CN105057883B - The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage - Google Patents

The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage Download PDF

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Publication number
CN105057883B
CN105057883B CN201510606168.1A CN201510606168A CN105057883B CN 105057883 B CN105057883 B CN 105057883B CN 201510606168 A CN201510606168 A CN 201510606168A CN 105057883 B CN105057883 B CN 105057883B
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Prior art keywords
guide rail
shaped guide
ring
laser cutting
vacuum suction
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CN105057883A (en
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李西军
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Chengdu Jin Sheng Green Wood Science And Technology Ltd
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Chengdu Jin Sheng Green Wood Science And Technology Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention relates to the wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage, it includes base, ring-shaped guide rail and vacuum adsorption conveying device, at least two support bars it are vertically arranged with on base, support bar is evenly distributed on the surrounding of ring-shaped guide rail, and be connected with outside it, on base, fixing device for fixing crystal to be cut is installed between support bar, the inner side of ring-shaped guide rail is provided with two can electric machine support that annularly guide rail circles, each electric machine support is provided with guide rail and mobile motor that annularly guide rail radial direction moves, two mobile motors are respectively equipped with machinery knives and laser cutting head, vacuum adsorption conveying device includes conveying device base, driving means, live-roller and vacuum suction conveyer belt, vacuum suction conveyer belt is positioned at the top of described ring-shaped guide rail and is centered around live-roller surrounding；Compared with prior art, product of the present invention is easy to use, and cut crystal is in hgher efficiency, and material unaccounted-for (MUF) is less, and cost is lower.

Description

The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage
Technical field
The present invention relates to wafer cutting field, particularly relate to a kind of wafer dicing equipment.
Background technology
Current wafer cutting, such as the cutting of monocrystalline silicon, main employing line patterning method or laser cutting method, i.e. needs to use wire cutting machine or laser cutting machine；Wire cutting machine can cut high intensity, high tenacity, high rigidity, high fragility, magnetic material; and the part that precision is tiny and complex-shaped; but the wire feeder of wire cutting machine is more complicated; fault rate is higher; if this structure is unfamiliar with; one fault the least will affect processing, even causes lathe to shut down；Laser cutting machine utilizes high power density laser bundle to irradiate cut material, material is made quickly to be heated to vapourizing temperature, evaporation forms hole, along with the light beam movement to material, hole is formed continuously (such as about 0.1mm) joint-cutting of narrower in width, complete the cutting to material, cutting speed is fast, quality is high, but laser cutting is due to Stimulated Light device power and the restriction of equipment volume, during laser cutting can only be cut, the sheet material of little thickness and tubing, increase along with thickness of workpiece, cutting speed is decreased obviously, use laser cutting input cost high completely when carrying out wafer cutting, power consumption is big；It addition, individually use line patterning method or laser cutting method to cut crystal ingot, cutting mouth is the widest, typically between 100-300 micron, can waste substantial amounts of ingot material, even the cutting machine of advanced person, material consumption is also between 20%-30%.
Summary of the invention
The technical problem to be solved be to provide a kind of save material, reduce cost, wafer dicing equipment that the laser cutting that easy to use, production efficiency is high combines with mechanical cleavage.
The technical scheme is that
The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage, it includes base, ring-shaped guide rail and vacuum adsorption conveying device, at least two support bars it are vertically arranged with on described base, all described support bars are evenly distributed on the surrounding of described ring-shaped guide rail, and every described support bar all outsides with described ring-shaped guide rail are connected；Fixing device for fixing crystal to be cut is installed on described base, between all described support bars, the inner side of described ring-shaped guide rail is provided with two electric machine supports that can circle along described ring-shaped guide rail, each described electric machine support is provided with the mobile motor that can move and the guide rail matched with described mobile motor along described ring-shaped guide rail radial direction, one described mobile motor is provided with machinery knives, and another described mobile motor is provided with laser cutting head；Described vacuum adsorption conveying device includes conveying device base, driving means, live-roller and for aid crystal cleavage the vacuum suction conveyer belt of taking away wafer, described live-roller is arranged on described conveying device base by rolling bearing, described vacuum suction conveyer belt is centered around described live-roller surrounding, described driving means drives described live-roller to rotate, described live-roller drives described vacuum suction conveyer belt to rotate, and described vacuum suction conveyer belt is positioned at the top of described ring-shaped guide rail.
Compared with prior art, the invention has the beneficial effects as follows:
Product of the present invention is easy to use, laser cutting head is first used to cut out the otch that width is the least, the most shallow, the most effectively combine machinery knives and vacuum suction conveyer belt, cleavage method is utilized to realize wafer cutting, the otch waste material that so cutting produces is few, it is only the material suitable with notch depth, the material unaccounted-for (MUF) of wafer cutting can control within 4% (as a example by 8 inches of crystal ingots, the cleavage degree of depth that otch has influence on is 2 millimeters), benefit is significantly larger than prior art, the diameter of crystal ingot to be cut is the biggest, and spillage of material is the least, more saves material；Need not use completely laser cutting, reduce cost；And defect that the wafer cut down is in cleavage surface is few, reduces the defect processing in wafer later stage and polishing step and time, add that the speed of cleavage, again much larger than conventional cutter, such as the speed of line cutting, is therefore greatly improved production efficiency.
A kind of preferred embodiment as the present invention, it is equipped with locking device on every described support bar, and be all connected by the outside of described locking device with described ring-shaped guide rail, when all described locking devices unclamp, described ring-shaped guide rail moves up and down along described support bar, when all described locking devices are locked, described ring-shaped guide rail is fixed on described support bar.
Above-mentioned preferred version is used to provide the benefit that:
Ring-shaped guide rail moves up and down along support bar and fixes, and according to the wafer thickness of actual conditions regulation cutting every time, one crystal to be cut can either can realize again cutting continuously.
As the another kind of preferred embodiment of the present invention, the quantity of described live-roller is 2-6.
Above-mentioned preferred version is used to provide the benefit that:
The quantity of live-roller is preferably 2-6, can either realize the rotation of vacuum suction conveyer belt, again on the premise of cost-effective, it is simple to sent away by the wafer after cutting, and live-roller quantity is the most more is easy to transmit, and the fewest cost of quantity is the lowest.
As the another kind of preferred embodiment of the present invention, the transporting velocity of described vacuum suction conveyer belt is 1-100cm/s.
Above-mentioned preferred version is used to provide the benefit that:
Transporting velocity can either preferably realize the vacuum suction to wafer in this range, and the wafer after being easy to cutting again sends away.
As the another kind of preferred embodiment of the present invention, described vacuum suction conveyer belt is made up of elastomeric material, is internally provided with vacuum suction chamber, and its outer surface is provided with vacuum absorption holes.
Above-mentioned preferred version is used to provide the benefit that:
Vacuum suction conveyer belt is made up of elastomeric material, and vacuum suction chamber is vacuumized by vavuum pump, produces negative pressure, it becomes possible to utilize vacuum absorption holes to hold wafer.
As the another kind of preferred embodiment of the present invention, the air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure.
Above-mentioned preferred version is used to provide the benefit that:
Air pressure in vacuum suction chamber is in this range, it becomes possible to chip sucking is attached to vacuum suction conveyor belt surface firmly.
As the another kind of preferred embodiment of the present invention, described fixing device is to regulate the fixture of chucking power.
Above-mentioned preferred version is used to provide the benefit that:
Not only install and be simple and convenient to operate, and can firmly crystal to be cut be fixed on base, to facilitate, it is cut.
As the another kind of preferred embodiment of the present invention, described fixing device is to regulate the cutting ferrule of internal diameter size.
Above-mentioned preferred version is used to provide the benefit that:
Not only install and be simple and convenient to operate, and can firmly crystal to be cut be fixed on base, to facilitate, it is cut.
As the another kind of preferred embodiment of the present invention, described conveying device base is provided with the arrangement for adjusting height of its height of regulation.
Above-mentioned preferred version is used to provide the benefit that:
Vacuum suction conveyer belt can move up and down along with the height change of conveying device base, when a crystal to be cut is cut by needs continuously, vacuum suction conveyer belt can move down, the outer surface making vacuum suction conveyer belt continues to be close to the upper surface of crystal to be cut, proceeds absorption, cleavage, transmission.
Accompanying drawing explanation
Fig. 1 is the structural representation of product of the present invention；
In accompanying drawing, the list of parts representated by each label is as follows:
1, base, 2, ring-shaped guide rail, 3, support bar, 4, fixing device, 5, electric machine support, 6, mobile motor, 7, live-roller, 8, vacuum suction conveyer belt, 9, vacuum absorption holes, 10, crystal to be cut, 11, wafer.
Detailed description of the invention
Being described principle and the feature of the present invention below in conjunction with accompanying drawing, example is served only for explaining the present invention, is not intended to limit the scope of the present invention.
Embodiment
As shown in Figure 1, the wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage, it includes base 1, ring-shaped guide rail 2 and vacuum adsorption conveying device, it is vertically arranged with at least two support bars 3 on described base 1, all described support bars 3 are evenly distributed on the surrounding of described ring-shaped guide rail 2, it is equipped with locking device on every described support bar 3, and be all connected by the outside of described locking device with described ring-shaped guide rail 2, when all described locking devices unclamp, described ring-shaped guide rail 2 moves up and down along described support bar 3, when all described locking devices are locked, described ring-shaped guide rail 2 is fixed on described support bar 3；
On described base 1, fixing device 4 for fixing crystal 10 to be cut is installed between all described support bars 3, described fixing device 4 can be can to regulate the fixture of chucking power or can regulate the cutting ferrule of internal diameter size, the inner side of described ring-shaped guide rail 2 is provided with two electric machine supports 5 that can circle along described ring-shaped guide rail 2, each described electric machine support 5 is provided with the mobile motor 6 that can move and the guide rail matched with described mobile motor 6 along described ring-shaped guide rail 2 radial direction, one described mobile motor 6 is provided with machinery knives, another described mobile motor 6 is provided with laser cutting head；
nullDescribed vacuum adsorption conveying device includes conveying device base、Driving means、Live-roller 7 and for aid crystal cleavage and take away the vacuum suction conveyer belt 8 of wafer 11，Described conveying device base is provided with the arrangement for adjusting height of its height of regulation，Described vacuum suction conveyer belt 8 is made up of elastomeric material，It is internally provided with vacuum suction chamber，Its outer surface is provided with vacuum absorption holes 9，Air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure，Described live-roller 7 is arranged on described conveying device base by rolling bearing，Described vacuum suction conveyer belt 8 is centered around described live-roller 7 surrounding，Described driving means drives described live-roller 7 to rotate，Described live-roller 7 drives described vacuum suction conveyer belt 8 to rotate，The quantity of described live-roller 7 is preferably as 2-6，Described vacuum suction conveyer belt 8 is positioned at the top of described ring-shaped guide rail 2，Its transporting velocity is 1-100cm/s.
Product of the present invention is in use, first crystal 10 to be cut is fixed on base 1 by described fixing device 4, height further according to crystal 10 to be cut, the regulation ring-shaped guide rail 2 position on support bar 3, crystal 10 to be cut is made to be positioned in the middle of ring-shaped guide rail 2, and make the height of the laser cutting head or machinery knives that are arranged on the mobile motor 6 inside ring-shaped guide rail 2 need the aligned in position of cutting with crystal 10 to be cut respectively, the outer surface of vacuum suction conveyer belt 8 is close on the upper surface of crystal 10 to be cut simultaneously；
So laser cutting head is under the drive of mobile motor 6, just can move in a circle along ring-shaped guide rail 2, and focuses the laser beam to crystal 10 surface to be cut, cuts an annular incision on crystal 10 to be cut, and notch depth is between 100 microns to 5 millimeters；nullIt is then shut off laser beam，Machinery knives move to correct position along ring-shaped guide rail 2 under the drive of another mobile motor 6，After aiming at annular incision，Machinery knives move again under the drive of corresponding mobile motor 6 on electric machine support 5，And move closer to crystal 10 to be cut，Machinery knives are made to cut annular incision，When entering the width that the thickness of machinery knives of annular incision is more than annular incision，Continue to promote machinery knives to crystal 10 direction to be cut，At this moment machinery knives will produce stress between the wafer 11 above crystal 10 to be cut and annular incision，Wafer 11 is promoted to start cleavage from crystal 10 to be cut，Re-use vacuum suction conveyer belt 8 and adsorb wafer 11，And drive it to move along cleavage direction，I.e. machinery knives incision direction motion，Wafer 11 cleavage from crystal 10 to be cut is facilitated to get off and taken away by vacuum suction conveyer belt 8.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.

Claims (7)

1. the wafer dicing equipment that a laser cutting combines with mechanical cleavage, it is characterized in that, it includes base (1), ring-shaped guide rail (2) and vacuum adsorption conveying device, at least two support bars (3) it are vertically arranged with on described base (1), all described support bars (3) are evenly distributed on the surrounding of described ring-shaped guide rail (2), and every described support bar (3) all outsides with described ring-shaped guide rail (2) are connected；On described base (1), fixing device (4) for fixing crystal to be cut (10) is installed between all described support bars (3), the inner side of described ring-shaped guide rail (2) is provided with two electric machine supports (5) that can circle along described ring-shaped guide rail (2), each described electric machine support (5) is provided with can be along the mobile motor (6) that described ring-shaped guide rail (2) radial direction moves and the guide rail matched with described mobile motor (6), one described mobile motor (6) is provided with machinery knives, another described mobile motor (6) is provided with laser cutting head；nullDescribed vacuum adsorption conveying device includes conveying device base、Driving means、Live-roller (7) and for aid crystal cleavage and take away the vacuum suction conveyer belt (8) of wafer (11)，Described live-roller (7) is arranged on described conveying device base by rolling bearing，Described vacuum suction conveyer belt (8) is centered around described live-roller (7) surrounding，Described driving means drives described live-roller (7) to rotate，Described live-roller (7) drives described vacuum suction conveyer belt (8) to rotate，Described vacuum suction conveyer belt (8) is positioned at the top of described ring-shaped guide rail (2)，It is equipped with locking device on every described support bar (3)，And be all connected by the outside of described locking device with described ring-shaped guide rail (2)，When all described locking devices unclamp，Described ring-shaped guide rail (2) moves up and down along described support bar (3)，When all described locking devices are locked，Described ring-shaped guide rail (2) is fixed on described support bar (3)，The quantity of described live-roller (7) is 2-6.
The wafer dicing equipment that laser cutting the most according to claim 1 combines with mechanical cleavage, it is characterised in that the transporting velocity of described vacuum suction conveyer belt (8) is 1-100cm/s.
The wafer dicing equipment that laser cutting the most according to claim 1 combines with mechanical cleavage, it is characterised in that described vacuum suction conveyer belt (8) is made up of elastomeric material, is internally provided with vacuum suction chamber, and its outer surface is provided with vacuum absorption holes (9).
The wafer dicing equipment that laser cutting the most according to claim 3 combines with mechanical cleavage, it is characterised in that the air pressure in described vacuum suction chamber is 0.001-0.2 atmospheric pressure.
The wafer dicing equipment that laser cutting the most according to claim 1 combines with mechanical cleavage, it is characterised in that described fixing device (4) is the fixture that can regulate chucking power.
The wafer dicing equipment that laser cutting the most according to claim 1 combines with mechanical cleavage, it is characterised in that described fixing device (4) is the cutting ferrule that can regulate internal diameter size.
7. the wafer dicing equipment combined with mechanical cleavage according to the laser cutting according to any one of claim 1-6, it is characterised in that described conveying device base is provided with the arrangement for adjusting height of its height of regulation.
CN201510606168.1A 2015-09-22 2015-09-22 The wafer dicing equipment that a kind of laser cutting combines with mechanical cleavage Active CN105057883B (en)

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CN105057883B true CN105057883B (en) 2016-09-07

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105328349A (en) * 2015-11-20 2016-02-17 李晓勤 Plastic-steel wound pipe cutting device
CN109510061B (en) * 2018-12-21 2021-01-19 中国工程物理研究院电子工程研究所 Gallium nitride laser bar cleavage method
CN112338369A (en) * 2020-11-06 2021-02-09 太仓治誓机械设备科技有限公司 Semiconductor wafer slicing and forming machine tool
CN114227949B (en) * 2021-11-30 2024-03-15 西安空间无线电技术研究所 Physical cutting method of magnetic substrate

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* Cited by examiner, † Cited by third party
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JP2002264078A (en) * 2001-03-08 2002-09-18 Sankyo Giken:Kk Cutting position marking device and cutting method using cutting position marking device
CN101992507B (en) * 2009-08-13 2013-06-12 中芯国际集成电路制造(上海)有限公司 Wafer cutting tool and method for cutting wafer by using same
WO2012126688A1 (en) * 2011-03-21 2012-09-27 Electronics And Computer Highlights - Produção, Reparação E Serviços Lda Apparatus for laser working of flat elements
CN203487032U (en) * 2013-09-18 2014-03-19 永润应用材料股份有限公司 Cutting equipment for optical glass and diamond cutter of cutting equipment
CN203599713U (en) * 2013-12-19 2014-05-21 黑龙江科技大学 Small horizontal type laser cutting device for laboratory
CN205043345U (en) * 2015-09-22 2016-02-24 成都锦盛新材科技有限公司 Wafer cutting equipment that laser cutting and mechanical cleavage combined together

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