CN220207647U

CN220207647U - Modularized IC test seat

Info

Publication number: CN220207647U
Application number: CN202320364157.7U
Authority: CN
Inventors: 曹维
Original assignee: Suzhou Industrial Park Kaizhongtong Micro Electronic Technology Co ltd
Current assignee: Wuhan Bodi Information Technology Co ltd
Priority date: 2023-03-02
Filing date: 2023-03-02
Publication date: 2023-12-19
Anticipated expiration: 2033-03-02

Abstract

The utility model relates to the technical field of chip testing, in particular to a modularized IC (integrated circuit) test seat, which comprises a workbench and a box body, wherein a chip lifting device is arranged in the box body, the chip lifting device comprises a first slideway and a chute, the other ends of the several frames are movably connected with a sleeve through a pin shaft, the sleeve is sleeved with a reciprocating screw rod, the reciprocating screw rod is driven to rotate by a rotating handle through the cooperation of the workbench and the chip lifting device, a first connecting rod is driven to rotate by a screw nut, a chip clamping device is driven to move to a proper position by the connecting rod, excessive pressure is prevented from being applied to a chip while the positions of a probe and a pin are correspondingly made in the manner, the cost of chip testing is reduced, the chip is prevented from being damaged by a cushion during clamping through the cooperation of the workbench, the box body and the chip clamping device, the position of the chip can be correspondingly arranged with the position of a test base, errors of a test result are avoided, and the accuracy of the test is improved.

Description

Modularized IC test seat

Technical Field

The utility model relates to the technical field of chip testing, in particular to a modularized IC test seat.

Background

An integrated circuit, abbreviated IC; microcircuits, microchips, wafers/chips are known in electronics as a way to miniaturize circuits (including mainly semiconductor devices, also including passive components, etc.) and are often manufactured on semiconductor wafer surfaces.

For example, the chip test seat with the authorized bulletin number of CN218180924U is provided with the motor assembly to drive the gland assembly, so that the gland assembly can downwards gland along the direction vertical to the chip, the requirement of the gland assembly on the stress balance of the contacted chip surface to be tested is met, and the oblique cutting contact of the gland assembly and the contact surface of the target chip to be tested is avoided. But this chip test seat can exert great pressure to the chip at some times and fix, and the too big pin that can lead to the chip receives the extrusion, takes place the skew and fracture even to lead to the inefficacy of chip, lead to the chip unable to test, increased the cost of chip test, this chip test seat simultaneously, place the chip on the test seat after, just test, but the position of chip has not been fixed, and the probe does not correspond with the position of pin when compressing tightly, can't test or lead to the result of test to appear the error, has reduced the degree of accuracy of test.

Disclosure of Invention

The utility model provides a modularized IC test seat, which aims to solve the problems of high chip test cost and low test accuracy.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

a modularized IC test seat is designed, which comprises a workbench and a box body, and is characterized in that: the inside of box is equipped with chip elevating gear, chip elevating gear includes first slide and spout, the inner wall processing of box has first slide, the inner wall of box links to each other with first slider activity through first slide, the lower extreme of first slider links to each other with the connecting rod is fixed, the outer wall of first slider links to each other with several types of frame activity through the round pin axle, the other end of several types of frame links to each other with the sleeve activity through the round pin axle, the sleeve cup joints with reciprocating screw mutually.

Preferably, the chip lifting device further comprises a first connecting rod, the lower end of the first connecting rod is movably connected with the upper end of the table-shaped frame through a pin shaft, the other end of the first connecting rod is movably connected with a screw nut through a pin shaft, the screw nut is connected with a reciprocating screw thread, the upper end of the reciprocating screw is fixedly connected with a rotating handle, the upper end of the table-shaped frame is movably connected with a second connecting rod through a pin shaft, the other end of the second connecting rod is movably connected with the inner wall of the box body through a pin shaft, a chute is formed in one side of the box body, and the second connecting rod and one end of the table-shaped frame penetrate through the box body through the chute.

Preferably, the upper end of the workbench is fixedly connected with the supporting plate, and the upper end of the supporting plate is fixedly connected with the outer wall of the box body.

Preferably, the lower extreme of connecting rod is equipped with chip clamping device, chip clamping device includes electric telescopic handle and second slide, electric telescopic handle's lateral wall passes through the support and links to each other with the connecting rod is fixed, electric telescopic handle's tip links to each other with the lifter block is fixed, the both sides of lifter block are fixed with two dismantlement pieces and link to each other, the outer wall of dismantlement piece is fixed with the commentaries on classics board through the round pin axle and links to each other with the inner wall activity of base through the round pin axle, the outer wall of base links to each other with the connecting rod is fixed, the other end of commentaries on classics board links to each other with the second slider activity through the round pin axle, the second slider links to each other with the third slider is fixed, the outer wall processing of base has the second slide, the third slider links to each other with the base activity through the second slide, the upper end of third slider links to each other with the clamp block is fixed, the cushion is installed to the inboard of clamp block.

Preferably, the upper end of workstation and test base are fixed to be linked to each other, the upper end of workstation and support column are fixed to be linked to each other, the upper end of support column rotates with the lower extreme of reciprocating screw through the bearing and links to each other, the lower extreme of workstation links to each other with four support frames are fixed, four the support frame is the rectangle at the lower extreme of workstation and distributes.

The modularized IC test seat provided by the utility model has the beneficial effects that: through workstation and chip elevating gear's cooperation, the commentaries on classics is driven reciprocating screw and is rotated, and reciprocating screw drives screw nut and remove, and screw nut drives first connecting rod and rotate, and first connecting rod drives several types frame and removes, and several types frame drive first slider downwardly moving, and first slider drives the connecting rod and removes, and the connecting rod drives chip clamping device and removes to suitable position, avoids exerting too big pressure to the chip when making the position of probe and pin corresponding through above-mentioned mode, has reduced the cost of chip test.

Through workstation, box and chip clamping device's cooperation, electric telescopic handle drives the lifting block and withdraws, and the lifting block drives the commentaries on classics board and rotates, and the commentaries on classics board drives second slider and inwards moves, and the second slider drives the third slider and slides along the second slide, presss from both sides tightly the chip, and the chip damages when the cushion prevents the centre gripping simultaneously, can make the position of chip and the position of test base corresponding through above-mentioned mode, avoids the test result to appear the error, has improved the degree of accuracy of test.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic front view of FIG. 1;

FIG. 3 is a schematic front cross-sectional view of the chip lifting device of FIG. 2;

FIG. 4 is a schematic top view of FIG. 2;

fig. 5 is a bottom view of the chip holding device of fig. 2.

In the figure: 1. the device comprises a workbench, 2, a chip lifting device, 201, a rotating handle, 202, a reciprocating screw, 203, a screw nut, 204, a first connecting rod, 205, a few-shaped frame, 206, a sleeve, 207, a chute, 208, a second connecting rod, 209, a first slideway, 210, a first sliding block, 211, a connecting rod, 3, a chip clamping device, 301, an electric telescopic rod, 302, a lifting block, 303, a rotating plate, 304, a base, 305, a second sliding block, 306, a second slideway, 307, a third sliding block, 308, a clamping block, 309, a soft cushion, 310, a disassembling block, 4, a box, 5, a supporting column, 6, a test base, 7, a supporting frame, 8 and a supporting plate.

Detailed Description

The utility model is further described below with reference to the accompanying drawings:

referring to fig. 1-5: in this embodiment, a modularized IC test seat comprises a workbench 1 and a box body 4, wherein a chip lifting device 2 is arranged in the box body 4, the chip lifting device 2 comprises a first slide 209 and a chute 207, the inner wall of the box body 4 is provided with a first slide 209, the inner wall of the box body 4 is movably connected with a first slide 210 through the first slide 209, the first slide 210 slides in the box body 4, the lower end of the first slide 210 is fixedly connected with a connecting rod 211, the first slide 210 drives the connecting rod 211 to move, the outer wall of the first slide 210 is movably connected with a few-type frame 205 through a pin shaft, the few-type frame 205 drives the first slide 210 to slide, the other end of the few-type frame 205 is movably connected with a sleeve 206 through a pin shaft, the few-type frame 205 rotates on the sleeve 206 and is sleeved with a reciprocating screw 202, the reciprocating screw 202 rotates in the sleeve 206, the chip lifting device 2 further comprises a first connecting rod 204, the lower extreme of first connecting rod 204 links to each other with the upper end activity of several type frame 205 through the round pin axle, first connecting rod 204 drives several type frame 205 and rotates, the other end of first connecting rod 204 links to each other with screw nut 203 activity through the round pin axle, screw nut 203 drives first connecting rod 204 and rotates, screw nut 203 links to each other with reciprocating screw 202 screw thread, reciprocating screw 202 drives screw nut 203 and rotates, the upper end of reciprocating screw 202 links to each other with the twist grip 201 is fixed, twist grip 201 drives reciprocating screw 202 and rotates, the upper end of several type frame 205 links to each other with the activity of second connecting rod 208 through the round pin axle, several type frame 205 drives the rotation of second connecting rod 208, the other end of second connecting rod 208 links to each other with the activity of the inner wall of box 4 through the round pin axle, second connecting rod 208 rotates on box 4, one side processing of box 4 has spout 207, second connecting rod 208 runs through box 4 with the one end of several type frame 205 through spout 207.

Referring to fig. 2 and 5: in this embodiment, a chip clamping device 3 is disposed at the lower end of a connecting rod 211, the chip clamping device 3 includes an electric telescopic rod 301 and a second slideway 306, the side wall of the electric telescopic rod 301 is fixedly connected with the connecting rod 211 through a bracket, the connecting rod 211 fixes the position of the electric telescopic rod 301, the size of the electric telescopic rod 301 is selected to meet the working requirement according to the actual requirement, the end of the electric telescopic rod 301 is fixedly connected with a lifting block 302, the electric telescopic rod 301 drives the lifting block 302 to rotate, two sides of the lifting block 302 are fixedly connected with two dismounting blocks 310, the lifting block 302 drives the dismounting block 310 to move, the outer wall of the dismounting block 310 is fixedly connected with a rotating plate 303 through a pin, the dismounting block 310 drives the rotating plate 303 to rotate, the center of the rotating plate 303 is movably connected with the inner wall of the base 304 through a pin shaft, the rotating plate 303 rotates on the base 304, the outer wall of the base 304 is fixedly connected with the connecting rod 211, the connecting rod 211 is used for fixing the position of the base 304, the other end of the rotating plate 303 is movably connected with the second sliding block 305 through a pin shaft, the rotating plate 303 drives the second sliding block 305 to slide, the second sliding block 305 is fixedly connected with the third sliding block 307, the second sliding block 305 drives the third sliding block 307 to rotate, a second slideway 306 is machined on the outer wall of the base 304, the third sliding block 307 is movably connected with the base 304 through the second slideway 306, the third sliding block 307 slides on the base 304, the upper end of the third sliding block 307 is fixedly connected with the clamping block 308, the position of the clamping block 308 is fixed by the third sliding block 307, a soft cushion 309 is arranged on the inner side of the clamping block 308, and a chip is clamped.

Referring to fig. 1 and 2: in this embodiment, a modularized IC test seat, the upper end of the workbench 1 is fixedly connected with the test base 6, the workbench 1 is fixed with the position of the test base 6, the upper end of the workbench 1 is fixedly connected with the support column 5, the workbench 1 is fixed with the position of the support column 5, the upper end of the support column 5 is rotatably connected with the lower end of the reciprocating screw 202 through a bearing, the reciprocating screw 202 is rotatably arranged on the support column 5, the lower end of the workbench 1 is fixedly connected with four support frames 7, the support frames 7 prop up the workbench 1, and the four support frames 7 are rectangular at the lower end of the workbench 1.

Working principle:

when the modularized IC test seat is used, firstly, a chip to be tested is placed between two clamping blocks 308, then an external power supply of an electric telescopic rod 301 is connected, the electric telescopic rod 301 is started, the electric telescopic rod 301 drives a lifting block 302 to retract, the lifting block 302 drives a rotating plate 303 to rotate, the rotating plate 303 drives a second sliding block 305 to move inwards, the second sliding block 305 drives a third sliding block 307 to slide along a second slideway 306, the chip is clamped, meanwhile, a soft cushion 309 prevents the chip from being damaged during clamping, the position of the chip can be corresponding to the position of a test base in the mode, errors of test results are avoided, after the chip is clamped, an operator rotates a rotating handle 201, the rotating handle 201 drives a reciprocating screw 202 to rotate, the reciprocating screw 202 drives a screw nut 203 to move, the screw nut 203 drives a first connecting rod 204 to rotate, the first connecting rod 204 drives a plurality of frames 205 to move, the plurality of frames 205 drive the first sliding block 210 to move downwards, the connecting rod 211 drives the chip clamping device 3 to move to a proper position, the chip is clamped, the position of the chip is correspondingly enabled to be in the mode, and simultaneously, the chip is enabled to be corresponding to the position of the pins, and the test cost is reduced. And then the chip is tested.

While the utility model has been shown and described with reference to a preferred embodiment, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the utility model.

Claims

1. A modular IC test socket comprising a table (1) and a box (4), characterized in that: the inside of box (4) is equipped with chip elevating gear (2), chip elevating gear (2) are including first slide (209) and spout (207), the inner wall processing of box (4) has first slide (209), the inner wall of box (4) links to each other with first slider (210) activity through first slide (209), the lower extreme of first slider (210) links to each other with connecting rod (211) is fixed, the outer wall of first slider (210) links to each other with several type frame (205) activity through the round pin axle, the other end of several type frame (205) links to each other with sleeve (206) activity through the round pin axle, sleeve (206) cup joints with reciprocating screw (202) mutually.

2. A modular IC test socket according to claim 1, wherein: the chip lifting device (2) further comprises a first connecting rod (204), the lower end of the first connecting rod (204) is movably connected with the upper end of the several-type frame (205) through a pin shaft, the other end of the first connecting rod (204) is movably connected with a screw nut (203) through a pin shaft, the screw nut (203) is in threaded connection with a reciprocating screw (202), the upper end of the reciprocating screw (202) is fixedly connected with a rotating handle (201), the upper end of the several-type frame (205) is movably connected with a second connecting rod (208) through a pin shaft, the other end of the second connecting rod (208) is movably connected with the inner wall of the box body (4) through a pin shaft, a sliding groove (207) is formed in one side of the box body (4), and the second connecting rod (208) and one end of the several-type frame (205) are all penetrated through the box body (4) through the sliding groove (207).

3. A modular IC test socket according to claim 1, wherein: the upper end of the workbench (1) is fixedly connected with the supporting plate (8), and the upper end of the supporting plate (8) is fixedly connected with the outer wall of the box body (4).

4. A modular IC test socket according to claim 1, wherein: the lower extreme of connecting rod (211) is equipped with chip clamping device (3), chip clamping device (3) include electric telescopic handle (301) and second slide (306), the lateral wall of electric telescopic handle (301) passes through the support and links to each other with connecting rod (211) is fixed, the tip of electric telescopic handle (301) links to each other with lifting block (302) is fixed, the both sides of lifting block (302) link to each other with two dismantlement blocks (310) are fixed, the outer wall of dismantlement block (310) links to each other with rotating plate (303) through the round pin axle is fixed, the center of rotating plate (303) links to each other with the inner wall activity of base (304) through the round pin axle, the outer wall of base (304) links to each other with connecting rod (211) is fixed, the other with third slider (307) is fixed, the outer wall processing of base (304) has second slide (306), third slider (307) links to each other with base (304) is fixed through second slide (306), the fixed end of clamp block (308) is equipped with on the fixed block (308).

5. A modular IC test socket according to claim 1, wherein: the upper end of workstation (1) links to each other with test base (6) is fixed, the upper end of workstation (1) links to each other with support column (5) is fixed, the upper end of support column (5) rotates with the lower extreme of reciprocating screw (202) through the bearing and links to each other, the lower extreme of workstation (1) links to each other with four support frame (7) is fixed, four support frame (7) are the rectangle and distribute in the lower extreme of workstation (1).