TWI411026B - - Google Patents
Info
- Publication number
- TWI411026B TWI411026B TW99127072A TW99127072A TWI411026B TW I411026 B TWI411026 B TW I411026B TW 99127072 A TW99127072 A TW 99127072A TW 99127072 A TW99127072 A TW 99127072A TW I411026 B TWI411026 B TW I411026B
- Authority
- TW
- Taiwan
- Prior art keywords
- encapsulation
- semiconductor device
- laser
- grooving
- internal structure
- Prior art date
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a two-stage encapsulation removing method for semiconductor device and a laser grooving device. The two-stage encapsulation removing method is first to remove partial encapsulation material in marked grooving area of the semiconductor device using laser processing means to form a groove; then, using the chemical etching means to remove the encapsulation material at the bottom of the groove to expose the internal structure of the semiconductor device enclosed by the encapsulation material, so as to shorten the processing time of encapsulation removing and prevent the damage to internal structure of the semiconductor device. The laser grooving device combines the control components with the optical imaging components to provide the operator to mark on the area position of the encapsulation according to the surface morphology of encapsulation of the semiconductor device, and then control the laser emitter to automatically proceed the precise laser drilling operation in the marked area position of encapsulation of the semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99127072A TW201207913A (en) | 2010-08-13 | 2010-08-13 | Two-stage encapsulation removing method for semiconductor device and laser grooving device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99127072A TW201207913A (en) | 2010-08-13 | 2010-08-13 | Two-stage encapsulation removing method for semiconductor device and laser grooving device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201207913A TW201207913A (en) | 2012-02-16 |
TWI411026B true TWI411026B (en) | 2013-10-01 |
Family
ID=46762362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99127072A TW201207913A (en) | 2010-08-13 | 2010-08-13 | Two-stage encapsulation removing method for semiconductor device and laser grooving device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201207913A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI653692B (en) * | 2013-09-26 | 2019-03-11 | 蔡宜興 | Degumming method for quadrilateral planar leadless package wafer |
CN114334749B (en) * | 2022-03-09 | 2022-06-14 | 绍兴中芯集成电路制造股份有限公司 | Plastic package device unsealing method |
CN117238820B (en) * | 2023-09-19 | 2024-03-08 | 南京江智科技有限公司 | Semiconductor packaging structure and packaging method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451364B (en) * | 1999-05-10 | 2001-08-21 | Intersil Corp | Method and apparatus for removing a plastic resin encapsulant from an encapsulated integrated circuit |
TW200307322A (en) * | 2002-03-12 | 2003-12-01 | Hamamatsu Photonics Kk | Semiconductor substrate, semiconductor chip and production method for a semiconductor device |
TW200805477A (en) * | 2006-06-08 | 2008-01-16 | Apic Yamada Corp | Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method |
TW200848191A (en) * | 2007-05-16 | 2008-12-16 | Nitto Denko Corp | Laser processing method and laser-processed product |
-
2010
- 2010-08-13 TW TW99127072A patent/TW201207913A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451364B (en) * | 1999-05-10 | 2001-08-21 | Intersil Corp | Method and apparatus for removing a plastic resin encapsulant from an encapsulated integrated circuit |
TW200307322A (en) * | 2002-03-12 | 2003-12-01 | Hamamatsu Photonics Kk | Semiconductor substrate, semiconductor chip and production method for a semiconductor device |
TW200805477A (en) * | 2006-06-08 | 2008-01-16 | Apic Yamada Corp | Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method |
TW200848191A (en) * | 2007-05-16 | 2008-12-16 | Nitto Denko Corp | Laser processing method and laser-processed product |
Also Published As
Publication number | Publication date |
---|---|
TW201207913A (en) | 2012-02-16 |
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