CN111816735A - 一种ald制作非晶硅的方法 - Google Patents
一种ald制作非晶硅的方法 Download PDFInfo
- Publication number
- CN111816735A CN111816735A CN202010663155.9A CN202010663155A CN111816735A CN 111816735 A CN111816735 A CN 111816735A CN 202010663155 A CN202010663155 A CN 202010663155A CN 111816735 A CN111816735 A CN 111816735A
- Authority
- CN
- China
- Prior art keywords
- amorphous silicon
- ald
- manufacturing
- introducing
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021417 amorphous silicon Inorganic materials 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 8
- BYLOHCRAPOSXLY-UHFFFAOYSA-N dichloro(diethyl)silane Chemical compound CC[Si](Cl)(Cl)CC BYLOHCRAPOSXLY-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000010926 purge Methods 0.000 claims description 6
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 claims description 5
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 2
- 239000005051 trimethylchlorosilane Substances 0.000 claims description 2
- 238000011065 in-situ storage Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000000231 atomic layer deposition Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02592—Microstructure amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010663155.9A CN111816735B (zh) | 2020-07-10 | 2020-07-10 | 一种ald制作非晶硅的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010663155.9A CN111816735B (zh) | 2020-07-10 | 2020-07-10 | 一种ald制作非晶硅的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111816735A true CN111816735A (zh) | 2020-10-23 |
CN111816735B CN111816735B (zh) | 2023-05-09 |
Family
ID=72842682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010663155.9A Active CN111816735B (zh) | 2020-07-10 | 2020-07-10 | 一种ald制作非晶硅的方法 |
Country Status (1)
Country | Link |
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CN (1) | CN111816735B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100115691A (ko) * | 2009-04-20 | 2010-10-28 | 한국전자통신연구원 | 투명 태양전지 |
US20110269315A1 (en) * | 2010-05-01 | 2011-11-03 | Tokyo Electron Limited | Thin film formation method and film formation apparatus |
CN104795315A (zh) * | 2015-04-15 | 2015-07-22 | 上海华力微电子有限公司 | 一种非晶硅薄膜及一种半导体器件的制造方法 |
CN105870249A (zh) * | 2016-03-24 | 2016-08-17 | 江苏微导纳米装备科技有限公司 | 一种晶硅太阳能电池的制造工艺 |
CN109898072A (zh) * | 2019-01-31 | 2019-06-18 | 长江存储科技有限责任公司 | 半导体处理装置 |
-
2020
- 2020-07-10 CN CN202010663155.9A patent/CN111816735B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100115691A (ko) * | 2009-04-20 | 2010-10-28 | 한국전자통신연구원 | 투명 태양전지 |
US20110269315A1 (en) * | 2010-05-01 | 2011-11-03 | Tokyo Electron Limited | Thin film formation method and film formation apparatus |
CN104795315A (zh) * | 2015-04-15 | 2015-07-22 | 上海华力微电子有限公司 | 一种非晶硅薄膜及一种半导体器件的制造方法 |
CN105870249A (zh) * | 2016-03-24 | 2016-08-17 | 江苏微导纳米装备科技有限公司 | 一种晶硅太阳能电池的制造工艺 |
CN109898072A (zh) * | 2019-01-31 | 2019-06-18 | 长江存储科技有限责任公司 | 半导体处理装置 |
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Publication number | Publication date |
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CN111816735B (zh) | 2023-05-09 |
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Effective date of registration: 20230119 Address after: 518000 Room 103, Building 3, Shekou Lanyuan, Nanshan District, Shenzhen, Guangdong Province Applicant after: Ou Wenkai Address before: 221399 room 1222, office building, No.11 Zhujiang East Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Applicant before: Pule new energy technology (Xuzhou) Co.,Ltd. |
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Effective date of registration: 20230404 Address after: No. 168, West Side of Kechuang Road, High-tech Industrial Development Zone, Taixing City, Taizhou City, Jiangsu Province, 225400 Applicant after: Pule New Energy Technology (Taixing) Co.,Ltd. Address before: 518000 Room 103, Building 3, Shekou Lanyuan, Nanshan District, Shenzhen, Guangdong Province Applicant before: Ou Wenkai |
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