JP7401683B2 - 吸引クランプ、物体ハンドラ、ステージ装置、およびリソグラフィ装置 - Google Patents
吸引クランプ、物体ハンドラ、ステージ装置、およびリソグラフィ装置 Download PDFInfo
- Publication number
- JP7401683B2 JP7401683B2 JP2022543439A JP2022543439A JP7401683B2 JP 7401683 B2 JP7401683 B2 JP 7401683B2 JP 2022543439 A JP2022543439 A JP 2022543439A JP 2022543439 A JP2022543439 A JP 2022543439A JP 7401683 B2 JP7401683 B2 JP 7401683B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- suction
- clamp
- receiving
- pressure drop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001459 lithography Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims description 71
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 description 43
- 238000005259 measurement Methods 0.000 description 28
- 230000033001 locomotion Effects 0.000 description 14
- 238000000059 patterning Methods 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003570 air Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920001871 amorphous plastic Polymers 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000000671 immersion lithography Methods 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
本出願は、2020年1月17日に出願された欧州出願20152451.9号の優先権を主張し、その全体が本明細書に援用される。
Claims (13)
- 物体をクランプするための吸引クランプであって、
基部と接続領域とを備える基部構造であって、第1突起を備え、前記第1突起が前記接続領域を備える基部構造と、
前記物体を受け取るための第1パッドと、
前記第1パッドが前記物体を受け取る受取位置と前記物体をクランプするクランプ位置との間で前記基部に対して移動可能であるように、前記第1パッドを前記基部構造の前記第1突起に接続する弾性部材であって、前記第1パッドを前記受取位置に付勢するように構成された弾性部材と、
前記基部に設けられ、前記第1パッド上の前記物体をクランプする吸引力を提供するための吸引装置に接続されるように構成された吸引開口と、
前記吸引力が前記吸引開口を介して提供されるとき、圧力降下部材の下流の内圧を前記第1パッドの上流の周囲圧力よりも低くするように構成された圧力降下部材と、を備え、
前記圧力降下部材は、前記基部に対して固定された位置に配置され、少なくとも前記第1パッドの前記受取位置において、前記第1パッドと前記圧力降下部材との間に隙間が存在する吸引クランプ。 - 物体をクランプするための吸引クランプであって、
基部と接続領域とを備える基部構造であって、第1突起を備え、前記第1突起が前記接続領域を備える基部構造と、
前記物体を受け取るための第1パッドと、
前記第1パッドが前記物体を受け取る受取位置と前記物体をクランプするクランプ位置との間で前記基部に対して移動可能であるように、前記第1パッドを前記基部構造の前記第1突起に接続する弾性部材であって、前記第1パッドを前記受取位置に付勢するように構成された弾性部材と、
前記基部に設けられ、前記第1パッド上の前記物体をクランプする吸引力を提供するための吸引装置に接続されるように構成された吸引開口と、を備え、
前記基部構造は、前記第1パッドが前記クランプ位置にあるときに前記第1パッドに係合するように構成されたパッド受け領域を備える、吸引クランプ。 - 前記吸引力が前記吸引開口を介して提供されるとき、圧力降下部材の下流の内圧を前記第1パッドの上流の周囲圧力よりも低くするように構成された圧力降下部材をさらに備える、請求項2に記載の吸引クランプ。
- 前記圧力降下部材は、前記吸引開口と前記第1パッドとの間に配置されている、請求項1または3に記載の吸引クランプ。
- 前記圧力降下部材は、前記第1パッドに隣接して配置され、前記第1パッドの前記クランプ位置において前記第1パッドと前記圧力降下部材が接触している、請求項1、3または4に記載の吸引クランプ。
- 前記第1パッドが、リング形状の要素であり、及び/又は、前記圧力降下部材が、リング形状の要素である、請求項1、3、4または5のいずれかに記載の吸引クランプ。
- 前記第1パッドは、少なくとも第1ゾーンおよび第2ゾーンを備え、前記第1ゾーンは、前記第2ゾーンが前記受取位置に留まる間に、前記受取位置から前記クランプ位置に移動可能であるように構成されている、請求項1から6のいずれかに記載の吸引クランプ。
- 前記第1パッドが前記受取位置と前記クランプ位置との間で移動するように構成された距離が、0.5mm未満である、請求項1から7のいずれかに記載の吸引クランプ。
- 前記第1パッドは、前記吸引クランプの上面視において非対称の形状を有しており、
前記非対称の形状は、
第1の質量中心を有する第1端部と、
第2の質量中心を有する第2端部と、
前記第1端部と前記第2端部の間にあり、第3の質量中心を有する中間部分であって、第1側に第1の境界部を有し、第2側に第2の境界部を有する中間部分と、を備え、
前記第1側から前記第2側に向かう方向に見たとき、前記第3の質量中心は、前記第1の質量中心と前記第2の質量中心との間に位置する、請求項1から8のいずれかに記載の吸引クランプ。 - 請求項1から9のいずれかに記載の第1の吸引クランプを少なくとも備える物体グリッパ。
- 請求項1から9のいずれかに記載の第2の吸引クランプと、第3の吸引クランプと、をさらに備える、請求項10に記載の物体グリッパ。
- 物体を受け取るためのステージ装置であって、前記ステージ装置は、物体支持体と、請求項10または11に記載の物体グリッパとを備え、前記物体グリッパは、前記物体支持体の上方に前記物体を配置するように構成される、ステージ装置。
- 基板を備える物体を受け取るための請求項12に記載のステージ装置と、前記基板上にパターンを投影するための投影システムと、を備えるリソグラフィ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20152451.9A EP3851916A1 (en) | 2020-01-17 | 2020-01-17 | Suction clamp, object handler, stage apparatus and lithographic apparatus |
EP20152451.9 | 2020-01-17 | ||
PCT/EP2020/087160 WO2021144119A1 (en) | 2020-01-17 | 2020-12-18 | Suction clamp, object handler, stage apparatus and lithographic apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023510612A JP2023510612A (ja) | 2023-03-14 |
JP7401683B2 true JP7401683B2 (ja) | 2023-12-19 |
Family
ID=69177090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022543439A Active JP7401683B2 (ja) | 2020-01-17 | 2020-12-18 | 吸引クランプ、物体ハンドラ、ステージ装置、およびリソグラフィ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230121922A1 (ja) |
EP (2) | EP3851916A1 (ja) |
JP (1) | JP7401683B2 (ja) |
KR (1) | KR20220116269A (ja) |
CN (1) | CN114945871A (ja) |
TW (1) | TWI815073B (ja) |
WO (1) | WO2021144119A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113858270B (zh) * | 2021-11-16 | 2023-10-10 | 上海非夕机器人科技有限公司 | 夹持装置、机器人夹爪和机器人 |
WO2023186569A1 (en) * | 2022-03-31 | 2023-10-05 | Asml Netherlands B.V. | Substrate warpage determination system |
CN116994962B (zh) * | 2023-09-25 | 2023-11-28 | 四川遂宁市利普芯微电子有限公司 | 一种芯片封装方法和封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001179672A (ja) | 1999-12-21 | 2001-07-03 | Mitsubishi Electric Corp | ロボットハンド |
JP2012099621A (ja) | 2010-11-01 | 2012-05-24 | Yaskawa Electric Corp | 基板搬送用ハンドおよびそれを備えた基板搬送装置 |
WO2015064613A1 (ja) | 2013-10-30 | 2015-05-07 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
JP2016157822A (ja) | 2015-02-25 | 2016-09-01 | キヤノン株式会社 | 搬送ハンドおよびリソグラフィ装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5804507A (en) * | 1995-10-27 | 1998-09-08 | Applied Materials, Inc. | Radially oscillating carousel processing system for chemical mechanical polishing |
US6020964A (en) | 1997-12-02 | 2000-02-01 | Asm Lithography B.V. | Interferometer system and lithograph apparatus including an interferometer system |
US6517130B1 (en) * | 2000-03-14 | 2003-02-11 | Applied Materials, Inc. | Self positioning vacuum chuck |
TWI274393B (en) * | 2002-04-08 | 2007-02-21 | Acm Res Inc | Electropolishing and/or electroplating apparatus and methods |
KR101018909B1 (ko) * | 2002-10-25 | 2011-03-02 | 도쿄엘렉트론가부시키가이샤 | 기판 얼라이먼트장치, 기판처리장치 및 기판반송장치 |
JP3977324B2 (ja) | 2002-11-12 | 2007-09-19 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置 |
DE102005043569A1 (de) | 2005-09-12 | 2007-03-22 | Dr. Johannes Heidenhain Gmbh | Positionsmesseinrichtung |
JP5861676B2 (ja) * | 2013-07-08 | 2016-02-16 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
SE544090C2 (en) * | 2018-04-22 | 2021-12-21 | Zenrobotics Oy | Waste Sorting Gantry Robot |
EP3385792A3 (en) * | 2018-04-26 | 2018-12-26 | ASML Netherlands B.V. | Stage apparatus for use in a lithographic apparatus |
-
2020
- 2020-01-17 EP EP20152451.9A patent/EP3851916A1/en not_active Withdrawn
- 2020-12-18 EP EP20830208.3A patent/EP4091024A1/en active Pending
- 2020-12-18 US US17/792,335 patent/US20230121922A1/en active Pending
- 2020-12-18 JP JP2022543439A patent/JP7401683B2/ja active Active
- 2020-12-18 KR KR1020227024778A patent/KR20220116269A/ko active Search and Examination
- 2020-12-18 WO PCT/EP2020/087160 patent/WO2021144119A1/en unknown
- 2020-12-18 CN CN202080093477.2A patent/CN114945871A/zh active Pending
-
2021
- 2021-01-07 TW TW110100561A patent/TWI815073B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001179672A (ja) | 1999-12-21 | 2001-07-03 | Mitsubishi Electric Corp | ロボットハンド |
JP2012099621A (ja) | 2010-11-01 | 2012-05-24 | Yaskawa Electric Corp | 基板搬送用ハンドおよびそれを備えた基板搬送装置 |
WO2015064613A1 (ja) | 2013-10-30 | 2015-05-07 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
JP2016157822A (ja) | 2015-02-25 | 2016-09-01 | キヤノン株式会社 | 搬送ハンドおよびリソグラフィ装置 |
Also Published As
Publication number | Publication date |
---|---|
CN114945871A (zh) | 2022-08-26 |
KR20220116269A (ko) | 2022-08-22 |
WO2021144119A1 (en) | 2021-07-22 |
EP3851916A1 (en) | 2021-07-21 |
EP4091024A1 (en) | 2022-11-23 |
JP2023510612A (ja) | 2023-03-14 |
TWI815073B (zh) | 2023-09-11 |
US20230121922A1 (en) | 2023-04-20 |
TW202132900A (zh) | 2021-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7401683B2 (ja) | 吸引クランプ、物体ハンドラ、ステージ装置、およびリソグラフィ装置 | |
JP2022539984A (ja) | 基板形状測定デバイス | |
EP3385792A2 (en) | Stage apparatus for use in a lithographic apparatus | |
US11243476B2 (en) | Stage apparatus, lithographic apparatus, control unit and method | |
JP7234345B2 (ja) | ステージ装置および物体搭載プロセスの較正方法 | |
JP7430194B2 (ja) | 検査装置、リソグラフィ装置及び測定方法 | |
US20220326627A1 (en) | Actuator assemblies comprising piezo actuators or electrostrictive actuators | |
NL2024693A (en) | Suction clamp, object handler, stage apparatus and lithographic apparatus | |
US11156924B2 (en) | Substrate support, lithographic apparatus, substrate inspection apparatus, device manufacturing method | |
TWI793741B (zh) | 底板、基板組件、處理半導體基板之方法、組裝底板及半導體基板之設備、微影設備 | |
US20230400783A1 (en) | Object table, stage apparatus, holding method and lithographic apparatus | |
TW202403443A (zh) | 基板翹曲度判定系統 | |
KR20220124237A (ko) | 듀얼 스테이지 리소그래피 장치를 사용하는 방법 및 리소그래피 장치 | |
NL2024847A (en) | Method of using a dual stage lithogrpahic apparatus and lithographic apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220822 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220822 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230712 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230725 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231004 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231128 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231207 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7401683 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |