CN105312774A - Full-automatic wafer cutting machine - Google Patents
Full-automatic wafer cutting machine Download PDFInfo
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- CN105312774A CN105312774A CN201410371423.4A CN201410371423A CN105312774A CN 105312774 A CN105312774 A CN 105312774A CN 201410371423 A CN201410371423 A CN 201410371423A CN 105312774 A CN105312774 A CN 105312774A
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Abstract
The invention discloses a full-automatic wafer cutting machine. The full-automatic wafer cutting machine comprises a cutting machine body, a control assembly, a feeding structure assembly, a cutting positioning assembly, a vacuum transfer mechanism and a laser cutting mechanism, wherein the laser cutting mechanism comprises a laser generator, an optical path structure and a cutting structure; the vacuum transfer mechanism can move back and forth and move vertically along straight lines; the cutting positioning assembly can move back and forth along X and Y axes and rotate circumferentially; the optical path structure comprises at least two beam expanders for expanding laser beams, a plurality of mirrors for reflecting and transferring lasers, a diaphragm for filtering stray light out of the lasers and an optical gate for controlling on-off of the lasers. The full-automatic wafer cutting machine is high in working efficiency, precision and adaptability, can adjust positions of a to-be-cut wafer in all directions accurately, operates in a full-automatic manner, positions the cut position of the wafer accurately and can cut various materials; the cut wafer have uniform chips and attractiveness.
Description
Technical field
The present invention relates to wafer manufacturing technical field, particularly relate to a kind of full-automatic wafer cutting machine.
Background technology
Along with the extensive use of silicon semiconductor integrated circuit, silicon semiconductor integrated circuit all will use wafer, traditional wafer cutting technique, be all that the manual diamond tool that adopts cuts, consumptive material is large, often cutter will be changed, the chip wafer cut out width is apart larger, uneven, and the material that can cut is single, poor for applicability, inefficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of full-automatic wafer cutting machine, the position that this full-automatic wafer cutting machine operating efficiency is high, accurately can adjust all directions of wafer to be cut, precision are high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance, multiple material can be cut, strong adaptability.
For solving the problems of the technologies described above, full-automatic wafer cutting machine provided by the invention comprises cutting machine body, be placed in the intrinsic Control Component of described cutting machine, be installed in the feeding structure assembly on described cutting machine body, cutting positioning component, to be installed on described cutting machine body and wafer to be cut to be sent to the vacuum transfer mechanism of described cutting positioning component from feeding mechanism assembly, to be installed on described cutting machine body and the laser cutting mechanism cooperatively interacted with described cutting positioning component, described laser cutting mechanism comprises the laser generator be installed on described cutting machine body, be installed on described laser generator and carry out for the laser sent by laser generator the light channel structure that transmits, be installed in the cutting structure for cutting described wafer on described light channel structure, described vacuum transfer mechanism linearly can move around and moves up and down, described cutting positioning component can along X, Y-axis moves around and circular-rotation, described light channel structure comprises at least two beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted, laser is carried out to the diaphragm of veiling glare filtering, laser is carried out to the optical gate of switch control rule.
Preferably, described feeding structure assembly comprises being installed on described cutting machine body and carries out the distributing structure of sub-material, the material fetching mechanism for being carried out picking and placeing on described distributing structure by wafer to be cut for treating cutting crystal wafer sheet.
Preferably, described cutting positioning component comprises and being installed in described laser cutting mechanism for the CCD detection architecture detected the cutting position of described wafer, the linear movement mechanism cooperatively interacted with described CCD detection architecture be installed on described cutting machine body.
Preferably, described full-automatic wafer cutting machine also comprises the cooling device cooled described laser cutting mechanism.
Preferably, described linear movement mechanism comprises the first X-axis moving structure be installed on described cutting machine body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in and described Y-axis moving structure inhales flat vacuum ceramic sucker for being carried out by described wafer to be cut, described first X-axis moving structure comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, described Y-axis moving structure comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, described vacuum ceramic sucker can do circular-rotation.
Preferably, described vacuum transfer mechanism comprises the second X-axis moving structure be installed on described cutting body, the first Z axis moving structure be installed on described second X-axis moving structure, described second X-axis moving structure comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described first Z axis moving structure comprises the 4th screw mandrel, the 4th screw rodb base and the four-wheel drive motor for driving described 4th screw mandrel to rotate.
Preferably, described CCD detection architecture comprises the CCD camera be installed in described laser cutting mechanism, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
Preferably, described light channel structure comprises the first speculum, second speculum, 3rd speculum, 4th speculum, first beam expanding lens, second beam expanding lens, optical gate and diaphragm, the assemble sequence of each parts of described line structure inside is: described first beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, described diaphragm is installed in before described first speculum, described second speculum is installed in before described diaphragm, described optical gate is installed in before described second speculum, described 3rd speculum is installed in before described optical gate, described second beam expanding lens is installed in before described 3rd speculum, described 4th speculum is installed in before described second beam expanding lens, described cutting head is installed in before described 4th speculum.
Preferably, described cutting structure comprises the second Z axis moving structure be installed on described light channel structure and the laser head be installed on described second Z axis moving structure, and described second Z axis moving structure comprises the 5th screw mandrel, the 5th screw rodb base and the 5th drive motors for driving described 5th screw mandrel to rotate.
Preferably, described Control Component comprises: display module, for the performance parameter of described full-automatic wafer cutting machine is passed through interface display; And/or key-press module, carry out work for handling described full-automatic wafer cutting machine.
After adopting said structure, wafer to be cut is placed on starting platform by feeding structure assembly by described full-automatic wafer cutting machine, described wafer to be cut is sent to described ceramic sucker from described starting platform by described vacuum transfer structure, described wafer to be cut is inhaled flat by described ceramic sucker, described ceramic sucker is sent to position to be cut by described linear movement mechanism, a described CCD camera and the 2nd CCD camera are taken the cut point of described wafer to be cut by described first light source and secondary light source and are analyzed, then the position of cutting is sent to cutting head, laser is sent to described cutting head by described light channel structure by described laser hair device, described cutting head cuts along cut point wafer, this full-automatic wafer cutting machine operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance, multiple material can be cut, strong adaptability.
Accompanying drawing explanation
Fig. 1 is the perspective view of full-automatic wafer cutting machine of the present invention;
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only for explaining the present invention, being not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the perspective view of full-automatic wafer cutting machine of the present invention, in the present embodiment, full-automatic wafer cutting machine 10 comprises cutting machine body 16, be placed in the Control Component in described cutting machine body 16, be installed in the feeding structure assembly 11 on cutting machine body 16, cutting positioning component 13, to be installed on cutting machine body 16 and wafer to be cut to be sent to the vacuum transfer mechanism 12 of described cutting positioning component 13 from feeding mechanism assembly 11, to be installed on described cutting machine body 16 and the laser cutting mechanism 14 cooperatively interacted with cutting positioning component 13, laser cutting mechanism 14 comprises the laser generator 141 be installed on cutting machine body 16, be installed on laser generator 141 and carry out for the laser sent by laser generator the light channel structure 142 that transmits, be installed in the cutting structure 143 for cutting described wafer on light channel structure 142, the cooling device 15 that can cool laser cutting mechanism 14, vacuum transfer mechanism linearly can move around and moves up and down, cutting positioning component can along X, Y-axis moves around and circular-rotation, light channel structure 142 comprises at least two beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted, laser is carried out to the diaphragm of veiling glare filtering, laser is carried out to the optical gate of switch control rule.
Feeding structure assembly 11 comprises the distributing structure, the material fetching mechanism for being carried out picking and placeing on described distributing structure by wafer to be cut that are installed in and cutting machine body 16 carry out sub-material for treating cutting crystal wafer sheet.
Cutting positioning component 13 comprise be installed in laser cutting mechanism 14 for the cutting position of wafer is detected CCD detection architecture 131, be installed in the linear movement mechanism 132 that on cutting machine body 131 and CCD detection architecture 131 cooperatively interacts.
Linear movement mechanism 132 comprises the first X-axis moving structure be installed on cutting machine body 16, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in and described Y-axis moving structure inhales flat vacuum ceramic sucker for being carried out by described wafer to be cut, described first X-axis moving structure comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, described Y-axis moving structure comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, vacuum ceramic sucker can do circular-rotation.
Vacuum transfer mechanism 12 comprises the second X-axis moving structure, the first Z axis moving structure be installed on the second X-axis moving structure that are installed on cutting body 16, described second X-axis moving structure comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described first Z axis moving structure comprises the 4th screw mandrel, the 4th screw rodb base and the four-wheel drive motor for driving described 4th screw mandrel to rotate.
CCD detection architecture 131 comprises the CCD camera be installed in described laser cutting mechanism 14, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on the 2nd CCD camera.
In the present embodiment, preferred light channel structure 142 comprises the first speculum, second speculum, 3rd speculum, 4th speculum, first beam expanding lens, second beam expanding lens, optical gate and diaphragm, the assemble sequence of each parts of described line structure inside is: described first beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, described diaphragm is installed in before described first speculum, described second speculum is installed in before described diaphragm, described optical gate is installed in before described second speculum, described 3rd speculum is installed in before described optical gate, described second beam expanding lens is installed in before described 3rd speculum, described 4th speculum is installed in before described second beam expanding lens, described cutting head is installed in before described 4th speculum.
Cutting structure 143 comprises the second Z axis moving structure be installed on light channel structure 142 and the laser head be installed on the second Z axis moving structure, and the second Z axis moving structure comprises the 5th screw mandrel, the 5th screw rodb base and the 5th drive motors for driving described 5th screw mandrel to rotate.
Control Component comprises: display module, for the performance parameter of described full-automatic wafer cutting machine is passed through interface display; And/or key-press module, carry out work for handling described full-automatic wafer cutting machine.
Wafer to be cut is placed on starting platform by feeding structure assembly by full-automatic wafer cutting machine 10, linear movement mechanism 132 by location platform to be cut along the first X-axis moving structure be sent to corresponding with vacuum transfer structure before cutting position, described wafer to be cut is sent to the ceramic sucker of front cutting position from starting platform by vacuum transfer structure 12, described wafer to be cut is inhaled flat by pottery sucker, ceramic sucker on front cutting position is sent to position to be cut by described linear movement mechanism by linear movement mechanism 132, one CCD camera and the 2nd CCD camera are taken the cut point of wafer to be cut by described first light source and secondary light source and are analyzed, then the position of cutting is sent to cutting head, laser is sent to cutting head by light channel structure 142 by laser hair device 141, cutting head cuts along cut point wafer, this full-automatic wafer cutting machine operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance, multiple material can be cut, strong adaptability.
Should be understood that; these are only the preferred embodiments of the present invention; can not therefore limit the scope of the claims of the present invention; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. full-automatic wafer cutting machine, it is characterized in that: comprise cutting machine body, be placed in the intrinsic Control Component of described cutting machine, be installed in the feeding structure assembly on described cutting machine body, cutting positioning component, to be installed on described cutting machine body and wafer to be cut to be sent to the vacuum transfer mechanism of described cutting positioning component from feeding mechanism assembly, to be installed on described cutting machine body and the laser cutting mechanism cooperatively interacted with described cutting positioning component, described laser cutting mechanism comprises the laser generator be installed on described cutting machine body, be installed on described laser generator and carry out for the laser sent by laser generator the light channel structure that transmits, be installed in the cutting structure for cutting described wafer on described light channel structure, described vacuum transfer mechanism linearly can move around and moves up and down, described cutting positioning component can along X, Y-axis moves around and circular-rotation, described light channel structure comprises at least two beam expanding lens for being carried out expanding by laser, some carrying out laser reflects the speculum transmitted, laser is carried out to the diaphragm of veiling glare filtering, laser is carried out to the optical gate of switch control rule.
2. full-automatic wafer cutting machine according to claim 1, is characterized in that: described feeding structure assembly comprises being installed on described cutting machine body and carries out the distributing structure of sub-material, the material fetching mechanism for being carried out picking and placeing on described distributing structure by wafer to be cut for treating cutting crystal wafer sheet.
3. full-automatic wafer cutting machine according to claim 1, is characterized in that: described cutting positioning component comprises and being installed in described laser cutting mechanism for the CCD detection architecture detected the cutting position of described wafer, the linear movement mechanism cooperatively interacted with described CCD detection architecture be installed on described cutting machine body.
4. full-automatic wafer cutting machine according to claim 1, is characterized in that: described full-automatic wafer cutting machine also comprises the cooling device cooled described laser cutting mechanism.
5. full-automatic wafer cutting machine according to claim 3, it is characterized in that: described linear movement mechanism comprises the first X-axis moving structure be installed on described cutting machine body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in and described Y-axis moving structure inhales flat vacuum ceramic sucker for being carried out by described wafer to be cut, described first X-axis moving structure comprises the first screw mandrel, first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, described Y-axis moving structure comprises the second screw mandrel, second screw rodb base and the second drive motors for driving described second screw mandrel to rotate, described vacuum ceramic sucker can do circular-rotation.
6. full-automatic wafer cutting machine according to claim 1, it is characterized in that: described vacuum transfer mechanism comprises the second X-axis moving structure be installed on described cutting body, the first Z axis moving structure be installed on described second X-axis moving structure, described second X-axis moving structure comprises the 3rd screw mandrel, the 3rd screw rodb base and the 3rd drive motors for driving described 3rd screw mandrel to rotate, and described first Z axis moving structure comprises the 4th screw mandrel, the 4th screw rodb base and the four-wheel drive motor for driving described 4th screw mandrel to rotate.
7. full-automatic wafer cutting machine according to claim 3, it is characterized in that: described CCD detection architecture comprises the CCD camera be installed in described laser cutting mechanism, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
8. full-automatic wafer cutting machine according to claim 1, it is characterized in that: described light channel structure comprises the first speculum, second speculum, 3rd speculum, 4th speculum, first beam expanding lens, second beam expanding lens, optical gate and diaphragm, the assemble sequence of each parts of described line structure inside is: described first beam expanding lens is installed in before described laser generator, described first speculum is installed in face in face of described beam expanding lens, described diaphragm is installed in before described first speculum, described second speculum is installed in before described diaphragm, described optical gate is installed in before described second speculum, described 3rd speculum is installed in before described optical gate, described second beam expanding lens is installed in before described 3rd speculum, described 4th speculum is installed in before described second beam expanding lens, described cutting head is installed in before described 4th speculum.
9. full-automatic wafer cutting machine according to claim 1, it is characterized in that: described cutting structure comprises the second Z axis moving structure be installed on described light channel structure and the laser head be installed on described second Z axis moving structure, described second Z axis moving structure comprises the 5th screw mandrel, the 5th screw rodb base and the 5th drive motors for driving described 5th screw mandrel to rotate.
10. full-automatic wafer cutting machine according to claim 1, is characterized in that: described Control Component comprises: display module, for the performance parameter of described full-automatic wafer cutting machine is passed through interface display; And/or key-press module, carry out work for handling described full-automatic wafer cutting machine.
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| CN201410371423.4A CN105312774A (en) | 2014-07-30 | 2014-07-30 | Full-automatic wafer cutting machine |
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| CN201410371423.4A CN105312774A (en) | 2014-07-30 | 2014-07-30 | Full-automatic wafer cutting machine |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345268A (en) * | 2014-08-18 | 2016-02-24 | 深圳市韵腾激光科技有限公司 | Laser scribing machine |
| CN105856437A (en) * | 2016-05-25 | 2016-08-17 | 肇庆市宏华电子科技有限公司 | High-speed intelligent cutting machine for chip-type electronic components |
| CN106312337A (en) * | 2016-09-19 | 2017-01-11 | 武汉帝尔激光科技股份有限公司 | Laser half-cutting machine for crystal silicon solar battery cell |
| CN106583942A (en) * | 2017-01-17 | 2017-04-26 | 深圳市韵腾激光科技有限公司 | Wafer marking mechanism |
| CN108098163A (en) * | 2016-11-24 | 2018-06-01 | 蓝思科技（长沙）有限公司 | The method and its equipment of use that display screen laser spiles before a kind of pressurization |
| CN108406135A (en) * | 2018-03-21 | 2018-08-17 | 厦门大学 | A kind of ceramic substrate serialization laser cutting device and its cutting method |
| CN109693048A (en) * | 2019-02-20 | 2019-04-30 | 广州安特激光技术有限公司 | A kind of laser cutting device of wafer |
| CN110434485A (en) * | 2019-08-14 | 2019-11-12 | 福建晟哲自动化科技有限公司 | A kind of high efficient full automatic, which is cut, splits machine |
| CN114057384A (en) * | 2021-12-10 | 2022-02-18 | 青岛天仁微纳科技有限责任公司 | Scanning electron microscope auxiliary positioning splitting device and using method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345268A (en) * | 2014-08-18 | 2016-02-24 | 深圳市韵腾激光科技有限公司 | Laser scribing machine |
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| CN105856437B (en) * | 2016-05-25 | 2018-05-04 | 肇庆市宏华电子科技有限公司 | A kind of electronic element high-speed intelligent cutting machine |
| CN106312337A (en) * | 2016-09-19 | 2017-01-11 | 武汉帝尔激光科技股份有限公司 | Laser half-cutting machine for crystal silicon solar battery cell |
| CN106312337B (en) * | 2016-09-19 | 2018-10-02 | 武汉帝尔激光科技股份有限公司 | A kind of crystal silicon solar batteries piece laser cuts half machine |
| CN108098163A (en) * | 2016-11-24 | 2018-06-01 | 蓝思科技（长沙）有限公司 | The method and its equipment of use that display screen laser spiles before a kind of pressurization |
| CN106583942B (en) * | 2017-01-17 | 2019-02-26 | 深圳市韵腾激光科技有限公司 | Wafer marking mechanism |
| CN106583942A (en) * | 2017-01-17 | 2017-04-26 | 深圳市韵腾激光科技有限公司 | Wafer marking mechanism |
| CN108406135A (en) * | 2018-03-21 | 2018-08-17 | 厦门大学 | A kind of ceramic substrate serialization laser cutting device and its cutting method |
| CN108406135B (en) * | 2018-03-21 | 2019-12-27 | 厦门大学 | Ceramic substrate continuous laser cutting device and cutting method thereof |
| CN109693048A (en) * | 2019-02-20 | 2019-04-30 | 广州安特激光技术有限公司 | A kind of laser cutting device of wafer |
| CN110434485A (en) * | 2019-08-14 | 2019-11-12 | 福建晟哲自动化科技有限公司 | A kind of high efficient full automatic, which is cut, splits machine |
| CN110434485B (en) * | 2019-08-14 | 2021-04-13 | 福建晟哲自动化科技有限公司 | High-efficient full-automatic cutting machine |
| CN114057384A (en) * | 2021-12-10 | 2022-02-18 | 青岛天仁微纳科技有限责任公司 | Scanning electron microscope auxiliary positioning splitting device and using method |
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