CN112017978A - 一种芯片金属凸块的成型方法 - Google Patents
一种芯片金属凸块的成型方法 Download PDFInfo
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- CN112017978A CN112017978A CN202010870940.1A CN202010870940A CN112017978A CN 112017978 A CN112017978 A CN 112017978A CN 202010870940 A CN202010870940 A CN 202010870940A CN 112017978 A CN112017978 A CN 112017978A
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- layer
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- metal bump
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
- H01L2224/0346—Plating
- H01L2224/03462—Electroplating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
- H01L2224/1146—Plating
- H01L2224/11462—Electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010870940.1A CN112017978B (zh) | 2020-08-26 | 2020-08-26 | 一种芯片金属凸块的成型方法 |
Applications Claiming Priority (1)
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CN202010870940.1A CN112017978B (zh) | 2020-08-26 | 2020-08-26 | 一种芯片金属凸块的成型方法 |
Publications (2)
Publication Number | Publication Date |
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CN112017978A true CN112017978A (zh) | 2020-12-01 |
CN112017978B CN112017978B (zh) | 2022-04-08 |
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CN202010870940.1A Active CN112017978B (zh) | 2020-08-26 | 2020-08-26 | 一种芯片金属凸块的成型方法 |
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CN (1) | CN112017978B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112687647A (zh) * | 2020-12-28 | 2021-04-20 | 颀中科技(苏州)有限公司 | 倒装芯片结构及其制备方法 |
CN113471061A (zh) * | 2021-06-30 | 2021-10-01 | 颀中科技(苏州)有限公司 | 晶圆表面介电层的制备方法、晶圆结构及凸块的成型方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050001313A1 (en) * | 2002-11-12 | 2005-01-06 | Siliconware Precision Industries Co., Ltd. | Semiconductor device with under bump metallurgy and method for fabricating the same |
TW200504976A (en) * | 2003-07-25 | 2005-02-01 | Advanced Semiconductor Eng | Bumping process |
TWI267155B (en) * | 2005-08-23 | 2006-11-21 | Advanced Semiconductor Eng | Bumping process and structure thereof |
CN101271890A (zh) * | 2005-02-14 | 2008-09-24 | 富士通株式会社 | 半导体器件及其制造方法与电容器结构及其制造方法 |
KR20120048067A (ko) * | 2010-11-05 | 2012-05-15 | 엘비세미콘 주식회사 | 반도체 소자용 금속 범프 형성 방법 |
CN102496580A (zh) * | 2011-12-19 | 2012-06-13 | 南通富士通微电子股份有限公司 | 一种焊料凸点的形成方法 |
CN109637990A (zh) * | 2018-11-16 | 2019-04-16 | 北京时代民芯科技有限公司 | 带不同直径凸点的晶圆制备方法 |
-
2020
- 2020-08-26 CN CN202010870940.1A patent/CN112017978B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050001313A1 (en) * | 2002-11-12 | 2005-01-06 | Siliconware Precision Industries Co., Ltd. | Semiconductor device with under bump metallurgy and method for fabricating the same |
TW200504976A (en) * | 2003-07-25 | 2005-02-01 | Advanced Semiconductor Eng | Bumping process |
CN101271890A (zh) * | 2005-02-14 | 2008-09-24 | 富士通株式会社 | 半导体器件及其制造方法与电容器结构及其制造方法 |
TWI267155B (en) * | 2005-08-23 | 2006-11-21 | Advanced Semiconductor Eng | Bumping process and structure thereof |
KR20120048067A (ko) * | 2010-11-05 | 2012-05-15 | 엘비세미콘 주식회사 | 반도체 소자용 금속 범프 형성 방법 |
CN102496580A (zh) * | 2011-12-19 | 2012-06-13 | 南通富士通微电子股份有限公司 | 一种焊料凸点的形成方法 |
CN109637990A (zh) * | 2018-11-16 | 2019-04-16 | 北京时代民芯科技有限公司 | 带不同直径凸点的晶圆制备方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112687647A (zh) * | 2020-12-28 | 2021-04-20 | 颀中科技(苏州)有限公司 | 倒装芯片结构及其制备方法 |
WO2022142865A1 (zh) * | 2020-12-28 | 2022-07-07 | 颀中科技(苏州)有限公司 | 倒装芯片结构及其制备方法 |
CN113471061A (zh) * | 2021-06-30 | 2021-10-01 | 颀中科技(苏州)有限公司 | 晶圆表面介电层的制备方法、晶圆结构及凸块的成型方法 |
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CN112017978B (zh) | 2022-04-08 |
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Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Material Technology Co.,Ltd. Applicant before: Hefei Qizhong Sealing Technology Co.,Ltd. Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Beijing yisiwei Material Technology Co.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Technology Co.,Ltd. Applicant before: Hefei yisiwei sealing and Testing Technology Co.,Ltd. |
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Effective date of registration: 20210617 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. Applicant before: Hefei Qizhong Sealing Technology Co.,Ltd. |
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Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Hefei Qizhong Sealing Technology Co.,Ltd. |
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