CN201322761Y - Supporting plate for probe cards - Google Patents

Supporting plate for probe cards Download PDF

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Publication number
CN201322761Y
CN201322761Y CNU2008201563704U CN200820156370U CN201322761Y CN 201322761 Y CN201322761 Y CN 201322761Y CN U2008201563704 U CNU2008201563704 U CN U2008201563704U CN 200820156370 U CN200820156370 U CN 200820156370U CN 201322761 Y CN201322761 Y CN 201322761Y
Authority
CN
China
Prior art keywords
ring surface
inner ring
probe
support plate
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008201563704U
Other languages
Chinese (zh)
Inventor
刘铁
童建桥
郭万瑾
柳入华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Beijing Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Priority to CNU2008201563704U priority Critical patent/CN201322761Y/en
Application granted granted Critical
Publication of CN201322761Y publication Critical patent/CN201322761Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The utility model provides a supporting plate for probe cards, which includes an outer ring surface and an inner ring surface; openings are formed on two sides of the inner ring surface; a plurality groups of holes are distributed on the inner ring surface; each group of holes are arranged like concentric circles taking the inner ring surface as the center; necks are connected with two sides of each opening on the inner ring surface, and detachably connected with the inner ring surface; the diameter of the circle corresponding to each group of holes correspondents to round probe cards in different sizes; and a plurality of protruding blocks are arranged on the outer side of the outer ring surface. In the utility model, the openings are formed on the prior supporting plate for the probe cards, so that the supporting plate can be connected with the necks, and the distance of the necks can be adjusted to be adapted to various rectangular probe cards; moreover, the groups of concentric holes are formed on the inner ring surfaces, so that the supporting plate is suitable for various round probe cards after the necks are removed, and the supporting plate is widely applicable to various probe cards. The equipment availability is improved, and the cost is saved.

Description

The probe support plate
Technical field
The utility model relates to the semiconductor test apparatus field, relates in particular to a kind of probe support plate that is used for test chip.
Background technology
Probe test is a kind of method that chip is tested, normally chip is placed on the probe support plate, and realize that by probe this a part of electronic circuit connects, there is tiny metal probe to adhere on the probe, make it to contact by reducing probe height, can link up circuit on the probe and bonding pads with pad on the chip.Afterwards, whether qualified operation trace routine checking chip is.After detection was finished, probe lifted, and is defective as fruit chip, then can do mark in the central, carries out the test of next chip then.
In present testing apparatus, the probe support plate of probe station all is the tailored version design, the feature that promptly needed to tell supplier's device that this probe station need be tested before buying is (such as the type of device, size, thickness etc.) and the feature of employed probe (such as the thickness of PCB, size, shape and structure etc.), supplier carries out the probe support plate of design specialized again to the probe station that uses according to these information, along with the variation and the consumption demand variation in market are rapid, often a probe station also needs the semi-conductor chip of many types is tested, special-purpose probe support plate is difficult to be applied on other products, a kind of probe support plate can only be useful in a kind of probe of chip type, may be just different such as the probe that is used for loading SOC (SOC (system on a chip)) with the probe of loading Memory (memory body) chip, lack adaptability.And, in case probe station is replaced other products to be tested, then need carry out special design at other products, have to spend extra expense, increase cost, replacement cycle while is long, influences the effective utilization and the comprehensive output of probe station, can't satisfy the quick variation demand of market to product.
The utility model content
The technical problems to be solved in the utility model provides a kind of probe support plate that adapts to various probe card configuration.
For solving the problems of the technologies described above, a kind of probe support plate that the utility model provides, described probe support plate comprises outer ring surface and inner ring surface, both sides are provided with opening on the described inner ring surface, described inner ring surface is distributed with some groups of holes, and each organizes the hole is that the center is the concentric circles arrangement with the described inner ring surface center of circle.
Further, described inner ring surface opening part both sides are connected with draw-in groove.
Further, described draw-in groove is connected with removably with described inner ring surface.
It is further, described that respectively to organize the pairing diameter of a circle in hole corresponding with the circular probe card of different size.
Further, be provided with some projecting blocks outside the described outer ring surface.
Compare with existing probe support plate, the utility model is by being provided with opening on original probe support plate, can be connected with draw-in groove, thereby can be applicable to the probe of various rectangle classes by the distance of adjusting draw-in groove, and, by on described inner ring surface, being provided with some groups of concentric holes, after removing described draw-in groove,, thereby can be widely used in all kinds of probe applicable to the probe of various circle class, improved usage ratio of equipment, also provided cost savings.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model probe support plate is described in further detail.
Fig. 1 is the structural representation of the utility model probe support plate;
Fig. 2 is the assembling synoptic diagram of the utility model probe support plate embodiment one;
Fig. 3 is the assembling synoptic diagram of the utility model probe support plate embodiment two.
Embodiment
See also Fig. 1, the probe back up pad 9 of present embodiment comprises inner ring surface 1 and outer ring surface 2, both sides are provided with opening 4 on described inner ring surface 1, simultaneously on described inner ring surface 1, be distributed with some groups of holes 3, each group hole is that the center is the concentric circles arrangement with described inner ring surface 1 center of circle, thereby selects different concentrically ringed holes to fix according to the size of different probe diameters.The outer ring surface outside is provided with some projecting blocks 5, and described projecting block 5 is used for being connected and fixed with external unit.
Embodiment one: see also Fig. 2, described inner ring surface 1 is connected with two draw-in grooves 6 respectively in the both sides at opening 4 places, described draw-in groove 6 is connected with described inner ring surface 1 by screw (not indicating), stationary probe card 7 on described draw-in groove 6 can not tested to be measured on the described probe 7 (indicating).The ratio broad that the groove position of fixed screw on the described draw-in groove 6 (indicate) can be designed, thus the probe with rectangle class of different size be applicable to, also be convenient to install and adjust.Described draw-in groove 6 is connected removably with described inner ring surface 1, carry out clamping such as lock or on described draw-in groove, be provided with clamping device (not indicating) by screw, when described probe back up pad 9 is used for carrying out the probe test of other structures, described draw-in groove 6 and clamping device can be laid down.
Embodiment two, see also Fig. 3, when using probe 8 instead with circle class, to lay down as embodiment one described draw-in groove 6 and clamping device among Fig. 1 earlier, directly described probe 8 is positioned on the described inner ring surface 1, during design, every group of hole 3 pairing diameter of a circles are corresponding with the circular probe card 8 of different size, size according to described probe 8 diameters, selection is distributed in the one group of hole 3 that is the concentric circles arrangement on the described inner ring surface 1 and fixes, and can be measured on the described probe 8 (indicating) not tested.
More than show and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; that describes in the foregoing description and the instructions just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (5)

1. probe support plate, described probe support plate comprises outer ring surface and inner ring surface, it is characterized in that: both sides are provided with opening on the described inner ring surface, and described inner ring surface is distributed with some groups of holes, and each organizes the hole is that the center is the concentric circles arrangement with the described inner ring surface center of circle.
2. probe support plate as claimed in claim 1 is characterized in that: described inner ring surface opening part both sides are connected with draw-in groove.
3. probe support plate as claimed in claim 2 is characterized in that: described draw-in groove is connected with removably with described inner ring surface.
4. probe support plate as claimed in claim 1 is characterized in that: described respectively to organize the pairing diameter of a circle in hole corresponding with the circular probe card of different size.
5. probe support plate as claimed in claim 1 is characterized in that: the described outer ring surface outside is provided with some projecting blocks.
CNU2008201563704U 2008-12-01 2008-12-01 Supporting plate for probe cards Expired - Lifetime CN201322761Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201563704U CN201322761Y (en) 2008-12-01 2008-12-01 Supporting plate for probe cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201563704U CN201322761Y (en) 2008-12-01 2008-12-01 Supporting plate for probe cards

Publications (1)

Publication Number Publication Date
CN201322761Y true CN201322761Y (en) 2009-10-07

Family

ID=41160140

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201563704U Expired - Lifetime CN201322761Y (en) 2008-12-01 2008-12-01 Supporting plate for probe cards

Country Status (1)

Country Link
CN (1) CN201322761Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103969475A (en) * 2014-04-22 2014-08-06 上海华力微电子有限公司 Probe card device
CN104181342A (en) * 2014-09-01 2014-12-03 上海理工大学 Oscilloscope probe contact fixing part facilitating measurement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103969475A (en) * 2014-04-22 2014-08-06 上海华力微电子有限公司 Probe card device
CN104181342A (en) * 2014-09-01 2014-12-03 上海理工大学 Oscilloscope probe contact fixing part facilitating measurement
CN104181342B (en) * 2014-09-01 2017-02-15 上海理工大学 Oscilloscope probe contact fixing part facilitating measurement

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING

Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

Effective date: 20130306

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING

TR01 Transfer of patent right

Effective date of registration: 20130306

Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing

Patentee after: Semiconductor Manufacturing International (Beijing) Corporation

Address before: 201203 No. 18 Zhangjiang Road, Shanghai

Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation

CX01 Expiry of patent term

Granted publication date: 20091007

CX01 Expiry of patent term