CN204094318U - Laser scribing positioner - Google Patents
Laser scribing positioner Download PDFInfo
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- CN204094318U CN204094318U CN201420467682.2U CN201420467682U CN204094318U CN 204094318 U CN204094318 U CN 204094318U CN 201420467682 U CN201420467682 U CN 201420467682U CN 204094318 U CN204094318 U CN 204094318U
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Abstract
A kind of laser scribing positioner, comprise device body, Control Component, CCD detection architecture, linear movement structure, described linear movement structure can relative to described device body along X, Y-axis moves around, described linear movement mechanism comprises X-axis moving structure, Y-axis moving structure, vacuum suction structure, described vacuum suction structure comprises inhales flat vacuum ceramic sucker for carrying out described wafer, described vacuum ceramic sucker can do circular-rotation relative to described device body, described X-axis moving structure comprises X-axis platform and for driving described X-axis platform along the first linear electric motors of X-axis movement, described Y-axis moving structure comprises Y-axis platform and for driving described Y-axis platform along the second linear electric motors of Y-axis movement, this laser scribing positioner operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance.
Description
Technical field
The utility model relates to wafer manufacturing technical field, particularly relates to a kind of laser scribing positioner.
Background technology
Along with the extensive use of silicon semiconductor integrated circuit, silicon semiconductor integrated circuit all will use chip wafer, traditional wafer cutting technique, all that the manual diamond tool that adopts cuts, lack before cutting with laser scribing positioner that wafer is positioned in cutting, cutting position during wafer cutting cannot accurate assurance, the chip wafer cut out width is apart larger, uneven, be easy to damage chip wafer, inefficiency.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of laser scribing positioner, and this laser scribing positioner accurately can set the cutting position of wafer, makes the chip wafer that cuts out even, attractive in appearance.
For solving the problems of the technologies described above, the laser scribing positioner that the utility model provides, for cutting wafer, comprise device body, be placed in the Control Component in described device body, be installed in the CCD detection architecture for detecting the cutting position of described wafer on described device body, be installed in the linear movement mechanism matched on described device body and with described CCD detection architecture, described linear movement mechanism can relative to described device body along X, Y-axis moves around, described linear movement mechanism comprises the X-axis moving structure be installed on described device body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in the vacuum suction structure on described Y-axis moving structure, described vacuum suction structure comprises inhales flat vacuum ceramic sucker for carrying out described wafer, described vacuum ceramic sucker can do circular-rotation relative to described device body, described X-axis moving structure comprises X-axis platform and for driving described X-axis platform along the first linear electric motors of X-axis movement, described Y-axis moving structure comprises Y-axis platform and for driving described Y-axis platform along the second linear electric motors of Y-axis movement, described Control Component is electrically connected with described first linear electric motors and described second linear electric motors respectively.
Preferably, described CCD detection architecture comprises the CCD camera be installed on described device body, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
Preferably, described X-axis moving structure also comprises the first grating scale of the movement position for determining described vacuum cup be installed on described first linear electric motors, and described Y-axis moving structure also comprises the second grating scale of the movement position for determining vacuum cup be installed on described second linear electric motors.
Preferably, described vacuum suction structure also comprises and is placed in the inner and vacuum generator linked together with described vacuum ceramic sucker of described device body.
Preferably, described Control Component comprises: display module, for the performance parameter of described laser scribing positioner is passed through interface display; And/or key-press module, carry out work for handling laser scribing positioner.
After adopting said structure, wafer to be cut is placed on vacuum ceramic sucker by described laser scribing positioner, described vacuum ceramic sucker is moved to suitable position by described X-axis moving structure and Y-axis moving structure, a described CCD camera and the 2nd CCD camera are taken pictures to described wafer, determine the tram that wafer will cut, by the movement of described X-axis moving structure, the position of circular-rotation to described vacuum ceramic sucker of the movement of described Y-axis moving structure and vacuum ceramic sucker itself adjusts, this laser scribing positioner operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model wafer cutting and positioning device;
Fig. 2 is the structural representation of the utility model wafer cutting and positioning device CCD detection architecture.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only for explaining the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is the structural representation of the utility model wafer cutting and positioning device;
In the present embodiment, laser scribing positioner 10, for cutting wafer, comprise device body 11, be placed in the Control Component in device body 11, be installed in the CCD detection architecture 14 for detecting the cutting position of wafer on device body 11, be installed in the linear movement mechanism 13 matched on device body 11 and with CCD detection architecture 14, linear movement mechanism 13 can relative to device body 11 along X, Y-axis moves around, linear movement mechanism 13 comprises the X-axis moving structure 131 be installed on device body 11, be installed in the Y-axis moving structure 132 on described X-axis moving structure, be installed in the vacuum suction structure 133 on Y-axis moving structure 132.
X-axis moving structure 131 comprises X-axis platform, for driving described X-axis platform along the first linear electric motors of X-axis movement and the first grating scale being installed in the movement position for determining described vacuum cup on the first linear electric motors, Y-axis moving structure 132 comprises Y-axis platform, for driving described Y-axis platform along the second linear electric motors of Y-axis movement and the second grating scale being installed in the movement position for determining vacuum cup on described second linear electric motors, described Control Component is electrically connected with described first linear electric motors and described second linear electric motors respectively.
Referring again to the structural representation that Fig. 2, Fig. 2 are the utility model wafer cutting and positioning device CCD detection architecture; CCD detection architecture 14 comprises the CCD camera 141 be installed on device body 11, the 2nd CCD camera 142, being installed in wafer cut point the first light source more clearly for making a CCD camera take on a CCD camera 141, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on the 2nd CCD camera 142.
Vacuum suction structure 133 comprises for carrying out inhaling flat vacuum ceramic sucker to described wafer, be placed in the inner and vacuum generator linked together with described vacuum ceramic sucker of device body 11, and vacuum ceramic sucker can do circular-rotation relative to device body 11.
Described Control Component comprises: display module, for the performance parameter of described laser scribing positioner is passed through interface display; And/or key-press module, carry out work for handling laser scribing positioner.
Should be understood that; these are only preferred embodiment of the present utility model; can not therefore limit the scope of the claims of the present utility model; every utilize the utility model description and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. laser scribing positioner, for cutting wafer, it is characterized in that: comprise device body, be placed in the Control Component in described device body, be installed in the CCD detection architecture for detecting the cutting position of described wafer on described device body, be installed in the linear movement mechanism matched on described device body and with described CCD detection architecture, described linear movement mechanism can relative to described device body along X, Y-axis moves around, described linear movement mechanism comprises the X-axis moving structure be installed on described device body, be installed in the Y-axis moving structure on described X-axis moving structure, be installed in the vacuum suction structure on described Y-axis moving structure, described vacuum suction structure comprises inhales flat vacuum ceramic sucker for carrying out described wafer, described vacuum ceramic sucker can do circular-rotation relative to described device body, described X-axis moving structure comprises X-axis platform and for driving described X-axis platform along the first linear electric motors of X-axis movement, described Y-axis moving structure comprises Y-axis platform and for driving described Y-axis platform along the second linear electric motors of Y-axis movement, described Control Component is electrically connected with described first linear electric motors and described second linear electric motors respectively.
2. laser scribing positioner according to claim 1, it is characterized in that: described CCD detection architecture comprises the CCD camera be installed on described device body, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
3. laser scribing positioner according to claim 1, it is characterized in that: described X-axis moving structure also comprises the first grating scale of the movement position for determining described vacuum cup be installed on described first linear electric motors, described Y-axis moving structure also comprises the second grating scale of the movement position for determining vacuum cup be installed on described second linear electric motors.
4. laser scribing positioner according to claim 1, is characterized in that: described vacuum suction structure also comprises and is placed in the inner and vacuum generator linked together with described vacuum ceramic sucker of described device body.
5. laser scribing positioner according to claim 1, is characterized in that: described Control Component comprises: display module, for the performance parameter of described laser scribing positioner is passed through interface display; And/or key-press module, carry out work for handling laser scribing positioner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467682.2U CN204094318U (en) | 2014-08-18 | 2014-08-18 | Laser scribing positioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467682.2U CN204094318U (en) | 2014-08-18 | 2014-08-18 | Laser scribing positioner |
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| Publication Number | Publication Date |
|---|---|
| CN204094318U true CN204094318U (en) | 2015-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420467682.2U Active CN204094318U (en) | 2014-08-18 | 2014-08-18 | Laser scribing positioner |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304540A (en) * | 2015-09-22 | 2016-02-03 | 常州星海电子有限公司 | Glass passivation chip reverse cutting method without positioning lines |
| CN111640678A (en) * | 2020-06-28 | 2020-09-08 | 安徽富信半导体科技有限公司 | Semiconductor element processing method and forming process |
| CN112008250A (en) * | 2019-05-28 | 2020-12-01 | 大族激光科技产业集团股份有限公司 | Green ceramic cutting device and cutting method |
-
2014
- 2014-08-18 CN CN201420467682.2U patent/CN204094318U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304540A (en) * | 2015-09-22 | 2016-02-03 | 常州星海电子有限公司 | Glass passivation chip reverse cutting method without positioning lines |
| CN112008250A (en) * | 2019-05-28 | 2020-12-01 | 大族激光科技产业集团股份有限公司 | Green ceramic cutting device and cutting method |
| CN111640678A (en) * | 2020-06-28 | 2020-09-08 | 安徽富信半导体科技有限公司 | Semiconductor element processing method and forming process |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |