CN105304540A - Glass passivation chip reverse cutting method without positioning lines - Google Patents
Glass passivation chip reverse cutting method without positioning lines Download PDFInfo
- Publication number
- CN105304540A CN105304540A CN201510609131.4A CN201510609131A CN105304540A CN 105304540 A CN105304540 A CN 105304540A CN 201510609131 A CN201510609131 A CN 201510609131A CN 105304540 A CN105304540 A CN 105304540A
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- Prior art keywords
- chip
- cutting
- position line
- positioning lines
- face
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention relates to the field of the chip cutting processing technology, and particularly discloses a glass passivation chip reverse cutting method without positioning lines. The method comprises the following steps that the P surface of a chip faces downwardly and the N surface faces upwardly in the cutting process, and the chip is arranged on a vacuum sucking disc to be firmly sucked; and a charge-coupled device CCD is installed below the sucking disc, the image of the P surface is transmitted to a display screen in real time in alignment, and the position of the chip can be right arranged by adjusting the facing direction and the position of the groove of the P surface so that poisoning without the positioning lines is realized, and cutting can be performed after end of positioning. The reserve cutting technology without the positioning lines is adopted so that the requirements for exposure equipment and clamps can be greatly reduced, the technology process can be shortened, labor and raw materials can be saved and the risk of cutting deviation can also be greatly reduced.
Description
Technical field
The present invention relates to chip cutting treatment process field, be specifically related to a kind of method of cutting glassivation chip without the position line back of the body.
Background technology
Traditional GPP (GlassPassivationPellet glassivation core grain) knife scraping method technique needs at the even glue of chip double-side, double-sided exposure, the i.e. lines of the first contraposition when N face erodes away for cutting, cover last layer photoresist again in N face afterwards, then just P face is corroded.After deep erosions puts in place, photoresist is removed, chip is cleaned.Dry after cleaning, the glass dust slurries mixed up evenly are blown in the groove in chip P face, remove the glass dust of excess surface, then carry out glass sintering.Sinter complete, then nickel plating, gold-plated is carried out to chip surface.With probe station, core grain is tested, bad core grain stamps ink dot as mark, then carries out the back of the body along the lines in N face to chip and cuts that [traditional knife scraping method cutting mode has tangent (from P face glass-cutting) and the back of the body to cut (from N face cutting silicon) two kinds.Because glass fragility is large, during cutting easily there is crackle in glass, and adopt the method cutting speed of tangent slow, cutting production capacity is low.Current industry many employing back ofs the body cutting method, namely cuts silicon from N face, then is split by core grain from P face], finally carry out sliver operation from P face, reject edge piece, after choosing bad core grain, carry out ultrasonic cleaning to core grain, after drying, namely GPP core grain completes.
And in the process, the apparatus expensive that double-sided exposure uses, production capacity are lower; If P, N upper thread bar has skew during exposure, along the position line cutting of N face skew, split the situation that the core grain there will be greatly, one side is little, be commonly called as size limit; Owing to being double-surface contact type exposure, when sheet thickness, slice, thin piece warpage are serious, exposed plate extruding slice, thin piece easily causes fragmentation even to be scrapped; Because chip is through twice even glue, single exposure above, once corrode, then when carrying out even glue, chip more easily occurs that breakage is even scrapped.
Conventional laser cutting machine CCD (Charge-coupledDevice, image controller) is positioned at above chip, and the image of shooting is chip N face.In order to realize location, must erode away position line in N face, the position line then photographed according to CCD towards the position adjusting chip, thus reaches the object of location.There is a major defect in the method, namely cutting effect and position line closely bound up, if position line offsets, even if line of cut and position line targeted by, core grain also can be cut partially.Therefore, this technique requires very high to double-sided exposure equipment and exposure fixture, and during exposure, upper and lower reticle must accurately be aimed at.
Summary of the invention
The present invention is in order to overcome the deficiency of above-mentioned technical problem, provide a kind of method of cutting glassivation chip without the position line back of the body, the method adopts without position line back of the body incision technology, greatly reduce the requirement to exposure sources and fixture, shorten technological process, save artificial and raw material, significantly can also reduce the risk of cutting off normal.
The technical scheme solved the problems of the technologies described above is as follows:
Cut a method for glassivation chip without the position line back of the body, comprise the following steps:
In cutting process, faced down by chip P, N faces up, and is positioned on vacuum cup and sucks, laser cutting machine CCD is arranged on below vacuum transparent sucker, described sucker is glass holder or plastic suckers, and during contraposition, P face Image Real-time Transmission is on display screen, by adjustment P face groove towards and position, chip position can be ajusted, realize without position line location, location can start cutting after terminating.
The invention has the beneficial effects as follows: the effect of position line is auxiliary center of finding groove accurately, without position line back of the body cutting process, laser cutting machine CCD is directly installed on below, take from P face, screen can being clear that the position of P face groove, by rotating θ axle, chip can being adjusted to the right place, line of cut position and groove center perfect registration, the risk that when avoiding double-sided exposure, register partial difference causes.
In cutting process, during contraposition, line of cut, facing to groove center, effectively can reduce cutting size limit phenomenon.
Adopt without position line back of the body incision technology, greatly reduce the requirement to exposure sources and fixture, shorten technological process, saved artificial and raw material, significantly can also reduce the risk of cutting off normal.
Owing to have employed without position line back of the body cutting process technology, the present invention without the need to carrying out double-sided exposure as traditional handicraft, and only needs one side to expose.And in the process of one side exposure, the exposure fixture of employing is made up of one piece of vacuum metal sucker and a film version, relatively simple for structure.The process of one side exposure is the position having respective graphical under the chip that two-sided even good glue is also dried is placed on film version, and open vacuum, film version is inhaled downwards, fits tightly with chip, is advanced in exposure machine by exposure fixture subsequently and exposes.
Owing to not needing double-sided exposure, without the need to the contraposition equipment by precision, the upper and lower exposed plate of running check in operating process, is not needed whether to aim at; Back side position line need not be corroded, eliminate the operations such as surface oxide layer, two-sided groove pre-etching, position line depth survey, even photoresist, baking, shorten operating process, save the photoresist (and artificial) of 1/3; Meanwhile, due to the position line that chip back does not need corrosion 10 ~ 20 μm dark, Die strength is increased, and effectively can reduce the fragment rate of subsequent job.
Embodiment
Below in conjunction with embodiment, the present invention is further detailed explanation.
Cut a method for glassivation chip without the position line back of the body, comprise the following steps:
In cutting process, chip P is faced down, N faces up, and is positioned on vacuum cup and sucks, and is arranged on below sucker by laser cutting machine CCD, during contraposition, P face Image Real-time Transmission on display screen, by adjustment P face groove towards and position, chip position can be ajusted, realize without position line location, location can be cut after terminating.Wherein said sucker is vacuum cup, can be glass holder or plastic suckers.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention, every according in technical spirit of the present invention to any simple modification, equivalent variations that above embodiment is done, all fall within protection scope of the present invention.
Claims (3)
1. cut a method for glassivation chip without the position line back of the body, it is characterized in that, comprise the following steps:
In cutting process, chip P is faced down, N faces up, and is positioned on vacuum cup and sucks, and is arranged on below sucker by laser cutting machine CCD, during contraposition, P face Image Real-time Transmission on display screen, by adjustment P face groove towards and position, chip position can be ajusted, realize without position line location, location can be cut after terminating.
2. a kind of method of cutting glassivation chip without the position line back of the body according to claim 1, it is characterized in that, described sucker is vacuum transparent sucker.
3. a kind of method of cutting glassivation chip without the position line back of the body according to claim 2, it is characterized in that, described vacuum transparent sucker is glass holder or plastic suckers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510609131.4A CN105304540A (en) | 2015-09-22 | 2015-09-22 | Glass passivation chip reverse cutting method without positioning lines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510609131.4A CN105304540A (en) | 2015-09-22 | 2015-09-22 | Glass passivation chip reverse cutting method without positioning lines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105304540A true CN105304540A (en) | 2016-02-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510609131.4A Pending CN105304540A (en) | 2015-09-22 | 2015-09-22 | Glass passivation chip reverse cutting method without positioning lines |
Country Status (1)
| Country | Link |
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| CN (1) | CN105304540A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109304816A (en) * | 2017-07-26 | 2019-02-05 | 天津环鑫科技发展有限公司 | A kind of silicon wafer cutting splitting technique |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180649A (en) * | 1990-11-15 | 1992-06-26 | Nec Yamagata Ltd | Device for sampling semiconductor chip |
| CN101058164A (en) * | 2006-04-18 | 2007-10-24 | 上海富安工厂自动化有限公司 | Image calibrating method used for chip dicing machine |
| CN102479885A (en) * | 2010-11-22 | 2012-05-30 | 威控自动化机械股份有限公司 | Method for manufacturing semiconductor element |
| CN103972171A (en) * | 2014-05-28 | 2014-08-06 | 江苏联恒物宇科技有限公司 | Chip cutting process for stainless steel substrate based on liquid silicon printing |
| CN204094318U (en) * | 2014-08-18 | 2015-01-14 | 深圳市韵腾激光科技有限公司 | Laser scribing positioner |
-
2015
- 2015-09-22 CN CN201510609131.4A patent/CN105304540A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180649A (en) * | 1990-11-15 | 1992-06-26 | Nec Yamagata Ltd | Device for sampling semiconductor chip |
| CN101058164A (en) * | 2006-04-18 | 2007-10-24 | 上海富安工厂自动化有限公司 | Image calibrating method used for chip dicing machine |
| CN102479885A (en) * | 2010-11-22 | 2012-05-30 | 威控自动化机械股份有限公司 | Method for manufacturing semiconductor element |
| CN103972171A (en) * | 2014-05-28 | 2014-08-06 | 江苏联恒物宇科技有限公司 | Chip cutting process for stainless steel substrate based on liquid silicon printing |
| CN204094318U (en) * | 2014-08-18 | 2015-01-14 | 深圳市韵腾激光科技有限公司 | Laser scribing positioner |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109304816A (en) * | 2017-07-26 | 2019-02-05 | 天津环鑫科技发展有限公司 | A kind of silicon wafer cutting splitting technique |
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| C06 | Publication | ||
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| CB02 | Change of applicant information | ||
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Address after: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Applicant after: Changzhou Xinghai Electronic Limited by Share Ltd Address before: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Applicant before: Changzhou Star Sea Electronics Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160203 |