhales the external air and discharges to the rubber suction cup in through the trachea, make the rubber suction cup internal gas pressure resume to normal condition, the adsorption affinity disappears between the bottom of rubber suction cup and the wafer top, well accuse case resumes to initial position through four hydro-cylinder push rods of group and third motor control rotor plate and rubber suction cup, thereby accomplish wafer autoloading work, make things convenient for equipment to carry out the continuous section processing to the silicon rod, practicality and reliability are improved.
The invention relates to a semiconductor wafer slicing and forming machine tool, which comprises two groups of fixed groove plates, two groups of fourth motors and two groups of transmission belts, wherein the two groups of fixed groove plates are respectively fixed at the left front side and the left rear side of the top of a workbench, the two groups of fixed groove plates correspond in position, the two groups of fixed groove plates are opposite in installation direction, a plurality of groups of transmission rollers are uniformly and transversely arranged in the two groups of fixed groove plates in a rotating manner, the two groups of fourth motors are respectively arranged at the right sides of the two groups of fixed groove plates, the left output ends of the two groups of fourth motors respectively penetrate through the two groups of fixed groove plates and are respectively in transmission connection with the transmission rollers at the middle parts of the two groups of fixed groove plates, the two groups of transmission belts are respectively laid on the plurality of transmission rollers in the front fixed groove plates and the plurality of transmission rollers in the rear fixed groove plates and are in synchronous transmission, a plurality of storage groove plates are, the positions of a plurality of groups of storage trough plates on the two groups of transmission belts correspond to each other, and the central control box is respectively and electrically connected with the two groups of fourth motors; the central control box controls and opens two groups of fourth motors, the two groups of fourth motors can respectively drive two groups of conveying rollers at the middle parts of two groups of fixed groove plates to rotate, the two groups of conveying rollers at the middle parts of the two groups of fixed groove plates can respectively drive a plurality of groups of conveying rollers in the two groups of fixed groove plates to synchronously rotate through two groups of driving belts, two groups of driving belts in a rotating state can drive a plurality of groups of storage groove plates to synchronously rotate, when the slicing of the wafer is completed, the wafer is grabbed above the two groups of fixed groove plates by the transfer device, the central control box controls the two groups of driving belts to rotate through the two groups of fourth motors, the two groups of storage groove plates at the uppermost side between the two groups of driving belts are controlled by the central control box to rotate to a horizontal state, the wafer is placed on the two groups of storage groove plates at the uppermost side in the horizontal state by the transfer device, the central control the, make things convenient for next group's wafer to place on it to make the wafer after the section place on multiunit storage frid in layers one by one, when preventing to contact between the wafer, because the mutual adsorption phenomenon that its roughness is lower to lead to takes place, make things convenient for external processing equipment to lift the wafer in the multiunit storage frid and take out layering storage device simultaneously, conveniently get material work, improve practicality and reliability.
The invention discloses a semiconductor wafer slicing forming machine tool, which further comprises a straight toothed disc, a fifth motor, a third straight toothed wheel, a rotating frame and three groups of laser range finders, wherein the straight toothed disc is positioned behind a second annular guide rail, the straight toothed disc is rotatably arranged on the right rear side of the top of a workbench, the fifth motor is arranged on the right side of the rear wall of the workbench, the third straight toothed wheel is arranged on the output end of the upper side of the fifth motor, the front side of the third straight toothed wheel is meshed with the rear side of the straight toothed disc, the rear side of the bottom of the rotating frame is arranged on the top of the straight toothed disc, the three groups of laser range finders are uniformly arranged on the front side of the bottom of the rotating frame, the positions of the three groups of laser range finders correspond to the positions of a material port, and a central control box; three group laser range finders are opened in well accuse case control, distance between three group laser range finders of three group laser range finder detectable and the silicon rod and with detected signal transmission to well accuse incasement, thereby detect the shift position of silicon rod, conveniently carry out real-time supervision to the sliced thickness of wafer, fifth motor is opened in well accuse case control, fifth motor accessible third straight-teeth gear drives the straight-teeth dish and rotates, the straight-teeth dish can drive rotating turret and three group laser range finder and rotate to the right side, thereby make the front side of rotating turret and three group laser range finders all keep away from with the material mouth, conveniently insert the silicon rod in the material mouth, thereby make things convenient for the material loading work, after silicon rod material loading is accomplished, well accuse case resumes to initial position through fifth motor control rotating turret and three group laser range finders, improve practicality and reliability.
The semiconductor wafer slicing and forming machine tool further comprises an annular fixed groove plate and six groups of reinforcing shafts, wherein the annular fixed groove plate is respectively and fixedly inserted into the lower sides of the outer walls of the six groups of screw sleeves; through setting up annular fixed frid and six group's reinforcing shafts, can conveniently support and fix six sets of swivel nuts, stability and fastness when improving its rotation to support and fix six screw rods of group and material platform, improve practicality and reliability.
The semiconductor wafer slicing and forming machine tool further comprises a reinforcing wheel, wherein the reinforcing wheel is positioned on the outer side of the first annular guide rail, the top of the reinforcing wheel is fixed on the workbench, the outer side wall of each group of sliding blocks is provided with a hexagonal fixing ring, the outer side of each group of hexagonal fixing rings is rotatably provided with a fixing plate, each group of fixing plates is positioned in the reinforcing wheel, and the bottom of each group of fixing plates is contacted with the bottom of the inner wall of the reinforcing wheel; when the multiunit slider rotated, the multiunit slider rolled in the stiffener through solid fixed ring drive multiunit fixed plate in the multiunit hexagon respectively, and through setting up solid fixed ring in stiffener, the multiunit hexagon and multiunit fixed plate, can conveniently support and the direction multiunit slider, interior ring gear and skewed tooth ring, improved the fastness when its moves, improve equipment strength, improvement practicality.
The invention discloses a semiconductor wafer slicing and forming machine tool, which further comprises a stabilizing frame, wherein the lower side of the stabilizing frame is rotatably arranged on the right side of a rotating shaft, and the top of the stabilizing frame is fixed on the left side of the bottom of a reinforcing wheel; through setting up the steady rest, can conveniently support the right side of countershaft and first bevel gear, conveniently make first bevel gear and skewed tooth ring remain the engaged state all the time, prevent that it from taking place the disjointing phenomenon, improve the reliability.
The semiconductor wafer slicing and forming machine tool further comprises a protective cover, wherein the protective cover is positioned on the outer sides of the straight toothed disc, the fifth motor and the third straight gear, the protective cover is rotatably sleeved on the outer side of the rotating frame, and the front side of the protective cover is fixed on the workbench; through setting up the guard shield, can conveniently keep apart the protection to straight fluted disc, fifth motor and third straight-teeth gear, conveniently protect it, prevent simultaneously that it from causing the injury to the workman when moving, improve practicality and reliability.
Compared with the prior art, the invention has the beneficial effects that: a silicon rod is downwards inserted into a material groove on a material platform through a material opening, the bottom of the silicon rod is clamped on the inner side wall of a ladder in the material groove, an elastic rubber ring on an inclined plane on the corresponding ladder is sleeved on the outer wall of the silicon rod so as to fix the silicon rod, the silicon rod and the material opening are coaxial at the moment, a central control box controls to turn on a first motor, the first motor drives a first bevel gear to rotate through a rotating shaft, the first bevel gear is meshed with an inclined gear ring, the first bevel gear drives the inclined gear ring to rotate, the inclined gear ring drives an inner gear ring to rotate, the inner gear ring drives a plurality of groups of sliding blocks to slide on a first annular guide rail, meanwhile, the inner gear ring is meshed with six groups of first straight gears, the inner gear ring respectively drives six groups of screw sleeves to rotate on a workbench through the six groups of first straight gears, the six groups of screw sleeves are respectively connected with the six groups of screw rods in a screw sleeve mode, six groups of screws synchronously drive the material platform and the silicon rod to move up and down, the silicon rod moves up and down in the material port so as to adjust the height of the silicon rod, the silicon rod is adjusted to the height corresponding to three groups of laser generators according to the thickness requirement of a wafer slice, the central control box controls the first motor to be closed, the central control box controls the transfer device to rotate and adsorb and fix the top of the silicon rod, the central control box controls the three groups of second motors to be opened, the three groups of second motors respectively drive the three groups of second straight gears to rotate, the three groups of second straight gears are all meshed with the outer gear ring, the three groups of second straight gears all roll on the outer gear ring, the three groups of second straight gears respectively drive the three groups of second motors to rotate, the three groups of second motors synchronously drive the annular chutes to rotate, the annular chutes slide on the second annular guide rail, and simultaneously the annular chutes drive the three groups of laser generators, the central control box controls the three groups of laser generators to be opened, plasma lasers are irradiated on the inner sides of the three groups of laser generators and cut the side wall of the silicon rod on the inner side of the fixing ring, the three groups of laser generators synchronously rotate, the three groups of laser generators synchronously cut the side wall of the silicon rod in an annular mode, the cut thin silicon rod is a wafer after the silicon rod is cut, the wafer is adsorbed and fixed on the transfer device, the lasers irradiated by the three groups of laser generators are respectively irradiated on the three groups of diode photon receivers, the three groups of diode photon receivers receive photon signals and transmit the signals to the central control box, the central control box controls the second motor and the three groups of laser generators to be closed, the central control box controls the transfer device to transfer the cut wafer to the layered storage device and enables the transfer device to be restored to the initial position, and controls the silicon rod to move upwards to the specified height through the, well accuse case passes through second motor and three laser generator of group to silicon rod repeated cutting processing, thereby carry out wafer slicing work in succession automatically, through carrying out continuous automatic operation to wafer slicing work, can effectively shorten the required time of section, improve work efficiency, adopt laser to cut, can effectively reduce the roughness of cutting plane, improve wafer production quality, laser cutting is non-contact cutting simultaneously, equipment operation's stability is higher, effectively avoid the equipment operation to the destruction of raw materials, conveniently protect the wafer, improve the yield of product, improve economic benefits, reduce the raw materials waste, and the practicality and reliability are improved.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a schematic top right oblique view of the present invention;
FIG. 3 is a rear right side oblique view structural schematic of the present invention;
FIG. 4 is a cross-sectional schematic view of a left-lower oblique view of the material table in FIG. 1;
FIG. 5 is an enlarged schematic view of the first motor of FIG. 4;
FIG. 6 is an enlarged schematic view of the second motor of FIG. 4;
FIG. 7 is an enlarged view of the rotation plate of FIG. 2;
FIG. 8 is an enlarged view of the fourth motor of FIG. 2;
FIG. 9 is an enlarged view of the first straight gear of FIG. 3;
in the drawings, the reference numbers: 1. a work table; 2. a support leg; 3. a central control box; 4. a material port; 5. a first endless guide rail; 6. a slider; 7. an inner gear ring; 8. a skewed tooth ring; 9. a motor base; 10. a first motor; 11. a rotating shaft; 12. a first bevel gear; 13. a threaded sleeve; 14. a first straight gear; 15. a screw; 16. a material platform; 17. a trough; 18. a second annular guide rail; 19. an annular chute; 20. a fixing ring; 21. a laser generator; 22. a diode photon receiver; 23. a second motor; 24. a second spur gear; 25. an outer ring gear; 26. a conical fluted disc; 27. a third motor; 28. a second bevel gear; 29. a cylinder push rod; 30. a rotating plate; 31. a rubber suction cup; 32. an air tube; 33. an electromagnetic valve; 34. an air pump; 35. fixing the groove plate; 36. a conveying roller; 37. a fourth motor; 38. a transmission belt; 39. a storage trough plate; 40. a straight fluted disc; 41. a fifth motor; 42. a third spur gear; 43. a rotating frame; 44. a laser range finder; 45. an annular fixed groove plate; 46. reinforcing the shaft; 47. a reinforcing wheel; 48. a hexagonal fixing ring; 49. a fixing plate; 50. a stabilizer frame; 51. a shield.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1 to 9, in the semiconductor wafer slicing and forming machine tool according to the present invention, when in operation, a silicon rod is inserted downwards into a trough 17 on a material table 16 through a material port 4, the bottom of the silicon rod is clamped on the inner side wall of a step in the trough 17, an elastic rubber ring on an inclined surface corresponding to the step is sleeved on the outer wall of the silicon rod, so as to fix the silicon rod, the silicon rod is coaxial with the material port 4, a central control box 3 controls to open a first motor 10, the first motor 10 drives a first bevel gear 12 to rotate through a rotating shaft 11, the first bevel gear 12 is engaged with a bevel gear ring 8, the first bevel gear 12 drives the bevel gear ring 8 to rotate, the bevel gear ring 8 drives an inner gear ring 7 to rotate, the inner gear ring 7 drives a plurality of sets of sliders 6 to slide on a first annular guide rail 5, the inner gear ring 7 is engaged with six sets of first straight gears 14, the inner gear ring 7 drives six sets of screw sleeves 13 to rotate on the table 1 through the six, six sets of screw sleeves 13 are respectively connected with six sets of screw rods 15 in a screw way, the six sets of screw sleeves 13 in a rotating state can drive the six sets of screw rods 15 to respectively move up and down on the six sets of screw sleeves 13 synchronously, the six sets of screw rods 15 synchronously drive the material platform 16 and the silicon rod to move up and down, the silicon rod moves up and down in the material port 4 so as to adjust the height of the silicon rod, the silicon rod is adjusted to the height corresponding to three sets of laser generators 21 according to the thickness requirement of a wafer slice, the central control box 3 controls the first motor 10 to be closed, the central control box 3 controls the transfer device to rotate and adsorbs and fixes the top of the silicon rod, the central control box 3 controls the three sets of second motors 23 to be opened, the three sets of second motors 23 respectively drive the three sets of second spur gears 24 to rotate, the three sets of second spur gears 24 are respectively meshed with the outer toothed ring 25, the three sets of second spur gears 24 are respectively rolled on the outer toothed ring 25, three groups of second motors 23 synchronously drive the annular chute 19 to rotate, the annular chute 19 slides on the second annular guide rail 18, meanwhile, the annular chute 19 drives three groups of laser generators 21 and three groups of diode photon receivers 22 to synchronously rotate through the fixing ring 20, the central control box 3 controls the three groups of laser generators 21 to be opened, plasma lasers are irradiated on the inner sides of the three groups of laser generators 21 and cut the side wall of the silicon rod on the inner side of the fixing ring 20, the three groups of laser generators 21 synchronously rotate, the three groups of laser generators 21 synchronously perform annular cutting on the side wall of the silicon rod, after the silicon rod is cut, the cut silicon rod slice is a wafer, the wafer is adsorbed and fixed on a transfer device, at the moment, the lasers irradiated by the three groups of laser generators 21 respectively irradiate on the three groups of diode photon receivers 22, the three groups of diode photon receivers 22 receive photon signals and transmit the signals to the central control, the second motor 23 and the three groups of laser generators 21 are controlled to be closed by the central control box 3, the central control box 3 controls the transfer device to transfer the cut wafers to the layered storage device and enable the transfer device to recover to the initial position, the central control box 3 controls the silicon rod to move upwards to the specified height through the first motor 10, and the central control box 3 repeatedly cuts the silicon rod through the second motor 23 and the three groups of laser generators 21, so that the wafer slicing work is continuously and automatically carried out.
The main functions realized by the invention are as follows: by carrying out continuous automatic operation on the wafer slicing work, the time required by slicing can be effectively shortened, the working efficiency is improved, the laser is adopted for cutting, the roughness of the cutting surface can be effectively reduced, the production quality of the wafer is improved, meanwhile, the laser cutting is non-contact cutting, the stability of the equipment operation is higher, the damage of the equipment operation to raw materials is effectively avoided, the wafer is conveniently protected, the yield of products is improved, the economic benefit is improved, and the raw material waste is reduced; the transfer device works in a mode that after the silicon rod is adjusted to a specified height, the central control box 3 controls the tops of the four groups of oil cylinder push rods 29 to move upwards through the four groups of oil cylinder push rods 29, the tops of the four groups of oil cylinder push rods 29 drive the rotating plate 30, the rubber suction cups 31, the air pipes 32, the electromagnetic valves 33 and the air pumps 34 to move upwards to the specified height, the central control box 3 controls the opening of the third motor 27, the third motor 27 drives the bevel gear disc 26 to rotate on the workbench 1 through the second bevel gear 28, the bevel gear disc 26 drives the four groups of oil cylinder push rods 29, the rotating plate 30, the rubber suction cups 31, the air pipes 32, the electromagnetic valves 33 and the air pumps 34 to rotate rightwards, the central control box 3 controls the rotating plate 30 and the rubber suction cups 31 to move downwards through the four groups of oil cylinder push rods 29, the bottoms of the rubber suction cups 31 are in contact with and tightly attached to the tops of the, the air pump 34 pumps the air in the rubber suction cup 31 through the electromagnetic valve 33 and the air pipe 32 to form negative pressure in the rubber suction cup 31, so that the bottom of the rubber suction cup 31 is tightly attached to the top of the silicon rod, the air pumped by the air pump 34 is exhausted to the outside through the output end on the rear side of the air pump 34, after the air pump 34 is started for a specified time, the central control box 3 controls the electromagnetic valve 33 and the air pump 34 to be closed, the air in the air pipe 32 and the rubber suction cup 31 stops flowing, the negative pressure of the air in the air pipe 32 and the rubber suction cup 31 reaches a specified requirement, after the wafer slicing operation is completed, the central control box 3 controls the rotating plate 30, the rubber suction cup 31, the air pipe 32, the electromagnetic valve 33 and the air pump 34 to move upwards to a specified position through the four groups of oil cylinder push rods 29, the central control box 3 controls the rotating plate 30, the rubber suction cup 31 and the, The rubber suction cup 31 and the wafer move upwards to the upper part of the layered material storage device, the central control box 3 controls the rubber suction cup 31 and the wafer to rotate leftwards through the third motor 27, the position of the wafer corresponds to the position of the layered material storage device, the central control box 3 controls the rubber suction cup 31 and the wafer to move downwards through four groups of oil cylinder push rods 29, the wafer is placed on the layered material storage device, the central control box 3 controls the electromagnetic valve 33 to be opened and controls the air pump 34 to run reversely, the air pump 34 sucks outside air and discharges the air into the rubber suction cup 31 through the air pipe 32, the air pressure in the rubber suction cup 31 is recovered to a normal state, the adsorption force between the bottom of the rubber suction cup 31 and the top of the wafer disappears, the central control box 3 controls the rotating plate 30 and the rubber suction cup 31 to be recovered to an initial position through the four groups of oil cylinder push rods 29 and the third motor 27, so; the working mode of the layered material storage device is that the central control box 3 controls to open two groups of fourth motors 37, the two groups of fourth motors 37 can respectively drive two groups of conveying rollers 36 at the middle parts of two groups of fixed groove plates 35 to rotate, the two groups of conveying rollers 36 at the middle parts of two groups of fixed groove plates 35 can respectively drive the multiple groups of conveying rollers 36 in the two groups of fixed groove plates 35 to synchronously rotate through two groups of driving belts 38, the two groups of driving belts 38 in the rotating state can drive multiple groups of material storage groove plates 39 to synchronously rotate, after the slicing of the wafer is completed, the transfer device grabs the wafer above the two groups of fixed groove plates 35, the central control box 3 controls the two groups of material storage groove plates 39 at the uppermost side between the two groups of driving belts 38 to rotate to the horizontal state through the two groups of fourth motors 37, the transfer device places the wafer on the two groups of material storage groove plates 39 at the uppermost side, the two groups of driving belts 38 drive the wafers to move downwards, and the two groups of material storage groove plates 39 at the corresponding positions of the next group are moved to the uppermost sides of the two groups of driving belts 38 and kept in a horizontal state, so that the next group of wafers can be conveniently placed on the next group of wafers, the sliced wafers are sequentially placed on the multiple groups of material storage groove plates 39 in a layered mode, the phenomenon of mutual adsorption caused by low surface roughness of the wafers is prevented when the wafers are contacted, meanwhile, external processing equipment can conveniently lift the wafers in the multiple groups of material storage groove plates 39 and draw the wafers out of the layered material storage device, and material taking is facilitated; the central control box 3 controls the three groups of laser range finders 44 to be opened, the three groups of laser range finders 44 can detect the distances between the three groups of laser range finders 44 and the silicon rod and transmit detection signals into the central control box 3, so that the moving position of the silicon rod is detected, the thickness of a wafer slice is conveniently monitored in real time, the central control box 3 controls the fifth motor 41 to be opened, the fifth motor 41 can drive the straight toothed disc 40 to rotate through the third straight gear 42, the straight toothed disc 40 can drive the rotating frame 43 and the three groups of laser range finders 44 to rotate towards the right side, so that the front side of the rotating frame 43 and the three groups of laser range finders 44 are far away from the material port 4, the silicon rod is conveniently inserted into the material port 4, so that the feeding work is convenient, and after the feeding of the silicon rod is completed, the central control box 3 controls the rotating frame 43 and the three groups of laser; by arranging the annular fixed groove plates 45 and the six groups of reinforcing shafts 46, the six groups of screw sleeves 13 can be conveniently supported and fixed, and the stability and firmness of the screw sleeves during rotation are improved, so that the six groups of screw rods 15 and the material platform 16 are supported and fixed; when the plurality of groups of sliding blocks 6 rotate, the plurality of groups of sliding blocks 6 drive the plurality of groups of fixing plates 49 to roll in the reinforcing wheel 47 through the plurality of groups of hexagonal fixing rings 48, and the plurality of groups of sliding blocks 6, the inner toothed ring 7 and the inclined toothed ring 8 can be conveniently supported and guided by the reinforcing wheel 47, the plurality of groups of hexagonal fixing rings 48 and the plurality of groups of fixing plates 49, so that the firmness of the sliding blocks in operation is improved, and the strength of equipment is improved; by arranging the stabilizing frame 50, the right side of the rotating shaft 11 and the first bevel gear 12 can be conveniently supported, the first bevel gear 12 and the helical gear ring 8 can be conveniently kept in a meshed state all the time, and the phenomenon of disjointing is prevented; through setting up guard shield 51, can conveniently keep apart the protection to straight fluted disc 40, fifth motor 41 and third straight-teeth gear 42, conveniently protect it, prevent simultaneously that it from causing the injury to the workman when moving, improve practicality and reliability.
According to the semiconductor wafer slicing and forming machine tool, the installation mode, the connection mode or the arrangement mode are common mechanical modes, and the semiconductor wafer slicing and forming machine tool can be implemented as long as the beneficial effects of the semiconductor wafer slicing and forming machine tool can be achieved; the central control box 3, the laser generator 21, the diode photon receiver 22, the cylinder push rod 29, the rubber suction cup 31, the electromagnetic valve 33 and the laser range finder 44 are commercially available.
According to the semiconductor wafer slicing and forming machine tool, the diode photon receiver 22 can be manufactured by adopting a diode joint, and the diode can directly receive photon irradiation and generate an electric signal.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A semiconductor wafer slicing and forming machine tool is characterized by comprising a workbench (1), four groups of supporting legs (2), a central control box (3), a first annular guide rail (5) and an inner gear ring (7), wherein the four groups of supporting legs (2) are uniformly arranged on the outer side of the bottom of the workbench (1), the central control box (3) is arranged on the left front side of the top of the workbench (1), a material opening (4) which penetrates through the workbench (1) from top to bottom is formed in the right side of the bottom of the workbench (1), the first annular guide rail (5) corresponds to the material opening (4) in position, a plurality of groups of sliding blocks (6) are uniformly arranged on the lower side of the first annular guide rail (5) in a sliding manner, the top of the inner gear ring (7) is fixed at the bottoms of the plurality of sliding blocks (6), an inclined gear ring (8) is arranged at the bottom of the inner gear ring (7), a motor base (9) is arranged on the left of the first annular guide rail (5), the top of a motor base (9) is fixed on a workbench (1), a first motor (10) is arranged at the bottom of the motor base (9), a rotating shaft (11) and a first bevel gear (12) are sequentially arranged on the right side of the first motor (10), the top of the first bevel gear (12) is meshed with the left side of an inclined toothed ring (8), six groups of screw sleeves (13) are arranged on the inner side of a first annular guide rail (5), the six groups of screw sleeves (13) are uniformly and annularly distributed on the outer side of the bottom of a material port (4), the tops of the six groups of screw sleeves (13) are rotatably arranged on the workbench (1), a first straight gear (14) is arranged on the outer wall of the upper side of each group of screw sleeves (13), the outer side wall of each group of first straight gears (14) is meshed with the inner side wall of an inner toothed ring (7), a screw rod (15) is arranged on the lower side of each group of screw sleeves (13), and a material platform (16) is arranged, the top outside of material platform (16) is evenly installed in six groups of screw rods (15) bottom, the top middle part of material platform (16) communicates and is provided with circular silo (17), silo (17) becomes the notch cuttype, the inner wall diameter of silo (17) reduces from top to bottom gradually, the border position of every group of ladder in silo (17) all sets up to the inclined plane, all be fixed with the elastic rubber circle on every group inclined plane, the position of silo (17) corresponds with the position of material mouth (4), the top right side of workstation (1) is provided with second annular guide rail (18), the position of second annular guide rail (18) corresponds with the position of material mouth (4), the top of second annular guide rail (18) slides and is provided with annular spout (19), the top of annular spout (19) is provided with solid fixed ring (20), the inner wall upside of solid fixed ring (20) evenly interlocks and is provided with three groups of laser generator (21) and three groups of diode photon receivers, the position of three groups of laser generators (21) corresponds with the position of three groups of diode photon receivers (22) respectively, evenly be provided with three groups of second motor (23) on the outer wall of annular spout (19), the downside output of three groups of second motor (23) all is provided with second straight-teeth gear (24), the outer wall downside of second annular guide rail (18) is provided with outer ring gear (25), three groups of second straight-teeth gear (24) all with outer ring gear (25) meshing, the top middle part of workstation (1) is provided with transfer device, the top left side of workstation (1) is provided with layering storage device, well accuse case (3) respectively with first motor (10), three groups of laser generators (21), three groups of diode photon receivers (22) and three groups of second motor (23) electricity are connected.
2. The semiconductor wafer slicing forming machine tool according to claim 1, wherein the transfer device comprises a conical fluted disc (26), a third motor (27), a second bevel gear (28), four sets of cylinder push rods (29), a rotating plate (30), a rubber suction cup (31), an air pipe (32), an electromagnetic valve (33) and an air pump (34), the conical fluted disc (26) is rotatably installed at the top of the workbench (1), the third motor (27) is positioned at the front side of the conical fluted disc (26), the third motor (27) is installed at the top of the workbench (1), the second bevel gear (28) is installed at the rear output end of the third motor (27), the lower side wall of the second bevel gear (28) is meshed with the front side wall of the conical fluted disc (26), the bottoms of the four sets of cylinder push rods (29) are uniformly installed at the top of the conical fluted disc (26), and the rear side of the top of the rotating plate (30) is fixed at the tops of the four sets of cylinder push rods (, the top of rubber suction cup (31) is installed in the bottom front side of rotor plate (30), trachea (32) are located the top of rotor plate (30), the front side input of trachea (32) passes rotor plate (30) and communicates with rubber suction cup (31) inside, the middle part at trachea (32) is installed in solenoid valve (33), air pump (34) are installed on rotor plate (30), the rear side output of trachea (32) is installed on the front side input of air pump (34), the output on air pump (34) is located the rear side of air pump (34), well accuse case (3) respectively with third motor (27), four groups hydro-cylinder push rods (29), solenoid valve (33) and air pump (34) electricity are connected.
3. The semiconductor wafer slicing and forming machine tool according to claim 2, wherein the layered material storage device comprises two sets of fixed slot plates (35), two sets of fourth motors (37) and two sets of transmission belts (38), the two sets of fixed slot plates (35) are respectively fixed on the left front side and the left rear side of the top of the worktable (1), the two sets of fixed slot plates (35) correspond in position, the two sets of fixed slot plates (35) are installed in opposite directions, multiple sets of transmission rollers (36) are uniformly and transversely arranged in the two sets of fixed slot plates (35) in a rotating manner, the two sets of fourth motors (37) are respectively installed on the right sides of the two sets of fixed slot plates (35), the left output ends of the two sets of fourth motors (37) respectively penetrate through the two sets of fixed slot plates (35) and are respectively in transmission connection with the transmission rollers (36) in the middle of the two sets of fixed slot plates (35), and the two sets of transmission belts (38) are respectively laid on the transmission rollers (36) in the front fixed slot plates (35) and the multiple sets of Send roller (36) to go up and make its synchronous drive, evenly transversely be provided with multiunit storage frid (39) on the outer wall of two sets of drive belts (38), multiunit storage frid (39) all are located between two sets of fixed frids (35), multiunit storage frid (39) position on two sets of drive belts (38) corresponds, and well accuse case (3) are connected with two sets of fourth motor (37) electricity respectively.
4. The semiconductor wafer slicing and forming machine tool according to claim 3, further comprising a straight toothed disc (40), a fifth motor (41), a third straight gear (42), a rotating frame (43) and three sets of laser range finders (44), wherein the straight toothed disc (40) is located behind the second annular guide rail (18), the straight toothed disc (40) is rotatably mounted on the right rear side of the top of the worktable (1), the fifth motor (41) is mounted on the right side of the rear wall of the worktable (1), the third straight gear (42) is mounted on the upper output end of the fifth motor (41), the front side of the third straight gear (42) is meshed with the rear side of the straight toothed disc (40), the bottom rear side of the rotating frame (43) is mounted on the top of the straight toothed disc (40), the three sets of laser range finders (44) are uniformly mounted on the bottom front side of the rotating frame (43), and the positions of the three sets of laser range finders (44) correspond to the positions of the material ports (4), the central control box (3) is respectively and electrically connected with the fifth motor (41) and the three groups of laser range finders (44).
5. The semiconductor wafer slicing and forming machine tool according to claim 4, further comprising an annular fixed groove plate (45) and six sets of reinforcing shafts (46), wherein the annular fixed groove plate (45) is respectively inserted and fixed at the lower sides of the outer walls of the six sets of screw sleeves (13), the annular fixed groove plate (45) is rotatably connected with the six sets of screw sleeves (13), the six sets of reinforcing shafts (46) are respectively staggered between the six sets of screw sleeves (13), the tops of the six sets of reinforcing shafts (46) are fixed on the worktable (1), and the bottoms of the six sets of reinforcing shafts (46) are fixed on the annular fixed groove plate (45).
6. The semiconductor wafer slicing and forming machine tool according to claim 5, further comprising a reinforcing wheel (47), wherein the reinforcing wheel (47) is located on the outer side of the first annular guide rail (5), the top of the reinforcing wheel (47) is fixed on the workbench (1), a hexagonal fixing ring (48) is arranged on the outer side wall of each group of sliders (6), a fixing plate (49) is rotatably arranged on the outer side of each group of hexagonal fixing rings (48), each group of fixing plates (49) is located in the reinforcing wheel (47), and the bottom of each group of fixing plates (49) is in contact with the bottom of the inner wall of the reinforcing wheel (47).
7. A semiconductor wafer slicing and forming machine as claimed in claim 6, further comprising a stabilizer (50), wherein the lower side of the stabilizer (50) is rotatably mounted on the right side of the rotary shaft (11), and the top of the stabilizer (50) is fixed to the left side of the bottom of the stiffening wheel (47).
8. The semiconductor wafer slicing and forming machine tool according to claim 7, further comprising a shield (51), wherein the shield (51) is located outside the straight toothed disc (40), the fifth motor (41) and the third straight gear (42), the shield (51) is rotatably fitted around the outside of the rotating frame (43), and the front side of the shield (51) is fixed to the table (1).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011235886.XA CN112338369A (en) | 2020-11-06 | 2020-11-06 | Semiconductor wafer slicing and forming machine tool |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011235886.XA CN112338369A (en) | 2020-11-06 | 2020-11-06 | Semiconductor wafer slicing and forming machine tool |
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| CN112338369A true CN112338369A (en) | 2021-02-09 |
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| CN202011235886.XA Withdrawn CN112338369A (en) | 2020-11-06 | 2020-11-06 | Semiconductor wafer slicing and forming machine tool |
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| CN113172782A (en) * | 2021-05-17 | 2021-07-27 | 伍路旺 | Single-chip microcomputer wafer slicing device |
| CN114289296A (en) * | 2021-12-31 | 2022-04-08 | 贺龙斌 | A quality testing appurtenance for section traditional chinese medicine |
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| TW201544223A (en) * | 2014-05-13 | 2015-12-01 | Disco Corp | Wafer processing method |
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