CN112309604B - 导电粒子及其制造方法、导电材料、接触结构体、电气及电子部件 - Google Patents

导电粒子及其制造方法、导电材料、接触结构体、电气及电子部件 Download PDF

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Publication number
CN112309604B
CN112309604B CN201911409469.XA CN201911409469A CN112309604B CN 112309604 B CN112309604 B CN 112309604B CN 201911409469 A CN201911409469 A CN 201911409469A CN 112309604 B CN112309604 B CN 112309604B
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conductive
conductive layer
concentration
particles
solution
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CN112309604A (zh
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金敬钦
郑舜浩
裵仓完
金泰根
金钟兑
朴俊奕
林永真
李枝原
崔阭秀
秋龙喆
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DukSan Neolux Co Ltd
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Duksan Hi Metal Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Chemically Coating (AREA)
CN201911409469.XA 2019-07-31 2019-12-31 导电粒子及其制造方法、导电材料、接触结构体、电气及电子部件 Active CN112309604B (zh)

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KR1020190092974A KR102222105B1 (ko) 2019-07-31 2019-07-31 도전입자, 도전재료 및 접속 구조체
KR10-2019-0092974 2019-07-31

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CN112309604B true CN112309604B (zh) 2023-04-14

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US8517923B2 (en) 2000-04-03 2013-08-27 Intuitive Surgical Operations, Inc. Apparatus and methods for facilitating treatment of tissue via improved delivery of energy based and non-energy based modalities
US6468203B2 (en) 2000-04-03 2002-10-22 Neoguide Systems, Inc. Steerable endoscope and improved method of insertion
KR102612482B1 (ko) * 2021-11-16 2023-12-11 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN108701508A (zh) * 2016-02-10 2018-10-23 日立化成株式会社 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂、连接结构体和导电粒子的制造方法

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JP2000322936A (ja) * 1999-05-12 2000-11-24 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
JP5297569B1 (ja) 2011-12-21 2013-09-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN105210157B (zh) * 2013-09-12 2017-05-31 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP6491446B2 (ja) 2013-09-30 2019-03-27 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6423687B2 (ja) * 2013-11-01 2018-11-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6397316B2 (ja) * 2013-11-18 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
US9920155B2 (en) * 2014-03-18 2018-03-20 Nippon Shokubai Co., Ltd. Resin particles, conductive microparticles, and anisotropic conductive material using same
JP6646366B2 (ja) * 2014-06-24 2020-02-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108701508A (zh) * 2016-02-10 2018-10-23 日立化成株式会社 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂、连接结构体和导电粒子的制造方法

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Publication number Publication date
CN112309604A (zh) 2021-02-02
KR20210014917A (ko) 2021-02-10
JP7116104B2 (ja) 2022-08-09
JP2021027027A (ja) 2021-02-22
KR102222105B1 (ko) 2021-03-03

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