CN105345268A - Laser scribing machine - Google Patents
Laser scribing machine Download PDFInfo
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- CN105345268A CN105345268A CN201410410192.3A CN201410410192A CN105345268A CN 105345268 A CN105345268 A CN 105345268A CN 201410410192 A CN201410410192 A CN 201410410192A CN 105345268 A CN105345268 A CN 105345268A
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Abstract
The invention discloses a laser scribing machine. The laser scribing machine comprises a scribing machine body, a control assembly, a cutting positioning assembly arranged on the scribing machine body, and a laser cutting mechanism arranged on the scribing machine body and matched with the cutting positioning assembly. The laser cutting mechanism comprises a laser generator which is arranged on the scribing machine body, a light path structure arranged on the laser generator and used for transmitting laser light emitted by the laser generator, and a cutting structure arranged on the light path structure and used for cutting a wafer. The light path structure comprises at least one beam expander used for beam expansion of the laser light, and a plurality of reflectors used for reflective transmission of the laser light. The laser scribing machine is high in working efficiency; the positions, in all directions, of the wafer to be cut can be adjusted accurately; the precision is high, and the cutting position of the wafer can be accurately positioned; wafer chips obtained through cutting are uniform and attractive, various materials can be cut, and the adaptability is high.
Description
Technical field
The present invention relates to wafer manufacturing technical field, particularly relate to a kind of laser scribing means that wafer is cut.
Background technology
Along with the extensive use of silicon semiconductor integrated circuit, silicon semiconductor integrated circuit all will use wafer, traditional wafer cutting technique, be all that the manual diamond tool that adopts cuts, consumptive material is large, often cutter will be changed, the chip wafer cut out width is apart larger, uneven, and the material that can cut is single, poor for applicability, inefficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of laser scribing means, the position that this laser scribing means operating efficiency is high, accurately can adjust all directions of wafer to be cut, precision be high, accurately locate the position of wafer cutting, the chip wafer cut out is even, attractive in appearance, multiple material can be cut, strong adaptability.
For solving the problems of the technologies described above, laser scribing means provided by the invention comprises scribing machine body, be placed in the intrinsic Control Component of described scribing machine, be installed in the cutting positioning component on described scribing machine body, to be installed on described scribing machine body and the laser cutting mechanism cooperatively interacted with described cutting positioning component, described laser cutting mechanism comprises the laser generator be installed on described scribing machine body, be installed on described laser generator and carry out for the laser sent by laser generator the light channel structure that transmits, be installed in the cutting structure for cutting described wafer on described light channel structure, described light channel structure comprises at least one beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted.
Preferably, described cutting positioning component comprises and being installed in described laser cutting mechanism for the CCD detection architecture detected the cutting position of described wafer, the linear movement mechanism cooperatively interacted with described CCD detection architecture be installed on described scribing machine body.
Preferably, described laser scribing means also comprises the cooling device cooled described laser cutting mechanism.
Preferably, described linear movement mechanism comprises the X-axis moving structure be installed on described scribing machine body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in and described Y-axis moving structure inhales flat vacuum ceramic sucker for being carried out by described wafer to be cut, described X-axis moving structure comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, described Y-axis moving structure comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, described vacuum ceramic sucker can do circular-rotation, described Control Component and described first drive motors and the second drive motors are electrically connected.
Preferably, described CCD detection architecture comprises the CCD camera be installed in described laser cutting mechanism, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
Preferably, described light channel structure comprises the first speculum, the second speculum, beam expanding lens, the assemble sequence of each parts of described light channel structure inside is: described beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, and described second speculum is installed in before described first speculum.
Preferably, described cutting structure comprises the Z axis moving structure be installed on described light channel structure and the laser head be installed on described Z axis moving structure, described Z axis moving structure comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described Control Component and described 3rd drive motors are electrically connected.
Preferably, described Control Component comprises: display module, for the performance parameter of described laser scribing means is passed through interface display; And/or key-press module, carry out work for handling described laser scribing means.
After adopting said structure, wafer to be cut passes through manually to be placed on described ceramic sucker by described laser scribing means, described wafer to be cut is inhaled flat by described ceramic sucker, described ceramic sucker is sent to position to be cut by described linear movement mechanism, a described CCD camera and the 2nd CCD camera are taken the cut point of described wafer to be cut by described first light source and secondary light source and are analyzed, then the position of cutting is sent to cutting head, laser is sent to described cutting head by described light channel structure by described laser hair device, described cutting head cuts along cut point wafer, this laser scribing means operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance, multiple material can be cut, strong adaptability.
Accompanying drawing explanation
Fig. 1 is the structural representation of laser scribing means of the present invention;
Fig. 2 is the structural representation of laser scribing means CCD detection architecture of the present invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only for explaining the present invention, being not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the structural representation of laser scribing means of the present invention,
In the present embodiment, laser scribing means 10 comprises scribing machine body 11, be placed in the Control Component in scribing machine body 11, be installed in the cutting positioning component 13 on scribing machine body 11, to be installed on scribing machine body 11 and the laser cutting mechanism 14 cooperatively interacted with cutting positioning component 13, to the cooling device that described laser cutting mechanism cools, laser cutting mechanism 14 comprises the laser generator 141 be installed on scribing machine body 11, be installed on laser generator 141 and carry out for the laser sent by laser generator the light channel structure 142 that transmits, be installed in the cutting structure 143 for cutting described wafer on light channel structure 142, light channel structure 142 comprises at least one beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted.
Cutting positioning component 13 comprise be installed in laser cutting mechanism 14 for the cutting position of described wafer is detected CCD detection architecture 131, be installed on described scribing machine body and that CCD detection architecture 131 cooperatively interacts linear movement mechanism 132.
Linear movement mechanism 131 comprises the X-axis moving structure 131a be installed on described scribing machine body, be installed in the Y-axis moving structure 131b on X-axis moving structure 131a, be installed in and Y-axis moving structure 131b inhales flat vacuum ceramic sucker 131c for being carried out by described wafer to be cut, X-axis moving structure 131a comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, Y-axis moving structure 132b comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, vacuum ceramic sucker 131c can do circular-rotation, described Control Component and described first drive motors and the second drive motors are electrically connected.
Refer to Fig. 2, Fig. 2 is the structural representation of laser scribing means CCD detection architecture of the present invention; CCD detection architecture 132 comprises the CCD camera 141 be installed in laser cutting mechanism 14, the 2nd CCD camera 142, being installed in wafer cut point the first light source more clearly for making CCD camera take on a CCD camera 141, being installed in the wafer cut point secondary light source more clearly for making the 2nd CCD camera 142 take on the 2nd CCD camera 142.
In the present embodiment, preferred light channel structure 142 comprises the first speculum, the second speculum, beam expanding lens, the assemble sequence of each parts of described light channel structure inside is: described beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, and described second speculum is installed in before described first speculum.
Cutting structure 143 comprises the Z axis moving structure 143b be installed on the light channel structure 142 and laser head 143a be installed on Z axis moving structure, Z axis moving structure 143b comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described Control Component and described 3rd drive motors are electrically connected.
Described Control Component comprises: display module, for the performance parameter of described laser scribing means is passed through interface display; And/or key-press module, carry out work for handling described laser scribing means.
Should be understood that; these are only the preferred embodiments of the present invention; can not therefore limit the scope of the claims of the present invention; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. laser scribing means, it is characterized in that: comprise scribing machine body, be placed in the intrinsic Control Component of described scribing machine, be installed in the cutting positioning component on described scribing machine body, to be installed on described scribing machine body and the laser cutting mechanism cooperatively interacted with described cutting positioning component, described laser cutting mechanism comprises the laser generator be installed on described scribing machine body, be installed on described laser generator and carry out for the laser sent by laser generator the light channel structure that transmits, be installed in the cutting structure for cutting wafer on described light channel structure, described light channel structure comprises at least one beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted.
2. laser scribing means according to claim 1, is characterized in that: described cutting positioning component comprises and being installed in described laser cutting mechanism for the CCD detection architecture detected the cutting position of described wafer, the linear movement mechanism cooperatively interacted with described CCD detection architecture be installed on described scribing machine body.
3. laser scribing means according to claim 1, is characterized in that: described laser scribing means also comprises the cooling device cooled described laser cutting mechanism.
4. laser scribing means according to claim 2, it is characterized in that: described linear movement mechanism comprises the X-axis moving structure be installed on described scribing machine body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in and described Y-axis moving structure inhales flat vacuum ceramic sucker for being carried out by described wafer to be cut, described X-axis moving structure comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, described Y-axis moving structure comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, described vacuum ceramic sucker can do circular-rotation, described Control Component and described first drive motors and the second drive motors are electrically connected.
5. laser scribing means according to claim 2, it is characterized in that: described CCD detection architecture comprises the CCD camera be installed in described laser cutting mechanism, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
6. laser scribing means according to claim 1, it is characterized in that: described light channel structure comprises the first speculum, the second speculum, beam expanding lens, the assemble sequence of each parts of described light channel structure inside is: described beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, and described second speculum is installed in before described first speculum.
7. laser scribing means according to claim 1, it is characterized in that: described cutting structure comprises the Z axis moving structure be installed on described light channel structure and the laser head be installed on described Z axis moving structure, described Z axis moving structure comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described Control Component and described 3rd drive motors are electrically connected.
8. laser scribing means according to claim 1, is characterized in that: described Control Component comprises: display module, for the performance parameter of described laser scribing means is passed through interface display; And/or key-press module, carry out work for handling described laser scribing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410192.3A CN105345268A (en) | 2014-08-18 | 2014-08-18 | Laser scribing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410192.3A CN105345268A (en) | 2014-08-18 | 2014-08-18 | Laser scribing machine |
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| Publication Number | Publication Date |
|---|---|
| CN105345268A true CN105345268A (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410410192.3A Pending CN105345268A (en) | 2014-08-18 | 2014-08-18 | Laser scribing machine |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106975848A (en) * | 2017-06-07 | 2017-07-25 | 佛山市建金建电子科技有限公司 | A kind of fine adjustment type laser cutting device |
| CN109639930A (en) * | 2018-12-01 | 2019-04-16 | 吴克成 | A kind of semiconductor crystal wafer diced system based on computer vision and its cutting method |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
| CN109693048A (en) * | 2019-02-20 | 2019-04-30 | 广州安特激光技术有限公司 | A kind of laser cutting device of wafer |
| CN110587835A (en) * | 2019-09-24 | 2019-12-20 | 上海集成电路研发中心有限公司 | Cutting method of grating silicon wafer |
| CN112338369A (en) * | 2020-11-06 | 2021-02-09 | 太仓治誓机械设备科技有限公司 | Semiconductor wafer slicing and forming machine tool |
| CN114750318A (en) * | 2022-05-20 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing positioning device, scribing machine and positioning method |
| CN114750319A (en) * | 2022-05-25 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing machine base and scribing machine |
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| US20070109526A1 (en) * | 2005-11-16 | 2007-05-17 | Disco Corporation | Laser beam processing machine |
| CN201151023Y (en) * | 2008-01-16 | 2008-11-19 | 武汉华工激光工程有限责任公司 | Wafer ultraviolet laser dicing saw |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106975848A (en) * | 2017-06-07 | 2017-07-25 | 佛山市建金建电子科技有限公司 | A kind of fine adjustment type laser cutting device |
| CN109639930A (en) * | 2018-12-01 | 2019-04-16 | 吴克成 | A kind of semiconductor crystal wafer diced system based on computer vision and its cutting method |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
| CN109693048A (en) * | 2019-02-20 | 2019-04-30 | 广州安特激光技术有限公司 | A kind of laser cutting device of wafer |
| CN110587835A (en) * | 2019-09-24 | 2019-12-20 | 上海集成电路研发中心有限公司 | Cutting method of grating silicon wafer |
| CN112338369A (en) * | 2020-11-06 | 2021-02-09 | 太仓治誓机械设备科技有限公司 | Semiconductor wafer slicing and forming machine tool |
| CN114750318A (en) * | 2022-05-20 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing positioning device, scribing machine and positioning method |
| CN114750319A (en) * | 2022-05-25 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing machine base and scribing machine |
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Application publication date: 20160224 |
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