CN111867232A - 线路载板结构及其制作方法与芯片封装结构 - Google Patents

线路载板结构及其制作方法与芯片封装结构 Download PDF

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CN111867232A
CN111867232A CN201910699564.1A CN201910699564A CN111867232A CN 111867232 A CN111867232 A CN 111867232A CN 201910699564 A CN201910699564 A CN 201910699564A CN 111867232 A CN111867232 A CN 111867232A
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layer
circuit
glass substrate
warping
conductive
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CN111867232B (zh
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林建辰
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Unimicron Technology Corp
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Unimicron Technology Corp
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Abstract

本发明提供一种线路载板结构及其制作方法与芯片封装结构，线路载板结构包括玻璃基板、抗翘层、导电层、增层线路层以及导电通孔。玻璃基板具有第一表面、与第一表面相对的第二表面以及贯穿玻璃基板的穿槽。抗翘层配置于玻璃基板的第一表面上，具有至少一第一开孔以及第二开口。导电层配置于抗翘层的第一开孔内。增层线路层配置于玻璃基板的第二表面上。导电通孔贯穿玻璃基板，以使导电层通过导电通孔与增层线路层电性连接。导电通孔对应于抗翘层的第一开孔设置，穿槽对应于抗翘层的第二开口设置，且穿槽暴露出部分增层线路层。

Description

线路载板结构及其制作方法与芯片封装结构
技术领域
本发明涉及一种线路载板结构及其制作方法，尤其涉及一种具有抗翘层的线路载板结构及其制作方法与芯片封装结构。
背景技术
目前，在电路板的线路载板结构中，线路载板结构通常会包括多层的线路层及介电层。然而，当于线路载板的单面进行增层时，容易造成线路载板有翘曲的问题。此外，当线路载板的材质(例如是BT树脂)的平整性不佳且刚性不足时，也不适合在线路载板上进行细线路的制作。另外，当以激光加工的方式在线路载板中制作凹槽时，也常会因为热效应而导致线路剥离的问题。
发明内容
本发明提供一种线路载板结构及其制作方法，其可改善线路载板有翘曲、平整性不佳、刚性不足的问题，具有较佳的可靠度。
本发明提供一种芯片封装结构，包括上述的线路载板结构，具有较佳的封装良率。
本发明的线路载板结构包括玻璃基板、抗翘层、导电层、增层线路层以及导电通孔。玻璃基板具有第一表面、与第一表面相对的第二表面以及贯穿玻璃基板的穿槽。抗翘层配置于玻璃基板的第一表面上，具有至少一第一开孔以及第二开口。导电层配置于抗翘层的第一开孔内。增层线路层配置于玻璃基板的第二表面上。导电通孔贯穿玻璃基板，以使导电层通过导电通孔与增层线路层电性连接。导电通孔对应于抗翘层的第一开孔设置，穿槽对应于抗翘层的第二开口设置，且穿槽暴露出部分增层线路层。
在本发明的一实施例中，上述的增层线路层至少包括第一线路层、至少一介电层、至少一第二线路层以及多个导通孔。第一线路层配置于玻璃基板的第二表面上。介电层配置于第一线路层上。第二线路层配置于介电层上。导通孔贯穿介电层，并电性连接第一线路层与第二线路层。玻璃基板与第二线路层分别位于介电层的相对两侧。
在本发明的一实施例中，上述的穿槽暴露出增层线路层的第一线路层的部分线路。
在本发明的一实施例中，上述的抗翘层的材料为感光型介电材料(Photoimageable dielectric，PID)。
在本发明的一实施例中，上述的穿槽连接玻璃基板的第一表面与第二表面。
本发明的芯片封装结构包括上述的线路载板结构以及芯片。芯片配置于线路载板结构的穿槽内。焊球配置于芯片上。
本发明的线路载板结构的制作方法包括以下步骤。提供玻璃基板。玻璃基板具有第一表面以及与第一表面相对的第二表面。形成增层线路层于玻璃基板的第二表面上。形成抗翘层于玻璃基板的第一表面上。抗翘层具有至少一第一开孔以及第二开口。形成导电通孔，且导电通孔贯穿玻璃基板。形成导电层于抗翘层的第一开孔内，以使导电层通过导电通孔与增层线路层电性连接。形成穿槽，且穿槽贯穿玻璃基板并暴露出部分增层线路层。导电通孔对应于抗翘层的第一开孔设置，且穿槽对应于抗翘层的第二开口设置。
在本发明的一实施例中，上述形成增层线路层的步骤包括以下步骤。形成第一线路层于玻璃基板的第二表面上。形成介电层于第一线路层上。形成第二线路层于介电层上。形成多个导通孔。导通孔贯穿介电层，并电性连接第一线路层与第二线路层。玻璃基板与第二线路层分别位于介电层的相对两侧。
基于上述，本发明的线路载板结构包括玻璃基板、抗翘层、导电层、增层线路层以及导电通孔。抗翘层配置于玻璃基板的第一表面上，导电层配置于抗翘层的第一开孔内。增层线路层配置于玻璃基板的第二表面上。导电通孔贯穿玻璃基板，以使导电层通过导电通孔与增层线路层电性连接。其中，抗翘层可用以对抗制作增层线路层时所产生的应力，玻璃基板可提供较佳的平整性以及刚性，玻璃基板可以蚀刻的方式形成穿槽。藉此，使得本发明的线路载板结构及其制作方法，可改善线路载板有翘曲、平整性不佳、刚性不足的问题，具有较佳的可靠度。
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，并配合附图作详细说明如下。
附图说明
图1A至图1G示出为本发明一实施例的一种线路载板结构的制作方法的剖面示意图；
图2示出为本发明一实施例的一种芯片封装结构的剖面示意图。
附图标记说明
10：芯片封装结构
100：线路载板结构
110：玻璃基板
111：第一表面
112：第二表面
113：通孔
120：增层线路层
121：第一线路层
121a：部分线路
122、122a：介电层
123、123a：导通孔
124、124a：第二线路层
130：抗翘层
131：第一开孔
132：第二开口
133：上表面
140、140a：光致抗蚀剂层
141：开口
150：导电通孔
160：导电层
161：顶表面
170：第一防焊层
171、171a：开口
172：第二防焊层
180：穿槽
200：芯片
200a：主动表面
210：焊球
具体实施方式
图1A至图1G示出为本发明一实施例的一种线路载板结构的制作方法的剖面示意图。
请参照图1A，在本实施例中，先提供玻璃基板110。其中，玻璃基板110具有第一表面111以及与第一表面111相对的第二表面112。
接着，请同时参照图1A与图1B，形成增层线路层120于玻璃基板110的第二表面112上。详细来说，在本实施例中，形成增层线路层120的步骤包括以下步骤：首先，在玻璃基板110的第二表面112上形成第一线路层121。在一些实施例中，形成第一线路层121的方法例如是，先在玻璃基板110的第二表面112上形成晶种层，且晶种层例如是包括钛层及位于钛层之上的铜层。接着，在晶种层上形成图案化光致抗蚀剂层，以暴露出部分的晶种层。接着，例如是以电镀的方式在暴露出的晶种层上形成导电材料。其中，导电材料可为金属或金属合金，例如是铜、钛、钨、铝等或其组合。接着，移除光致抗蚀剂以及部分晶种层，以形成第一线路层121。在另一些实施例中，第一线路层121可直接接触玻璃基板110。
然后，在形成第一线路层121于玻璃基板110的第二表面112上之后，将介电层122压合于第一线路层121上。介电层122覆盖第一线路层121以及玻璃基板110的第二表面112，并使第一线路层121内埋于介电层122中。接着，再形成多个导通孔123以及第二线路层124。具体来说，在介电层122中形成导通孔123，以使导通孔123贯穿介电层122。在介电层122上形成第二线路层124，以使玻璃基板110与第二线路层124分别位于介电层122的相对两侧。其中，导通孔123电性连接第一线路层121与第二线路层124。
特别要说明的是，由于玻璃基板110的平整性佳，因而使得形成在玻璃基板110上的第一线路层121以及第二线路层124可以是细线路。此外，虽然本实施例的增层线路层120至少包括一个第一线路层121、一个介电层122、一个第二线路层124以及多个导通孔123，但本发明并不以此为限。也就是说，在其他实施例中，增层线路层还可包括一个以上的介电层(例如是介电层122a)以及一个以上的第二线路层(例如是第二线路层124a)，如图1E所示。
而后，请参照图1C，形成抗翘层130于玻璃基板110的第一表面111上，并压合介电层122a于第二线路层124上。其中，抗翘层130具有至少一第一开孔131(图1C中示意地示出为四个)以及第二开口132。第一开孔131与第二开口132分别暴露出部分的玻璃基板110。在本实施例中，抗翘层130的材料例如是感光型介电材料(Photoimageable dielectric，PID)或其他适合的高收缩材料，但不以此为限。在一些实施例中，抗翘层130的材料不包括导电材料。在另一些实施例中，抗翘层130可直接接触玻璃基板110。此外，介电层122a覆盖介电层122，并暴露出部分第二线路层124。
特别要说明的是，由于抗翘层130形成在玻璃基板110的第一表面111上，使得抗翘层130可用以对抗增层线路层120在玻璃基板110的第二表面112上所产生的应力，进而可避免本实施例的线路载板结构100有翘曲的问题。此外，由于对习知的介电层材料进行图案化时需要以激光加工的方式，因而会有易损伤玻璃的问题，然而，在本实施例中，抗翘层130的材料为感光型介电材料，因而使得在对抗翘层130进行图案化时可利用微影蚀刻的方式，藉此可避免对玻璃基板110造成损伤。
然后，请参照图1D，在玻璃基板110上形成光致抗蚀剂层140，并在介电层122a上形成光致抗蚀剂层140a。其中，光致抗蚀剂层140覆盖抗翘层130。光致抗蚀剂层140具有多个开口141(图1D中示意地示出为四个)，且开口141对应于抗翘层130的第一开孔131设置。此外，光致抗蚀剂层140a覆盖介电层122a以及由介电层122a暴露出的部分第二线路层124。在本实施例中，光致抗蚀剂层140、140a例如是干膜，但不以此为限。
请继续参照图1D，在玻璃基板110中形成多个通孔113，以使通孔113贯穿玻璃基板110。其中，通孔113可对应于光致抗蚀剂层140的开口141以及抗翘层130的第一开孔131设置。通孔113可连接玻璃基板110的第一表面111与第二表面112，并暴露出增层线路层120的部分第一线路层121。在本实施例中，形成通孔113的方式例如是使用玻璃蚀刻剂对玻璃基板110进行蚀刻，但不以此为限。
接着，请参照图1E，移除光致抗蚀剂层140、140a，并形成导电通孔150、导电层160、导通孔123a以及第二线路层124a。详细来说，将导电材料填入于玻璃基板110的通孔113中以及抗翘层130的第一开孔131内，以分别形成导电通孔150以及导电层160。其中，导电通孔150贯穿玻璃基板110，且导电通孔150对应于抗翘层130的第一开孔131设置。导电层160可通过导电通孔150与增层线路层120的第一线路层121电性连接。此外，导电层160具有背向玻璃基板110的顶表面161，且抗翘层130具有背向玻璃基板110的上表面133。在本实施例中，导电层160的顶表面161可高于抗翘层130的上表面133，但不以此为限。在其他实施例中，导电层160的顶表面161也可以低于抗翘层130的上表面133。
然后，请参照图1F，在抗翘层130上形成第一防焊层170，并在增层线路层120上形成第二防焊层172。详细来说，第一防焊层170覆盖抗翘层130，以使第一防焊层170与玻璃基板110分别位于抗翘层130的相对两侧。第一防焊层170具有开口171、171a。其中，开口171暴露出部分的玻璃基板110，且开口171a暴露出部分的导电层160。第一防焊层170的开口171对应于抗翘层130的第二开口132设置。此外，第二防焊层172覆盖介电层122a，以使第二防焊层172与玻璃基板110分别位于增层线路层120的相对两侧。第二防焊层172暴露出部分的第二线路层124a。
而后，请参照图1G，在玻璃基板110中形成穿槽180。详细来说，在对应于第一防焊层170的开口171以及抗翘层130的第二开口132的玻璃基板110中形成穿槽180。其中，穿槽180贯穿玻璃基板110并连接玻璃基板110的第一表面111与第二表面112。穿槽180暴露出增层线路层120的第一线路层121的部分线路121a。在本实施例中，形成穿槽180的方式例如是使用玻璃蚀刻剂对玻璃基板110进行蚀刻，但不以此为限。此时，以制作完成本实施例的线路载板结构100。
在本实施例中，由于玻璃基板110可以蚀刻的方式形成穿槽180，进而可避免激光加工的热效应而导致第一线路层121有剥离的问题。因此，本实施例线路载板结构100可在穿槽180的底部进行布线(例如是第一线路层121的部分线路121a)，以增加线路利用面积。
虽然本实施例是在玻璃基板110的第二表面112上设置增层线路层120，但不以此为限。也就是说，在其他未示出的实施例中，也可在玻璃基板110的第一表面111上设置增层线路层，以使所述增层线路层堆叠于抗翘层130的上表面133上。
简言之，本实施例的线路载板结构100包括玻璃基板110、抗翘层130、导电层160、增层线路层120以及导电通孔150。玻璃基板110具有第一表面111、与第一表面111相对的第二表面112以及贯穿玻璃基板110的穿槽180。抗翘层130配置于玻璃基板110的第一表面111上，具有至少一第一开孔131以及第二开口132。导电层160配置于抗翘层130的第一开孔131内。增层线路层120配置于玻璃基板110的第二表面112上。导电通孔150贯穿玻璃基板110，以使导电层160通过导电通孔150与增层线路层120电性连接。导电通孔150对应于抗翘层130的第一开孔131设置，穿槽180对应于抗翘层130的第二开口132设置，且穿槽180暴露出部分增层线路层120。其中，由于抗翘层130可用以对抗制作增层线路层120时所产生的应力，因而可避免线路载板结构100有翘曲的问题。由于玻璃基板110可提供较佳的平整性以及刚性，使得制作的细线路有较佳的可靠性。由于玻璃基板110可以蚀刻的方式形成穿槽180，进而可避免激光加工的热效应而导致第一线路层121有剥离的问题，以使本实施例的线路载板结构100具有较佳的可靠度。
在此必须说明的是，下述实施例沿用前述实施例的元件标号与部分内容，其中采用相同的标号来表示相同或近似的元件，并且省略了相同技术内容的说明。关于省略部分的说明可参考前述实施例，下述实施例不再重复赘述。
图2示出为本发明一实施例的一种芯片封装结构的剖面示意图。请参照图2，在本实施例的芯片封装结构10中，是将芯片200配置于上述图1G所示的线路载板结构100中。详细来说，本实施例的芯片封装结构10包括线路载板结构100、芯片200以及多个焊球210。其中，多个焊球210可设置于芯片200的主动表面200a上，以使芯片200可通过焊球210配置于线路载板结构100的穿槽180中。芯片200也可通过焊球210与增层线路层120的第一线路层121的部分线路121a电性连接。此外，虽然本实施例的芯片封装结构10的芯片200是通过焊球210来配置于线路载板结构100的穿槽180中，但本发明并不对芯片的封装方式加以限制。在一些实施例中，芯片也可以通过凸块来配置于线路载板结构上。在其他实施例中，甚至还可以在芯片与线路载板结构之间加入胶层，例如是底胶(underfill)，以使芯片可以更紧密地贴附在线路载板结构上。
另外，本实施例的芯片封装结构10还可作为中介层(interposer)，或是也可叠加其他的封装结构，以形成叠层封装(package-on-package，POP)结构。
综上所述，本发明的线路载板结构包括玻璃基板、抗翘层、导电层、增层线路层以及导电通孔。抗翘层配置于玻璃基板的第一表面上，导电层配置于抗翘层的第一开孔内。增层线路层配置于玻璃基板的第二表面上。导电通孔贯穿玻璃基板，以使导电层通过导电通孔与增层线路层电性连接。其中，抗翘层可用以对抗制作增层线路层时所产生的应力，玻璃基板可提供较佳的平整性以及刚性，玻璃基板可以蚀刻的方式形成穿槽。藉此，使得本发明的线路载板结构及其制作方法，可改善线路载板有翘曲、平整性不佳、刚性不足的问题，具有较佳的可靠度。此外，本发明提供的一种芯片封装结构，包括上述的线路载板结构，具有较佳的封装良率。
虽然本发明已以实施例揭示如上，然其并非用以限定本发明，任何所属技术领域中技术人员，在不脱离本发明的精神和范围内，当可作些许的更改与润饰，故本发明的保护范围当视权利要求所界定的为准。

Claims (10)

1.一种线路载板结构，其特征在于，包括：
玻璃基板，具有第一表面、与所述第一表面相对的第二表面以及贯穿所述玻璃基板的穿槽；
抗翘层，配置于所述玻璃基板的所述第一表面上，具有至少一第一开孔以及第二开口；
导电层，配置于所述抗翘层的所述至少一第一开孔内；
增层线路层，配置于所述玻璃基板的所述第二表面上；以及
导电通孔，贯穿所述玻璃基板，以使所述导电层通过所述导电通孔与所述增层线路层电性连接，其中所述导电通孔对应于所述抗翘层的所述至少一第一开孔设置，所述穿槽对应于所述抗翘层的所述第二开口设置，且所述穿槽暴露出部分所述增层线路层。
2.根据权利要求1所述的线路载板结构，其特征在于，所述增层线路层至少包括：
第一线路层，配置于所述玻璃基板的所述第二表面上；
至少一介电层，配置于所述第一线路层上；
至少一第二线路层，配置于所述至少一介电层上；以及
多个导通孔，贯穿所述至少一介电层，并电性连接所述第一线路层与所述至少一第二线路层，其中所述玻璃基板与所述至少一第二线路层分别位于所述至少一介电层的相对两侧。
3.根据权利要求2所述的线路载板结构，其特征在于，所述穿槽暴露出所述增层线路层的所述第一线路层的部分线路。
4.根据权利要求1所述的线路载板结构，其特征在于，所述抗翘层的材料为感光型介电材料。
5.根据权利要求1所述的线路载板结构，其特征在于，所述穿槽连接所述玻璃基板的所述第一表面与所述第二表面。
6.一种芯片封装结构，其特征在于，包括：
如权利要求1至5中任一项所述的线路载板结构；
芯片，配置于所述线路载板结构的所述穿槽内，且与所述线路载板结构电性连接。
7.一种线路载板结构的制作方法，其特征在于，包括：
提供玻璃基板，所述玻璃基板具有第一表面以及与所述第一表面相对的第二表面；
形成增层线路层于所述玻璃基板的所述第二表面上；
形成抗翘层于所述玻璃基板的所述第一表面上，且所述抗翘层具有至少一第一开孔以及第二开口；
形成导电通孔，且所述导电通孔贯穿所述玻璃基板；
形成一导电层于所述抗翘层的所述至少一第一开孔内，以使所述导电层通过所述导电通孔与所述增层线路层电性连接；以及
形成一穿槽，且所述穿槽贯穿所述玻璃基板并暴露出部分所述增层线路层，其中所述导电通孔对应于所述抗翘层的所述至少一第一开孔设置，且所述穿槽对应于所述抗翘层的所述第二开口设置。
8.根据权利要求7所述的线路载板结构的制作方法，其特征在于，形成所述增层线路层的步骤包括：
形成第一线路层于所述玻璃基板的所述第二表面上；
形成介电层于所述第一线路层上；
形成第二线路层于所述介电层上；以及
形成多个导通孔，且所述多个导通孔贯穿所述介电层，并电性连接所述第一线路层与所述第二线路层，其中所述玻璃基板与所述第二线路层分别位于所述介电层的相对两侧。
9.根据权利要求8所述的线路载板结构的制作方法，其特征在于，所述穿槽暴露出所述增层线路层的所述第一线路层的一部分线路。
10.根据权利要求7所述的线路载板结构的制作方法，其特征在于，所述抗翘层的材料包括感光型介电材料。
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