CN111902383B - 复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 - Google Patents

复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 Download PDF

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CN111902383B
CN111902383B CN201980018676.4A CN201980018676A CN111902383B CN 111902383 B CN111902383 B CN 111902383B CN 201980018676 A CN201980018676 A CN 201980018676A CN 111902383 B CN111902383 B CN 111902383B
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sintered body
composite sintered
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alumina
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CN111902383A (zh
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阿闭恭平
西村升
永井明日美
胜田祐司
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NGK Insulators Ltd
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CN201980018676.4A 2018-03-28 2019-03-08 复合烧结体、半导体制造装置部件以及复合烧结体的制造方法 Active CN111902383B (zh)

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JPPCT/JP2018/012832 2018-03-28
JP2018012832 2018-03-28
PCT/JP2019/009511 WO2019188148A1 (ja) 2018-03-28 2019-03-08 複合焼結体、半導体製造装置部材および複合焼結体の製造方法

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CN111902383B true CN111902383B (zh) 2022-12-16

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US (1) US11845697B2 (ja)
JP (1) JP7248653B2 (ja)
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CN (1) CN111902383B (ja)
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US11837489B2 (en) * 2018-03-23 2023-12-05 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device and production method for electrostatic chuck device
JP2021054677A (ja) * 2019-09-30 2021-04-08 京セラ株式会社 セラミック構造体
WO2023068159A1 (ja) * 2021-10-18 2023-04-27 日本特殊陶業株式会社 アルミナ質焼結体、および静電チャック

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JPH09208296A (ja) * 1996-01-31 1997-08-12 Kyocera Corp 電子部品用セラミック基板
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WO2019188148A1 (ja) 2019-10-03
US20200407279A1 (en) 2020-12-31
CN111902383A (zh) 2020-11-06
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KR20200131884A (ko) 2020-11-24
US11845697B2 (en) 2023-12-19

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