CN111929320B - Film stretching ring wafer inspection machine - Google Patents
Film stretching ring wafer inspection machine Download PDFInfo
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- CN111929320B CN111929320B CN202010729072.5A CN202010729072A CN111929320B CN 111929320 B CN111929320 B CN 111929320B CN 202010729072 A CN202010729072 A CN 202010729072A CN 111929320 B CN111929320 B CN 111929320B
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- 238000007689 inspection Methods 0.000 title claims abstract description 66
- 238000001179 sorption measurement Methods 0.000 claims abstract description 17
- 239000003550 marker Substances 0.000 claims abstract description 5
- 229920006302 stretch film Polymers 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract description 7
- 230000009471 action Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 55
- 238000000034 method Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a stretched film ring wafer inspection machine which comprises an inspection machine main body, a wafer basket, a workbench, a longitudinal moving assembly, a transverse moving assembly, a mounting seat, an X-axis moving assembly, a Y-axis moving assembly, an adsorption platform, a bracket, a INKER marker, a CCD alignment instrument, an inspection assembly and a scanner, wherein the inspection machine main body is provided with a plurality of clamping plates; according to the invention, the longitudinal moving assembly, the transverse moving assembly, the X-axis moving assembly, the Y-axis moving assembly, the adsorption platform and the inspection assembly are additionally arranged, and the CCD alignment instrument and the scanner are matched, so that the wafer inspection machine can position the wafer to be inspected in real time, and automatically complete the actions of moving, clamping, adsorbing and inspecting the wafer to be inspected, thereby improving the automation degree of the wafer inspection machine, reducing the labor intensity of personnel, improving the efficiency of the wafer inspection, avoiding the problem of damage to the surface of the wafer caused by manual misoperation, reducing the defective rate of the wafer inspection and saving resources.
Description
Technical Field
The invention relates to the technical field of wafer inspection machines, in particular to a film stretching ring wafer inspection machine.
Background
A wafer refers to a substrate, also called a substrate, from which semiconductor transistors or integrated circuits are fabricated, and is called a wafer because it is a crystalline material that is circular in shape. Generally, silicon is purified to prepare a silicon crystal rod, and then polysilicon is melted to form a single crystal silicon crystal rod through the procedures of photoengraving, grinding, polishing, slicing and the like, and then the single crystal silicon crystal rod is cut into thin wafers.
At present, a wafer inspection machine is commonly used in the industry to inspect the appearance of a cut wafer, inspect the morphology and defects of the wafer, measure data and the like, and screen out defective wafers with defects on the surface.
However, most of the conventional wafer inspection machines are required to be manually operated, so that the labor intensity of personnel is improved, the wafer inspection efficiency is low, the surface of the wafer is easily damaged due to manual misoperation, the defective rate of the wafer inspection is inevitably increased, and unnecessary resource waste is caused.
Therefore, it is necessary to design a stretched film ring wafer inspection machine.
Disclosure of Invention
The invention aims to provide a stretched film ring wafer inspection machine, which solves the problems in the prior art.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides a stretch film ring wafer inspection machine, includes inspection machine main part, wafer basket, workstation, vertical movable assembly, lateral shifting subassembly, mount pad, X axle movable assembly, Y axle movable assembly, adsorption platform, support, INKER mark appearance, CCD counterpoint appearance, inspection subassembly and scanner, the one corner at inspection machine main part top and the bottom fixed connection of wafer basket, and the bottom fixed connection of inspection machine main part top and workstation, one side at workstation top is through support column and the bottom fixed connection of vertical movable assembly, be provided with lateral shifting subassembly directly over one side at vertically movable assembly top, the adjacent one side fixed connection at lateral shifting subassembly bottom is passed through the mount pad and is passed through at the both sides at workstation top, the center at workstation top and the bottom fixed connection of X axle movable assembly, fixed mounting has Y axle movable assembly on the X axle movable assembly, fixed mounting has adsorption platform on the Y axle movable assembly. The two adjacent sides of workstation top and the both sides fixed connection of support bottom, the both sides at support side center are fixed mounting INKER marker and CCD counterpoint appearance respectively, and the center and the one side of support another side are fixed mounting respectively have inspection subassembly and scanner, the inspection subassembly is located the X axle and removes the right upper side of subassembly middle section.
Further, the longitudinal movement subassembly comprises first fixed plate, longitudinal slide rail, longitudinal movement seat, clamp manipulator, first belt and first driving pulley, the bottom of first fixed plate passes through support column and one side fixed connection at workstation top, and the both sides fixed mounting at first fixed plate top has longitudinal slide rail, the middle section of longitudinal slide rail passes through slider and the both sides fixed connection at longitudinal movement seat bottom, the top fixed mounting of longitudinal movement seat has clamp manipulator, and the one side of longitudinal movement seat bottom and the middle section fixed connection of first belt, the fixed cup joint of the outer circumference of the inner circumference of first belt one end and first driven pulley, and the inner circumference of first belt other end and the fixed cup joint of the outer circumference of first driving pulley, the center and the output fixed connection of longitudinal movement motor of first driving pulley bottom, the top of longitudinal movement motor and one side fixed plate bottom are fixed connection.
Further, the lateral shifting subassembly comprises second mounting panel, lateral sliding rail, lateral shifting seat, centre gripping manipulator, second belt, second driven pulley, second driving pulley and lateral shifting motor, the both sides of second mounting panel bottom are through the adjacent one side fixed connection at mount pad and workstation top, and the positive top of second mounting panel and bottom all fixed mounting have lateral sliding rail, the middle section of lateral sliding rail passes through slider and the top and the bottom fixed connection at lateral shifting seat back, the positive top fixed mounting of lateral shifting seat has the centre gripping manipulator, and the middle section fixed connection of one side at lateral shifting seat back and second belt, the fixed cover of the outer circumference of the interior circumference and the second driven pulley of second belt one end, the center at the back of second driving pulley and the output fixed connection of lateral shifting motor, lateral shifting motor fixed mounting is in the one side at the second mounting panel back.
Further, the X-axis moving assembly is composed of a third mounting plate, an X-axis moving sliding rail and an X-axis moving cylinder, the bottom of the third mounting plate is fixedly connected with the center of the top of the workbench, one side of the top of the third mounting plate is fixedly provided with the X-axis moving sliding rail, one end of the X-axis moving sliding rail is fixedly connected with the output end of the X-axis moving cylinder, and the middle section of the X-axis moving sliding rail is fixedly connected with the center of the bottom of the Y-axis moving assembly through a sliding block.
Further, the Y-axis moving assembly is composed of a fourth mounting plate, a Y-axis moving slide rail and a Y-axis moving cylinder, the center of the bottom of the fourth mounting plate is fixedly connected with the middle section of the X-axis moving slide rail through a slide block, the center of the top of the fourth mounting plate is fixedly provided with the Y-axis moving slide rail, one end of the Y-axis moving slide rail is fixedly connected with the output end of the Y-axis moving cylinder, and the middle section of the Y-axis moving slide rail is fixedly connected with the center of the bottom of the adsorption platform through the slide block.
Further, the inspection assembly comprises fifth mounting panel, lifting seat, microscope and elevator motor, the side of fifth mounting panel and the center fixed connection of support another side, and the both sides fixed mounting of fifth mounting panel another side have the lift slide rail, the middle section of lift slide rail passes through slider and the both sides fixed connection of lifting seat side, the top fixed mounting of lifting seat has the microscope, and the center of lifting seat side passes through ball nut and the middle section fixed connection of screw thread lead screw, the top and the bottom fixed connection of screw thread lead screw's both ends through lead screw fixing base and fifth mounting panel another side, and the output fixed connection of shaft coupling and elevator motor is passed through to the one end of screw thread lead screw, elevator motor fixed mounting is at the center at fifth mounting panel top.
Compared with the prior art, the invention has the following beneficial effects: according to the stretched film ring wafer inspection machine, the longitudinal moving assembly, the transverse moving assembly, the X-axis moving assembly, the Y-axis moving assembly, the adsorption platform and the inspection assembly are additionally arranged, and the CCD alignment instrument and the scanner are matched, so that the wafer inspection machine can position a wafer to be inspected in real time, the wafer to be inspected can automatically complete the actions of moving, clamping, adsorbing and inspecting, the degree of automation of the wafer inspection machine is improved, the labor intensity of personnel is reduced, the efficiency of wafer inspection is improved, the problem that the surface of the wafer is damaged due to manual operation errors is avoided, the defective rate of wafer inspection is reduced, and resources are saved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a top view of the overall structure of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a partial enlarged view at B in FIG. 1;
FIG. 4 is an enlarged view of a portion of FIG. 1 at C;
FIG. 5 is a partial enlarged view at D in FIG. 1;
In the figure: 1. an inspection machine main body; 2. wafer basket; 3. a work table; 4. a longitudinally moving assembly; 41. a first fixing plate; 42. a longitudinal slide rail; 43. a longitudinally movable seat; 44. clamping a manipulator; 45. a first belt; 46. a first driving pulley; 5. a lateral movement assembly; 51. a second mounting plate; 52. a transverse slide rail; 53. a lateral movement seat; 54. a clamping manipulator; 55. a second belt; 56. a second driven pulley; 57. a second driving pulley; 58. a lateral movement motor; 6. a mounting base; 7. an X-axis moving assembly; 71. a third mounting plate; 72. an X-axis moving slide rail; 73. an X-axis moving cylinder; 8. a Y-axis moving assembly; 81. a fourth mounting plate; 82. the Y-axis moves the slide rail; 83. a Y-axis moving cylinder; 9. an adsorption platform; 10. a bracket; 11. INKER marker; 12. a CCD alignment instrument; 13. checking the assembly; 131. a fifth mounting plate; 132. a lifting seat; 133. a microscope; 134. a lifting motor; 14. a scanner.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, the present invention provides a technical solution: a stretched film ring wafer inspection machine comprises an inspection machine body 1, a wafer basket 2, a workbench 3, a longitudinal moving component 4, a transverse moving component 5, a mounting seat 6, an X-axis moving component 7, a Y-axis moving component 8, an adsorption platform 9, a bracket 10, INKER marking instrument 11, a CCD counterpoint instrument 12, an inspection component 13 and a scanner 14, wherein one corner of the top of the inspection machine body 1 is fixedly connected with the bottom of the wafer basket 2, the top of the inspection machine body 1 is fixedly connected with the bottom of the workbench 3, one side of the top of the workbench 3 is fixedly connected with the bottom of the longitudinal moving component 4 through a support column, The longitudinal moving assembly 4 consists of a first fixed plate 41, a longitudinal sliding rail 42, a longitudinal moving seat 43, a clamping manipulator 44, a first belt 45 and a first driving pulley 46, wherein the bottom of the first fixed plate 41 is fixedly connected with one side of the top of the workbench 3 through a supporting column, the longitudinal sliding rail 42 is fixedly arranged on two sides of the top of the first fixed plate 41, the middle section of the longitudinal sliding rail 42 is fixedly connected with two sides of the bottom of the longitudinal moving seat 43 through a sliding block, the clamping manipulator 44 is fixedly arranged on the top of the longitudinal moving seat 43, one side of the bottom of the longitudinal moving seat 43 is fixedly connected with the middle section of the first belt 45, the inner circumference of one end of the first belt 45 is fixedly sleeved with the outer circumference of the first driven pulley, The inner circumference of the other end of the first belt 45 is fixedly sleeved with the outer circumference of the first driving belt pulley 46, the center of the bottom of the first driving belt pulley 46 is fixedly connected with the output end of a longitudinal moving motor, the top of the longitudinal moving motor is fixedly connected with one side of the bottom of the first fixing plate 41, a transverse moving assembly 5 is arranged right above one side of the top of the longitudinal moving assembly 4, the transverse moving assembly 5 consists of a second mounting plate 51, a transverse sliding rail 52, a transverse moving seat 53, a clamping manipulator 54, a second belt 55, a second driven belt pulley 56, a second driving belt pulley 57 and a transverse moving motor 58, two sides of the bottom of the second mounting plate 51 are fixedly connected with the adjacent side of the top of the workbench 3 through the mounting seat 6, The top and bottom ends of the front surface of the second mounting plate 51 are fixedly provided with transverse sliding rails 52, the middle section of the transverse sliding rail 52 is fixedly connected with the top and bottom ends of the back surface of the transverse moving seat 53 through sliding blocks, the top end of the front surface of the transverse moving seat 53 is fixedly provided with a clamping manipulator 54, one side of the back surface of the transverse moving seat 53 is fixedly connected with the middle section of a second belt 55, the inner circumference of one end of the second belt 55 is fixedly sleeved with the outer circumference of a second driven belt wheel 56, the inner circumference of the other end of the second belt 55 is fixedly sleeved with the outer circumference of a second driving belt wheel 57, the center of the back surface of the second driving belt wheel 57 is fixedly connected with the output end of a transverse moving motor 58, The transverse moving motor 58 is fixedly arranged on one side of the back of the second mounting plate 51, two sides of the bottom of the transverse moving assembly 5 are fixedly connected with the adjacent side of the top of the workbench 3 through the mounting seat 6, the center of the top of the workbench 3 is fixedly connected with the bottom of the X-axis moving assembly 7, the X-axis moving assembly 7 consists of a third mounting plate 71, an X-axis moving slide rail 72 and an X-axis moving cylinder 73, the bottom of the third mounting plate 71 is fixedly connected with the center of the top of the workbench 3, one side of the top of the third mounting plate 71 is fixedly provided with the X-axis moving slide rail 72, one end of the X-axis moving slide rail 72 is fixedly connected with the output end of the X-axis moving cylinder 73, The middle section of the X-axis moving slide rail 72 is fixedly connected with the center of the bottom of the Y-axis moving assembly 8 through a slide block, the Y-axis moving assembly 8 is fixedly installed on the X-axis moving assembly 7, the Y-axis moving assembly 8 consists of a fourth mounting plate 81, a Y-axis moving slide rail 82 and a Y-axis moving cylinder 83, the center of the bottom of the fourth mounting plate 81 is fixedly connected with the middle section of the X-axis moving slide rail 72 through the slide block, the center of the top of the fourth mounting plate 81 is fixedly provided with the Y-axis moving slide rail 82, one end of the Y-axis moving slide rail 82 is fixedly connected with the output end of the Y-axis moving cylinder 83, the middle section of the Y-axis moving slide rail 82 is fixedly connected with the center of the bottom of the adsorption platform 9 through the slide block, An adsorption platform 9 is fixedly arranged on the Y-axis moving assembly 8; adjacent two sides of the top of the workbench 3 are fixedly connected with two sides of the bottom of the bracket 10, a INKER marker 11 and a CCD aligner 12 are respectively and fixedly arranged on two sides of the center of the side surface of the bracket 10, an inspection assembly 13 and a scanner 14 are respectively and fixedly arranged on the center and one side of the other side surface of the bracket 10, the inspection assembly 13 is positioned right above the middle section of the X-axis moving assembly 7, the inspection assembly 13 consists of a fifth mounting plate 131, a lifting seat 132, a microscope 133 and a lifting motor 134, the side surface of the fifth mounting plate 131 is fixedly connected with the center of the other side surface of the bracket 10, lifting slide rails are fixedly arranged on two sides of the other side surface of the fifth mounting plate 131, The middle section of the lifting slide rail is fixedly connected with two sides of the side surface of the lifting seat 132 through a slide block, a microscope 133 is fixedly installed at the top of the lifting seat 132, the center of the side surface of the lifting seat 132 is fixedly connected with the middle section of a threaded screw rod through a ball nut, two ends of the threaded screw rod are fixedly connected with the top end and the bottom end of the other side surface of the fifth mounting plate 131 through screw rod fixing seats, one end of the threaded screw rod is fixedly connected with the output end of a lifting motor 134 through a coupler, the lifting motor 134 is fixedly installed at the center of the top of the fifth mounting plate 131, and a longitudinal moving assembly 4, a transverse moving assembly 5, an X-axis moving assembly 7 are additionally arranged, The Y-axis moving assembly 8, the adsorption platform 9 and the inspection assembly 13 are matched with the CCD contraposition instrument 12 and the scanner 14, so that the wafer inspection machine can position the wafer to be inspected in real time, and automatically complete the actions of moving, clamping, adsorbing and inspecting the wafer to be inspected, thereby not only improving the automation degree of the wafer inspection machine, reducing the labor intensity of personnel, improving the efficiency of wafer inspection, but also avoiding the problem of damage to the surface of the wafer caused by manual misoperation, reducing the defective rate of wafer inspection and saving resources; When the invention works, firstly, the wafer to be inspected is placed into the wafer basket 2, then corresponding data is input into the inspection machine main body 1, the inspection machine main body 1 automatically starts a longitudinal moving motor in the longitudinal moving assembly 4, then the first driving belt pulley 46 is matched with the first driven belt pulley to drive the first belt 45, then the longitudinal moving seat 43 is driven to move on the longitudinal sliding rail 42, the wafer to be inspected in the wafer basket 2 is clamped by the clamping manipulator 44 and longitudinally moved, then the clamping manipulator 54 in the transverse moving assembly 5 clamps the wafer to be inspected by the inspection machine main body 1, and simultaneously the clamping manipulator 44 releases the wafer to be inspected, then automatically starting a transverse moving motor 58, enabling a second driving belt wheel 57 to be matched with a second driven belt wheel 56 to drive a second belt 55, further driving a transverse moving seat 53 to move on a transverse sliding rail 52, transversely moving a wafer to be inspected to a position right above an adsorption platform 9 through a clamping manipulator 54, automatically lifting the adsorption platform 9 to a corresponding height through an inspection machine main body 1, adsorbing the wafer to be inspected, simultaneously loosening the clamping manipulator 54 to loosen the wafer to be inspected, then automatically starting an X-axis moving cylinder 73 in an X-axis moving assembly 7 through the inspection machine main body 1, enabling a fourth mounting plate 81 in a Y-axis moving assembly 8 to move in an X-axis direction on the X-axis moving sliding rail 72, Simultaneously, the Y-axis moving cylinder 83 is started to enable the adsorption platform 9 to move in the Y-axis direction on the Y-axis moving sliding rail 82, further enable the wafer to be inspected to move in the X-axis direction and the Y-axis direction under the microscope 133 in the inspection assembly 13, finally automatically start the lifting motor 134 to adjust the height of the lifting seat 132 through the inspection machine main body 1, comprehensively inspect the appearance of the wafer to be inspected through the proper height adjusted through the microscope 133, further perform defective marking on the wafer with the surface defect through the INKER marking instrument 11, enable the inspection machine main body 1 to position the wafer to be inspected in real time through the CCD alignment instrument 12 and the scanner 14 which are matched with each other in the whole process, Thereby accomplish automatic clamp and get, centre gripping, remove, adsorb and inspect, not only improved the degree of automation of wafer inspection machine, reduced personnel's intensity of labour, improved the efficiency of wafer inspection, still avoided manual misoperation to cause the problem of damage to the wafer surface, reduced the defective rate of wafer inspection, saved the resource.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. The utility model provides a stretch film ring wafer inspection machine, includes inspection machine main part (1), wafer basket (2), workstation (3), longitudinal movement subassembly (4), lateral movement subassembly (5), mount pad (6), X axle remove subassembly (7), Y axle remove subassembly (8), adsorption platform (9), support (10), INKER mark appearance (11), CCD counterpoint appearance (12), inspection subassembly (13) and scanner (14), its characterized in that: one corner of the top of the inspection machine main body (1) is fixedly connected with the bottom of the wafer basket (2), the top of the inspection machine main body (1) is fixedly connected with the bottom of the workbench (3), One side at the top of the workbench (3) is fixedly connected with the bottom of the longitudinal moving assembly (4) through a support column, a transverse moving assembly (5) is arranged right above one side at the top of the longitudinal moving assembly (4), two sides at the bottom of the transverse moving assembly (5) are fixedly connected with the adjacent side at the top of the workbench (3) through a mounting seat (6), the center at the top of the workbench (3) is fixedly connected with the bottom of the X-axis moving assembly (7), a Y-axis moving assembly (8) is fixedly arranged on the X-axis moving assembly (7), and an adsorption platform (9) is fixedly arranged on the Y-axis moving assembly (8); Two adjacent sides of the top of the workbench (3) are fixedly connected with two sides of the bottom of the bracket (10), a INKER marker (11) and a CCD (charge coupled device) aligner (12) are respectively fixedly installed on two sides of the center of the side face of the bracket (10), an inspection assembly (13) and a scanner (14) are respectively fixedly installed on the center and one side of the other side face of the bracket (10), and the inspection assembly (13) is positioned right above the middle section of the X-axis moving assembly (7); the longitudinal moving assembly (4) consists of a first fixing plate (41), a longitudinal sliding rail (42), a longitudinal moving seat (43), a clamping manipulator (44), a first belt (45) and a first driving pulley (46), wherein the bottom of the first fixing plate (41) is fixedly connected with one side of the top of the workbench (3) through a supporting column, the two sides of the top of the first fixing plate (41) are fixedly provided with the longitudinal sliding rail (42), the middle section of the longitudinal sliding rail (42) is fixedly connected with the two sides of the bottom of the longitudinal moving seat (43) through a sliding block, the top of the longitudinal moving seat (43) is fixedly provided with the clamping manipulator (44), One side of the bottom of the longitudinal moving seat (43) is fixedly connected with the middle section of a first belt (45), the inner circumference of one end of the first belt (45) is fixedly sleeved with the outer circumference of a first driven belt wheel, the inner circumference of the other end of the first belt (45) is fixedly sleeved with the outer circumference of a first driving belt wheel (46), the center of the bottom of the first driving belt wheel (46) is fixedly connected with the output end of a longitudinal moving motor, and the top of the longitudinal moving motor is fixedly connected with one side of the bottom of a first fixing plate (41); The transverse moving assembly (5) consists of a second mounting plate (51), a transverse sliding rail (52), a transverse moving seat (53), a clamping manipulator (54), a second belt (55), a second driven belt pulley (56), a second driving belt pulley (57) and a transverse moving motor (58), wherein two sides of the bottom of the second mounting plate (51) are fixedly connected with the adjacent side of the top of the workbench (3) through the mounting seat (6), the transverse sliding rail (52) is fixedly arranged at the top end and the bottom end of the front surface of the second mounting plate (51), the middle section of the transverse sliding rail (52) is fixedly connected with the top end and the bottom end of the back surface of the transverse moving seat (53) through sliding blocks, The top end of the front surface of the transverse moving seat (53) is fixedly provided with a clamping manipulator (54), one side of the back surface of the transverse moving seat (53) is fixedly connected with the middle section of a second belt (55), the inner circumference of one end of the second belt (55) is fixedly sleeved with the outer circumference of a second driven belt wheel (56), the inner circumference of the other end of the second belt (55) is fixedly sleeved with the outer circumference of a second driving belt wheel (57), the center of the back surface of the second driving belt wheel (57) is fixedly connected with the output end of a transverse moving motor (58), and the transverse moving motor (58) is fixedly arranged on one side of the back surface of a second mounting plate (51); The X-axis moving assembly (7) consists of a third mounting plate (71), an X-axis moving slide rail (72) and an X-axis moving cylinder (73), wherein the bottom of the third mounting plate (71) is fixedly connected with the center of the top of the workbench (3), one side of the top of the third mounting plate (71) is fixedly provided with the X-axis moving slide rail (72), one end of the X-axis moving slide rail (72) is fixedly connected with the output end of the X-axis moving cylinder (73), and the middle section of the X-axis moving slide rail (72) is fixedly connected with the center of the bottom of the Y-axis moving assembly (8) through a sliding block; the Y-axis moving assembly (8) consists of a fourth mounting plate (81), a Y-axis moving sliding rail (82) and a Y-axis moving cylinder (83), the center of the bottom of the fourth mounting plate (81) is fixedly connected with the middle section of the X-axis moving sliding rail (72) through a sliding block, the center of the top of the fourth mounting plate (81) is fixedly provided with the Y-axis moving sliding rail (82), one end of the Y-axis moving sliding rail (82) is fixedly connected with the output end of the Y-axis moving cylinder (83), and the middle section of the Y-axis moving sliding rail (82) is fixedly connected with the center of the bottom of the adsorption platform (9) through the sliding block; The inspection assembly (13) consists of a fifth mounting plate (131), a lifting seat (132), a microscope (133) and a lifting motor (134), wherein the side surface of the fifth mounting plate (131) is fixedly connected with the center of the other side surface of the bracket (10), lifting slide rails are fixedly arranged on two sides of the other side surface of the fifth mounting plate (131), the middle section of each lifting slide rail is fixedly connected with two sides of the side surface of the lifting seat (132) through a sliding block, the microscope (133) is fixedly arranged at the top of the lifting seat (132), the center of the side surface of the lifting seat (132) is fixedly connected with the middle section of a threaded screw rod through a ball nut, the two ends of the threaded screw rod are fixedly connected with the top end and the bottom end of the other side face of the fifth mounting plate (131) through screw rod fixing seats, one end of the threaded screw rod is fixedly connected with the output end of the lifting motor (134) through a coupler, and the lifting motor (134) is fixedly mounted at the center of the top of the fifth mounting plate (131).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010729072.5A CN111929320B (en) | 2020-07-27 | 2020-07-27 | Film stretching ring wafer inspection machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010729072.5A CN111929320B (en) | 2020-07-27 | 2020-07-27 | Film stretching ring wafer inspection machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111929320A CN111929320A (en) | 2020-11-13 |
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| US7878336B2 (en) * | 2008-09-09 | 2011-02-01 | Cheng Mei Instrument Technology Co., Ltd. | System and method for inspection of chips on tray |
| CN202770779U (en) * | 2012-08-27 | 2013-03-06 | 由田新技股份有限公司 | Detection device capable of applying multi-shaft mechanical arm |
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