CN111880079B - Chip test monitoring method and server - Google Patents
Chip test monitoring method and server Download PDFInfo
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- CN111880079B CN111880079B CN202010721249.7A CN202010721249A CN111880079B CN 111880079 B CN111880079 B CN 111880079B CN 202010721249 A CN202010721249 A CN 202010721249A CN 111880079 B CN111880079 B CN 111880079B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
- G01R31/287—Procedures; Software aspects
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
- G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
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Abstract
The invention provides a chip test monitoring method and a server, wherein the method comprises the following steps: the server scans the chip tester one by one; the server queries a database to obtain current test data and a current test product model, wherein the database stores test data sent to the database by a test machine in real time; the server inquires a product database to obtain the customs condition and the standard of the current test product; and comparing the current test data with the customs condition and standard, and if the current test data exceeds the standard, triggering an alarm mechanism. According to the method and the device, the test data generated in the chip test process is monitored and analyzed in real time, once exceeding the standard is found, an immediate alarm event is triggered, the test machine is stopped immediately, and the batch scrapping of chips caused by a large number of abnormal tests is avoided.
Description
Technical Field
The invention relates to the field of chip testing, in particular to a chip testing monitoring method and a server.
Background
In a supply chain of a semiconductor integrated circuit Chip, a wafer Test (Chip Probe) and a finished product Test (Final Test) are two very important detection links, and the Test link mainly realizes two functions: firstly, chip electrical property and function simulation test; secondly, chip performance optimization, electrical parameter modification (Trim), function configuration (config), mark code burning (code) and the like, wherein the optimization process is risky, and if the optimization process is abnormal, the chips can be scrapped in large batch. Chips determined to be good products through testing can be assembled into various electronic equipment terminals.
Because the testing process is so important, the testing data needs to be analyzed in the testing process to determine the yield of the chip, the parameter distribution, the performance optimization result, and the like. Where wafer test (CP) is in wafer units, each lot has 25 wafers (6 inches, 8 inches, 12 inches, etc.). Each wafer end-of-test tester (ATE) generates a complete set of test data. The finished product test (FT) is in batches, the number of chips in each batch varies from several thousand to several hundred thousand, and a complete test data is generated by the test machine (ATE) after each batch of tests.
At present, the timeliness node which can be achieved by analyzing test data is that each wafer test (CP) finishes analyzing each piece, and each batch of finished product test (FT) finishes analyzing each piece.
Disclosure of Invention
In order to solve the problem that a large number of chips are scrapped due to hysteresis in analysis of current chip test data, the embodiment of the application provides a chip test monitoring method and a server.
In a first aspect, an embodiment of the present application provides a chip test monitoring method, including:
the server scans the chip testing machine one by one;
the server inquires a database to obtain current test data and the current test product model, wherein the database stores the test data sent to the database by the test machine in real time;
the server inquires a product database to obtain the customs condition and the standard of the current test product;
and comparing the current test data with the customs condition and standard, and if the current test data exceeds the standard, triggering an alarm mechanism.
Wherein, if the standard exceeds, an alarm mechanism is triggered, and the alarm mechanism comprises:
if the standard exceeds the standard, an alarm mail is sent, a three-color lamp audible and visual alarm is triggered, and a stop instruction is sent to the intelligent finger control system, so that the manipulator presses a test machine stop key.
Wherein, the said comparison of the said current test data and the said customs condition and standard, if exceed standard, trigger the alarm mechanism, including:
<xnotran> , Yield, bin , parametric , , . </xnotran>
Wherein, the server scans the chip tester one by one and also comprises the following steps:
the server starts running.
Wherein, the server scans the chip tester one by one, including:
and scanning all the test machines once every preset time by adopting a Timer mode.
In a second aspect, the present application provides a chip testing and monitoring apparatus, including:
the scanning unit is used for scanning the chip testing machine one by one;
the first acquisition unit is used for inquiring a database, acquiring current test data and a current test product model, wherein the database stores the test data which is sent to the database by the tester in real time;
the second acquisition unit is used for inquiring the product database and acquiring the customs conditions and standards of the current test product;
and the comparison unit is used for comparing the current test data with the customs condition and standard, and if the current test data exceeds the customs condition and standard, triggering an alarm mechanism.
Wherein the comparison unit is used for:
if the standard exceeds the standard, an alarm mail is sent, a three-color lamp sound-light alarm is triggered, and a stop instruction is sent to the intelligent finger control system, so that the manipulator presses a test machine stop key.
In a third aspect, the present application provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of any of the methods described above.
In a fourth aspect, the present application provides a server comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of any one of the methods described above.
In a fifth aspect, the present application provides a chip test monitoring system, including the server described in any one of the above.
The chip test monitoring method and the server in the embodiment of the application have the following beneficial effects:
the method comprises the steps that servers scan chip testing machines one by one; the server inquires a database to obtain current test data and the current test product model, wherein the database stores the test data sent to the database by the test machine in real time; the server inquires a product database to obtain the customs condition and the standard of the current test product; and comparing the current test data with the customs condition and standard, and if the current test data exceeds the standard, triggering an alarm mechanism. The method and the device monitor and analyze the test data generated in the chip test process in real time, trigger an immediate alarm event once exceeding the standard, stop the test machine immediately, and avoid batch scrapping of chips caused by a large number of abnormal tests.
Drawings
FIG. 1 is a schematic flow chart of a chip test monitoring method according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a chip test monitoring apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a chip test monitoring server according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a chip test monitoring system according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a robot finger pressing system of the chip test monitoring system according to the embodiment of the present application.
Detailed Description
The present application is further described with reference to the following figures and examples.
In the following description, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The following description provides embodiments of the invention, where different embodiments may be substituted or combined, and this application is therefore intended to include all possible combinations of the same and/or different embodiments described. Thus, if one embodiment includes features a, B, C and another embodiment includes features B, D, then this application should also be construed to include embodiments that include all other possible combinations of one or more of a, B, C, D, although such embodiments may not be explicitly recited in the following text.
The following description provides examples, and does not limit the scope, applicability, or examples set forth in the claims. Changes may be made in the function and arrangement of elements described without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as appropriate. For example, the described methods may be performed in an order different than the order described, and various steps may be added, omitted, or combined. Furthermore, features described with respect to some examples may be combined into other examples.
In a supply chain of a semiconductor integrated circuit Chip, a wafer Test (Chip Probe) and a finished product Test (Final Test) are two very important detection links, and the Test links mainly realize two functions of a Chip electrical property and function simulation Test; b. chip performance optimization, electrical parameter trimming (Trim), function configuration (config), mark code burning (code), etc., wherein the optimization process is risky, which may lead to large-scale scrapping of chips if the optimization process is abnormal. Chips determined to be good products through testing can be assembled into various electronic equipment terminals.
Because the testing process is so important, the testing data needs to be periodically analyzed in the testing process to determine the yield of the chip, the parameter distribution, the performance optimization result, and the like. Where wafer test (CP) is in wafer units, each lot has 25 wafers (6 inches, 8 inches, 12 inches, etc.). Each wafer end-of-test tester (ATE) generates a complete set of test data. The finished product test (FT) is in batches, the number of chips in each batch varies from several thousand to several hundred thousand, and a complete test data is generated by the test machine (ATE) after each batch of tests.
The timeliness node which can be achieved by analyzing the test data at present is that each wafer test (CP) is tested and analyzed, each batch of finished product tests (FT) is tested and analyzed, and the analysis consumes a large amount of systems and manpower.
Based on the above analysis, real-time monitoring of parameters during testing and immediate shutdown functions become especially important.
As shown in fig. 1, the chip testing monitoring method of the present application includes the steps of: s101, scanning a chip tester one by a server; s103, the server inquires a database to obtain current test data and the model of a current test product, wherein the database stores the test data sent to the database by the test machine in real time; s105, the server inquires a product database to obtain the customs condition and the standard of the current test product; s107, comparing the current test data with the customs condition and standard, and if the current test data exceeds the customs condition and standard, triggering an alarm mechanism. Each step is described below.
S101, the server scans the chip testing machine one by one.
In this step, all the testers are scanned once every preset time, for example, by using a Timer mode, where the preset time is 2 seconds, for example. This step also includes, for example: the server starts to run, and after the server software is started, all the tester data are scanned every 2 seconds (which can be set) by adopting a Timer mode. That is, the present step includes: and scanning all the test machines once every preset time by adopting a Timer mode.
S103, the server inquires a database to obtain current test data and the current test product model, and the database stores the test data which is sent to the database by the test machine in real time.
In this step, the server captures the latest data thrown to the database from the client, and the model of the current product being tested of the machine can be obtained.
And S105, the server inquires a product database to obtain the customs condition and the standard of the current test product.
The tester will set various customs conditions and standards of the product in the product database, including Yield, bin number, site difference, parameter value of Parametric, etc.
S107, comparing the current test data with the customs condition and standard, and if the current test data exceeds the standard, triggering an alarm mechanism.
In this step, if the standard exceeds, an alarm mechanism is triggered, which includes: if the standard exceeds the standard, an alarm mail is sent, a three-color lamp sound-light alarm is triggered, and a stop instruction is sent to the intelligent finger control system, so that the manipulator presses a test machine stop key.
In some embodiments, this step comprises: the current test data includes data of products currently tested by the current testing machine, comparing the Yield, the Bin number and the parameter of parameter after the current test of the current testing machine with the customs condition and the standard, if the standard exceeds the standard, an alarm mechanism is triggered. After the step is finished, the single scanning is finished, and the step S101 returns to the monitoring point to continue the next scanning.
The method and the device monitor the test data generated in the chip test process in real time, trigger an immediate alarm event once exceeding the standard is found, stop the test machine immediately, and avoid batch scrapping of chips caused by a large number of abnormal tests.
As shown in fig. 2, the present application provides a chip testing monitoring apparatus, which includes:
a scanning unit 201 for scanning the chip tester one by one;
the first obtaining unit 202 is configured to query a database, obtain current test data and a current test product model, where the database stores test data sent to the database by a testing machine in real time;
the second obtaining unit 203 is configured to query the product database, and obtain the customs condition and the standard of the current test product;
and the comparison unit 204 is used for comparing the current test data with the customs condition and standard, and triggering an alarm mechanism if the current test data exceeds the standard.
Wherein, the comparison unit is used for: if the standard exceeds the standard, an alarm mail is sent, a three-color lamp audible and visual alarm is triggered, and a stop instruction is sent to the intelligent finger control system, so that the manipulator presses a test machine stop key.
In the present application, the embodiments of the chip testing and monitoring apparatus are substantially similar to the embodiments of the chip testing and monitoring method, and reference is made to the introduction of the embodiments of the chip testing and monitoring method for relevant points.
As shown in fig. 3, the server of the present application includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the computer program, the processor implements the steps of any one of the methods described above.
The server of the present application comprises a processor 401, a memory 402, an input device 403 and an output device 404. The processor 401, memory 402, input device 403, and output device 404 may be connected by a bus 405 or otherwise. The memory 402 has stored thereon a computer program that is executable on the processor 401 and that, when executed by the processor 401, implements the chip test monitoring method steps described above.
The input device 403 may receive input numeric or character information and generate key signal inputs related to user settings and function control of the data processing computer apparatus, such as a touch screen, keypad, mouse, track pad, touch pad, pointer stick, one or more mouse buttons, track ball, joystick or other input device. The output devices 404 may include a display device, auxiliary lighting devices (e.g., LEDs), and haptic feedback devices (e.g., vibrating motors), among others. Display devices may include, but are not limited to, liquid Crystal Displays (LCDs), light Emitting Diode (LED) displays, plasma displays, and touch screens.
The application also provides a chip testing monitoring system which comprises any one of the servers. As shown in fig. 4, the chip test monitoring system includes a chip test monitoring client 301, and fig. 4 shows a total of three clients, that is, the chip test monitoring client 301, the chip test monitoring client 302, and the chip test monitoring client 303, where the number of the clients is adjusted according to actual needs, and the clients also refer to test machines. The chip testing and monitoring system further comprises a database 304, a server 305, an alarm device 306, an intelligent finger control system 307, a manipulator finger pressing system 308, a manipulator finger pressing system 309 and a manipulator finger pressing system 310, wherein the manipulator finger pressing systems correspond to the testing machine one by one.
The chip test monitoring client 301 is configured to analyze chip test data and send the data obtained through analysis to the database 304; the client side realizes real-time analysis and uploading of test data (STDF format), and can be realized through a software program, the program runs on each test machine computer and monitors the byte size and time change condition of specific test data in real time, and once the file change is detected, an analysis flow is triggered, and the data of the latest change part is analyzed and uploaded.
The chip test monitor client 301 is configured to: the client monitors whether a target file with a preset file name changes in real time under a preset path; when the target file is monitored to be changed, judging whether the target file name is the same as the last analysis file or not; if the target file is the old file, recording the last analysis stop point, and analyzing the newly added part of the target file to obtain analyzed data; if the target file is different from the target file, analyzing the new file to obtain analyzed data; and sending the analyzed data to a database.
The database 304 is configured to receive and store the analyzed data sent by the chip test monitoring client, and check the analyzed data, for example, check correctness of some key information.
The server 305 is used for analyzing data in the database in real time according to preset card control parameters and card control standards of different products, and sending alarm information to the intelligent finger control system and the alarm device when exceeding the standard; for example, triggering an immediate alarm event upon finding an out-of-compliance, including a sending an email; b. triggering a site three-color lamp and a buzzer to alarm; c. triggering the AI-Finger control program.
The intelligent finger control system 307 is used for receiving alarm information and transmitting an instruction of immediately stopping to the mechanical hand finger pressing system; the smart finger control system 307 can wirelessly control a plurality of smart terminals (such as mechanical fingers), can receive an alarm and a shutdown request sent by the server 305, and then transmits an instruction of immediate shutdown to the smart terminals (such as mechanical fingers) in a wireless manner such as WIFI.
The manipulator finger pressing system 308 comprises a manipulator finger pressing module, the manipulator finger pressing module is installed right above the shutdown key of the chip test monitoring client, and the manipulator finger pressing system is used for controlling the manipulator finger pressing module to pop up once and withdraw according to the shutdown instruction so as to press the shutdown key of the client. The manipulator finger pressing module can be arranged right above a shutdown key (physical key) of the testing machine through a sucking disc or a binding belt and the like, and the pressing finger is required to face the shutdown key within 2 cm.
As shown in fig. 5, the finger pressing system 308 includes a WIFI receiving module, a single-chip microcomputer module (or a PLC module), a dc motor module, a power module, and a finger pressing module. The power supply/battery module is used for providing working power supply; the direct current motor module is used for providing a relay and a manipulator finger driving circuit; the singlechip module is used for realizing system-on-chip programming and function configuration; a WIFI module: the terminal can be configured, wireless WIFI networking can be performed, and the terminal has a unique MAC address and an IP address after networking. The programming control on and off can be realized by MAC address or TCP/IP mode. Robot finger-pressing system 308 control principle: after the WIFI receiving module receives the stop signal, the single chip microcomputer module (or the PLC module) is triggered, the single chip microcomputer (or the PLC) controls the direct current motor to be started, and the direct current motor controls the mechanical finger to pop up (with the stroke of 2.2 cm) once and withdraw after being started.
The manipulator finger pressing system 308 is provided with a software interface DLL file, the DLL is packaged in a real-time data analysis system Server (RTMS Server), the Server can monitor data of a plurality of testing machines in real time, and when the situation that the data exceed the standard is found, an intelligent finger interface is called to send a stop instruction to a terminal (the manipulator finger pressing system 308) of a MAC address and an IP address which are uniquely corresponding to the machine. After the terminal receives the shutdown instruction, the mechanical finger is ejected once and withdrawn, the action similar to that of pressing a STOP shutdown key by a person is realized, and the shutdown of test equipment such as Prober, handler and the like is realized.
In some embodiments, the smart finger control system transmits an instruction of immediate shutdown to the manipulator finger pressing system in a WIFI wireless manner. The alarm device comprises a three-color lamp and a buzzer, and is used for receiving alarm information, triggering the three-color lamp to flicker and triggering the buzzer to alarm. The alarm device comprises three main parts, namely a USB control circuit, a three-color lamp and a buzzer, and once an alarm instruction sent by the server is received, the three-color lamp flickers and the buzzer alarms in real time to remind technicians of abnormity discovery and intervention processing. After being informed, the field technicians can stop equipment production at the first time, and batch scrapping caused by a large number of abnormal tests is avoided.
The application relates to a chip test monitoring method applied to a chip test monitoring system, which comprises the following steps: step S101, by any one of the chip test monitoring methods, the chip test monitoring client analyzes the chip test data and sends the data obtained by analysis to a database; step S103, the database receives and stores the analyzed data sent by the chip test monitoring client, and the analyzed data is verified; step S105, the server analyzes data in the database in real time according to preset card control parameters and card control standards of different products, and sends alarm information to the intelligent finger control system and the alarm device when exceeding standards is found; step S107, the intelligent finger control system receives the alarm information and transmits an instruction of immediate shutdown to the manipulator finger pressing system; and step S109, the mechanical hand finger pressing system comprises a mechanical hand finger pressing module, the mechanical hand finger pressing module is installed right above the shutdown key of the chip test monitoring client, and the mechanical hand finger pressing system controls the mechanical hand finger pressing module to pop up once and withdraw so as to press the shutdown key of the client.
In the present application, the embodiments of the chip testing and monitoring method applied to the chip testing and monitoring system are basically similar to the embodiments of the chip testing and monitoring system, and please refer to the introduction of the embodiments of the chip testing and monitoring system for relevant points.
The application has the following advantages: aiming at the requirements of real-time monitoring and shutdown control of the test of the semiconductor chip, a brand-new complete solution is provided; avoid the trouble that the industry supplier can only provide partial or incomplete service; through the realization of the intelligent terminal manipulator, the traditional software control shutdown (SECS protocol) in the industry is changed into a hardware control mode, so that the problem that most equipment cannot be controlled because the SECS protocol is not supported is solved; the intelligent terminal manipulator has wide application scenes and covers the control fields of a large number of devices such as manufacturing, industrial equipment, factory affairs and the like. The software program and the control mode of the solution break through monopoly of foreign big-head companies and save more than ten million yuan of capital investment for the companies.
It is clear to a person skilled in the art that the solution according to the embodiments of the invention can be implemented by means of software and/or hardware. The "unit" and "module" in this specification refer to software and/or hardware that can perform a specific function independently or in cooperation with other components, where the hardware may be, for example, an FPGA (Field-Programmable Gate Array), an IC (Integrated Circuit), or the like.
Each processing unit and/or module according to the embodiments of the present invention may be implemented by an analog circuit that implements the functions described in the embodiments of the present invention, or may be implemented by software that executes the functions described in the embodiments of the present invention.
The embodiment of the invention also provides a computer readable storage medium, which stores a computer program, and the program realizes the steps of the chip test monitoring method when being executed by a processor. The computer-readable storage medium may include, but is not limited to, any type of disk including floppy disks, optical disks, DVD, CD-ROMs, microdrive, and magneto-optical disks, ROMs, RAMs, EPROMs, EEPROMs, DRAMs, VRAMs, flash memory devices, magnetic or optical cards, nanosystems (including molecular memory ICs), or any type of media or device suitable for storing instructions and/or data.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
All functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A chip test monitoring method is characterized by comprising the following steps:
the server scans the chip tester one by one;
the server inquires a database to obtain current test data and the current test product model, wherein the database stores the test data sent to the database by the test machine in real time; the chip test monitoring client side realizes real-time analysis and uploading of test data, monitors the specific test data byte size and time change condition in the test machine computer in real time, triggers an analysis flow once detecting the file change, and analyzes and uploads the latest changed data to the database;
the server inquires a product database to obtain the customs condition and the standard of the current test product;
comparing the current test data with the customs condition and standard, and if the current test data exceeds the customs condition and standard, triggering an alarm mechanism;
if the standard exceeds the standard, an alarm mechanism is triggered, and the method comprises the following steps:
if the standard exceeds the standard, sending an alarm mail, triggering a three-color lamp to give an audible and visual alarm, and sending a shutdown instruction to the intelligent finger control system so that the manipulator presses a test machine stop key;
the intelligent finger control system receives the alarm information and transmits an instruction of immediate shutdown to the manipulator finger pressing system;
the mechanical hand finger pressing system comprises a mechanical hand finger pressing module, the mechanical hand finger pressing module is arranged right above a shutdown key of the testing machine equipment, and the mechanical hand finger pressing system is used for controlling the mechanical hand finger pressing module to pop up once and retract according to a shutdown instruction so as to press the shutdown key of the testing machine equipment; the manipulator finger pressing module is arranged right above a physical key shutdown key of the testing machine equipment through a sucking disc or a binding belt, the finger pressing module faces the shutdown key, and the distance is less than 2cm;
the manipulator finger pressing system also comprises a singlechip module and a direct current motor module; the direct current motor module is used for providing a relay and a manipulator finger driving circuit; the singlechip module is used for realizing system-on-chip programming and function configuration; the robot finger pressing system is provided with a software interface DLL file, and the DLL is packaged into the server.
2. The chip test monitoring method according to claim 1, wherein the comparing the current test data with the customs condition and the standard, and if the current test data exceeds the customs condition and the standard, triggering an alarm mechanism, comprises:
the current test data comprises the current tested product data of the current testing machine, comparing the Yield, the Bin number and the parameter of parameter after the current test of the current testing machine with the customs condition and the standard, if the standard exceeds the standard, an alarm mechanism is triggered.
3. The chip test monitoring method according to claim 1 or 2, wherein the server further comprises before scanning the chip testing machines one by one:
the server starts running.
4. The chip test monitoring method according to claim 1 or 2, wherein the server scans the chip tester one by one, comprising:
and scanning all the test machines once every preset time by adopting a Timer mode.
5. A chip test monitoring apparatus, comprising:
the scanning unit is used for scanning the chip testing machine one by one;
the first acquisition unit is used for inquiring a database, acquiring current test data and a current test product model, wherein the database stores the test data which is sent to the database by the test machine in real time; the chip test monitoring client side realizes real-time analysis and uploading of test data, monitors the specific test data byte size and time change condition in the test machine computer in real time, triggers an analysis flow once detecting the file change, and analyzes and uploads the latest changed data to a database;
the second acquisition unit is used for inquiring the product database and acquiring the customs conditions and standards of the current test product;
the comparison unit is used for comparing the current test data with the customs conditions and standards, and if the current test data exceeds the customs conditions and standards, an alarm mechanism is triggered;
the alignment unit is used for:
if the standard exceeds the standard, sending an alarm mail, triggering a three-color lamp to give an audible and visual alarm, and sending a shutdown instruction to the intelligent finger control system so that the manipulator presses a test machine stop key;
the intelligent finger control system is used for receiving the alarm information and transmitting an instruction of immediately stopping to the mechanical hand finger pressing system;
the mechanical hand finger pressing system comprises a mechanical hand finger pressing module, the mechanical hand finger pressing module is arranged right above a shutdown key of the testing machine equipment, and the mechanical hand finger pressing system is used for controlling the mechanical hand finger pressing module to pop up once and retract according to a shutdown instruction so as to press the shutdown key of the testing machine equipment; the manipulator finger pressing module is arranged right above a physical key shutdown key of the testing machine equipment through a sucking disc or a binding belt, the finger pressing module faces the shutdown key, and the distance is less than 2cm;
the manipulator finger pressing system also comprises a singlechip module and a direct current motor module; the direct current motor module is used for providing a relay and a mechanical finger driving circuit; the singlechip module is used for realizing system-on-chip programming and function configuration; the robot finger pressing system is provided with a software interface DLL file, and the DLL is packaged into the server.
6. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 4.
7. A server comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the method of any of claims 1-4 are implemented when the program is executed by the processor.
8. A chip test monitoring system comprising the server of claim 7.
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| CN202010721249.7A CN111880079B (en) | 2020-07-24 | 2020-07-24 | Chip test monitoring method and server |
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| CN202010721249.7A CN111880079B (en) | 2020-07-24 | 2020-07-24 | Chip test monitoring method and server |
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| CN111880079B true CN111880079B (en) | 2022-12-13 |
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| CN112652086A (en) * | 2020-11-15 | 2021-04-13 | 南京宏泰半导体科技有限公司 | Monitoring system for abnormal faults of integrated circuit mass production test |
| CN112397409A (en) * | 2020-11-24 | 2021-02-23 | 安测半导体技术(江苏)有限公司 | Chip wafer test data analysis method and system |
| CN112346920A (en) * | 2020-11-24 | 2021-02-09 | 安测半导体技术(江苏)有限公司 | Integrated circuit test data analysis method and system |
| CN112612661B (en) * | 2020-12-17 | 2022-08-23 | 海光信息技术股份有限公司 | Chip system level test method, device and system |
| CN112685237B (en) * | 2020-12-31 | 2023-06-13 | 海光信息技术股份有限公司 | Chip test data tracking and inquiring method and system and electronic equipment |
| CN113012410B (en) * | 2021-02-10 | 2022-11-25 | 杭州广立微电子股份有限公司 | Wafer test early warning method |
| CN112964974A (en) * | 2021-03-18 | 2021-06-15 | 嘉盛半导体(苏州)有限公司 | Semiconductor test monitoring method, device, equipment and storage medium |
| CN113485157B (en) * | 2021-07-01 | 2023-04-07 | 杭州加速科技有限公司 | Wafer simulation test method, device and wafer test method |
| CN113484731B (en) * | 2021-07-23 | 2024-05-24 | 安测半导体技术(江苏)有限公司 | Semiconductor testing method and device |
| CN115774182B (en) * | 2022-12-05 | 2023-10-13 | 安测半导体技术(义乌)有限公司 | Chip testing method and device based on ATE platform |
| CN117472699B (en) * | 2023-12-28 | 2024-03-22 | 杭州芯云半导体技术有限公司 | Real-time monitoring method and device for semiconductor test |
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| US7197417B2 (en) * | 2003-02-14 | 2007-03-27 | Advantest America R&D Center, Inc. | Method and structure to develop a test program for semiconductor integrated circuits |
| CN102012478A (en) * | 2010-12-02 | 2011-04-13 | 上海华岭集成电路技术股份有限公司 | Test method of specially packaged chip |
| CN104122871B (en) * | 2014-07-29 | 2017-02-15 | 于兵 | Real-time monitoring method of semiconductor test data |
| KR101978901B1 (en) * | 2015-10-30 | 2019-08-28 | (주)나란 | Apparatus and method for remote control of an input device |
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| CN106449464A (en) * | 2016-11-30 | 2017-02-22 | 上海华力微电子有限公司 | Wafer testing method |
| CN206362898U (en) * | 2016-12-30 | 2017-07-28 | 合肥市华达半导体有限公司 | A kind of long-range open test system of integrated circuit |
| CN208507632U (en) * | 2018-08-10 | 2019-02-15 | 无锡芯启博科技有限公司 | A kind of wafer test yield rate real-time monitoring system |
| CN109376190A (en) * | 2018-09-14 | 2019-02-22 | 上海华岭集成电路技术股份有限公司 | Equipment interconnection, data source emerging system in integrated circuit test system |
| CN110031746B (en) * | 2019-04-19 | 2020-09-18 | 中国南方电网有限责任公司 | Chip test remote monitoring method and device, computer equipment and storage medium |
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