CN111902383B - 复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 - Google Patents
复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 Download PDFInfo
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- CN111902383B CN111902383B CN201980018676.4A CN201980018676A CN111902383B CN 111902383 B CN111902383 B CN 111902383B CN 201980018676 A CN201980018676 A CN 201980018676A CN 111902383 B CN111902383 B CN 111902383B
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JPPCT/JP2018/012832 | 2018-03-28 | ||
JP2018012832 | 2018-03-28 | ||
PCT/JP2019/009511 WO2019188148A1 (ja) | 2018-03-28 | 2019-03-08 | 複合焼結体、半導体製造装置部材および複合焼結体の製造方法 |
Publications (2)
Publication Number | Publication Date |
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CN111902383A CN111902383A (zh) | 2020-11-06 |
CN111902383B true CN111902383B (zh) | 2022-12-16 |
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Application Number | Title | Priority Date | Filing Date |
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CN201980018676.4A Active CN111902383B (zh) | 2018-03-28 | 2019-03-08 | 复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 |
Country Status (6)
Country | Link |
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US (1) | US11845697B2 (ja) |
JP (1) | JP7248653B2 (ja) |
KR (1) | KR102497967B1 (ja) |
CN (1) | CN111902383B (ja) |
TW (1) | TWI728327B (ja) |
WO (1) | WO2019188148A1 (ja) |
Families Citing this family (4)
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DE102016224443A1 (de) * | 2016-12-08 | 2018-06-14 | Siemens Aktiengesellschaft | Erosionsbeständiger keramischer Werkstoff, Pulver, Schlicker und Bauteil |
US11837489B2 (en) * | 2018-03-23 | 2023-12-05 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device and production method for electrostatic chuck device |
JP2021054677A (ja) * | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | セラミック構造体 |
WO2023068159A1 (ja) * | 2021-10-18 | 2023-04-27 | 日本特殊陶業株式会社 | アルミナ質焼結体、および静電チャック |
Citations (8)
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JPH06107454A (ja) * | 1992-09-25 | 1994-04-19 | Toshiba Tungaloy Co Ltd | アルミナ系焼結体及びその製造方法 |
JPH09208296A (ja) * | 1996-01-31 | 1997-08-12 | Kyocera Corp | 電子部品用セラミック基板 |
JP2002324833A (ja) * | 2002-03-15 | 2002-11-08 | Sumitomo Osaka Cement Co Ltd | 静電チャック |
JP2005272293A (ja) * | 2004-02-23 | 2005-10-06 | Kyocera Corp | 酸化アルミニウム質焼結体とこれを用いた半導体製造装置用部材並びに液晶製造装置用部材 |
CN101045635A (zh) * | 2007-03-22 | 2007-10-03 | 武汉科技大学 | 一种陶瓷化Al2O3-SiC质耐火砖及其制备方法 |
CN101844916A (zh) * | 2009-03-26 | 2010-09-29 | 日本碍子株式会社 | 氧化铝烧结体、其制法和半导体制造装置部件 |
CN102167569A (zh) * | 2010-12-28 | 2011-08-31 | 高树森 | 矾土基纳米复合氧化物陶瓷结合Al2O3-MgO-C不烧制品及其制备方法 |
JP2012216816A (ja) * | 2011-03-30 | 2012-11-08 | Ngk Insulators Ltd | 静電チャックの製法及び静電チャック |
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US5175132A (en) * | 1991-11-19 | 1992-12-29 | Ketcham Thomas D | Sinterable ceramic compositions |
US5482907A (en) * | 1994-05-26 | 1996-01-09 | National Science Council | Ceramic composite containing a spinel phase and an oxide phase and the preparation thereof |
JP5057620B2 (ja) * | 2000-08-28 | 2012-10-24 | 京セラ株式会社 | 低温焼成セラミック焼結体、並びに配線基板 |
US7304010B2 (en) * | 2004-02-23 | 2007-12-04 | Kyocera Corporation | Aluminum oxide sintered body, and members using same for semiconductor and liquid crystal manufacturing apparatuses |
CN1654429A (zh) * | 2005-01-14 | 2005-08-17 | 李根法 | 用于生产结构陶瓷的氧化物共晶复合粉末烧结助剂及其制备方法 |
US20070259768A1 (en) * | 2006-05-03 | 2007-11-08 | Kear Bernard H | Nanocomposite ceramic and method for producing the same |
CN101265082A (zh) | 2008-04-24 | 2008-09-17 | 烁光特晶科技有限公司 | 一种透明镁铝尖晶石陶瓷的制备方法 |
JP5501040B2 (ja) * | 2009-03-26 | 2014-05-21 | 日本碍子株式会社 | アルミナ焼結体、その製法及び半導体製造装置部材 |
CN101786872A (zh) * | 2010-03-02 | 2010-07-28 | 中国地质大学(北京) | 一种纳米级透明镁铝尖晶石陶瓷材料及其制备方法 |
JP6032022B2 (ja) | 2013-01-16 | 2016-11-24 | 住友大阪セメント株式会社 | 誘電体材料 |
JP5614603B1 (ja) | 2013-12-03 | 2014-10-29 | Toto株式会社 | ボンディングキャピラリ |
CN104761251B (zh) * | 2015-03-31 | 2016-10-05 | 中南大学 | 一种制备镁铝尖晶石的反应烧结方法 |
JP6636307B2 (ja) | 2015-11-27 | 2020-01-29 | 株式会社ニッカトー | 高温特性及び耐食性に優れたアルミナ焼結体 |
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2019
- 2019-03-08 KR KR1020207029652A patent/KR102497967B1/ko active IP Right Grant
- 2019-03-08 WO PCT/JP2019/009511 patent/WO2019188148A1/ja active Application Filing
- 2019-03-08 CN CN201980018676.4A patent/CN111902383B/zh active Active
- 2019-03-08 JP JP2020509802A patent/JP7248653B2/ja active Active
- 2019-03-20 TW TW108109447A patent/TWI728327B/zh active
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2020
- 2020-09-16 US US17/022,492 patent/US11845697B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06107454A (ja) * | 1992-09-25 | 1994-04-19 | Toshiba Tungaloy Co Ltd | アルミナ系焼結体及びその製造方法 |
JPH09208296A (ja) * | 1996-01-31 | 1997-08-12 | Kyocera Corp | 電子部品用セラミック基板 |
JP2002324833A (ja) * | 2002-03-15 | 2002-11-08 | Sumitomo Osaka Cement Co Ltd | 静電チャック |
JP2005272293A (ja) * | 2004-02-23 | 2005-10-06 | Kyocera Corp | 酸化アルミニウム質焼結体とこれを用いた半導体製造装置用部材並びに液晶製造装置用部材 |
CN101045635A (zh) * | 2007-03-22 | 2007-10-03 | 武汉科技大学 | 一种陶瓷化Al2O3-SiC质耐火砖及其制备方法 |
CN101844916A (zh) * | 2009-03-26 | 2010-09-29 | 日本碍子株式会社 | 氧化铝烧结体、其制法和半导体制造装置部件 |
CN102167569A (zh) * | 2010-12-28 | 2011-08-31 | 高树森 | 矾土基纳米复合氧化物陶瓷结合Al2O3-MgO-C不烧制品及其制备方法 |
JP2012216816A (ja) * | 2011-03-30 | 2012-11-08 | Ngk Insulators Ltd | 静電チャックの製法及び静電チャック |
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KR102497967B1 (ko) | 2023-02-10 |
TWI728327B (zh) | 2021-05-21 |
JPWO2019188148A1 (ja) | 2021-04-08 |
TW201942089A (zh) | 2019-11-01 |
WO2019188148A1 (ja) | 2019-10-03 |
US20200407279A1 (en) | 2020-12-31 |
CN111902383A (zh) | 2020-11-06 |
JP7248653B2 (ja) | 2023-03-29 |
KR20200131884A (ko) | 2020-11-24 |
US11845697B2 (en) | 2023-12-19 |
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