CN111971423A - Co阳极及使用有Co阳极的Co电镀方法 - Google Patents
Co阳极及使用有Co阳极的Co电镀方法 Download PDFInfo
- Publication number
- CN111971423A CN111971423A CN201880091917.3A CN201880091917A CN111971423A CN 111971423 A CN111971423 A CN 111971423A CN 201880091917 A CN201880091917 A CN 201880091917A CN 111971423 A CN111971423 A CN 111971423A
- Authority
- CN
- China
- Prior art keywords
- anode
- purity
- fine particles
- particles
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-063008 | 2018-03-28 | ||
JP2018063008A JP6960363B2 (ja) | 2018-03-28 | 2018-03-28 | Coアノード、Coアノードを用いた電気Coめっき方法及びCoアノードの評価方法 |
PCT/JP2018/037118 WO2019187250A1 (ja) | 2018-03-28 | 2018-10-03 | Coアノード及びCoアノードを用いた電気Coめっき方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111971423A true CN111971423A (zh) | 2020-11-20 |
Family
ID=68060989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880091917.3A Pending CN111971423A (zh) | 2018-03-28 | 2018-10-03 | Co阳极及使用有Co阳极的Co电镀方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210010149A1 (ko) |
JP (1) | JP6960363B2 (ko) |
KR (1) | KR102435667B1 (ko) |
CN (1) | CN111971423A (ko) |
SG (1) | SG11202009378RA (ko) |
TW (1) | TWI683040B (ko) |
WO (1) | WO2019187250A1 (ko) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5667665A (en) * | 1995-03-14 | 1997-09-16 | Japan Energy Corporation | Process of producing high purity cobalt |
JPH11315392A (ja) * | 1999-03-19 | 1999-11-16 | Japan Energy Corp | コバルトの精製方法 |
US20050000821A1 (en) * | 2001-11-16 | 2005-01-06 | White Tamara L | Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
CN102933740A (zh) * | 2011-04-19 | 2013-02-13 | Jx日矿日石金属株式会社 | 铟靶及其制造方法 |
US20160168728A1 (en) * | 2013-12-02 | 2016-06-16 | Jx Nippon Mining & Metals Corporation | High purity cobalt chloride and manufacturing method therefor |
CN107849716A (zh) * | 2016-03-09 | 2018-03-27 | Jx金属株式会社 | 高纯度锡及其制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3416993A1 (de) * | 1984-05-09 | 1985-11-21 | Gerhard Collardin GmbH, 5000 Köln | Waessrige, saure, nickel- und cobalt-ionen enthaltende elektrolyte zur galvanischen abscheidung von harten, anlaufbestaendigen, weiss glaenzenden legierungsueberzuegen |
JPS62278293A (ja) * | 1986-05-26 | 1987-12-03 | C Uyemura & Co Ltd | 電子部品の製造方法 |
KR100512644B1 (ko) * | 2000-05-22 | 2005-09-07 | 가부시키 가이샤 닛코 마테리알즈 | 금속의 고 순도화 방법 |
JP4076751B2 (ja) | 2001-10-22 | 2008-04-16 | 日鉱金属株式会社 | 電気銅めっき方法、電気銅めっき用含リン銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
JP3611545B2 (ja) * | 2001-12-20 | 2005-01-19 | 株式会社荏原製作所 | めっき装置 |
CN1297364C (zh) * | 2005-05-18 | 2007-01-31 | 北京科技大学 | 沉淀-还原制备纳米钴粉的方法 |
US7897265B2 (en) * | 2006-01-26 | 2011-03-01 | Hamilton Sundstrand Corporation | Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance |
CN103726097B (zh) | 2007-11-01 | 2016-08-17 | Jx日矿日石金属株式会社 | 铜阳极或含磷铜阳极、在半导体晶片上电镀铜的方法及粒子附着少的半导体晶片 |
JP5544527B2 (ja) * | 2009-03-02 | 2014-07-09 | 国立大学法人信州大学 | 複合めっき皮膜及びその形成方法並びに電解めっき液 |
JP5281186B1 (ja) * | 2012-10-25 | 2013-09-04 | Jx日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
CN103966627B (zh) * | 2014-04-30 | 2017-01-11 | 兰州金川新材料科技股份有限公司 | 一种降低高纯钴中杂质Fe含量的方法 |
-
2018
- 2018-03-28 JP JP2018063008A patent/JP6960363B2/ja active Active
- 2018-10-03 SG SG11202009378RA patent/SG11202009378RA/en unknown
- 2018-10-03 WO PCT/JP2018/037118 patent/WO2019187250A1/ja active Application Filing
- 2018-10-03 KR KR1020207027944A patent/KR102435667B1/ko active IP Right Grant
- 2018-10-03 CN CN201880091917.3A patent/CN111971423A/zh active Pending
- 2018-10-03 US US17/041,229 patent/US20210010149A1/en not_active Abandoned
- 2018-10-04 TW TW107135059A patent/TWI683040B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5667665A (en) * | 1995-03-14 | 1997-09-16 | Japan Energy Corporation | Process of producing high purity cobalt |
JPH11315392A (ja) * | 1999-03-19 | 1999-11-16 | Japan Energy Corp | コバルトの精製方法 |
US20050000821A1 (en) * | 2001-11-16 | 2005-01-06 | White Tamara L | Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
CN102933740A (zh) * | 2011-04-19 | 2013-02-13 | Jx日矿日石金属株式会社 | 铟靶及其制造方法 |
US20160168728A1 (en) * | 2013-12-02 | 2016-06-16 | Jx Nippon Mining & Metals Corporation | High purity cobalt chloride and manufacturing method therefor |
CN107849716A (zh) * | 2016-03-09 | 2018-03-27 | Jx金属株式会社 | 高纯度锡及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2019187250A1 (ja) | 2019-10-03 |
US20210010149A1 (en) | 2021-01-14 |
SG11202009378RA (en) | 2020-10-29 |
KR20200128097A (ko) | 2020-11-11 |
KR102435667B1 (ko) | 2022-08-25 |
JP6960363B2 (ja) | 2021-11-05 |
TW201942423A (zh) | 2019-11-01 |
JP2019173104A (ja) | 2019-10-10 |
TWI683040B (zh) | 2020-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9441289B2 (en) | High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film | |
EP2330224B1 (en) | High-purity copper and process for electrolytically producing high-purity copper | |
US7943033B2 (en) | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | |
JP4034095B2 (ja) | 電気銅めっき方法及び電気銅めっき用含リン銅アノード | |
JP2019183256A (ja) | スパッタリングターゲット材 | |
JP2018204103A (ja) | 高純度電気銅 | |
CN111971423A (zh) | Co阳极及使用有Co阳极的Co电镀方法 | |
JP4064121B2 (ja) | 含リン銅アノードを使用する電気銅めっき方法 | |
JP4554662B2 (ja) | 電気銅めっき用含リン銅アノード及びその製造方法 | |
KR20210111671A (ko) | 스퍼터링 타깃재 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |