CN112046101A - 层叠基板和捆包体 - Google Patents

层叠基板和捆包体 Download PDF

Info

Publication number
CN112046101A
CN112046101A CN202010509466.XA CN202010509466A CN112046101A CN 112046101 A CN112046101 A CN 112046101A CN 202010509466 A CN202010509466 A CN 202010509466A CN 112046101 A CN112046101 A CN 112046101A
Authority
CN
China
Prior art keywords
resin layer
protective film
polyimide resin
support base
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010509466.XA
Other languages
English (en)
Chinese (zh)
Inventor
长尾洋平
川崎周马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN112046101A publication Critical patent/CN112046101A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Buffer Packaging (AREA)
  • Packaging Frangible Articles (AREA)
CN202010509466.XA 2019-06-06 2020-06-04 层叠基板和捆包体 Pending CN112046101A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-106053 2019-06-06
JP2019106053 2019-06-06

Publications (1)

Publication Number Publication Date
CN112046101A true CN112046101A (zh) 2020-12-08

Family

ID=73600993

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010509466.XA Pending CN112046101A (zh) 2019-06-06 2020-06-04 层叠基板和捆包体

Country Status (4)

Country Link
JP (1) JP7115510B2 (ja)
KR (1) KR102526049B1 (ja)
CN (1) CN112046101A (ja)
TW (1) TWI803752B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811636B (zh) * 2020-03-31 2023-08-11 日商東洋紡股份有限公司 附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法
JPWO2022186002A1 (ja) * 2021-03-04 2022-09-09
JPWO2023074536A1 (ja) * 2021-10-27 2023-05-04

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012035583A (ja) * 2010-08-11 2012-02-23 Kaneka Corp 積層体の製造方法、及びフレキシブルデバイス
CN103009723A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN103421437A (zh) * 2012-05-21 2013-12-04 藤森工业株式会社 表面处理膜、表面保护膜、以及精密电气/电子部件
CN104245537A (zh) * 2012-04-13 2014-12-24 旭硝子株式会社 玻璃板的包装方法及包装体
CN104821293A (zh) * 2014-02-04 2015-08-05 旭硝子株式会社 层叠体的剥离开始部制作方法和装置及电子器件制造方法
CN107531996A (zh) * 2015-04-17 2018-01-02 旭化成株式会社 树脂组合物、聚酰亚胺树脂膜及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4087232B2 (ja) * 2002-12-03 2008-05-21 日東電工株式会社 ガラス割れ防止用透明積層体とその梱包構造
JP4924982B2 (ja) 2006-12-07 2012-04-25 日本電気硝子株式会社 ガラス板梱包方法及びガラス板梱包体
JP5489088B2 (ja) * 2010-04-28 2014-05-14 旭硝子株式会社 ガラス板梱包体及びガラス板積層体の梱包方法
WO2015016064A1 (ja) * 2013-08-01 2015-02-05 リンテック株式会社 保護膜形成用複合シート
JP2015104843A (ja) 2013-11-29 2015-06-08 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 積層体とその製造方法、及び該積層体を用いた電子デバイスの製造方法
TWI709481B (zh) 2014-08-25 2020-11-11 日商東洋紡股份有限公司 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法
KR20160104450A (ko) 2015-02-26 2016-09-05 이만택 지압기구
JP6688450B2 (ja) 2016-01-15 2020-04-28 東洋紡株式会社 積層体、電子デバイス、及びフレキシブル電子デバイスの製造方法
JP6946900B2 (ja) 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、および、電子デバイスの製造方法
JP7167693B2 (ja) 2018-12-20 2022-11-09 東洋紡株式会社 積層フィルム、積層体、及び、積層体の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012035583A (ja) * 2010-08-11 2012-02-23 Kaneka Corp 積層体の製造方法、及びフレキシブルデバイス
CN103009723A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN104245537A (zh) * 2012-04-13 2014-12-24 旭硝子株式会社 玻璃板的包装方法及包装体
CN103421437A (zh) * 2012-05-21 2013-12-04 藤森工业株式会社 表面处理膜、表面保护膜、以及精密电气/电子部件
CN104821293A (zh) * 2014-02-04 2015-08-05 旭硝子株式会社 层叠体的剥离开始部制作方法和装置及电子器件制造方法
CN107531996A (zh) * 2015-04-17 2018-01-02 旭化成株式会社 树脂组合物、聚酰亚胺树脂膜及其制造方法

Also Published As

Publication number Publication date
JP7115510B2 (ja) 2022-08-09
KR102526049B1 (ko) 2023-04-27
TW202103913A (zh) 2021-02-01
JP2020199766A (ja) 2020-12-17
TWI803752B (zh) 2023-06-01
KR20200140719A (ko) 2020-12-16

Similar Documents

Publication Publication Date Title
CN112046101A (zh) 层叠基板和捆包体
US8425711B2 (en) Glass substrate with protective glass, and process for producing display device using glass substrate with protective glass
KR101844808B1 (ko) 유리-수지 적층체, 그것을 권취한 유리 롤, 및 유리 롤의 제조 방법
US11951726B2 (en) Method of manufacturing a flexible display substrate and process film for manufacturing a flexible display substrate
JP7063313B2 (ja) 積層基板および剥離方法
JP4923165B2 (ja) 光学用透明粘着体、光学用透明粘着積層体及びその製造方法
JPWO2011024690A1 (ja) フレキシブル基材−支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
EP2551754A2 (en) Protective sheet for touch panel and fabrication method thereof
TWI518165B (zh) 表面保護薄膜及貼黏有其之光學零件、工業製品
TW202031567A (zh) 被捆包體及捆包體
JP2013078925A (ja) フィルム積層体およびガラスフィルムの製造関連処理方法
JP7081581B2 (ja) 切断方法、切断装置および積層体
CN105694748A (zh) 晶片加工用带
TWI646166B (zh) 晶圓加工用膠帶
CN105694743A (zh) 晶片加工用带
JP4592851B2 (ja) 薄板の平坦度維持方法、並びにそれを用いた積層体
CN117917321A (zh) 复合体层叠物
TW201213142A (en) Method for laminating optical substrate and carrier board and manufacturing process of flexible substrate using the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20201208

RJ01 Rejection of invention patent application after publication