CN112599609B - 一种高效晶体硅太阳能电池及其制备方法 - Google Patents

一种高效晶体硅太阳能电池及其制备方法 Download PDF

Info

Publication number
CN112599609B
CN112599609B CN202011474658.8A CN202011474658A CN112599609B CN 112599609 B CN112599609 B CN 112599609B CN 202011474658 A CN202011474658 A CN 202011474658A CN 112599609 B CN112599609 B CN 112599609B
Authority
CN
China
Prior art keywords
silicon wafer
preparation
sintering
electrode
ammonia gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011474658.8A
Other languages
English (en)
Other versions
CN112599609A (zh
Inventor
任现坤
杨晓君
仲伟佳
葛永见
曹振
郭瑞静
陈冲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Linuo Sunshine Power Technology Co ltd
Original Assignee
Shandong Linuo Sunshine Power Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Linuo Sunshine Power Technology Co ltd filed Critical Shandong Linuo Sunshine Power Technology Co ltd
Priority to CN202011474658.8A priority Critical patent/CN112599609B/zh
Publication of CN112599609A publication Critical patent/CN112599609A/zh
Application granted granted Critical
Publication of CN112599609B publication Critical patent/CN112599609B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1864Annealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1868Passivation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photovoltaic Devices (AREA)

Abstract

本发明涉及太阳能电池技术领域,具体涉及一种高效晶体硅太阳能电池及其制备方法,所述高效晶体硅太阳能电池的制备方法包括:(1)硅片前处理:将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为800~1200℃,时间为30~240min,甲烷的流量为0.8~1.0m3/h,氨气的流量为0.5~0.75m3/h,碳势为0.9%~1.2%;(2)制绒;(3)扩散;(4)刻蚀;(5)钝化;(6)丝网印刷;(7)退火烧结。本发明通过对硅片进行前处理,增强了由SiNx:H薄膜扩散到硅片中的氢的稳定性,减少了一定温度及光照下氢的释放量。

Description

一种高效晶体硅太阳能电池及其制备方法
技术领域
本发明涉及太阳能电池技术领域,具体涉及一种高效晶体硅太阳能电池及其制备方法。
背景技术
随着工业化进程的不断推进和人民生活水平的日益提高,人们对能源的需求越来越大,石油、煤炭等传统化石能源储量有限,可替代传统化石能源的绿色可再生能源逐渐进入研究者视野,太阳能作为一种取之不尽用之不竭的清洁能源受到极大关注。现阶段,对太阳能的研究主要集中在光热利用、光电利用和光化利用等领域。
太阳能电池是太阳能光电利用的一种主要方式,其基本原理是利用光生伏特效应将太阳辐射能直接转换为电能。晶体硅是现阶段太阳能电池的主流材料,晶体硅的表面复合速率对太阳能电池的性能影响很大,必须通过表面钝化的方式降低复合速率。通过PECVD方法生长的SiNx:H薄膜是目前使用最多的钝化方法,SiNx:H薄膜中含有大量的氢,这些氢会在后续的热处理过程中从薄膜中扩散到晶体硅的表面,与晶体硅的悬挂键结合,起到钝化作用。但太阳能电池中氢含量也不宜过高,在一定的温度和光照下,这些氢又会以更快的速度释放,从而导致衰减。
发明内容
针对SiNx:H薄膜所释放的氢与硅片之间形成弱氢键受温度和光照易破坏,影响电池性能的问题,本发明提供一种高效晶体硅太阳能电池及其制备方法,通过对硅片进行前处理,增强了由SiNx:H薄膜扩散到硅片中的氢的稳定性,减少了一定温度及光照下氢的释放量。
第一方面,本发明提供一种高效晶体硅太阳能电池的制备方法,所述制备方法包括如下步骤:
(1)硅片前处理:将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为800~1200℃,时间为30~240min,甲烷的流量为0.8~1.0m3/h,氨气的流量为0.5~0.75m3/h,碳势为0.9%~1.2%;
(2)制绒:待硅片冷却后使用制绒液在硅片表面制绒;
(3)扩散:通过磷扩散,在硅片表面形成P-N结;
(4)刻蚀:刻蚀硅片边缘;
(5)钝化:在硅片的背面生长一层AlOx薄膜,然后采用PECVD方式分别在硅片两面沉积SiNx:H薄膜;
(6)丝网印刷:在硅片的正面印刷正电极,在硅片的背面印刷背电极和背电场;
(7)退火烧结:将硅片置于烧结炉中烧结。
进一步的,所述步骤(1)为将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为900℃,时间为180min,甲烷的流量为0.9m3/h,氨气的流量为0.6m3/h,碳势为1.0%。
进一步的,所述步骤(2)具体为:
在10~15℃下制绒,所述制绒液包括如下重量百分比的原料:
3%氢氧化钠、0.2%十二烷基苯磺酸钠、8%异丙醇,余量为水。
进一步的,所述步骤(3)具体为:
使用扩散炉对硅片进行高温磷扩散,采用三氯氧磷液态源扩散方法,利用氮气将三氯氧磷带入扩散炉中,在800~900℃内通源15~60min。
进一步的,所述步骤(4)为激光刻蚀或湿法刻蚀。
进一步的,所述步骤(5)具体为:
将硅片置于PECVD设备中,加热到400~500℃后通入氨气、硅烷和氮气,其中氮气为保护气体,氨气与硅烷的流量比为4~10:1,沉积功率为6500W,沉积时间为8~12min,在硅片正、背两面沉积SiNx:H薄膜。
进一步的,所述步骤(6)具体为:
硅片背面激光开槽后,在硅片的正面印刷正电极,正电极为Ni/Cu/Ag电极,在硅片的背面印刷背电极和背电场,背电极为Ag电极,背电场为铝背电场,正电极、背电极和背电场印刷后分别在300~400℃下烘干。
进一步的,所述步骤(7)具体为:
将硅片置于烧结炉中烧结退火,烧结温度为600~900℃,烧结时间为15~30min。
第二方面,本发明提供一种采用上述制备方法生产的高效晶体硅太阳能电池。
本发明的有益效果在于,
本发明提供一种高效晶体硅太阳能电池及其制备方法,制备时首先对硅片进行前处理,通过硅片的渗氮、渗碳,使硅片的缺陷处形成碳氮化物,碳氮化物能够对氢产生捕获作用,当SiNx:H薄膜中的H经烧结扩散到硅片中时,能够被碳氮化物钉扎,抑制氢从硅片中的再次逸出,进而避免硅片缺陷再次出现导致的性能衰减。
具体实施方式
为了使本技术领域的人员更好地理解本发明中的技术方案,下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。
实施例1
一种高效晶体硅太阳能电池的制备方法,所述制备方法包括如下步骤:
(1)硅片前处理:将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为900℃,时间为180min,甲烷的流量为0.9m3/h,氨气的流量为0.6m3/h,碳势为1.0%;
(2)制绒:待硅片冷却后,在12℃下制绒使用制绒液在硅片表面制绒,制绒液包括如下重量百分比的原料:
3%氢氧化钠、0.2%十二烷基苯磺酸钠、8%异丙醇,余量为水;
(3)扩散:使用扩散炉对硅片进行高温磷扩散,在硅片表面形成P-N结,采用三氯氧磷液态源扩散方法,利用氮气将三氯氧磷带入扩散炉中,在900℃内通源30min;
(4)刻蚀:激光刻蚀硅片边缘;
(5)钝化:将硅片置于PECVD设备中,加热到450℃后通入氨气、硅烷和氮气,其中氮气为保护气体,氨气与硅烷的流量比为8:1,沉积功率为6500W,沉积时间为10min,在硅片正、背两面沉积SiNx:H薄膜;
(6)丝网印刷:硅片背面激光开槽后,在硅片的正面印刷正电极,正电极为Ni/Cu/Ag电极,在硅片的背面印刷背电极和背电场,背电极为Ag电极,背电场为铝背电场,正电极、背电极和背电场印刷后分别在400℃下烘干;
(7)退火烧结:将硅片置于烧结炉中烧结退火,烧结温度为750℃,烧结时间为30min。
实施例2
一种高效晶体硅太阳能电池的制备方法,所述制备方法包括如下步骤:
(1)硅片前处理:将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为1100℃,时间为150min,甲烷的流量为1.0m3/h,氨气的流量为0.75m3/h,碳势为1.2%;
(2)制绒:待硅片冷却后,在10℃下制绒使用制绒液在硅片表面制绒,制绒液包括如下重量百分比的原料:
3%氢氧化钠、0.2%十二烷基苯磺酸钠、8%异丙醇,余量为水;
(3)扩散:使用扩散炉对硅片进行高温磷扩散,在硅片表面形成P-N结,采用三氯氧磷液态源扩散方法,利用氮气将三氯氧磷带入扩散炉中,在800℃内通源60min;
(4)刻蚀:激光刻蚀硅片边缘;
(5)钝化:将硅片置于PECVD设备中,加热到400℃后通入氨气、硅烷和氮气,其中氮气为保护气体,氨气与硅烷的流量比为6:1,沉积功率为6500W,沉积时间为12min,在硅片正、背两面沉积SiNx:H薄膜;
(6)丝网印刷:硅片背面激光开槽后,在硅片的正面印刷正电极,正电极为Ni/Cu/Ag电极,在硅片的背面印刷背电极和背电场,背电极为Ag电极,背电场为铝背电场,正电极、背电极和背电场印刷后分别在300℃下烘干;
(7)退火烧结:将硅片置于烧结炉中烧结退火,烧结温度为900℃,烧结时间为15min。
对比例1
对比例1与实施例1的区别在于硅片是否经过前处理,实施例1的硅片进行前处理,对比例1的硅片不进行前处理。
对实施例1、2及对比例1制得的电池进行衰减测试(75℃,1倍太阳强度),结果如下表1所示。
表1测试结果
项目 5KWh 60KWh
实施例1 0.68% 2.01%
实施例2 0.77% 2.35%
对比例1 1.03% 2.80%
可以看出,本发明提供的太阳能电池制备方法通过对硅片进行前处理,缓解了硅片中不稳定氢源引起的衰减。
尽管通过优选实施例的方式对本发明进行了详细描述,但本发明并不限于此。在不脱离本发明的精神和实质的前提下,本领域普通技术人员可以对本发明的实施例进行各种等效的修改或替换,而这些修改或替换都应在本发明的涵盖范围内/任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求所述的保护范围为准。

Claims (9)

1.一种高效晶体硅太阳能电池的制备方法,其特征在于,所述制备方法包括如下步骤:
(1)硅片前处理:将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为800~1200℃,时间为30~240min,甲烷的流量为0.8~1.0m3/h,氨气的流量为0.5~0.75m3/h,碳势为0.9%~1.2%;
(2)制绒:待硅片冷却后使用制绒液在硅片表面制绒;
(3)扩散:通过磷扩散,在硅片表面形成P-N结;
(4)刻蚀:刻蚀硅片边缘;
(5)钝化:在硅片的背面生长一层AlOx薄膜,然后采用PECVD方式分别在硅片两面沉积SiNx:H薄膜;
(6)丝网印刷:在硅片的正面印刷正电极,在硅片的背面印刷背电极和背电场;
(7)退火烧结:将硅片置于烧结炉中烧结。
2.如权利要求1所述的制备方法,其特征在于,所述步骤(1)为将洁净的硅片置于碳氮共渗炉中,抽真空后通入甲烷和氨气的混合气体,温度为900℃,时间为180min,甲烷的流量为0.9m3/h,氨气的流量为0.6m3/h,碳势为1.0%。
3.如权利要求1所述的制备方法,其特征在于,所述步骤(2)具体为:
在10~15℃下制绒,所述制绒液包括如下重量百分比的原料:
3%氢氧化钠、0.2%十二烷基苯磺酸钠、8%异丙醇,余量为水。
4.如权利要求1所述的制备方法,其特征在于,所述步骤(3)具体为:
使用扩散炉对硅片进行高温磷扩散,采用三氯氧磷液态源扩散方法,利用氮气将三氯氧磷带入扩散炉中,在800~900℃内通源15~60min。
5.如权利要求1所述的制备方法,其特征在于,所述步骤(4)为激光刻蚀或湿法刻蚀。
6.如权利要求1所述的制备方法,其特征在于,所述步骤(5)具体为:
将硅片置于PECVD设备中,加热到400~500℃后通入氨气、硅烷和氮气,其中氮气为保护气体,氨气与硅烷的流量比为4~10:1,沉积功率为6500W,沉积时间为8~12min,在硅片正、背两面沉积SiNx:H薄膜。
7.如权利要求1所述的制备方法,其特征在于,所述步骤(6)具体为:
硅片背面激光开槽后,在硅片的正面印刷正电极,正电极为Ni/Cu/Ag电极,在硅片的背面印刷背电极和背电场,背电极为Ag电极,背电场为铝背电场,正电极、背电极和背电场印刷后分别在300~400℃下烘干。
8.如权利要求1所述的制备方法,其特征在于,所述步骤(7)具体为:
将硅片置于烧结炉中烧结退火,烧结温度为600~900℃,烧结时间为15~30min。
9.一种高效晶体硅太阳能电池,所述太阳能电池采用如权利要求1~8任一项记载的制备方法生产得到。
CN202011474658.8A 2020-12-15 2020-12-15 一种高效晶体硅太阳能电池及其制备方法 Active CN112599609B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011474658.8A CN112599609B (zh) 2020-12-15 2020-12-15 一种高效晶体硅太阳能电池及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011474658.8A CN112599609B (zh) 2020-12-15 2020-12-15 一种高效晶体硅太阳能电池及其制备方法

Publications (2)

Publication Number Publication Date
CN112599609A CN112599609A (zh) 2021-04-02
CN112599609B true CN112599609B (zh) 2022-07-08

Family

ID=75195408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011474658.8A Active CN112599609B (zh) 2020-12-15 2020-12-15 一种高效晶体硅太阳能电池及其制备方法

Country Status (1)

Country Link
CN (1) CN112599609B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101510576A (zh) * 2009-03-16 2009-08-19 浙江理工大学 提高太阳电池用非晶氢化碳氮化硅薄膜钝化性能的热处理方法
CN105129804A (zh) * 2015-09-01 2015-12-09 中国化学工程第六建设有限公司 多晶硅的生产工艺
CN105340085A (zh) * 2013-06-26 2016-02-17 康斯坦茨大学 用于生产具有稳定效率的光伏元件的方法和设备
CN107464857A (zh) * 2017-08-18 2017-12-12 常州亿晶光电科技有限公司 一种降低perc电池片衰减的镀膜工艺方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880852B (zh) * 2005-12-08 2012-01-25 Ntn株式会社 碳氮共渗方法、机械零件的制造方法及机械零件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101510576A (zh) * 2009-03-16 2009-08-19 浙江理工大学 提高太阳电池用非晶氢化碳氮化硅薄膜钝化性能的热处理方法
CN105340085A (zh) * 2013-06-26 2016-02-17 康斯坦茨大学 用于生产具有稳定效率的光伏元件的方法和设备
CN105129804A (zh) * 2015-09-01 2015-12-09 中国化学工程第六建设有限公司 多晶硅的生产工艺
CN107464857A (zh) * 2017-08-18 2017-12-12 常州亿晶光电科技有限公司 一种降低perc电池片衰减的镀膜工艺方法

Also Published As

Publication number Publication date
CN112599609A (zh) 2021-04-02

Similar Documents

Publication Publication Date Title
CN101937940B (zh) 印刷磷源单步扩散法制作选择性发射结太阳电池工艺
JP5795125B2 (ja) 太陽電池シート及びその熱処理プロセス
CN107681018B (zh) 一种太阳能电池片的低压氧化工艺
CN105895738A (zh) 一种钝化接触n型太阳能电池及制备方法和组件、系统
CN111739957B (zh) N型太阳能电池的选择性掺杂方法
CN106711239A (zh) Perc太阳能电池的制备方法及其perc太阳能电池
CN111092160B (zh) 一种钝化反型结构钙钛矿太阳能电池下界面的方法
CN102842646A (zh) 一种基于n型衬底的ibc电池的制备方法
CN102005501A (zh) 制造太阳能电池的磷扩散方法
CN108010972A (zh) 一种mcce制绒多晶黑硅硅片扩散方法
WO2022166040A1 (zh) 一种适用于hbc电池的硼扩散方法
CN102130211B (zh) 一种改善太阳能电池表面扩散的方法
CN102888584A (zh) 一种基于金刚石薄膜上沉积CdTe薄膜的方法
CN101431122B (zh) 太阳电池减反射膜生产工艺
CN112599609B (zh) 一种高效晶体硅太阳能电池及其制备方法
CN111129212B (zh) 一种降低管式perc太阳能电池光致衰减的方法及应用
WO2023179023A1 (zh) 太阳能电池的制备方法、太阳能电池及发电装置
CN109545976B (zh) 绒面均匀空穴或电子传输膜的液膜高温高浓速涂原位速干制备方法
CN111146308B (zh) 一种用于降低perc双面电池效率衰减的光源再生炉及方法
CN106653954A (zh) 一种多晶硅太阳能电池用二氧化硅钝化层的制备工艺
CN113555468A (zh) 一种提升n型硅片硼扩散方阻均匀性的工艺
CN110265293A (zh) 太阳能电池的p-n结制作工艺
CN111816735B (zh) 一种ald制作非晶硅的方法
CN108110086A (zh) 一种新型氮化硅太阳能电池的制备方法
CN103236470A (zh) 一种晶体硅太阳电池二氧化硅薄膜的制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20220616

Address after: 250000 Room 305, sunshine office building, Linuo wisdom Park, 30766 jingshidong Road, Jinan area, China (Shandong) pilot Free Trade Zone, Jinan City, Shandong Province

Applicant after: Shandong Linuo sunshine Power Technology Co.,Ltd.

Address before: 250103 30766 Licheng Road, Licheng District, Ji'nan, Shandong, 30766

Applicant before: Shandong Linuo Solar Power Holdings Co.,Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant