CN112038253A - Wafer test probe card capable of life warning and test method - Google Patents
Wafer test probe card capable of life warning and test method Download PDFInfo
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- CN112038253A CN112038253A CN202011038867.8A CN202011038867A CN112038253A CN 112038253 A CN112038253 A CN 112038253A CN 202011038867 A CN202011038867 A CN 202011038867A CN 112038253 A CN112038253 A CN 112038253A
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- probe card
- early warning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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Abstract
The invention discloses a wafer test probe card capable of realizing life warning, which is integrated with a signal acquisition module, a counting warning module and an RF module of a high-speed data transmission module, wherein the signal acquisition module can count and record the number of times of needle insertion of the wafer test probe card, the counting warning module can count the number of times of needle insertion of the wafer test probe card, when the life warning value of the probe card is reached, the counting warning module can give a warning to the outside to remind personnel to process, and the high-speed data transmission module can communicate data in the signal acquisition module with a terminal server to realize remote monitoring.
Description
Technical Field
The invention relates to the field of manufacturing and testing of semiconductor devices, in particular to a wafer test probe card capable of realizing life warning and a test method.
Background
In the manufacturing process of the semiconductor device, testing is an important link for ensuring the delivery quality of the device, and through the testing, some defective products or products with unqualified performance generated in the manufacturing process can be selected, or through the testing, performance parameters of the device can be obtained, and the products can be classified.
A probe test, which uses a probe card to make contact with a PAD on a wafer to transmit an electrical signal, is a very important test item in a silicon wafer test. A probe card is an interface between a test instrument and a Device Under Test (DUT), and is important hardware for connecting the test instrument and a chip under test. A typical probe card is a printed circuit board with many fine pins that make physical and electrical contact with the device under test, the probes passing voltage and current into and out of the pads of the wafer test structure.
In the semiconductor chip testing industry, when testing wafer-level products or IP, testing or verification under multiple conditions is often required.
The probe card required by test production needs to be designed according to the layout and the spacing of PADs on a wafer chip, and for a plurality of probe cards to be tested simultaneously, one probe card can have thousands of probes, and the probe card can correspond to the simultaneous testing requirements of 1024 DUTs.
And meanwhile, the probe alignment precision is required to be high, and the deformation of any probe head can cause the corresponding DUT to fail.
The deviation of the pin position in the test process can cause the pin to deviate from the PAD, thereby causing open circuit/short circuit in the test and even destroying the chip function.
Since each probe card has a specific service life (i.e., a maximum number of times of insertion) due to different probe materials, and the test result is affected when the maximum number of times of insertion is exceeded, the number of times of insertion is particularly concerned when the probe card is used to test a chip, and the probe card is used within the maximum number of times of insertion.
The number of times of needle inserting of the ordinary probe card cannot be intuitively reflected, and the probe card needs to be monitored by other means (such as manual work).
Disclosure of Invention
The invention aims to provide a wafer test probe card capable of early warning the service life and a test method of the probe card.
The wafer test probe card capable of early warning the service life comprises an RF module.
In a further improvement, the RF module comprises a signal acquisition module, a counting and early warning module, and a high-speed data transmission module.
The signal acquisition module can count and record the number of needle inserting times of the wafer test probe card.
The counting early warning module can count the number of times of inserting needles of the wafer test probe card, and can warn the outside when the early warning value of the service life of the probe card is reached to remind personnel to process.
The further improvement is that the high-speed data transmission module can communicate data in the signal acquisition module with a terminal server to realize remote monitoring.
In a further improvement, the counting early-warning module further comprises an acousto-optic device, and when the number of times of inserting the probe card in the wafer test reaches the life early-warning value, the acousto-optic device can give an alarm to the outside.
In a further improvement, the acousto-optic device comprises any one or combination of a buzzer, a loudspeaker, an LED and a bulb.
The invention provides a test method of a wafer test probe card capable of realizing life warning, wherein when a wafer probe is tested, a signal acquisition module on the wafer test probe card carries out signal acquisition, and the signal acquisition module counts and accumulates the needle pricking times of the probe once every time the wafer test probe card contacts with a wafer; when the counted value reaches the early warning value of the service life of the probe, the counting early warning module can send out acousto-optic alarm; the early warning value of the service life of the probe is set by an operator in advance according to an operation instruction or a past experience value before testing;
meanwhile, the high-speed data transmission module communicates with the remote terminal server.
The further improvement is that the high-speed data transmission module transmits probe pricking data of the probe card to the terminal server in real time, and the terminal server can monitor the state of the wafer test probe card in real time.
The further improvement is that when the counting early-warning module gives out an audible and visual alarm, an operator replaces the probes which have reached the service life of the wafer test probe card, and subsequent continuous tests are carried out.
According to the invention, the special RF module (integrating a signal acquisition function, a counting function, a high-speed data transmission function and the like) is arranged in the probe card, so that the monitoring and remote visualization of the number of times of inserting needles are realized, and meanwhile, the automatic service life early warning of the probe card is realized through the counting function.
Drawings
Fig. 1 is a block diagram illustrating the structure of an RF module on a wafer test probe card according to the present invention.
Fig. 2 is a schematic view of a wafer test probe card with integrated RF modules according to the present invention.
Detailed Description
The invention provides a wafer test probe card capable of life warning, as shown in fig. 1, the wafer test probe card capable of life warning comprises an RF module.
The RF module comprises a signal acquisition module, a counting early warning module and a high-speed data transmission module.
The signal acquisition module can count and record the number of times of inserting needles of the wafer test probe card.
The counting early warning module can count the number of times of inserting needles of the wafer test probe card, and can give an early warning to the outside when the early warning value of the service life of the probe card is reached. The counting early warning module can be provided with an acousto-optic device, such as a buzzer, a loudspeaker, a light emitting diode or a bulb and any device capable of giving out sound or warning light, when the counting early warning module monitors that the number of times of inserting the needle reaches the service life of the probe, the acousto-optic device gives an alarm outwards to remind an operator of timely replacing the probe close to the service life limit. The acousto-optic device can only contain any one of acoustic information and optical information, can adapt to the test application environment and can send out obvious alarm information.
The high-speed data transmission module can communicate data in the signal acquisition module with the terminal server to realize remote monitoring.
When the wafer probe test probe card capable of early warning the service life is used for testing a wafer probe, a signal acquisition module on the wafer probe card acquires a probe signal, and the signal acquisition module counts and accumulates the number of times of inserting the probe once when the wafer probe card contacts the wafer; when the counted value reaches the early warning value of the service life of the probe, the counting early warning module can send out acousto-optic alarm to the outside to remind the user of replacement. The early warning value of the service life of the probe is set by an operator in advance according to an operation instruction or a past empirical value before testing.
Meanwhile, the high-speed data transmission module is communicated with a remote terminal server, probe pricking data of the probe card is transmitted to the terminal server in real time, and the terminal server can monitor the state of the wafer test probe card in real time.
Through the improvement of the common wafer test probe card, the intelligent management of the probe card is realized, when a plurality of test machines are arranged on a production line for wafer test, the data of each probe card is transmitted to the terminal server in real time, the real-time state monitoring and management of the plurality of probe cards can be simultaneously carried out, the operation personnel can be actively warned to remind when the service life of the probe expires, the labor intensity of the operation personnel is greatly reduced, the number of the operation personnel can be reduced, the timely replacement of the near-failure probe can be ensured, and the test efficiency is not influenced.
The above are merely preferred embodiments of the present invention, and are not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A wafer test probe card capable of life warning is characterized in that: the wafer test probe card comprises an RF module.
2. The wafer test probe card with life span early warning as claimed in claim 1, wherein: the RF module comprises a signal acquisition module, a counting early warning module and a high-speed data transmission module.
3. The wafer test probe card with life span early warning as claimed in claim 2, wherein: the signal acquisition module can count and record the number of times of inserting needles of the wafer test probe card.
4. The wafer test probe card with life span early warning as claimed in claim 2, wherein: the counting early warning module can count the number of times of inserting needles of the wafer test probe card, and when the early warning value of the service life of the probe card is reached, the counting early warning module gives an early warning to the outside to remind personnel to process.
5. The wafer test probe card with life span early warning as claimed in claim 2, wherein: the high-speed data transmission module can communicate data in the signal acquisition module with the terminal server to realize remote monitoring.
6. The wafer test probe card with life span early warning as set forth in claim 4, wherein: the counting early warning module further comprises an acousto-optic device, and when the number of times of inserting the probe card in the wafer test reaches the service life early warning value, an alarm can be given out through the acousto-optic device.
7. The wafer test probe card with life span early warning as recited in claim 6, wherein: the acousto-optic device comprises any one or combination of a buzzer, a loudspeaker, an LED and a bulb.
8. A test method of a wafer test probe card capable of life warning is characterized in that: when a wafer probe is tested, a signal acquisition module on a wafer test probe card carries out signal acquisition, and the signal acquisition module counts and accumulates the needle inserting times of the probe once when the wafer test probe card contacts with a wafer; when the counted value reaches the early warning value of the service life of the probe, the counting early warning module can send out acousto-optic alarm; the early warning value of the service life of the probe is set by an operator in advance according to an operation instruction or a past experience value before testing;
meanwhile, the high-speed data transmission module communicates with the remote terminal server.
9. The method for testing a wafer of claim 8, wherein: the high-speed data transmission module transmits probe pricking data of the probe card to the terminal server in real time, and the terminal server can monitor the state of the wafer test probe card in real time.
10. The method for testing a wafer of claim 8, wherein: when the counting early-warning module gives out an audible and visual alarm, an operator replaces the probes which have reached the service life on the wafer test probe card, and subsequent continuous tests are carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011038867.8A CN112038253A (en) | 2020-09-28 | 2020-09-28 | Wafer test probe card capable of life warning and test method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011038867.8A CN112038253A (en) | 2020-09-28 | 2020-09-28 | Wafer test probe card capable of life warning and test method |
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| CN112038253A true CN112038253A (en) | 2020-12-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113077833A (en) * | 2021-03-03 | 2021-07-06 | 上海伟测半导体科技股份有限公司 | Cantilever type probe life measuring and calculating method |
| CN116256544A (en) * | 2023-01-05 | 2023-06-13 | 苏州斯尔特微电子有限公司 | Wafer test probe station with offset correction function |
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| US9859176B1 (en) * | 2016-10-31 | 2018-01-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device, test system and method of the same |
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| TW594020B (en) * | 2002-12-31 | 2004-06-21 | Chien Hui Chuan | MEMS RF probe cards |
| CN102016615A (en) * | 2008-02-27 | 2011-04-13 | 斯卡尼梅特里科斯有限公司 | Method and apparatus for interrogating electronic components |
| CN201681417U (en) * | 2010-03-22 | 2010-12-22 | 华润赛美科微电子(深圳)有限公司 | Needle inserting frequency counting device of probe card and probe card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113077833A (en) * | 2021-03-03 | 2021-07-06 | 上海伟测半导体科技股份有限公司 | Cantilever type probe life measuring and calculating method |
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| CN116256544A (en) * | 2023-01-05 | 2023-06-13 | 苏州斯尔特微电子有限公司 | Wafer test probe station with offset correction function |
| CN116256544B (en) * | 2023-01-05 | 2023-12-05 | 苏州斯尔特微电子有限公司 | Wafer test probe station with offset correction function |
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Application publication date: 20201204 |
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