JP2014213386A - Method of cutting sealing sheet and device of cutting sealing sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately cut a sealing sheet adhered on a semiconductor substrate and formed of a resin composition along a shape of the semiconductor substrate.SOLUTION: A sealing sheet T is cut by fitting a cutter included in a first cutting mechanism along an outer diameter of a substrate W while a notch part V of the sealing sheet T which is adhered and covers the notch formed on the substrate is left. Then, a cutter 64 of a second cutting mechanism forms a cut to a back end by fitting a blade edge with the notch from one opening end of the notch, and is retreated. Then, the substrate W is rotated, and the blade edge of the cutter 64 is fitted with the notch and forms a cut from the other opening end of the notch to the back end to be joined with the first half cut, and the sealing sheet T is cut out in a notch shape.

Description

  The present invention relates to a sealing sheet cutting method and a sealing method in which a sealing sheet formed with a sealing layer made of a resin composition attached to a semiconductor substrate for sealing a semiconductor element is cut into the shape of the semiconductor substrate. The present invention relates to a sheet cutting device.

  There has been proposed and practiced a method of cutting a protective sheet attached to a circuit surface of a semiconductor wafer (hereinafter referred to as “wafer” as appropriate) along the outer diameter of the semiconductor wafer. That is, the protective sheet is cut along the circular arc portion and the notch portion of the semiconductor wafer while changing the angle and the turning direction of the cutter. Specifically, the cutter is pierced from the vicinity of the notch, and the protective tape is cut to the far end along the side of the cutter along one inclined surface of the notch, and then the cutter is retracted to the initial position along the cutting track. Then, change the direction of the cutting edge and cut the protective tape along the arc part. When the cutter reaches the other open end of the notch, change the angle of the cutter, cut the protective tape along the side of the cutter along the inclined surface of the notch and cut the protective tape to the far end, and connect it with the notch in the first half to cut out the protective tape (See Patent Document 1).

JP 2009-125871 A

  2. Description of the Related Art Conventionally, a semiconductor device is manufactured by dicing a wafer thinned by a back grinding process and then molding the semiconductor element divided into individual pieces with a resin. In recent years, in order to improve production efficiency, there is a method in which a sealing sheet made of a resin composition is attached to the entire surface of an element forming surface of a back-grinded wafer and the sealing layer is cured, followed by a dicing process. Proposed.

  Since the sealing sheet has a thickness and higher hardness than the protective tape, there is a disadvantage that the cutting angle of the cutter is not easily changed in the cutting process. In other words, if the cutting angle is greatly changed from the arc part to the notch part of the wafer, the sealing layer or the blade of the cutter may be missing, or the load due to pressing during the angle change may be applied to the notch part and damage the wafer. Such a problem has arisen.

  This invention is made in view of such a situation, Comprising: The sealing sheet cutting method and sealing sheet cutting device which can cut | disconnect the sealing sheet affixed on the semiconductor wafer to the wafer shape accurately are provided. The main purpose is to provide.

In order to achieve such an object, the present invention has the following configuration.
That is, a sealing sheet cutting method for cutting a sealing sheet formed with a sealing layer made of a resin composition attached to a semiconductor substrate,
A pasting process for pasting a sealing sheet larger than the semiconductor substrate to the semiconductor substrate;
The first cutting blade provided in the first cutting mechanism is placed along the outer diameter of the semiconductor substrate while leaving the notch portion of the sealing sheet attached to cover the notch formed in the semiconductor substrate. A first cutting process for cutting the sheet;
A recovery process of recovering the sealing sheet cut out in the shape of the semiconductor substrate;
A second cutting process in which a second cutting blade of a second cutting mechanism is cut from one of the open ends of the notch to the back end along the notch;
A third cutting step of cutting the sealing sheet into a notch shape by cutting the second cutting blade of the second cutting mechanism from the other of the open ends of the notch to the far end along the notch and joining the cut in the first half; ,
It is provided with.

  (Operation / Effect) According to the above method, the cutting angle of the first cutting blade can be fixed, and the sealing sheet can be cut into a substantially semiconductor substrate shape. Moreover, since the sealing sheet which covers the notch part left in the 1st cutting process can be cut by the second cutting blade from each open end of the notch, the cutting angle of the second cutting blade from the arc part to the notch There is no need to make major changes. In other words, an excessive load is not applied to the notch portion, the sealing layer, and the second cutting blade of the semiconductor substrate due to the pressing accompanying the angle change. Therefore, breakage of the semiconductor substrate and chipping of the sealing layer and the second cutting blade can be avoided. Furthermore, by avoiding chipping of the second cutting blade, the second cutting blade can be used over a long period of time.

  In the above method, in the second cutting process and the third cutting process, it is preferable to cut the sealing sheet while elastically biasing the second cutting blade pivotally supported by the holder in the cutting direction. .

  According to this method, when an excessive pressing force acts on the second cutting blade in the process of cutting the sealing sheet of the notch portion, the second cutting blade moves backward against the urging force in the traveling direction. Therefore, damage to the second cutting blade and the semiconductor substrate can be avoided.

  Moreover, in the said method, it is preferable to cut out a sealing sheet, attracting | sucking a notch part at least in a 3rd cutting process.

  According to this method, chips generated when the sealing sheet at the notch portion is cut can be immediately removed by suction. Therefore, it is possible to suppress the semiconductor substrate from being contaminated by chips.

  Moreover, in the said method, you may provide the test process which test | inspects the cutting | disconnection defect of the sealing sheet of a notch part after a 3rd cutting process.

  In this case, the cutting failure of the sealing sheet at the notch portion can be detected. That is, when the cutting failure is detected, the sealing sheet at the notch portion can be surely cut and removed by performing at least one of the second cutting process and the third cutting process.

  Further, in the above method, in the first cutting process to the third cutting process, the sealing sheet may be cut while heating the first cutting blade and the second cutting blade with a heater.

  According to this method, since it can cut | disconnect, softening the sealing layer of a sealing sheet with a heater, the sealing sheet of a micro notch part can be cut | disconnected reliably.

  The present invention has the following configuration in order to achieve such an object.

That is, a sealing sheet cutting device for cutting a sealing sheet formed with a sealing layer made of a resin composition attached to a semiconductor substrate,
A first holding table for mounting and holding the semiconductor substrate;
A pasting mechanism for pasting a sealing sheet to the semiconductor substrate;
A first cutting mechanism that cuts the sealing sheet along the first cutting blade along the outer shape of the semiconductor substrate while leaving the notch portion of the sealing sheet attached to cover the notch formed on the semiconductor substrate. When,
A sheet recovery mechanism for recovering the remaining sealing sheet cut out in the shape of the semiconductor substrate;
A second holding table that horizontally moves while mounting and holding the semiconductor substrate to which the sealing sheet is attached, and that rotates around the central axis of the semiconductor substrate;
A detector for detecting a notch of the semiconductor substrate placed and held on the second holding table;
A second cutting mechanism for cutting out a sealing sheet covering the notch portion along the notch of the edge of the second cutting blade;
Each time the second holding table is rotated and horizontally moved based on the position information of the notch detected by the detector so as to align the opening end of the notch and the cutting edge of the second cutting blade, the second cutting is performed. In the process of reciprocating the second holding table with respect to the second cutting blade arranged in the mechanism, the second cutting blade is cut along the notch to the notch deep end, and both cuts are made at the notch deep end. It is characterized in that the sealing sheet is cut out in a notch shape by joining.

  (Operation / Effect) According to this configuration, the first cutting blade and the second cutting blade can be selectively used for the arc portion and the notch portion of the semiconductor substrate. That is, when the sealing sheet covering the notch portion is cut, by using the second cutting blade that cuts only the notch portion, it is not necessary to greatly change the cutting angle of the cutting blade while cutting as in the prior art. Therefore, the above method can be suitably performed.

  In the above-mentioned device, for example, it is preferable that the second cutting blade is pivotally supported on the holder of the second cutting mechanism so as to be swingable and elastically biased in the cutting direction of the sealing sheet.

  According to this configuration, when an excessive pressing force acts on the second cutting blade in the process of cutting the sealing sheet of the notch portion, the second cutting blade moves backward against the urging force in the traveling direction. Therefore, damage to the second cutting blade and the semiconductor substrate can be avoided.

  In the above configuration, a suction mechanism may be provided to immediately suction and remove chips generated when the sealing sheet of the notch portion is cut.

  According to this configuration, contamination of the semiconductor substrate can be avoided.

  Moreover, you may cut | disconnect, heating a 1st cutting blade and a 2nd cutting blade with a heater, and softening a sealing sheet.

  Further, a detector may be provided to detect whether or not the sealing sheet at the notch portion is cut and to detect a cutting failure.

  According to the sealing sheet cutting method and the sealing sheet cutting apparatus of the present invention, the sealing sheet attached to the semiconductor substrate on which the notch is formed can be accurately cut into the shape of the semiconductor substrate.

It is a perspective view which shows the original fabric roll of a sealing sheet. It is a longitudinal cross-sectional view of a sealing sheet. It is a perspective view which shows the whole sealing sheet sticking apparatus. It is a top view of a sealing sheet sticking apparatus. It is a perspective view which shows the principal part of a sealing sheet sticking apparatus. It is a front view which shows the structure around a 1st cutting mechanism. It is a front view which shows the structure around the 2nd cutting mechanism. It is a top view which shows the structure around the 2nd cutting mechanism. It is a schematic front view which shows the sticking operation | movement of a sealing sheet. It is a schematic front view which shows the cutting | disconnection operation | movement of the sealing sheet by a 1st cutting mechanism. It is a schematic front view which shows peeling operation | movement of a sealing sheet. It is a schematic front view which shows collection | recovery operation | movement of the cut-out sealing sheet. It is the elements on larger scale which show the cutting | disconnection operation | movement of the sealing sheet by a 2nd cutting mechanism. It is a top view which shows the cutting | disconnection operation | movement of the sealing sheet by a 2nd cutting mechanism. It is a top view which shows the cutting | disconnection operation | movement of the sealing sheet by a 2nd cutting mechanism. It is a front view of the cutter of a modification. It is a top view of the cutter of a modification.

  An embodiment of the present invention will be described below with reference to the drawings. A case where a sealing sheet having a sealing layer made of a resin composition is attached to a semiconductor substrate having a plurality of semiconductor elements formed on the surface will be described as an example.

<Sealing sheet>
The sealing sheet T is supplied with the raw fabric roll which wound the elongate sealing sheet T, for example, as shown in FIG.1 and FIG.2. Further, the sealing sheet T is provided with a protective first release liner S1 and a second release liner S2 on both surfaces of the sealing layer M.

  The sealing layer M is formed in a sheet shape from a sealing material. Examples of the sealing material include thermosetting silicone resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting urethane resin, and the like. A curable resin is mentioned. Moreover, as a sealing material, the above-mentioned thermosetting resin and the thermosetting resin composition which contains an additive in an appropriate ratio can also be mentioned.

Examples of the additive include a filler and a phosphor. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and silicon nitride, and organic fine particles such as silicone particles. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. . Examples of the yellow phosphor include garnet phosphors such as Y ₃ Al ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce). Examples of the red phosphor include nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu.

  The sealing layer M is adjusted to a semi-solid state before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.

  The dimension of the sealing layer M is appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long sheet, the length in the left-right direction of the sealing layer, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm. Hereinafter, it is preferably 700 mm or less. The thickness of the sealing layer is appropriately set according to the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less.

  Examples of the first release liner S1 and the second release liner S2 include polymer sheets such as polyethylene sheets, polyester sheets (such as PET), polystyrene sheets, polycarbonate sheets, and polyimide sheets, such as ceramic sheets, such as metal foil. It is done. In the release liner, the contact surface in contact with the sealing layer can be subjected to a release treatment such as a fluorine treatment. The dimensions of the first release liner and the second release liner are appropriately set according to the release conditions, and the thickness is, for example, 15 μm or more, preferably 25 μm or more, and for example, 125 μm or less, preferably 75 μm. It is as follows.

<Sealing sheet pasting device>
Hereinafter, an apparatus for attaching the sealing sheet to a semiconductor substrate (hereinafter simply referred to as “substrate”) will be described with reference to the drawings.

  FIG. 3 is a perspective view showing the entire configuration of the sealing sheet sticking device, FIG. 4 is a plan view of the sealing sheet sticking device, and FIG. 5 is a perspective view showing the main part of the sealing sheet sticking device.

  As shown in FIGS. 3 and 4, the sealing sheet sticking apparatus includes a substrate supply / recovery unit 1, a substrate transport mechanism 2, an alignment stage 3, a first holding table 4, a sheet supply unit 5, a separator recovery unit 6, and affixing. A unit 7, a first cutting mechanism 8, a peeling unit 9, a sheet collecting unit 10, a second cutting mechanism 11, and the like are provided. Here, the substrate supply / recovery unit 1, the substrate transport mechanism 2, the alignment stage 3, and the first holding table 4 are arranged on the upper surface of the base 12. The sheet supply unit 5 and the sheet collection unit 10 are installed on the front surface of a vertical wall that stands on the upper surface of the base 12. The affixing unit 7 and the peeling unit 9 are provided adjacent to the lower opening of the vertical wall, and the unit driving unit 13 is disposed on the back of the vertical wall. Further, the second cutting mechanism 11 is adjacent to the side surface of the base 12. Hereinafter, each configuration will be described in detail.

  The substrate supply / recovery unit 1 inserts and stores cassettes C1 and C2 for storing the substrate W before the sealing sheet T is pasted and the substrate W after the sealing sheet T is pasted, and is loaded on the cassette base. It is supposed to be. The substrates W are stored in the cassettes C1 and C2 in multiple stages with the circuit surface facing upward and at a predetermined interval in the vertical direction.

  The substrate transfer mechanism 2 is provided with a robot arm 14. The robot arm 14 is configured to be able to advance / retreat horizontally, turn and lift. A horseshoe-shaped suction holding portion 14 a is provided at the tip of the robot arm 14. The suction holding unit 14a takes out the substrate W from one of the cassettes C1 and C2 of the substrate supply / recovery unit 1, and in the order of the alignment stage 3, the first holding table 4, the second cutting mechanism 11, and the wafer supply / recovery unit 1. The substrate W is transported and collected.

  The alignment stage 3 detects an alignment notch formed on the outer periphery of the substrate W while rotating with the suction pad advancing and retreating from the holding surface while the back surface of the substrate W is sucked and held, and based on the detection result, Align.

  As shown in FIGS. 6 and 9, the first holding table 4 vacuum-sucks the substrate W transferred from the substrate transport mechanism 2 and placed in a predetermined alignment posture. Further, on the upper surface of the first holding table 4, there is a cutter running groove 15 for cutting a sealing sheet T by turning a cutter 41 provided in a first cutting mechanism 8 described later along the outer shape of the substrate W. Is formed. In addition, a suction holding portion 15a that is retracted when the substrate is carried in and out is provided at the center of the first holding table 4.

  The sheet supply unit 5 guides the sealing sheet T with the separator S fed from the supply bobbin 16 to be wound and guided by the feed roller 17 and the guide roller 18 to the peeling guide bar 19 having a knife edge shape. Further, the separator S is peeled off from the sealing sheet T by folding at the tip of the peeling guide bar 19, and the sealing sheet T from which the separator S has been peeled is guided to the affixing unit 7. The separator S peeled off from the sealing sheet T is guided to the separator collection unit 6.

  The feed roller 17 sandwiches and guides the sealing sheet T between the feed roller 17 and the pinch roller 20, and is rotated by a motor 21. Further, the feed roller 17 forcibly feeds the sealing sheet T as necessary.

  The supply bobbin 16 is interlocked with an electromagnetic brake and applied with a suitable rotational resistance. Therefore, excessive sheet feeding is prevented.

  The separator collection unit 6 is provided with a collection bobbin 22 that winds up the separator S peeled off from the sealing sheet T, and is rotationally controlled forward and backward by a motor 23.

  The affixing unit 7 includes an affixing roller 24 whose position can be changed up and down by a cylinder or the like. The entire pasting unit 7 is supported so as to be horizontally movable along the guide rail 25 and is reciprocally screw-driven by a screw shaft 27 that is driven to rotate forward and backward by a motor 26.

  The peeling unit 9 includes a peeling roller 28, a motor-driven delivery roller 29, a guide roller 30, and a pinch roller 31. In addition, the entire peeling unit 9 is supported so as to be horizontally movable along the guide rail 25 and is reciprocally screw-driven by a screw shaft 33 that is driven to rotate forward and backward by a motor 32.

  The pinch roller 31 is moved up and down by a cylinder and sandwiches the sealing sheet T in cooperation with the feed roller 29.

  As shown in FIGS. 5 and 6, the sheet collection unit 10 includes a motor-driven collection bobbin 35 and is rotationally driven in a direction in which the sealing sheet T cut out in a circular shape is wound up.

  The first cutting mechanism 8 is equipped with a support arm 43 at a lower part of a movable table 42 that can be moved up and down so as to be capable of driving and turning about a longitudinal axis X located on the center of the first holding table 4. Further, a tapered taper cutter 41 with a cutting edge facing downward is mounted on a cutter unit 44 provided on the free end side of the support arm 43. The support arm 43 is configured to turn around the longitudinal axis X so that the cutter 41 travels along the outer periphery of the substrate W and cuts the sealing sheet T into a circle.

  The second cutting mechanism 11 includes a second holding table 50, a cutter unit 51, and a camera unit 52.

  As shown in FIGS. 7 and 8, the second holding table 50 has a suction surface having a diameter smaller than the diameter of the substrate W, and is transferred from the substrate transport mechanism 2 and placed in a predetermined alignment posture. The back surface of the substrate W is vacuum-sucked. Further, the second holding table 50 is configured to horizontally move front and rear and left and right by the first movable base 53 and the second movable base 54 and to be rotatable around the central axis X by a turning motor.

  In other words, the first movable base 53 moves horizontally along the guide rail 55 laid on the base 12 from the substrate transport mechanism 2 side toward the cutter unit 51 side. The second movable base 54 moves horizontally along the guide rail 56 laid on the first movable base 53 in a direction orthogonal to the guide rail 55.

  The cutter unit 51 includes a movable base 63 connected to a cylinder 62 so as to be able to move up and down along a guide rail 61 laid vertically on a vertical wall 60. A tapered taper-shaped cutter 64 with the blade tip facing downward is detachably attached to the cutter holder at the lower part of the movable table 63.

  Below the cutter unit 51, a suction nozzle 65 is arranged on a movable base 68 connected to a cylinder 67 so that it can be moved up and down along the same guide rail 61, with its suction port facing the cutter 64. The suction nozzle 65 is connected in communication with an external vacuum device 66.

  The camera unit 52 is provided from the second holding table 50 from the cutting position of the cutter unit 51, and images the outer periphery of the wafer W from the back side. The captured image data is transmitted to the control unit 70. The control unit 70 will be described later in the following description of the operation of the apparatus.

  Next, a series of operations for sticking the surface protecting sealing sheet T to the surface of the substrate W using the above-described embodiment apparatus will be described with reference to FIGS.

  When a sticking command is issued, first, the robot arm 14 of the substrate transport mechanism 2 is moved toward the cassette C1 placed on the cassette base 12. The substrate holding part 14a of the robot arm 14 is inserted into the gap between the substrates W accommodated in the cassette C1. The robot arm 14 that holds the substrate W by suction from the back surface by the substrate holding portion 14a carries the substrate W out of the cassette C1 and transfers it to the alignment stage 3.

  The substrate W placed on the alignment stage 3 is aligned using notches formed on the outer periphery. The aligned substrate W is again carried out by the robot arm 14 and placed on the first holding table 4.

  The substrate W placed on the first holding table 4 is sucked and held in a state of being aligned so that the center thereof is on the center of the first holding table 4. At this time, as shown in FIG. 6, the pasting unit 7 and the peeling unit 9 are in the initial position on the left side. Further, the cutter 41 of the first cutting mechanism 8 stands by at an upper initial position.

  First, the peeling unit 9 operates the cylinder to lower the pinch roller 31 and grips the sealing sheet T with the feed roller 29.

  Next, as shown in FIG. 9, the sticking roller 24 is lowered and the sticking unit 7 moves forward. Along with this movement, the sticking roller 24 rolls forward (rightward in the figure) while pressing the sealing sheet T against the substrate W. At this time, the sealing sheet T wider than the substrate W is stuck on the surface of the substrate W from the left end in the figure.

  As shown in FIG. 10, when the sticking unit 7 reaches the end position beyond the first holding table 4, the cutter 41 waiting upward is lowered. The cutter 41 is pierced by the sealing sheet T in the cutter running groove 15 of the first holding table 4.

  When the cutter 41 is lowered to a predetermined cutting height position and stopped, the support arm 43 is rotated in a predetermined direction. With this rotation, the cutter 41 turns around the vertical axis X, and the sealing sheet T is cut out in a circle along the outer shape of the wafer.

  When the sheet cutting along the outer periphery of the substrate W is completed, the cutter 41 is raised to the original standby position as shown in FIG. At the same time, the pinch roller 31 of the peeling unit 9 is raised to release the gripping of the sealing sheet T, and the entire peeling unit 9 moves to the end position of the peeling operation.

  At this time, the feeding roller 29 is driven in synchronization with the moving speed of the peeling unit 9, and the sealing sheet T cut out in a circular shape is fed toward the sheet collecting unit 10.

  When the sheet pasting process ends, as shown in FIG. 12, the peeling unit 9 and the pasting unit 7 return to the original standby position. At this time, the sealing sheet T having a length corresponding to the moving speed of the peeling unit 9 and the pasting unit 7 is fed out from the sheet supply unit 5.

  When the peeling unit 9 and the affixing unit 7 reach the standby position, the suction of the substrate W by the first holding table 4 is released, and then the substrate W is held by the suction holding portion 14a of the robot arm 14 for the first holding. It is lifted above the table 4 and carried out to the second cutting mechanism 11.

  The robot arm 14 places the substrate W on the second holding table 50 in the standby position. When the substrate W is sucked by the second holding table 50, the suction of the substrate W by the suction holding unit 14a is released. The second holding table 50 moves to a predetermined position where the outer periphery of the substrate W is within the field of view of the camera unit 52.

  When the second holding table 50 reaches the predetermined position, an image of the outer periphery of the substrate W is taken while the second holding table 50 is rotated. The acquired image data is transmitted to the control unit 70. The control unit 70 obtains the center position of the substrate W from the reference image obtained in advance and the actual image obtained at the present time by using, for example, pattern matching and obtains the position of the notch. Based on the obtained result, the control unit 70 lowers the cutter 64 to a predetermined position and also raises the suction nozzle 65 to a predetermined position. Thereafter, the controller 70 horizontally and rotates the second holding table 50 so that the cutter 64 and the back end of the V-shaped notch face each other, as shown by a one-dot chain line in FIG. Center it.

  Next, as shown by the alternate long and short dash line in FIG. 14B, the control unit 70 performs the second operation so that the side surface from the opening end to the back end of one notch and the blade edge of the cutter 64 are in parallel contact. The holding table 50 is rotated horizontally around the center and around the center for alignment.

  When the alignment is completed, the position of the second holding table 50 is fixed, and the second holding table 50 is moved toward the cutter 64 by a predetermined distance as shown in FIG. In other words, the blade edge of the cutter 64 is cut to the back end along the side surface of the notch. When the cutting edge of the cutter 64 reaches the back end of the notch, the second holding table 50 is retracted and pulled out from the notch.

  In this embodiment, since the depth of the notch is several millimeters or less, it is only necessary to move the second holding table 50 horizontally. In the process of cutting the sealing sheet T according to the angle θ formed by the one-dot chain line in the center and the blade edge of the cutter 64 and the depth of the notch, the direction in which the second holding table 50 is orthogonal to the traveling direction. The blade edge and the side surface of the notch are kept parallel to each other while being moved horizontally. When the cutter 64 is extracted from the back end of the notch, the second holding table 50 is moved in the reverse operation to that for cutting.

  Next, as shown in FIG. 15A, the control unit 70 causes the second holding table 50 so that the side surface from the open end to the back end of the other notch and the blade edge of the cutter 64 are in parallel contact. Rotate the back and forth horizontally and around the center for alignment.

  When the alignment is completed, the position of the second holding table 50 is fixed and the second holding table 50 is moved by a predetermined distance toward the cutter 64 as shown in FIG. Let That is, as shown in FIG. 15C, the sealing sheet T is cut into a notch shape by cutting the blade 64 of the cutter 64 to the back end along the side surface of the notch and connecting it to the notch of the first half.

  At this time, the movable base 68 is raised and the notch portion is sucked by the suction nozzle 65 from the back side of the substrate W. Therefore, the chips generated when cutting the notch portion V and the sealing sheet piece cut into the notch shape are removed by suction.

  Note that, when the sealing sheet T is sucked, the detector may detect whether the sealing sheet piece cut out from the notch portion V is sucked by the suction nozzle 65. As the detector, for example, a non-contact type optical sensor or the like may be provided in the suction nozzle 65, or the pressure change at the time of suction of the sealing sheet piece is detected by a pressure gauge or the flow rate. You may comprise.

  When the cutting process of the sealing sheet T at the notch portion is completed, the cutter unit 51 and the cutter holder 68 are returned to the standby positions. At the same time, the second holding table 50 moves to a position where the substrate W is transferred to the robot arm 14.

  When the robot arm 14 holds the substrate W by suction, the second holding table 50 releases the suction holding of the substrate W. Thereafter, the robot arm 14 transports the substrate W to the cassette C2.

  The above-described operation is sequentially repeated until the pasting process of one sealing sheet T is completed, and thereafter the sheet pasting process is completed on a predetermined number of substrates W.

  Thus, a series of operations of the above-described embodiment apparatus is completed.

  As described above, the V-shaped notch portion V is covered by the second cutting blade 64 of the second cutting mechanism 11 after the sealing sheet T is cut out in the same circle as the wafer W by the first cutting mechanism 8. By cutting the sealing sheet T, in the process of cutting the sealing sheet T of the notch portion V, excessive pressing accompanying the change of the cutting angle of the conventional cutter does not act on the substrate W and the cutter 64. Therefore, chipping and cracking of the substrate W and the sealing layer M and blade spillage of the cutter 64 are also suppressed.

  In addition, since the suction nozzle 65 is disposed opposite to the cutter 64 with the substrate W sandwiched when the sealing sheet of the notch portion V is cut, dust such as chips and solid particles generated during cutting of the sealing sheet T and sealing Sheet pieces and the like are immediately removed by suction. Therefore, contamination of the substrate W can be suppressed.

  In addition, this invention can also be implemented with the following forms.

  (1) In the above-described embodiment apparatus, the cutter 64 provided with the second cutting mechanism 11 is pivotally supported so as to swing back and forth in the cutting direction of the sealing sheet T as shown in FIG. Alternatively, the angle may be changed by inserting and fixing the screw 72 into the long hole 71.

  Furthermore, in the said structure, it is preferable to elastically urge the cutter 64 in the cutting direction of the sealing sheet T. That is, when excessive pressing acts on the blade edge during the cutting process of the sealing sheet T, the cutter 64 swings backward against the elastic bias. Therefore, chipping and cracking of the substrate W and further blade spilling of the cutter 64 can be avoided reliably.

  (2) In the above-described embodiment apparatus, at least the cutter 64 of the cutter 41 of the first cutting mechanism 8 and the cutter 64 of the second cutting mechanism 11 may be heated by a heater. In other words, a heater may be embedded in the cutter unit 51 and the cutter 64 may be heated. According to this configuration, the sealing sheet T can be cut while being softened by the heat of the cutter 64.

  (3) Although the sealing sheet T of the circular arc part of the board | substrate W was cut | disconnected previously in the said Example, the sealing sheet T of the notch part V was cut | disconnected by the 2nd cutting mechanism 11 arrange | positioned in the separate position. The configuration is not limited to this. Therefore, for example, after cutting the sealing sheet T of the notch portion V, the sealing sheet T of the arc portion may be cut.

  in this case. The first holding table 4 may have the function of the suction nozzle 65 provided in the second cutting mechanism 11. For example, since the first holding table 4 is a chuck table, the suction groove of the substrate W and a portion for sucking and collecting the sealing sheet piece are partitioned, and only the sealing sheet piece is collected by a different suction system. That's fine. The notch may be detected by the alignment stage 3 and placed by the robot arm 14 so that the notch portion V comes to the cutting position based on the position information. Further, in order to improve the positional accuracy, the first holding table 4 may be configured to rotate around the front and rear, right and left in the sheet supply direction and around the central axis.

  (4) Although the above embodiment has been described by taking a substantially circular semiconductor substrate as an example, the present invention can be applied to a case where a notch is formed on a rectangular substrate such as a rectangle or a square. Moreover, the notch formed in the board | substrate W is not limited to V shape, The curved recessed shape etc. are included.

  When the notch is concavely curved, the cutter holder and the cutter 64 may be configured to rotate around the longitudinal axis so that the blade edge of the cutter 64 follows the curved shape. For example, as shown in FIG. 17, pin cylinders 73 are brought into contact with both side surfaces near the rear end of the cutting direction of the cutter 64 that is rotatably mounted around the longitudinal axis, and the rods of the left and right pin cylinders 73 are The blade edge of the cutter 64 is configured to come into contact with the side surface of the notch with an appropriate biasing force.

DESCRIPTION OF SYMBOLS 4 ... 1st holding table 5 ... Sheet supply part 7 ... Pasting unit 8 ... 1st cutting mechanism 9 ... Peeling unit 10 ... Sheet collection | recovery part 11 ... 2nd cutting mechanism 41 ... Cutter (1st cutting blade)
50 ... Second holding table 64 ... Cutter (second cutting blade)
65 ... Suction nozzle T ... Sealing sheet V ... Notch part W ... Semiconductor substrate

Claims (10)

A sealing sheet cutting method for cutting a sealing sheet having a sealing layer formed of a resin composition attached to a semiconductor substrate,
A pasting process for pasting a sealing sheet larger than the semiconductor substrate to the semiconductor substrate;
The first cutting blade provided in the first cutting mechanism is placed along the outer diameter of the semiconductor substrate while leaving the notch portion of the sealing sheet attached to cover the notch formed in the semiconductor substrate. A first cutting process for cutting the sheet;
A recovery process of recovering the sealing sheet cut out in the shape of the semiconductor substrate;
A second cutting process in which a second cutting blade of a second cutting mechanism is cut from one of the open ends of the notch to the back end along the notch;
A third cutting step of cutting the sealing sheet into a notch shape by cutting the second cutting blade of the second cutting mechanism from the other of the opening ends of the notch into the notch along the notch;
A sealing sheet cutting method comprising: In the sealing sheet cutting method according to claim 1,
The second cutting process and the third cutting process are characterized in that the sealing sheet is cut while elastically urging the second cutting blade pivotally supported by the holder in the cutting direction. Cutting method. In the sealing sheet cutting method according to claim 1 or 2,
A sealing sheet cutting method, wherein the sealing sheet is cut out while sucking the notch portion at least in the third cutting process among the second cutting process and the third cutting process. In the sealing sheet cutting method according to any one of claims 1 to 3,
A sealing sheet cutting method comprising: an inspection process for inspecting a cutting failure of the sealing sheet at the notch portion after the third cutting process. In the sealing sheet cutting method according to any one of claims 1 to 4,
In the first cutting process to the third cutting process, the sealing sheet is cut while heating the first cutting blade and the second cutting blade with a heater. A sealing sheet cutting device for cutting a sealing sheet formed with a sealing layer made of a resin composition attached to a semiconductor substrate,
A first holding table for mounting and holding the semiconductor substrate;
A pasting mechanism for pasting a sealing sheet to the semiconductor substrate;
A first cutting mechanism that cuts the sealing sheet along the first cutting blade along the outer shape of the semiconductor substrate while leaving the notch portion of the sealing sheet attached to cover the notch formed on the semiconductor substrate. When,
A sheet recovery mechanism for recovering the remaining sealing sheet cut out in the shape of the semiconductor substrate;
A second holding table that horizontally moves while mounting and holding the semiconductor substrate to which the sealing sheet is attached, and that rotates around the central axis of the semiconductor substrate;
A detector for detecting a notch of the semiconductor substrate placed and held on the second holding table;
A second cutting mechanism for cutting out a sealing sheet covering the notch portion along the notch of the edge of the second cutting blade;
Each time the second holding table is rotated and horizontally moved based on the position information of the notch detected by the detector so as to align the opening end of the notch and the cutting edge of the second cutting blade, the second cutting is performed. In the process of reciprocating the second holding table with respect to the second cutting blade arranged in the mechanism, the second cutting blade is cut along the notch to the notch deep end, and both cuts are made at the notch deep end. A sealing sheet cutting device characterized in that the sealing sheet is cut out into a notch shape by joining together. In the sealing sheet cutting device according to claim 6,
The said 2nd cutting blade is pivotally supported by the holder of the 2nd cutting mechanism so that rocking is possible, and is elastically urged | biased in the cutting direction of a sealing sheet. The sealing sheet cutting device characterized by the above-mentioned. In the sealing sheet cutting device according to claim 6 or 7,
A sealing sheet cutting device comprising a suction mechanism that is disposed opposite to the second cutting blade with the semiconductor substrate interposed therebetween and sucks a notch portion. In the sealing sheet cutting device according to any one of claims 6 to 8,
A sealing sheet cutting device comprising a heater for heating the second cutting blade. In the sealing sheet cutting device according to any one of claims 6 to 9,
A detector for detecting the presence or absence of cutting of the sealing sheet of the notch portion;
A sealing sheet cutting apparatus comprising: a determination unit that determines a cutting failure of a notch portion based on a detection signal from the detector.

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