CN112041750B - 平台设备、光刻设备、控制单元和方法 - Google Patents

平台设备、光刻设备、控制单元和方法 Download PDF

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Publication number
CN112041750B
CN112041750B CN201980028170.1A CN201980028170A CN112041750B CN 112041750 B CN112041750 B CN 112041750B CN 201980028170 A CN201980028170 A CN 201980028170A CN 112041750 B CN112041750 B CN 112041750B
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China
Prior art keywords
support
control unit
support members
plane
support member
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CN201980028170.1A
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English (en)
Chinese (zh)
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CN112041750A (zh
Inventor
R·P·C·范多斯特
G·克拉默
B·C·H·斯梅茨
M·J·H·弗雷肯
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ASML Holding NV
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ASML Holding NV
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Publication date
Priority claimed from EP18169639.4A external-priority patent/EP3385792A3/en
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Publication of CN112041750A publication Critical patent/CN112041750A/zh
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201980028170.1A 2018-04-26 2019-03-27 平台设备、光刻设备、控制单元和方法 Active CN112041750B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP18169639.4 2018-04-26
EP18169639.4A EP3385792A3 (en) 2018-04-26 2018-04-26 Stage apparatus for use in a lithographic apparatus
EP19150671.6 2019-01-08
EP19150671 2019-01-08
PCT/EP2019/057672 WO2019206548A1 (en) 2018-04-26 2019-03-27 Stage apparatus, lithographic apparatus, control unit and method

Publications (2)

Publication Number Publication Date
CN112041750A CN112041750A (zh) 2020-12-04
CN112041750B true CN112041750B (zh) 2024-11-22

Family

ID=65818534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980028170.1A Active CN112041750B (zh) 2018-04-26 2019-03-27 平台设备、光刻设备、控制单元和方法

Country Status (6)

Country Link
US (1) US11243476B2 (https=)
JP (1) JP7079858B2 (https=)
KR (1) KR102493253B1 (https=)
CN (1) CN112041750B (https=)
NL (1) NL2022818A (https=)
WO (1) WO2019206548A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3764165A1 (en) 2019-07-12 2021-01-13 ASML Netherlands B.V. Substrate shape measuring device
DE102019008104A1 (de) * 2019-11-21 2021-05-27 Vat Holding Ag Verfahren zur Überwachung, Positionsbestimmung und Positionierung eines Stiffthubsystems
US20240345490A1 (en) * 2021-08-24 2024-10-17 Asml Netherlands B.V. An object gripper, a method of holding an object and a lithographic apparatus
KR102883313B1 (ko) * 2022-04-04 2025-11-06 세메스 주식회사 기판 지지 장치 및 이를 포함하는 기판 하면 세정 장치
CN115709902B (zh) * 2022-11-24 2025-05-16 镇江龙源铝业有限公司 一种铝合金板带辅助支撑装置及其控制方法

Citations (2)

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US5564682A (en) * 1993-08-13 1996-10-15 Kabushiki Kaisha Toshiba Wafer stage apparatus for attaching and holding semiconductor wafer
JP2014003259A (ja) * 2012-06-21 2014-01-09 Nikon Corp ロード方法、基板保持装置及び露光装置

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JP3477777B2 (ja) * 1993-01-22 2003-12-10 株式会社日立製作所 投影露光装置およびその方法
US5563684A (en) 1994-11-30 1996-10-08 Sgs-Thomson Microelectronics, Inc. Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer
JPH1154423A (ja) * 1997-07-31 1999-02-26 Horiba Ltd 露光装置
US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JP2002064132A (ja) * 2000-08-22 2002-02-28 Tokyo Electron Ltd 被処理体の受け渡し方法、被処理体の載置機構及びプローブ装置
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2004228453A (ja) 2003-01-27 2004-08-12 Renesas Technology Corp 半導体装置の製造方法
US6805338B1 (en) 2003-06-13 2004-10-19 Lsi Logic Corporation Semiconductor wafer chuck assembly for a semiconductor processing device
US7307697B2 (en) 2004-05-28 2007-12-11 Board Of Regents, The University Of Texas System Adaptive shape substrate support system
DE102005043569A1 (de) 2005-09-12 2007-03-22 Dr. Johannes Heidenhain Gmbh Positionsmesseinrichtung
JP2007189181A (ja) * 2006-01-10 2007-07-26 Horon:Kk 露光ステージ装置
KR20070119386A (ko) * 2006-06-15 2007-12-20 세메스 주식회사 평판 디스플레이 제조용 장비
JP5090079B2 (ja) 2007-06-27 2012-12-05 大日本スクリーン製造株式会社 減圧乾燥装置
JP5406475B2 (ja) 2008-07-28 2014-02-05 大日本スクリーン製造株式会社 熱処理装置
JP2010056217A (ja) 2008-08-27 2010-03-11 Dainippon Screen Mfg Co Ltd 基板昇降装置および基板処理装置
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JP5141707B2 (ja) * 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
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KR102247936B1 (ko) * 2013-10-30 2021-05-04 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조 방법
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564682A (en) * 1993-08-13 1996-10-15 Kabushiki Kaisha Toshiba Wafer stage apparatus for attaching and holding semiconductor wafer
JP2014003259A (ja) * 2012-06-21 2014-01-09 Nikon Corp ロード方法、基板保持装置及び露光装置

Also Published As

Publication number Publication date
CN112041750A (zh) 2020-12-04
NL2022818A (en) 2019-10-31
JP2021522544A (ja) 2021-08-30
JP7079858B2 (ja) 2022-06-02
KR102493253B1 (ko) 2023-01-27
US11243476B2 (en) 2022-02-08
US20210116820A1 (en) 2021-04-22
WO2019206548A1 (en) 2019-10-31
KR20200134307A (ko) 2020-12-01

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