CN111792911B - 一种智能调温装饰陶瓷板材及其制备方法 - Google Patents

一种智能调温装饰陶瓷板材及其制备方法 Download PDF

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CN111792911B
CN111792911B CN202010669150.7A CN202010669150A CN111792911B CN 111792911 B CN111792911 B CN 111792911B CN 202010669150 A CN202010669150 A CN 202010669150A CN 111792911 B CN111792911 B CN 111792911B
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ceramic
decorative
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temperature
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CN111792911A (zh
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叶德林
马杰
陈然
简润桐
黄佳奇
王亚婕
刘世明
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Foshan Sanshuiguanzhu Ceramics Co ltd
New Pearl Guangdong New Materials Co ltd
Newpearl Group Co Ltd
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Foshan Sanshuiguanzhu Ceramics Co ltd
Guangdong Summit Ceramics Co Ltd
Newpearl Group Co Ltd
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Abstract

本发明公开了一种智能调温陶瓷装饰板材及其制备方法。智能调温陶瓷装饰板材包括陶瓷相变复合装饰层、石墨烯发热膜和绝热保温层，其中陶瓷相变复合装饰层由相变材料和晶须增强多孔陶瓷装饰板材经熔融浸渗工艺复合而成，集相变调温、承载和装饰功能于一体。其制备方法包括：高强度高气孔率晶须增强多孔陶瓷装饰板材制备；相变材料熔融浸渗制备陶瓷相变复合装饰层；陶瓷相变复合装饰层、石墨烯发热膜和绝热保温层粘接复合。相比于现有技术，将相变材料与装饰板材复合为一体，简化结构，减小厚度，利于高效传热，同时辅以石墨烯发热膜，能够在气温寒冷时实现高效供暖，提高室内温度稳定性，节省取暖用电成本。

Description

一种智能调温装饰陶瓷板材及其制备方法
技术领域
本发明属于建筑陶瓷装饰技术领域，主要涉及一种智能调温装饰陶瓷板材及其制备方法。
背景技术
陶瓷砖作为一种物理化学稳定、耐久耐磨的建筑装饰材料，在建筑家居领域被广泛使用，近年来市场上出现了许多功能性瓷砖，在提供装饰效果的同时附带了诸如净化、杀菌或发热的功能。室内温度是建筑家居环境舒适性的重要指标，当外界气温较低时，就需要借助设备来进行取暖，将相变材料与建筑材料结合起来，利用其恒温相变过程中能够吸收或释放大量潜热的原理，可以减小室内温度的波动，延缓热量散失，同时通过利用电网低谷期的电能进行蓄热，在用电高峰将其释放取暖，不仅能调节电负荷峰谷差，充分利用电力资源，提高电网稳定性，另当采用峰谷分价制度时，还能切实的降低用电成本。因此，将相变材料与瓷砖装饰材料进行复合，对于居住的舒适度和用电成本的降低都具有积极的意义。
现有的相变调温瓷砖或地板常需要将相变材料通过封装单独制作为一层，再与陶瓷砖体进行复合，如申请公布号为CN107098681A的专利中将相变材料涂覆于瓷砖上表面；或者如其他专利(CN104962241B，CN204475742U)所描述的，需要开辟专门的空腔或容置槽来放置相变材料。上述相变调温瓷砖的设计不仅增加了结构的厚度和复杂性，影响热量的快速传导，还可能导致砖体表面不耐磨或不美观。
将相变材料与多孔物质进行复合是制备定型相变材料一种常见的方法，但是由于选用的多孔陶瓷气孔率较高，如CN107011868A和CN109321208A中多孔支撑体的孔隙率经换算大约在70～90％之间，高气孔率会导致所制备的定型相变材料强度较低，在使用中不能单独承受载荷，需要其他结构来辅助支撑，大大限制了其使用场景。同时由于表面无耐磨的装饰层，应用范围大大受限。
发明内容
针对现有技术存在的不足，本发明的目的在于提供一种智能调温装饰陶瓷板材，通过将高强度且带有釉面装饰层的晶须增强多孔陶瓷装饰板材与相变材料进行复合，将相变蓄热调温功能和装饰、承载功能结合为一体，相比现有技术简化了相变调温瓷砖的结构，减少了结构热阻，提高了传热效率；并辅以石墨烯发热膜，通过高效的面发热效率和高的热导率，能够在气温降低时实现高效供暖，提高居住环境舒适度。
为实现上述目的，本发明提供的技术方案如下：
一种智能调温装饰陶瓷板材，包括陶瓷相变复合装饰层、石墨烯发热膜和绝热保温层，其中陶瓷相变复合装饰层由相变材料和晶须增强多孔陶瓷装饰板材经熔融浸渗工艺复合而成；
所述晶须增强多孔陶瓷装饰板材由如下原料制备而成：高岭土、煅烧铝矾土、矿化剂、助烧剂和增强剂，所述高岭土、煅烧铝矾土质量比为1:0.1～3.0；所述晶须增强多孔陶瓷装饰板材的气孔率在30～55％之间，孔径分布在0.01～2μm之间，抗折强度大于30MPa；
所述陶瓷相变复合装饰层的制备工艺包括球磨、喷雾干燥、压制成型、第一次烧成、喷墨打印及施釉、第二次烧成、相变材料熔融浸渍和表面清理。
上述提到的熔融浸渗工艺，为本领域常规复合工艺，本领域技术人员熟知其操作过程。熔融浸渗法制备复合相变材料通常是用两种熔点区别很大的物质，高熔点的作为支撑物，制备出有连通网络结构的多孔基体，低熔点的为相变材料熔化渗入多孔基体中。熔融浸渗法一般采用熔体无压浸渗工艺。无压渗入对相变材料熔体及多孔基体有如下要求：①相变材料熔体应对多孔基体浸润；②基体应具有相互连通的渗入通道；③体系组分性质匹配。本发明的晶须增强多孔陶瓷装饰板材和相变材料满足上述要求。
本发明通过优化多孔陶瓷板材的微观孔结构，利用矿化剂和助烧剂的低温催化作用在陶瓷坯体内部原位生成大量的莫来石晶须，借助坯体内部原位自生的莫来石晶须强化作用，采用传统的干法压制工艺，在无造孔剂和发泡剂的情况下低温(<1200℃)制备气孔率在30～55％之间，抗折强度高于30MPa的轻质陶瓷板材，克服了传统多孔陶瓷轻质与高强度间的矛盾，获得了轻质高强的多孔陶瓷。本发明原料配方中引入了碳化硅颗粒作为增强剂，其中，碳化硅粉体对坯体的增强机理是利用其在高温下的氧化反应来促进传质，通过反应烧结起到粘接莫来石晶须、提高制品强度的目的，同时又不降低制品的气孔率。因此，就作用机理来讲，本发明中引入的碳化硅颗粒完全不同于发泡陶瓷中的发泡剂，不利用其高温下产生气体的发泡造孔作用，仅起到粘接晶须，强化坯体强度的作用。本发明陶瓷相变复合装饰层将相变材料与多孔陶瓷复合，相变材料位于多孔陶瓷内部的孔洞中，相变材料具有相变功能，当相变材料从一个相态变化到另一个相态时会吸收或放出热量。例如选用相变点为40℃的阻燃石蜡熔体时，当多孔陶瓷温度高于40℃，石蜡从固态转变到液态，会吸收热量，从而降低多孔陶瓷温度。同样，当多孔陶瓷温度低于40℃，石蜡又从液态转变到固态，会放出热量，从而提高多孔陶瓷温度。因此，通过相变材料相变的来回转换，可起到一个调温的作用。
本发明所述智能调温装饰陶瓷板材的制备工艺包括以下具体步骤：
S1.将高岭土、煅烧铝矾土置于球磨装置内，同时加入矿化剂、助烧剂、增强剂，以水为球磨介质球磨12～24小时获得陶瓷浆料，经喷雾干燥获得坯体粉料；
具体地，所述的高岭土化学组成中氧化铝质量分数高于32％，所述煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％之间。
具体地，所述的矿化剂为氟化铝，添加量占坯体粉料的3～5wt％；助烧剂为氧化钼或氧化铈中的一种，添加量占坯体粉料的3～5wt％；增强剂为碳化硅粉体，其平均粒径在5～30μm之间，添加量占坯体粉料的5～10wt％。
具体地，所述的陶瓷浆料的中位径D50在2～10μm之间，所述的坯体粉料的化学组成中氧化铝质量分数在50％～72％之间。本发明中所述的中位径D50是指，一个样品的累计粒度分布百分数达到50％时所对应的粒径。它的物理意义是粒径大于它的颗粒占50％，小于它的颗粒也占50％，D50也叫中位径或中值粒径。
S2.将S1中获得的坯体粉料压制成陶瓷生坯，压制压力在10～40MPa之间；
S3.将S2中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，待冷却后在坯体上表面进行图案装饰和施釉操作，干燥后送入窑炉中进行第二次烧成，获得晶须增强多孔陶瓷装饰板材；
具体地，所述的第一次烧成温度依原料配比的不同而控制在1100～1250℃之间，第二次烧成温度控制在1050～1150℃之间；所述的图案装饰和施釉操作指在生坯上表面分别施加喷墨装饰层和保护釉层，省去了常规施加打底增白釉层的工序，这是由于本发明所制备的高气孔坯体中的微气孔对光线会产生明显散射作用，坯体自身白度较高(>65度)，无需利用底釉进行打底增白。
S4.在60～120℃下将相变材料通过熔融浸渍工艺渗入S3获得的晶须增强多孔陶瓷装饰板材中，表面清理后获得陶瓷相变复合装饰层；
S5.将获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层通过粘接剂粘接，即得；其中石墨烯发热膜位于陶瓷相变复合装饰层和绝热保温层中间。
具体地，所述石墨烯发热膜厚度在0.1～1mm之间，发热功率在20～200W/m2之间，面内热导率在1000～2000W/(m·K)之间，其发热功率或温度可通过设置内置的控制器进行调节和监控。
具体地，所述的相变材料为阻燃石蜡或脂肪酸类有机相变材料，相变点在27～50℃之间，相变潜热大于100J/g。
本发明的绝热保温层可采用本领域常规使用的绝热保温材料。具体地，所述绝热保温层为阻燃聚氨酯保温板。粘接剂是采用环氧类树脂胶或酚醛类树脂胶，无毒无味无污染，柔性好，达到环保的目的。粘接剂厚度为0.1mm-0.2mm。
本发明中，多孔陶瓷板材厚度在3～22mm之间，高的气孔率为相变材料提供了较大的存储空间，优异的力学强度使其可单独承受载荷，同时通过喷墨和施釉工艺，在板材表面形成用于装饰的图案花纹，使得本发明的相变调温瓷砖具有了承载、控温和装饰的功能；所述相变材料为阻燃石蜡或脂肪酸类有机相变材料，相变点在27～50℃之间，相变潜热大于100J/g；所述石墨烯发热膜经供电后可进行发热取暖，同时兼具均热的作用，其发热功率或温度可通过设置内置的控制器进行调节和监控。将相变材料与装饰板材复合为一体，简化结构，减小厚度，利于高效传热，同时辅以石墨烯发热膜，能够在气温寒冷时实现高效供暖，提高室内温度稳定性，节省取暖用电成本。
与现有技术相比，本发明的有益效果：
(1)本发明借助原位自生的莫来石晶须增强作用，克服了传统多孔瓷砖轻质与高强度间的矛盾，在不添加造孔剂和发泡剂的条件下获得了低密度(<1.8g/cm3)、高气孔(30～50％)和高强度(>30MPa)的多孔陶瓷板材。本发明原料配方中引入了碳化硅粉体作为增强剂，其中，碳化硅粉体对坯体的增强机理是利用其在高温下的氧化反应来促进传质，通过反应烧结起到粘接莫来石晶须、提高制品强度的目的，同时又不降低制品的气孔率。
(2)本发明将相变材料熔渗于晶须增强多孔陶瓷装饰板材中，使其成为具有承载、相变调温和装饰的功能，简化了传统相变调温瓷砖的结构及厚度，减少了结构热阻，提高了传热效率；并辅以石墨烯发热膜，通过高效的面发热效率和热导率，能够在气温降低时实现高效供暖，提高居住环境舒适度。
附图说明
图1为实施例1制备的晶须增强多孔陶瓷装饰板材的微观孔结构电子扫描照片。
图2为实施例1制备的智能调温装饰陶瓷板材的结构示意图；其中，1为陶瓷相变复合装饰层，2为石墨烯发热膜，3为绝热保温层。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合说明书附图和具体实施例，对本发明进一步详细说明，但本发明要求的保护范围并不局限于实施例。
下述实施例所采用的原料如无特殊说明，均为市售。
性能测试方法：本发明中陶瓷板材的气孔率和平均孔径均按照国家标准GB/T21650.1-2008《压汞法和气体吸附法测定固体材料孔径分布和孔隙度第1部分：压汞法》测量，抗折强度按照国家标准GB/T1965-1996《多孔陶瓷弯曲强度试验方法》测量。
实施例1:
智能调温装饰陶瓷板材的制备：
(a)各称量高岭土300kg、煅烧铝矾土150kg、矿化剂氟化铝18kg、助烧剂氧化钼18kg和增强剂碳化硅24kg(平均粒径为10μm)，置于球磨罐中，加入水，球磨混合12小时，获得中位径为7.0μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，高岭土化学组成中氧化铝质量分数高于32％，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为20MPa，保压时间为10s。
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1200℃，时间1h，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为0.5h；获得晶须增强多孔陶瓷装饰板材，其气孔率为40％，抗折强度33MPa，平均孔径为0.7μm，板材厚度为10mm。
(d)在90℃下将相变点为40℃的阻燃石蜡熔体渗入步骤(c)中获得的晶须增强多孔陶瓷装饰板材微孔内部，并经表面清理后获得陶瓷相变复合装饰层。
(e)将步骤(d)中获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层从上到下通过粘接剂依次粘接，最终获得所述智能调温陶瓷装饰板材。石墨烯发热膜厚度在0.1～0.3mm之间，绝热保温层厚度为5mm，粘接剂采用环氧类树脂胶或酚醛类树脂胶。
实施例2:
智能调温装饰陶瓷板材的制备：
(a)各称量高岭土300kg、煅烧铝矾土150kg、矿化剂氟化铝13kg、助烧剂氧化钼22kg和增强剂碳化硅25kg(平均粒径为10μm)，置于球磨罐中，加入水，球磨混合12小时，获得中位径为7.0μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，高岭土化学组成中氧化铝质量分数高于32％，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为25MPa，保压时间为6s；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1230℃，时间0.5h，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1130℃，时间为0.2h；获得晶须增强多孔陶瓷装饰板材，其气孔率为44％，抗折强度31MPa，平均孔径为0.5μm，板材厚度为6mm；
(d)在90℃下将相变点为40℃的阻燃石蜡熔体渗入步骤(c)中获得的晶须增强多孔陶瓷装饰板材微孔内部，并经表面清理后获得陶瓷相变复合装饰层；
(e)将步骤(d)中获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层从上到下通过粘接剂依次粘接，最终获得所述智能调温陶瓷装饰板材。石墨烯发热膜厚度在0.3～0.5mm之间，绝热保温层厚度为6mm，粘接剂采用环氧类树脂胶或酚醛类树脂胶。
实施例3:
智能调温装饰陶瓷板材的制备：
(a)各称量高岭土300kg、煅烧铝矾土150kg、矿化剂氟化铝18kg、助烧剂氧化铈18kg和增强剂碳化硅24kg(平均粒径为10μm)，置于球磨罐中，加入水，球磨混合18小时，获得中位径为6.5μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，高岭土化学组成中氧化铝质量分数高于32％，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为20MPa，保压时间为7s；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1200℃，时间1h，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为0.4h；获得晶须增强多孔陶瓷装饰板材，其气孔率为40％，抗折强度34MPa，平均孔径为1.1μm，板材厚度为15mm；
(d)在70℃下将相变点为30℃的阻燃脂肪酸相变材料渗入步骤(c)中获得的晶须增强多孔陶瓷装饰板材微孔内部，并经表面清理后获得陶瓷相变复合装饰层；
(e)将步骤(d)中获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层从上到下通过粘接剂依次粘接，最终获得所述智能调温陶瓷装饰板材。石墨烯发热膜厚度在0.5～0.8mm之间，绝热保温层厚度为8mm，粘接剂采用环氧类树脂胶或酚醛类树脂胶。
实施例4:
智能调温装饰陶瓷板材的制备：
(a)各称量高岭土300kg、煅烧铝矾土300kg、矿化剂氟化铝40kg、助烧剂氧化铈40kg和增强剂碳化硅80kg(平均粒径为8μm)，置于球磨罐中，加入水，球磨混合24小时，获得中位径为7.0μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，高岭土化学组成中氧化铝质量分数高于32％，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为32MPa，保压时间为4s；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1250℃，时间0.5h，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1150℃，时间为0.2h；获得晶须增强多孔陶瓷装饰板材，其气孔率为48％，抗折强度33MPa，平均孔径为1.5μm，板材厚度为20mm；
(d)在90℃下将相变点为40℃的阻燃石蜡熔体渗入步骤(c)中获得的晶须增强多孔陶瓷装饰板材微孔内部，并经表面清理后获得陶瓷相变复合装饰层；
(e)将步骤(d)中获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层从上到下通过粘接剂依次粘接，最终获得所述智能调温陶瓷装饰板材。石墨烯发热膜厚度在0.8～1.0mm之间，绝热保温层厚度为10mm，粘接剂采用环氧类树脂胶或酚醛类树脂胶。
实施例5:
智能调温装饰陶瓷板材的制备：
(a)各称量高岭土200kg、煅烧铝矾土400kg、矿化剂氟化铝30kg、助烧剂氧化钼30kg和增强剂碳化硅50kg(平均粒径为15μm)，置于球磨罐中，加入水，球磨混合24小时，获得中位径为7.6μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，高岭土化学组成中氧化铝质量分数高于32％，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为35MPa，保压时间为5s；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1100℃，时间1.5h，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1050℃，时间为0.5h；获得晶须增强多孔陶瓷装饰板材，其气孔率为50％，抗折强度31MPa，平均孔径为0.2μm，板材厚度为13mm；
(d)在70℃下将相变点为30℃的阻燃脂肪酸相变材料渗入步骤(c)中获得的晶须增强多孔陶瓷装饰板材微孔内部，并经表面清理后获得陶瓷相变复合装饰层；
(e)将步骤(d)中获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层从上到下通过粘接剂依次粘接，最终获得所述智能调温陶瓷装饰板材。石墨烯发热膜厚度在0.5～0.7mm之间，绝热保温层厚度为8mm，粘接剂采用环氧类树脂胶或酚醛类树脂胶。
对比例1:
与实施例1相比，不添加增强剂碳化硅，其它操作与实施例1相同。
步骤(c)获得的晶须增强多孔陶瓷装饰板材：气孔率为45％，抗折强度为24MPa，平均孔径0.8μm。
对比例2:
与实施例1相比，在制备原料中，高岭土100kg、煅烧铝矾土350kg；其它操作与实施例1相同。
步骤(c)获得的晶须增强多孔陶瓷装饰板材：气孔率为53％，抗折强度为21MPa，平均孔径0.4μm。
根据上述说明书的揭示和教导，本发明所属领域的技术人员还可以对上述实施方式进行变更和修改。因此，本发明并不局限于上面揭示和描述的具体实施方式，对发明的一些修改和变更也应当落入本发明的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本发明构成任何限制。

Claims (9)

1.一种智能调温装饰陶瓷板材，其特征在于，包括陶瓷相变复合装饰层、石墨烯发热膜和绝热保温层，其中陶瓷相变复合装饰层由相变材料和晶须增强多孔陶瓷装饰板材经熔融浸渗工艺复合而成；
所述晶须增强多孔陶瓷装饰板材由如下原料制备而成：高岭土、煅烧铝矾土、矿化剂、助烧剂和增强剂，所述高岭土、煅烧铝矾土质量比为1:0.1～3.0，增强剂为碳化硅粉体，其平均粒径在5～30μm之间，添加量占原料总重的5～10wt％；所述晶须增强多孔陶瓷装饰板材的气孔率在30～55％之间，孔径分布在0.01～2μm之间，抗折强度大于30MPa；
所述智能调温装饰陶瓷板材的制备方法，包括以下步骤：
S1.将高岭土、煅烧铝矾土置于球磨装置内，同时加入矿化剂、助烧剂、增强剂，以水为球磨介质球磨12～24小时获得陶瓷浆料，经喷雾干燥获得坯体粉料；
S2.将S1中获得的坯体粉料压制成陶瓷生坯，压制压力在10～40MPa之间；
S3.将S2中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，待冷却后在坯体上表面进行图案装饰和施釉操作，干燥后送入窑炉中进行第二次烧成，获得晶须增强多孔陶瓷装饰板材；
S4.在60～120℃下将相变材料通过熔融浸渍工艺渗入S3获得的晶须增强多孔陶瓷装饰板材中，表面清理后获得陶瓷相变复合装饰层；
S5.将获得的陶瓷相变复合装饰层与石墨烯发热膜和绝热保温层通过粘接剂粘接，即得；其中石墨烯发热膜位于陶瓷相变复合装饰层和绝热保温层中间。
2.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，所述陶瓷相变复合装饰层的厚度为3～22mm；所述石墨烯发热膜厚度在0.1～1mm之间，发热功率在20～200W/m 2之间，面内热导率在1000～2000W/(m·K)之间。
3.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，所述绝热保温层为阻燃聚氨酯保温板。
4.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，所述的高岭土化学组成中氧化铝质量分数高于32％，所述煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％之间。
5.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，所述的矿化剂为氟化铝，添加量占原料总重的3～5wt％；助烧剂为氧化钼或氧化铈中的一种，添加量占原料总重的3～5wt％。
6.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，所述的相变材料为阻燃石蜡或脂肪酸类有机相变材料，相变点在27～50℃之间，相变潜热大于100J/g。
7.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，S1所述的陶瓷浆料的中位径D50在2～10μm之间，所述的坯体粉料的化学组成中氧化铝质量分数在50％～72％之间。
8.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，S3所述的第一次烧成温度依原料配比的不同而控制在1100～1250℃之间，第二次烧成温度控制在1050～1150℃之间。
9.根据权利要求1所述智能调温装饰陶瓷板材，其特征在于，S3所述图案装饰和施釉操作是指在坯体表面采用喷墨打印机进行图案打印，然后施加保护釉层，不包含常规的施增白底釉操作。
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