CN105057883A - Wafer cutting device combining laser cutting and mechanical splitting - Google Patents

Wafer cutting device combining laser cutting and mechanical splitting Download PDF

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Publication number
CN105057883A
CN105057883A CN201510606168.1A CN201510606168A CN105057883A CN 105057883 A CN105057883 A CN 105057883A CN 201510606168 A CN201510606168 A CN 201510606168A CN 105057883 A CN105057883 A CN 105057883A
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CN
China
Prior art keywords
guide rail
laser cutting
shaped guide
vacuum suction
combines
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Granted
Application number
CN201510606168.1A
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Chinese (zh)
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CN105057883B (en
Inventor
李西军
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Chengdu Jin Sheng Green Wood Science And Technology Ltd
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Chengdu Jin Sheng Green Wood Science And Technology Ltd
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention relates to a wafer cutting device combining laser cutting and mechanical splitting. The wafer cutting device comprises a base, an annular guide rail and a vacuum absorption conveying device, wherein at least two support posts are vertically arranged on the base, uniformly distributed on the periphery of the annular guide rail, and connected with the outer side of the annular guide rail; fixing devices for fixing to-be-cut crystals are mounted on the base, and among the support posts, the inner side of the annular guide rail is provided with two motor brackets capable of carrying out circling motion along the annular guide rail, each motor bracket is provided with a guide rail and a mobile motor capable of moving along the radial direction of the annular guide rail, the two mobile motors are respectively provided with a mechanical cutter and a laser cutting head, the vacuum absorption conveying device comprises a conveying device base, a drive device, a driving roller and a vacuum absorption conveying belt, and the vacuum absorption conveying belt is positioned above the annular guide rail and surrounds the driving roller. Compared with the prior art, the wafer cutting device is convenient to use, high in cutting wafer cutting efficiency, small in material loss and low in cost.

Description

The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage
Technical field
The present invention relates to wafer cutting field, particularly relate to a kind of wafer dicing equipment.
Background technology
Current wafer cutting, as the cutting of monocrystalline silicon, main employing Linear cut method or laser cutting method, namely need to use wire cutting machine or laser cutting machine, the cutting of Linear cut function high strength, high tenacity, high rigidity, high fragility, magnetic material, and accurate tiny and complex-shaped part, but the wire feeder of wire cutting machine is more complicated, fault rate is higher, if be unfamiliar with this structure, a very little fault will affect processing, even causes lathe to shut down, laser cutting machine utilizes high power density laser bundle to irradiate cut material, material is made to be heated to vapourizing temperature very soon, evaporation forms hole, along with light beam is to the movement of material, hole forms (as about 0.1mm) joint-cutting of narrower in width continuously, complete the cutting to material, cutting speed is fast, quality is high, but laser cutting is due to the restriction of Stimulated Light device power and equipment volume, during laser cutting can only be cut, the sheet material of little thickness and tubing, along with the increase of thickness of workpiece, cutting speed obviously declines, adopt laser cutting input cost high completely when carrying out wafer cutting, power consumption is large, in addition, adopt separately Linear cut method or laser cutting method to cut crystal ingot, cutting mouth is all wider, generally between 100-300 micron, can waste a large amount of ingot material, even the cutting machine of advanced person, material consumption is also between 20%-30%.
Summary of the invention
Technical problem to be solved by this invention is to provide and a kind ofly saves material, reduce costs, wafer dicing equipment that the laser cutting that easy to use, production efficiency is high combines with mechanical cleavage.
The technical scheme that the present invention solves the problems of the technologies described above is as follows:
The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage, it comprises base, ring-shaped guide rail and vacuum adsorption conveying device, described base is vertically provided with at least two support bars, all described support bars are evenly distributed on the surrounding of described ring-shaped guide rail, and described in every root, support bar is all connected with the outside of described ring-shaped guide rail; Fixture for fixing crystal to be cut is installed on described base, between all described support bars, the inner side of described ring-shaped guide rail is provided with two electric machine supports that can circle along described ring-shaped guide rail, each described electric machine support is provided with can along the mobile motor of described ring-shaped guide rail radial direction movement and the guide rail matched with described mobile motor, a described mobile motor is provided with machinery knives, and described in another, mobile motor is provided with laser cutting head; Described vacuum adsorption conveying device comprises conveying device base, drive unit, live-roller and takes away the vacuum suction conveyer belt of wafer for aid crystal cleavage, described live-roller is arranged on described conveying device base by rolling bearing, described vacuum suction conveyer belt is centered around described live-roller surrounding, described drive unit drives described live-roller to rotate, described live-roller drives described vacuum suction conveyer belt to rotate, and described vacuum suction conveyer belt is positioned at the top of described ring-shaped guide rail.
Compared with prior art, the invention has the beneficial effects as follows:
Product of the present invention is easy to use, laser cutting head is first adopted to cut out very little, the very shallow otch of width, again effectively in conjunction with machinery knives and vacuum suction conveyer belt, cleavage method is utilized to realize wafer cutting, the otch waste material that such cutting produces is few, only the material suitable with notch depth, the material unaccounted-for (MUF) of wafer cutting can control within 4% (for 8 inches of crystal ingots, the cleavage degree of depth that otch has influence on is 2 millimeters), benefit is far away higher than prior art, the diameter of crystal ingot to be cut is larger, and spillage of material is less, more saves material; Do not need to use laser cutting completely, reduce costs; And the defect of the wafer cut down in cleavage surface is few, reduces the defect processing in wafer later stage and polishing step and time, add that the speed of cleavage is again much larger than conventional cutter, as the speed of Linear cut, therefore improves production efficiency greatly.
As a kind of preferred embodiment of the present invention, support bar described in every root is equipped with locking device, and be all connected by the outside of described locking device with described ring-shaped guide rail, when all described locking devices unclamp, described ring-shaped guide rail moves up and down along described support bar, when all described locking device locking, described ring-shaped guide rail is fixed on described support bar.
The beneficial effect of above-mentioned preferred version is adopted to be:
Ring-shaped guide rail moves up and down along support bar and fixes, and can either regulate the wafer thickness of each cutting, can realize cutting continuously again to a crystal to be cut according to actual conditions.
As another kind of preferred embodiment of the present invention, the quantity of described live-roller is 2-6.
The beneficial effect of above-mentioned preferred version is adopted to be:
The quantity of live-roller is preferably 2-6, can either realize the rotation of vacuum suction conveyer belt, and again under cost-saving prerequisite, be convenient to the wafer after by cutting and send away, more many being more convenient to of live-roller quantity is transmitted, and the fewer cost of quantity is lower.
As another kind of preferred embodiment of the present invention, the transporting velocity of described vacuum suction conveyer belt is 1-100cm/s.
The beneficial effect of above-mentioned preferred version is adopted to be:
Transporting velocity better can either realize the vacuum suction to wafer within the scope of this, is convenient to again the wafer after by cutting and sends away.
As another kind of preferred embodiment of the present invention, described vacuum suction conveyer belt is made up of elastomeric material, and its inside is provided with vacuum suction chamber, and its outer surface is provided with vacuum absorption holes.
The beneficial effect of above-mentioned preferred version is adopted to be:
Vacuum suction conveyer belt is made up of elastomeric material, and vacuum suction chamber, by vacuum pump evacuation, produces negative pressure, vacuum absorption holes just can be utilized to hold wafer.
As another kind of preferred embodiment of the present invention, the air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure.
The beneficial effect of above-mentioned preferred version is adopted to be:
Chip sucking, within the scope of this, just can be attached to vacuum suction conveyor belt surface by air pressure in vacuum suction chamber firmly.
As another kind of preferred embodiment of the present invention, described fixture is the fixture that can regulate chucking power.
The beneficial effect of above-mentioned preferred version is adopted to be:
Not only install simple, easy to operate, and can firmly crystal to be cut is fixed on base, to facilitate, it is cut.
As another kind of preferred embodiment of the present invention, described fixture is the cutting ferrule that can regulate internal diameter size.
The beneficial effect of above-mentioned preferred version is adopted to be:
Not only install simple, easy to operate, and can firmly crystal to be cut is fixed on base, to facilitate, it is cut.
As another kind of preferred embodiment of the present invention, described conveying device base is provided with the arrangement for adjusting height regulating its height.
The beneficial effect of above-mentioned preferred version is adopted to be:
Vacuum suction conveyer belt can move up and down along with the height change of conveying device base, when needs cut continuously to a crystal to be cut, vacuum suction conveyer belt can move down, make the outer surface of vacuum suction conveyer belt continue to be close to the upper surface of crystal to be cut, proceed absorption, cleavage, transmission.
Accompanying drawing explanation
Fig. 1 is the structural representation of product of the present invention;
In accompanying drawing, the list of parts representated by each label is as follows:
1, base, 2, ring-shaped guide rail, 3, support bar, 4, fixture, 5, electric machine support, 6, mobile motor, 7, live-roller, 8, vacuum suction conveyer belt, 9, vacuum absorption holes, 10, crystal to be cut, 11, wafer.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment
As shown in Figure 1, the wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage, it comprises base 1, ring-shaped guide rail 2 and vacuum adsorption conveying device, described base 1 is vertically provided with at least two support bars 3, all described support bars 3 are evenly distributed on the surrounding of described ring-shaped guide rail 2, support bar 3 described in every root is equipped with locking device, and be all connected by the outside of described locking device with described ring-shaped guide rail 2, when all described locking devices unclamp, described ring-shaped guide rail 2 moves up and down along described support bar 3, when all described locking device locking, described ring-shaped guide rail 2 is fixed on described support bar 3,
On described base 1, fixture 4 for fixing crystal 10 to be cut is installed between all described support bars 3, described fixture 4 can be the cutting ferrule that can regulate the fixture of chucking power or can regulate internal diameter size, the inner side of described ring-shaped guide rail 2 is provided with two electric machine supports 5 that can circle along described ring-shaped guide rail 2, each described electric machine support 5 is provided with can along the mobile motor 6 of described ring-shaped guide rail 2 radial direction movement and the guide rail matched with described mobile motor 6, a described mobile motor 6 is provided with machinery knives, described in another, mobile motor 6 is provided with laser cutting head,
Described vacuum adsorption conveying device comprises conveying device base, drive unit, live-roller 7 and take away the vacuum suction conveyer belt 8 of wafer 11 for aid crystal cleavage, described conveying device base is provided with the arrangement for adjusting height regulating its height, described vacuum suction conveyer belt 8 is made up of elastomeric material, its inside is provided with vacuum suction chamber, its outer surface is provided with vacuum absorption holes 9, air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure, described live-roller 7 is arranged on described conveying device base by rolling bearing, described vacuum suction conveyer belt 8 is centered around described live-roller 7 surrounding, described drive unit drives described live-roller 7 to rotate, described live-roller 7 drives described vacuum suction conveyer belt 8 to rotate, the quantity of described live-roller 7 is preferably as 2-6, described vacuum suction conveyer belt 8 is positioned at the top of described ring-shaped guide rail 2, its transporting velocity is 1-100cm/s.
Product of the present invention in use, first crystal 10 to be cut is fixed on base 1 by described fixture 4, again according to the height of crystal 10 to be cut, regulate the position of ring-shaped guide rail 2 on support bar 3, crystal 10 to be cut is made to be positioned in the middle of ring-shaped guide rail 2, and the height of the laser cutting head making to be arranged on the mobile motor 6 inside ring-shaped guide rail 2 or machinery knives needs the aligned in position of cutting respectively with crystal 10 to be cut, be close to by the outer surface of vacuum suction conveyer belt 8 on the upper surface of crystal 10 to be cut simultaneously;
Such laser cutting head is under the drive of mobile motor 6, just can move in a circle along ring-shaped guide rail 2, and focusing the laser beam to crystal 10 to be cut surface, crystal 10 to be cut cuts an annular incision, and notch depth is between 100 microns to 5 millimeters, then laser beam is closed, machinery knives move to correct position along ring-shaped guide rail 2 under the drive of another mobile motor 6, after aiming at annular incision, machinery knives move again under the drive of corresponding mobile motor 6 on electric machine support 5, and gradually near crystal 10 to be cut, machinery knives are made to cut annular incision, when the thickness of the machinery knives entering annular incision is greater than the width of annular incision, continue to promote machinery knives to crystal 10 direction to be cut, at this moment machinery knives will produce stress between the wafer 11 above crystal 10 to be cut and annular incision, wafer 11 is impelled to start cleavage from crystal 10 to be cut, re-use vacuum suction conveyer belt 8 and adsorb wafer 11, and drive it to move along cleavage direction, i.e. machinery knives incision direction motion, wafer 11 is facilitated to get off from cleavage crystal 10 to be cut and taken away by vacuum suction conveyer belt 8.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (9)

1. the wafer dicing equipment that combines with mechanical cleavage of a laser cutting, it is characterized in that, it comprises base (1), ring-shaped guide rail (2) and vacuum adsorption conveying device, described base (1) is vertically provided with at least two support bars (3), all described support bars (3) are evenly distributed on the surrounding of described ring-shaped guide rail (2), and described in every root, support bar (3) is all connected with the outside of described ring-shaped guide rail (2), on described base (1), fixture (4) for fixing crystal to be cut (10) is installed between all described support bars (3), the inner side of described ring-shaped guide rail (2) is provided with two electric machine supports (5) that can circle along described ring-shaped guide rail (2), each described electric machine support (5) is provided with can along the mobile motor (6) of described ring-shaped guide rail (2) radial direction movement and the guide rail matched with described mobile motor (6), a described mobile motor (6) is provided with machinery knives, mobile motor described in another (6) is provided with laser cutting head, described vacuum adsorption conveying device comprises conveying device base, drive unit, live-roller (7) and take away the vacuum suction conveyer belt (8) of wafer (11) for aid crystal cleavage, described live-roller (7) is arranged on described conveying device base by rolling bearing, described vacuum suction conveyer belt (8) is centered around described live-roller (7) surrounding, described drive unit drives described live-roller (7) to rotate, described live-roller (7) drives described vacuum suction conveyer belt (8) to rotate, described vacuum suction conveyer belt (8) is positioned at the top of described ring-shaped guide rail (2).
2. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, it is characterized in that, support bar (3) described in every root is equipped with locking device, and be all connected by the outside of described locking device with described ring-shaped guide rail (2), when all described locking devices unclamp, described ring-shaped guide rail (2) moves up and down along described support bar (3), and when all described locking device locking, described ring-shaped guide rail (2) is fixed on described support bar (3).
3. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, is characterized in that, the quantity of described live-roller (7) is 2-6.
4. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, it is characterized in that, the transporting velocity of described vacuum suction conveyer belt (8) is 1-100cm/s.
5. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, it is characterized in that, described vacuum suction conveyer belt (8) is made up of elastomeric material, and its inside is provided with vacuum suction chamber, and its outer surface is provided with vacuum absorption holes (9).
6. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 5, it is characterized in that, the air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure.
7. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, it is characterized in that, described fixture (4) is the fixture that can regulate chucking power.
8. the wafer dicing equipment that combines with mechanical cleavage of laser cutting according to claim 1, it is characterized in that, described fixture (4) is the cutting ferrule that can regulate internal diameter size.
9. the wafer dicing equipment that the laser cutting according to any one of claim 1-8 combines with mechanical cleavage, is characterized in that, described conveying device base is provided with the arrangement for adjusting height regulating its height.
CN201510606168.1A 2015-09-22 2015-09-22 The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage Active CN105057883B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105328349A (en) * 2015-11-20 2016-02-17 李晓勤 Plastic-steel wound pipe cutting device
CN109510061A (en) * 2018-12-21 2019-03-22 中国工程物理研究院电子工程研究所 A kind of method of gallium nitride lasers bar cleavage
CN112338369A (en) * 2020-11-06 2021-02-09 太仓治誓机械设备科技有限公司 Semiconductor wafer slicing and forming machine tool
CN114227949A (en) * 2021-11-30 2022-03-25 西安空间无线电技术研究所 Physical cutting method of magnetic base material

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002264078A (en) * 2001-03-08 2002-09-18 Sankyo Giken:Kk Cutting position marking device and cutting method using cutting position marking device
CN101992507A (en) * 2009-08-13 2011-03-30 中芯国际集成电路制造(上海)有限公司 Wafer cutting tool and method for cutting wafer by using same
WO2012126688A1 (en) * 2011-03-21 2012-09-27 Electronics And Computer Highlights - Produção, Reparação E Serviços Lda Apparatus for laser working of flat elements
CN203487032U (en) * 2013-09-18 2014-03-19 永润应用材料股份有限公司 Cutting equipment for optical glass and diamond cutter of cutting equipment
CN203599713U (en) * 2013-12-19 2014-05-21 黑龙江科技大学 Small horizontal type laser cutting device for laboratory
CN205043345U (en) * 2015-09-22 2016-02-24 成都锦盛新材科技有限公司 Wafer cutting equipment that laser cutting and mechanical cleavage combined together

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002264078A (en) * 2001-03-08 2002-09-18 Sankyo Giken:Kk Cutting position marking device and cutting method using cutting position marking device
CN101992507A (en) * 2009-08-13 2011-03-30 中芯国际集成电路制造(上海)有限公司 Wafer cutting tool and method for cutting wafer by using same
WO2012126688A1 (en) * 2011-03-21 2012-09-27 Electronics And Computer Highlights - Produção, Reparação E Serviços Lda Apparatus for laser working of flat elements
CN203487032U (en) * 2013-09-18 2014-03-19 永润应用材料股份有限公司 Cutting equipment for optical glass and diamond cutter of cutting equipment
CN203599713U (en) * 2013-12-19 2014-05-21 黑龙江科技大学 Small horizontal type laser cutting device for laboratory
CN205043345U (en) * 2015-09-22 2016-02-24 成都锦盛新材科技有限公司 Wafer cutting equipment that laser cutting and mechanical cleavage combined together

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105328349A (en) * 2015-11-20 2016-02-17 李晓勤 Plastic-steel wound pipe cutting device
CN109510061A (en) * 2018-12-21 2019-03-22 中国工程物理研究院电子工程研究所 A kind of method of gallium nitride lasers bar cleavage
CN109510061B (en) * 2018-12-21 2021-01-19 中国工程物理研究院电子工程研究所 Gallium nitride laser bar cleavage method
CN112338369A (en) * 2020-11-06 2021-02-09 太仓治誓机械设备科技有限公司 Semiconductor wafer slicing and forming machine tool
CN114227949A (en) * 2021-11-30 2022-03-25 西安空间无线电技术研究所 Physical cutting method of magnetic base material
CN114227949B (en) * 2021-11-30 2024-03-15 西安空间无线电技术研究所 Physical cutting method of magnetic substrate

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