CN212722576U

CN212722576U - Full-automatic wafer lobe of a leaf inspection machine

Info

Publication number: CN212722576U
Application number: CN202021992850.1U
Authority: CN
Inventors: 戚孝峰; 周鹏程
Original assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Current assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Priority date: 2020-09-12
Filing date: 2020-09-12
Publication date: 2021-03-16
Anticipated expiration: 2030-09-12

Abstract

The utility model relates to a wafer lobe of a leaf check out test set's field specifically is a full-automatic wafer lobe of a leaf inspection machine, and it includes the workstation, and the side is fixed to be equipped with laser scanner and scanning receiver on the workstation, and laser scanner is located scanning receiver's top, is equipped with two backup pads that are used for placing the wafer on the workstation, and the height of side is between laser scanner's height and scanning receiver's height in the backup pad. The wafer splitting and separating device has the effect of automatically detecting the wafer splitting and separating degree.

Description

Full-automatic wafer lobe of a leaf inspection machine

Technical Field

The application relates to the field of wafer crack inspection equipment, in particular to a full-automatic wafer crack inspection machine.

Background

Wafers are silicon wafers formed by grinding, polishing, and slicing a silicon ingot, which is a cylindrical single crystal silicon formed by pulling out a silicon crystal seed crystal doped with dissolved high-purity polycrystalline silicon, and are often used for manufacturing silicon semiconductor integrated circuits. The wafer requires several steps before it can be used in integrated circuits: sticking a film, splitting, separating and taking the film. The film is formed by adhering a film for adhering a wafer on a frame, and the wafer is conveniently split after being adhered on the film. After the splitting, in order to ensure that the splitting pieces are separated from each other along the cutting trace, the wafer is vibrated and separated, and the membrane on the surface of the wafer is taken down after vibration. The frame outside the wafer is not removed before the film on the wafer surface is removed.

After the cracked wafer is oscillated, the split pieces are not necessarily completely separated, but whether the split pieces are separated or not is difficult to determine through visual observation, so that an apparatus capable of accurately checking the separation degree of the wafer split pieces is needed.

SUMMERY OF THE UTILITY MODEL

In order to accurately detect the separation condition of the wafer splinters, the application provides a full-automatic wafer splinter detecting machine.

The application provides a full-automatic wafer lobe of a leaf inspection machine adopts following technical scheme:

the utility model provides a full-automatic wafer lobe of a leaf inspection machine, includes the workstation, the side fixing is equipped with laser scanner and scanning receiver on the workstation, laser scanner is located scanning receiver's top, be equipped with two backup pads that are used for placing the wafer on the workstation, the height of side is between laser scanner's height and scanning receiver's height in the backup pad.

Through adopting above-mentioned technical scheme, laser scanner can carry out laser scanning to the wafer in the backup pad, and the laser after the scanning is received by scanning receiver to comparatively accurately inspect the degree that the wafer lobe of a leaf separates.

Preferably, one side of workstation is fixed and is equipped with first elevating platform, it is equipped with the electronic clamping jaw that is used for pressing from both sides the clamp wafer to slide on the first elevating platform, the fixed first electric jar that is used for driving electronic clamping jaw and slides that is equipped with on the first elevating platform.

Through adopting above-mentioned technical scheme, the wafer can be got to electronic clamping jaw, slides and the lift of first elevating platform is placed the wafer and is carried out the lobe of a leaf degree inspection on the support frame through first electric jar, and the degree of automation that the wafer lobe of a leaf separation degree was inspected promotes.

Preferably, the electric clamping jaw comprises a first sub-jaw and a second sub-jaw, and clamping plates are fixedly arranged on the opposite sides of the first sub-jaw and the second sub-jaw.

Through adopting above-mentioned technical scheme, first minute claw and second divide the claw to press from both sides the in-process of getting the wafer, splint and wafer direct contact, divide the claw with first minute claw and second to press from both sides the wafer and compare, area of contact is bigger, and it is more stable to press from both sides and get the wafer.

Preferably, the opposite side surfaces of the two clamping plates are fixedly provided with elastic pads.

Through adopting above-mentioned technical scheme, the wafer is got to the frame clamp that splint pass through the centre gripping wafer outside, and when the frame in the splint centre gripping wafer outside, elastic pad and frame direct contact take place elastic deformation after receiving the extrusion of splint and frame, and is bigger with the area of contact of frame, and the frictional force between splint and the frame is bigger, and splint centre gripping frame is more stable to make splint press from both sides the better and get the wafer.

Preferably, a wafer placing box is arranged on one side of the workbench, which faces away from the first lifting table, a placing plate for horizontally placing wafers is fixedly arranged in the wafer placing box, and one side of the wafer placing box, which is close to the workbench, is open.

Through adopting above-mentioned technical scheme, the wafer can be placed in the case is placed to the wafer, and electronic clamping jaw places case open-ended one side through the wafer and gets into the wafer and place the case, presss from both sides the wafer and places the incasement wafer and put and examine in the backup pad to after examining wafer lobe separation degree, electronic clamping jaw can place the wafer back the wafer and place the incasement, therefore above-mentioned technical scheme has the automatic function of getting the material and unloading.

Preferably, one side of the placing plate close to the workbench is provided with a notch.

Through adopting above-mentioned technical scheme, when the wafer was placed on placing the board, the position of breach can be covered to the frame in the wafer outside, and the electric clamping jaw can press from both sides the breach department frame part and get the wafer to make electric clamping jaw place the incasement from the wafer and press from both sides and get the wafer comparatively conveniently.

Preferably, the placing plates are arranged in a plurality, the placing plates are distributed in a wafer placing box in a layered mode, a second lifting table is fixedly arranged on one side of the workbench, and the wafer placing box is located on the upper side face of the second lifting table.

By adopting the technical scheme, a plurality of wafers can be placed in the wafer placing box, so that the wafers do not need to be frequently placed in the wafer placing box in the process of detecting the wafers; electric clamping jaw presss from both sides after getting the wafer and place a slice wafer of incasement, and the second elevating platform can drive the wafer and place the case and rise, and the wafer is placed the case and is placed the board height increase of placing of wafer, and electric clamping jaw can continue to press from both sides from placing the board and get the wafer, inspects the wafer continuously, has promoted the efficiency of inspection wafer lobe of a leaf separation degree.

Preferably, one side of workstation is fixed and is equipped with two support frames, two the support frame all is located between second elevating platform and the workstation, the height that highly is greater than the backup pad of support frame, the upside of support frame is rotated and is connected with the gyro wheel.

By adopting the technical scheme, in the process that the electric clamping jaw clamps and takes the wafer to be placed on the supporting plate, the roller supports the frame on the outer side of the wafer, so that the electric clamping jaw can clamp the wafer more stably, and the wafer is protected to a certain extent.

Preferably, the surface of the roller is fixedly provided with a rubber sleeve.

By adopting the technical scheme, the rubber sleeve increases the friction force between the surface of the roller and the surface of the frame outside the wafer, and the frame outside the wafer and the roller are prevented from slipping as far as possible, so that the frame outside the wafer is prevented from being carved by the roller in a slipping manner to a certain extent.

Preferably, the supporting plate is connected with the workbench in a sliding mode, and two second electric cylinders for driving the supporting plate to slide are fixedly arranged on the workbench.

Through adopting above-mentioned technical scheme, the second electric jar can drive the backup pad and slide on the workstation, makes the distance between two backup pads can regulate and control to make can place the wafer size scope in two backup pads and widen, and then make this application have the commonality, can inspect the wafer of not unidimensional.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the laser scanner can perform laser scanning on the wafer on the supporting plate, and the scanned laser is received by the scanning receiver, so that the splitting and separating degree of the wafer can be accurately detected;

2. after the electric clamping jaw clamps the wafer from the wafer placing box, the second lifting platform can drive the wafer placing box to ascend, so that the electric clamping jaw can continuously clamp the wafer from the wafer placing box, the wafer is continuously inspected, and the efficiency of inspecting the wafer cracking degree is improved;

3. the distance between the two supporting plates can be adjusted and controlled, so that wafers with different sizes can be placed on the supporting plates for inspection, and the device has universality.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a fully automatic wafer cracking inspection machine;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIG. 3 is a perspective view highlighting the location and configuration of the wafer placement box;

FIG. 4 is a perspective view highlighting the position and configuration of the support stand;

fig. 5 is an enlarged view of a portion B in fig. 4.

Description of reference numerals: 1. a work table; 2. a laser scanner; 3. a scanning receiver; 4. a support plate; 5. a first elevating platform; 6. an electric jaw; 61. a first claw; 62. a second sub-claw; 7. a first electric cylinder; 8. a splint; 9. an elastic pad; 10. a wafer placing box; 11. placing the plate; 12. a second lifting table; 13. a support frame; 14. a roller; 15. a rubber sleeve; 16. a second electric cylinder; 17. a support pillar; 18. a slide rail; 19. a sliding block; 20. and (5) fixing the column.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

The embodiment of the application discloses a full-automatic wafer lobe of a leaf inspection machine. Referring to fig. 1, a full-automatic wafer lobe of a leaf inspection machine includes workstation 1, fixedly connected with laser scanner 2 and scanning receiver 3 on the workstation 1, still slides on the workstation 1 and is provided with backup pad 4 that is used for placing the wafer, and one side of workstation 1 slides and is provided with the electronic clamping jaw 6 that is used for the automatic clamp to get the wafer, and the opposite side is provided with the wafer that is used for placing the wafer and places case 10. When the inspection is performed, the electric clamping jaws 6 clamp and take the wafer from the wafer placing box 10 to be placed on the supporting plate 4, and the detection of the wafer is completed under the matching of the laser scanner 2 and the scanning receiver 3.

Referring to fig. 1, the support plate 4 is provided in two pieces, and the height of the support plate 4 is interposed between the scan receiver 3 and the laser scanner 2. Two second electric cylinders 16 are fixedly connected to the worktable 1, and the two second electric cylinders 16 are oppositely arranged and are positioned at one side of the scanning receiver 3. The sliding blocks of the two second electric cylinders 16 are fixedly connected with the two supporting plates 4 respectively. A slide rail 18 is arranged on one side of the scanning receiver 3, which is opposite to the second electric cylinder 16, and the slide rail 18 is fixedly connected with the workbench 1. The slide rail 18 is connected with two sliding blocks 19 in a sliding manner, and the two sliding blocks 19 are respectively fixedly connected with the two support plates 4.

The wafer with the frame arranged on the outer side is placed on the two supporting plates 4, the laser scanner 2 scans the wafer, and the scanned information is received by the scanning receiver 3 below, so that the separation degree of the wafer splinters is detected. The second electric slide rail 18 drives the support plates 4 to slide, the distance between the two support plates 4 can be adjusted, so that wafers with different sizes can be placed on the two support plates 4, and the wafer inspection device has universality.

Referring to fig. 1, a first lifting table 5 is fixedly arranged on one side of the workbench 1 close to the slide rail 18, a first electric cylinder 7 is fixedly connected to the first lifting table 5, and the sliding direction of the slide block on the first electric cylinder 7 is perpendicular to the sliding direction of the slide block on the slide rail 18. The first elevating platform 5 is elevated by an oil cylinder. The electric clamping jaw 6 is fixedly connected with the sliding block of the first electric cylinder 7 through a fixing column 20.

After the electric clamping jaw 6 clamps the wafer, the wafer is driven by the first electric cylinder 7 to slide to the upper part of the supporting plate 4, the first lifting platform 5 descends, the wafer is in contact with the upper side surfaces of the two supporting plates 4, the electric clamping jaw 6 loosens the wafer at the moment, the wafer is stably placed on the supporting plate 4, and the split separation degree is detected through the laser scanner 2 and the scanning receiver 3.

Referring to fig. 2, the electric clamping jaw 6 comprises a first sub-jaw 61 and a second sub-jaw 62, a clamping plate 8 is fixedly connected to one side of the first sub-jaw 61 opposite to the one side of the second sub-jaw 62, an elastic pad 9 is fixedly connected to the side of the two clamping plates 8 opposite to each other, and the elastic pad 9 can be fixedly connected with the clamping plate 8 in an adhesion mode.

The electric clamping jaw 6 drives the two clamping plates 8 to clamp the frame on the outer side of the wafer, and the clamping area of the electric clamping jaw 6 is increased. The elastic pad 9 on the clamping plate 8 is in direct contact with the outer side frame of the wafer, so that the friction between the clamping plate 8 and the outer side frame of the wafer is increased, and the stability of clamping the wafer by the electric clamping jaw 6 is improved.

Referring to fig. 3, a second lifting table 12 is fixedly disposed on one side of the table 1 close to the second electric cylinder 16, and the second lifting table 12 is lifted by the oil cylinder. The wafer placing box 10 is placed on the upper side surface of the second elevating table 12, and the side of the wafer placing box 10 close to the table 1 is opened. The wafer placing box 10 is internally and fixedly provided with a plurality of placing plates 11, each placing plate 11 is horizontally placed, and the plurality of placing plates 11 are distributed in a layered manner. One side of the placing plate 11 close to the workbench 1 is provided with a notch, and the notch is arranged to facilitate the electric clamping jaw 6 to clamp the wafer from the placing plate 11.

After placing the wafer on the placing plate 11 in the wafer placing box 10, the electric clamping jaw 6 slides into the wafer placing box 10, clamps the outer side frame of the cylindrical wafer from the notch position of the placing plate 11, and clamps the wafer to place the wafer on the supporting plate 4 for the examination of the splitting separation degree. After the wafer placing box 10 is clamped with a wafer, the second lifting table 12 drives the wafer placing box 10 to ascend, the height of the placing plate 11 on which the wafer is placed is increased, and the electric clamping jaw 6 is convenient to clamp the wafer again.

Referring to fig. 4, two support frames 13 are fixedly arranged on one side of the workbench 1, the two support frames 13 are both located between the second lifting platform 12 and the workbench 1, and the heights of the two support frames 13 are the same and are greater than the height of the support plate 4. All rotate on two support frames 13 and be connected with a plurality of gyro wheels 14, gyro wheel 14 is located the upside of support frame 13. Referring to fig. 5, a rubber sleeve 15 is fixedly connected to the surface of the roller 14, and the rubber sleeve 15 can be sleeved on the roller 14 in a sleeving manner.

In the process that the electric clamping jaw 6 clamps the wafer, the roller 14 supports the frame outside the wafer, and the wafer is more stable in the moving process. The rubber sleeve 15 can increase the friction between the roller 14 and the wafer outer frame, and prevent the wafer outer frame from being scratched by the roller 14 due to the slipping between the roller 14 and the frame.

The implementation principle of the full-automatic wafer splitting inspection machine in the embodiment of the application is as follows: before the inspection, a plurality of wafers are placed on the placing plate 11 in the wafer placing box 10, and the distance between the two support plates 4 is adjusted by the second electric cylinder 16.

Then the first lifting platform 5 is lifted, the first electric cylinder 7 drives the electric clamping jaw 6 to slide into the wafer placing box 10, and the clamping plate 8 clamps the wafer from the gap position of the placing plate 11.

Then, the first electric cylinder 7 drives the electric clamping jaw 6 to slide to the upper part of the supporting plate 4, and in the process of sliding the wafer, the roller 14 is contacted with the surface of the frame outside the wafer to support the wafer.

Subsequently, the first elevating stage 5 is lowered until the surface of the wafer comes into contact with the support plate 4, the electric chuck 6 is released and slid away from the wafer, and the wafer is placed on the support plate 4.

Finally, the separation degree of the wafer splinters is checked under the combined action of the laser scanner 2 and the scanning receiver 3.

When the inspection is finished, the electric clamping jaws 6 slide to clamp the inspected wafer, and after the first lifting platform 5 rises to the same height as the rollers 14, the wafer is placed back to the supporting plate 4, and then the wafer is loosened and separated. The second lift table 12 is then raised so that the underside of the wafer below the inspected wafer is level with the peaks of the rollers 14. At this point, the motorized chuck 6 may again pick up a new wafer for inspection.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a full-automatic wafer lobe of a leaf inspection machine which characterized in that: including workstation (1), the side fixing is equipped with laser scanner (2) and scanning receiver (3) to going up of workstation (1), laser scanner (2) are located the top of scanning receiver (3), be equipped with two backup pads (4) that are used for placing the wafer on workstation (1), the height that highly lies in laser scanner (2) of side on backup pad (4) and the height of scanning receiver (3) between.

2. The full-automatic wafer crack inspection machine of claim 1, wherein: one side of workstation (1) is fixed and is equipped with first elevating platform (5), it is equipped with electronic clamping jaw (6) that are used for pressing from both sides the clamp to slide on first elevating platform (5), fixed first electric jar (7) that are used for driving electronic clamping jaw (6) and slide on first elevating platform (5).

3. The full-automatic wafer crack inspection machine of claim 2, wherein: the electric clamping jaw (6) comprises a first sub-jaw (61) and a second sub-jaw (62), and clamping plates (8) are fixedly arranged on the opposite sides of the first sub-jaw (61) and the second sub-jaw (62).

4. The full-automatic wafer crack inspection machine of claim 3, wherein: elastic pads (9) are fixedly arranged on the opposite side surfaces of the two clamping plates (8).

5. The full-automatic wafer crack inspection machine of claim 2, wherein: one side of the workbench (1), which faces away from the first lifting table (5), is provided with a wafer placing box (10), a placing plate (11) for horizontally placing wafers is fixedly arranged in the wafer placing box (10), and one side, close to the workbench (1), of the wafer placing box (10) is provided with an opening.

6. The full-automatic wafer crack inspection machine of claim 5, wherein: one side of the placing plate (11) close to the workbench (1) is provided with a notch.

7. The full-automatic wafer crack inspection machine of claim 5, wherein: the wafer placing box is characterized in that the placing plates (11) are arranged in a plurality of layers, the placing plates (11) are distributed in the wafer placing box (10), a second lifting table (12) is fixedly arranged on one side of the workbench (1), and the wafer placing box (10) is located on the upper side face of the second lifting table (12).

8. The full-automatic wafer crack inspection machine of claim 7, wherein: one side of workstation (1) is fixed and is equipped with two support frames (13), two support frame (13) all are located between second elevating platform (12) and workstation (1), the height that highly is greater than backup pad (4) of support frame (13), the upside of support frame (13) is rotated and is connected with gyro wheel (14).

9. The full-automatic wafer fragment inspection machine of claim 8, wherein: and a rubber sleeve (15) is fixedly arranged on the surface of the roller (14).

10. The full-automatic wafer crack inspection machine of claim 1, wherein: the support plate (4) is connected with the workbench (1) in a sliding mode, and two second electric cylinders (16) which drive the support plate (4) to slide are fixedly arranged on the workbench (1).