TWI411026B - - Google Patents

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Publication number
TWI411026B
TWI411026B TW99127072A TW99127072A TWI411026B TW I411026 B TWI411026 B TW I411026B TW 99127072 A TW99127072 A TW 99127072A TW 99127072 A TW99127072 A TW 99127072A TW I411026 B TWI411026 B TW I411026B
Authority
TW
Taiwan
Prior art keywords
encapsulation
semiconductor device
laser
grooving
internal structure
Prior art date
Application number
TW99127072A
Other languages
Chinese (zh)
Other versions
TW201207913A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99127072A priority Critical patent/TW201207913A/en
Publication of TW201207913A publication Critical patent/TW201207913A/en
Application granted granted Critical
Publication of TWI411026B publication Critical patent/TWI411026B/zh

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a two-stage encapsulation removing method for semiconductor device and a laser grooving device. The two-stage encapsulation removing method is first to remove partial encapsulation material in marked grooving area of the semiconductor device using laser processing means to form a groove; then, using the chemical etching means to remove the encapsulation material at the bottom of the groove to expose the internal structure of the semiconductor device enclosed by the encapsulation material, so as to shorten the processing time of encapsulation removing and prevent the damage to internal structure of the semiconductor device. The laser grooving device combines the control components with the optical imaging components to provide the operator to mark on the area position of the encapsulation according to the surface morphology of encapsulation of the semiconductor device, and then control the laser emitter to automatically proceed the precise laser drilling operation in the marked area position of encapsulation of the semiconductor device.
TW99127072A 2010-08-13 2010-08-13 Two-stage encapsulation removing method for semiconductor device and laser grooving device TW201207913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99127072A TW201207913A (en) 2010-08-13 2010-08-13 Two-stage encapsulation removing method for semiconductor device and laser grooving device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99127072A TW201207913A (en) 2010-08-13 2010-08-13 Two-stage encapsulation removing method for semiconductor device and laser grooving device

Publications (2)

Publication Number Publication Date
TW201207913A TW201207913A (en) 2012-02-16
TWI411026B true TWI411026B (en) 2013-10-01

Family

ID=46762362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99127072A TW201207913A (en) 2010-08-13 2010-08-13 Two-stage encapsulation removing method for semiconductor device and laser grooving device

Country Status (1)

Country Link
TW (1) TW201207913A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI653692B (en) * 2013-09-26 2019-03-11 蔡宜興 Degumming method for quadrilateral planar leadless package wafer
CN114334749B (en) * 2022-03-09 2022-06-14 绍兴中芯集成电路制造股份有限公司 Plastic package device unsealing method
CN117238820B (en) * 2023-09-19 2024-03-08 南京江智科技有限公司 Semiconductor packaging structure and packaging method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW451364B (en) * 1999-05-10 2001-08-21 Intersil Corp Method and apparatus for removing a plastic resin encapsulant from an encapsulated integrated circuit
TW200307322A (en) * 2002-03-12 2003-12-01 Hamamatsu Photonics Kk Semiconductor substrate, semiconductor chip and production method for a semiconductor device
TW200805477A (en) * 2006-06-08 2008-01-16 Apic Yamada Corp Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method
TW200848191A (en) * 2007-05-16 2008-12-16 Nitto Denko Corp Laser processing method and laser-processed product

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW451364B (en) * 1999-05-10 2001-08-21 Intersil Corp Method and apparatus for removing a plastic resin encapsulant from an encapsulated integrated circuit
TW200307322A (en) * 2002-03-12 2003-12-01 Hamamatsu Photonics Kk Semiconductor substrate, semiconductor chip and production method for a semiconductor device
TW200805477A (en) * 2006-06-08 2008-01-16 Apic Yamada Corp Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method
TW200848191A (en) * 2007-05-16 2008-12-16 Nitto Denko Corp Laser processing method and laser-processed product

Also Published As

Publication number Publication date
TW201207913A (en) 2012-02-16

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