CN112309848A - 湿蚀刻方法 - Google Patents

湿蚀刻方法 Download PDF

Info

Publication number
CN112309848A
CN112309848A CN202010736081.7A CN202010736081A CN112309848A CN 112309848 A CN112309848 A CN 112309848A CN 202010736081 A CN202010736081 A CN 202010736081A CN 112309848 A CN112309848 A CN 112309848A
Authority
CN
China
Prior art keywords
wafer
etching
liquid
cleaning
etching solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010736081.7A
Other languages
English (en)
Chinese (zh)
Inventor
松崎荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN112309848A publication Critical patent/CN112309848A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42—Auxiliary equipment or operation thereof
    • B01D46/44—Auxiliary equipment or operation thereof controlling filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202010736081.7A 2019-07-31 2020-07-28 湿蚀刻方法 Pending CN112309848A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-140936 2019-07-31
JP2019140936A JP7303688B2 (ja) 2019-07-31 2019-07-31 ウエットエッチング方法

Publications (1)

Publication Number Publication Date
CN112309848A true CN112309848A (zh) 2021-02-02

Family

ID=74483589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010736081.7A Pending CN112309848A (zh) 2019-07-31 2020-07-28 湿蚀刻方法

Country Status (4)

Country Link
JP (1) JP7303688B2 (ja)
KR (1) KR20210015644A (ja)
CN (1) CN112309848A (ja)
TW (1) TW202107549A (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286130A (ja) 1988-09-22 1990-03-27 Fuji Electric Co Ltd 半導体装置の製造方法
JPH06265869A (ja) 1993-03-12 1994-09-22 Hitachi Ltd ブラックマトリクスを有する基板およびその製造方法、ならびに液晶表示装置
JPH07176507A (ja) * 1993-12-20 1995-07-14 Hitachi Ltd ウエット処理装置およびウエット処理方法
JP3489947B2 (ja) * 1996-11-15 2004-01-26 松下電器産業株式会社 枚葉化学処理装置と基板の処理方法
JPH10242110A (ja) * 1997-03-03 1998-09-11 Hitachi Ltd 回転処理方法および回転処理装置
JP2005079212A (ja) * 2003-08-29 2005-03-24 Trecenti Technologies Inc 半導体製造装置、及び半導体装置の製造方法
JP2005340331A (ja) * 2004-05-25 2005-12-08 Matsushita Electric Ind Co Ltd 基板の洗浄方法及び基板洗浄装置
JP4498893B2 (ja) * 2004-11-11 2010-07-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP2006278606A (ja) * 2005-03-29 2006-10-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008021920A (ja) * 2006-07-14 2008-01-31 Nec Electronics Corp 半導体基板のエッチング装置及びエッチング方法
JP6080291B2 (ja) * 2012-09-28 2017-02-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6242056B2 (ja) * 2013-02-15 2017-12-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2014184434A (ja) * 2014-04-21 2014-10-02 Sumitomo Precision Prod Co Ltd 搬送式基板処理装置における節水型洗浄システム
JP6449097B2 (ja) * 2014-07-24 2019-01-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP6761166B2 (ja) 2015-07-23 2020-09-23 セントラル硝子株式会社 ウェットエッチング方法及びエッチング液

Also Published As

Publication number Publication date
JP7303688B2 (ja) 2023-07-05
JP2021027063A (ja) 2021-02-22
KR20210015644A (ko) 2021-02-10
TW202107549A (zh) 2021-02-16

Similar Documents

Publication Publication Date Title
KR101371572B1 (ko) 액처리 장치, 액처리 방법 및 기억 매체
KR101982391B1 (ko) 기판 처리 장치
KR100907125B1 (ko) 기판처리방법 및 기판처리장치
JP5188217B2 (ja) 基板処理装置
JP5129042B2 (ja) 基板の処理装置
JP5486708B2 (ja) 基板処理装置および基板処理方法
KR101867748B1 (ko) 기판 처리 장치
KR101866640B1 (ko) 기판 처리 방법 및 기판 처리 장치
KR102297377B1 (ko) 기판 처리 장치
KR20190112639A (ko) 기판 처리 방법 및 기판 처리 장치
US20090241995A1 (en) Substrate cleaning method and apparatus
KR101895409B1 (ko) 기판 처리 설비
JP3621568B2 (ja) 基板洗浄装置
CN112309848A (zh) 湿蚀刻方法
JP2009238793A (ja) 基板処理方法および基板処理装置
JP2003297794A (ja) 基板処理装置および基板処理方法
JP4325831B2 (ja) 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
CN112309908A (zh) 蚀刻装置和晶片支承件
JP2002299305A (ja) 基板周縁処理装置および基板周縁処理方法
JP6280790B2 (ja) 基板処理装置および基板処理方法
JP6215748B2 (ja) 基板処理装置
JP2009218376A (ja) 基板処理装置および基板処理方法
KR101485579B1 (ko) 기판세정장치
JP2005340331A (ja) 基板の洗浄方法及び基板洗浄装置
JP7413087B2 (ja) ウエットエッチング方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination