SG11201508294PA - Sealing sheet cutting method and sealing sheet cutting apparatus - Google Patents

Sealing sheet cutting method and sealing sheet cutting apparatus

Info

Publication number
SG11201508294PA
SG11201508294PA SG11201508294PA SG11201508294PA SG11201508294PA SG 11201508294P A SG11201508294P A SG 11201508294PA SG 11201508294P A SG11201508294P A SG 11201508294PA SG 11201508294P A SG11201508294P A SG 11201508294PA SG 11201508294P A SG11201508294P A SG 11201508294PA
Authority
SG
Singapore
Prior art keywords
sealing sheet
sheet cutting
cutting apparatus
cutting method
sealing
Prior art date
Application number
SG11201508294PA
Inventor
Naoki Ishii
Shinichirou Mori
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG11201508294PA publication Critical patent/SG11201508294PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/14—Forming notches in marginal portion of work by cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
SG11201508294PA 2013-04-22 2014-03-24 Sealing sheet cutting method and sealing sheet cutting apparatus SG11201508294PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013089373A JP2014213386A (en) 2013-04-22 2013-04-22 Method of cutting sealing sheet and device of cutting sealing sheet
PCT/JP2014/058121 WO2014174963A1 (en) 2013-04-22 2014-03-24 Method for cutting sealing sheet and device for cutting sealing sheet

Publications (1)

Publication Number Publication Date
SG11201508294PA true SG11201508294PA (en) 2015-11-27

Family

ID=51791546

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508294PA SG11201508294PA (en) 2013-04-22 2014-03-24 Sealing sheet cutting method and sealing sheet cutting apparatus

Country Status (6)

Country Link
JP (1) JP2014213386A (en)
KR (1) KR20150145233A (en)
CN (1) CN105163914A (en)
SG (1) SG11201508294PA (en)
TW (1) TW201448007A (en)
WO (1) WO2014174963A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111605842A (en) * 2019-02-23 2020-09-01 希为工业自动化设备（上海）有限公司 Device for disassembling and shearing steel roll packaging belt for tail end of robot and using method thereof
KR102484237B1 (en) * 2020-11-06 2023-01-04 ㈜토니텍 Mounter cutting device for semiconductor package
JP7100926B1 (en) * 2020-11-17 2022-07-14 スターテクノ株式会社 An ultrasonic processing device equipped with a work processing device and the work processing device.
WO2022107192A1 (en) * 2020-11-17 2022-05-27 スターテクノ株式会社 Workpiece machining device, and ultrasonic machining apparatus provided with said workpiece machining device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004025402A (en) * 2002-06-27 2004-01-29 Lintec Corp Cutting method and cutting device of protection tape of semiconductor wafer
JP4740927B2 (en) * 2007-11-27 2011-08-03 日東精機株式会社 Method and apparatus for cutting protective tape of semiconductor wafer
JP5554100B2 (en) * 2010-03-19 2014-07-23 リンテック株式会社 Sheet cutting method and sheet cutting apparatus

Also Published As

Publication number Publication date
JP2014213386A (en) 2014-11-17
KR20150145233A (en) 2015-12-29
TW201448007A (en) 2014-12-16
WO2014174963A1 (en) 2014-10-30
CN105163914A (en) 2015-12-16

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