CN111807812B - 一种轻质高强陶瓷装饰板材及其制备方法 - Google Patents
一种轻质高强陶瓷装饰板材及其制备方法 Download PDFInfo
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- CN111807812B CN111807812B CN202010669128.2A CN202010669128A CN111807812B CN 111807812 B CN111807812 B CN 111807812B CN 202010669128 A CN202010669128 A CN 202010669128A CN 111807812 B CN111807812 B CN 111807812B
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Abstract
本发明提供一种轻质高强陶瓷装饰板材及其制备方法，以球土和煅烧铝矾土为原料，辅以矿化剂、助烧剂、增强剂和分散剂，经球磨、喷雾干燥、压制成型、喷墨打印及施釉、两次烧结、抛光和封孔工序制备获得。本发明的有益效果在于，利用矿化剂和助烧剂的低温催化作用在陶瓷坯体内部原位生成大量的莫来石晶须，提高了轻质陶瓷板材的强度，同时轻质高强陶瓷装饰板材中众多的微气孔对光线的散射作用，使得坯体具有较高的白度，省去了常规工序中施增白底釉的工序，简化了工艺流程，且具有良好的装饰效果。另外，通过瓷砖侧面及底面的封孔工序，避免了传统多孔陶瓷板材使用过程中的吸湿膨胀现象。
Description
技术领域
本发明属于建筑陶瓷装饰技术领域，主要涉及一种轻质高强陶瓷装饰板材及其制备方法。
背景技术
瓷砖作为一种优异的建筑装饰材料，在人们的家居生活中占据重要的位置，但生产过程中也消耗了大量的黏土、砂石等矿物原料和能源，对此，各陶瓷企业通过研发薄型瓷砖来降低原料及能量的消耗，除此之外，通过降低瓷砖容重也可以达到相同的目的，即降低了产品的运输及安装成本，也扩大了瓷砖产品的应用领域(如高层建筑、轻质门板柜面等)。
制备轻质多孔陶瓷的方法多种多样，如颗粒堆积法、造孔剂法、挤出成型法、泡沫浸渍法和发泡法。但大多数工艺复杂，成本较高。对于建筑陶瓷领域，制备多孔轻质瓷砖的工艺目前主要有添加造孔剂法和发泡法，前者通过在瓷砖的原料中添加造孔剂或天然多孔组分，如淀粉、硅藻土、蛭石、海泡石、沸石或竹炭等，再通过低温烧制(<1000℃)来获得轻质瓷砖；后者通过添加发泡剂(碳化硅或瓷砖抛光废渣)，利用高温发泡获得低容重的发泡陶瓷。上述两种工艺虽然工艺简单、生产制造成本较低，但其制品强度均较低，大多数低于20MPa。如中国专利，公开号CN105246854A提供一种多孔瓷砖，上述多孔瓷砖包含通过吸湿及防湿功能优秀的γ-氧化铝及粘结剂作用提高强度的玻璃质结合物质，包含约15重量百分比至约60重量百分比的γ-氧化铝及约5重量百分比至约20重量百分比的玻璃质结合物质。其吸湿防湿功能良好，但强度不高(最高约16MPa)。公开号CN106187274A公开了一种表面具有不规则颗粒状凸起的轻质瓷砖及其制备方法，包括砖坯体，按质量份数计算，所述砖坯体的配方包括60～80份陶瓷坯体料和20～40份发泡料；按质量份数计算，所述发泡料的配方包括80～100份陶瓷抛光废渣。该技术方案以陶瓷抛光废渣为发泡料的主要原料，利用具有不同烧成收缩率的陶瓷坯体料和发泡料构成砖坯体。其抗折强度最高为16.1MPa。
多孔陶瓷强度低的主要原因是由于高的气孔率导致其单位面积可承载的结构减少，强度也因此降低，严重限制了多孔陶瓷的使用范围，因此研发一种气孔率高同时强度也高的多孔陶瓷显得十分重要。
发明内容
针对现有技术存在的不足，本发明的目的在于提供一种轻质高强的陶瓷装饰板材，及所述陶瓷装饰板材的制备方法。
为实现上述目的，本发明提供的技术方案如下：
一种轻质高强陶瓷装饰板材，包括如下原料制备而成：球土、煅烧铝矾土、矿化剂、助烧剂、增强剂和分散剂，所述球土、煅烧铝矾土质量比为1:0.1～3.0；在所述球土中，40～80wt％的球土经过900℃高温煅烧2小时，所述的增强剂为碳化硅颗粒或瓷砖抛光废渣；
所述陶瓷装饰板材的显气孔率为30～55％，容重为1.3～1.8g/cm3，抗折强度高于30MPa；所述陶瓷装饰板材的制备工艺包括球磨、喷雾干燥、压制成型、第一次烧成、喷墨打印及施釉、第二次烧成、抛光和封孔工序。
本发明通过优化多孔陶瓷板材的微观孔结构，利用矿化剂和助烧剂的低温催化作用在陶瓷坯体内部原位生成大量的莫来石晶须，借助坯体内部原位自生的莫来石晶须强化作用，采用传统的干法压制工艺，在无造孔剂和发泡剂的情况下低温(<1200℃)制备显气孔率在30～55％之间，抗折强度高于30MPa的轻质陶瓷板材，克服了传统多孔陶瓷轻质与高强度间的矛盾，获得了轻质高强的轻质陶瓷，同时具有工艺简单、成本低的优点。同时由于微小气孔的散射作用，本发明所制备的高强轻质砖坯体具有很高白度(>65度)，因此在施釉环节可去除施加增白底釉环节，不仅减少了工艺环节、降低生产成本，同时也增加了产品的美观性。
本发明的原料配方中引入了碳化硅颗粒或瓷砖抛光废渣作为增强剂，其中，碳化硅粉体对坯体的增强机理是利用其在高温下的氧化反应来促进传质，通过反应烧结起到粘接莫来石晶须、提高制品强度的目的，同时又不降低制品的气孔率；对于瓷砖抛光废渣，其粉体粒径小、熔点低，较低温度下能够产生低粘度液相，部分包裹莫来石晶须，冷却后起到粘接作用，最终达到增强制品强度的作用。因此，就作用机理来讲，本发明中引入的碳化硅颗粒或瓷砖抛光废渣完全不同于发泡陶瓷中的发泡剂，不利用其高温下产生气体的发泡造孔作用，仅起到粘接晶须，强化坯体强度的作用。
本发明所述轻质高强陶瓷装饰板材的制备工艺包括以下具体步骤：
S1.将球土、煅烧铝矾土置于球磨罐内，同时加入矿化剂、助烧剂、增强剂和分散剂，以水为球磨介质球磨12～24小时获得陶瓷浆料，经喷雾干燥获得坯体粉料；
具体的，上述描述中的球土中有40％～80％(质量分数)经过900℃高温煅烧2小时，且应确保煅烧后的球土化学组成中氧化铝含量应高于35％(质量分数)，氧化钛和氧化铁含量合计低于1％(质量分数)，同时所述的煅烧铝矾土的化学组成中氧化铝质量分数在55％～80％(质量分数)之间，氧化钛和氧化铁含量合计低于4％(质量分数)；所述的陶瓷浆料的中位径D50在2～10μm之间，所述的坯体粉料的化学组成中氧化铝质量分数在50％～72％之间。所述的矿化剂为氟化铝，添加量占坯体粉料的1～5％(质量分数)。助烧剂为氧化钼或氧化铈其中的一种，添加量占坯体粉料的3～5％(质量分数)；所述的坯体增强剂为碳化硅颗粒或瓷砖抛光废渣，当选用碳化硅颗粒为增强剂时，其粒径应在2～30μm之间，添加量为5～10％(质量分数)。当选用瓷砖抛光废渣为坯体增强剂时，添加量为5～20％(质量分数)，粒径不作特殊要求。
本发明中所述的中位径D50是指，一个样品的累计粒度分布百分数达到50％时所对应的粒径。它的物理意义是粒径大于它的颗粒占50％，小于它的颗粒也占50％，D50也叫中位径或中值粒径。本发明中的“wt％”指重量百分比。
S2.将S1中获得的坯体粉料经压机压制成陶瓷生坯，压制压力在15～40MPa之间，保压时间3～20秒。
S3.将S2中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，待冷却后在坯体上表面进行图案装饰和施釉操作，干燥后送入窑炉中进行第二次烧成。
具体的，所述的第一次烧成温度依原料配比的不同而控制在1100～1250℃之间，时间为30～120分钟，第二次烧成温度控制在1000～1150℃之间，时间为10～30分钟；所述的图案装饰和施釉操作指在生坯上表面分别施加喷墨装饰层和保护釉层，省去了常规施加打底增白釉层的工序，这是由于本发明所制备的高气孔坯体中的微气孔对光线会产生明显散射作用，坯体自身白度较高，无需利用底釉进行打底增白。
S4.将S3中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材。
具体的，所述的背面及侧面封孔处理是指将溶有树脂类封孔剂的酒精溶液喷涂于陶瓷板材的背面及侧面，经干燥后在陶瓷板材背面及侧面的表面形成一种致密的薄膜，避免所制备的轻质高强陶瓷装饰板材在使用环境中的吸湿膨胀现象。
在本发明中，分散剂采用本领域常规使用的陶瓷分散剂即可。具体地，所述的分散剂主要成分为阴离子型聚合物的盐，添加量为2～8wt％。
在本发明中，轻质高强陶瓷装饰板材的制备过程中还可添加减水剂、粘结剂、悬浮剂中的一种或多种，视具体情况添加。
本发明的有益效果：
1)本发明借助原位自生的莫来石晶须增强作用，克服了传统多孔瓷砖轻质与高强度间的矛盾，在不添加造孔剂和发泡剂的条件下获得了低容重(<1.8g/cm3)、高气孔(30～50％)和高强度(>30MPa)的陶瓷板材。
2)本发明轻质高强陶瓷装饰板材中众多的微气孔对光线的散射作用使得坯体具有极高的白度(>65度)，省去了传统工艺中施加增白底釉的工艺，简化了工序、提高生产效率，且降低了原料成本。
3)本发明中，球土和铝矾土等原料来源广泛、价格低廉，且生产工艺流程与传统建筑陶瓷基本一致，减小了上线投产的设备投入。
4)本发明轻质高强陶瓷装饰板材在生产过程中能够节省原料，同时也能降低运输和安装成本。
5)本发明轻质高强陶瓷装饰板材气孔孔径<10μm，坯体表面平整，经上釉后具有良好的装饰效果，且侧面及背面经封孔后可避免使用过程中因吸湿膨胀所造成的釉层开裂现象。
附图说明
图1为本发明实施例1制备的轻质高强陶瓷装饰板材的XRD图谱。
图2为本发明实施例1制备的轻质高强陶瓷装饰板材的微观形貌SEM照片。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合说明书附图和具体实施例，对本发明进一步详细说明，但本发明要求的保护范围并不局限于实施例。
下述实施例所采用的原料如无特殊说明，均为市售。
性能测试方法：
本发明中陶瓷板材的显气孔率、容重均按照国家标准GB/T 1966-1996《多孔陶瓷显气孔率、容重试验方法》测量，抗折强度按照国家标准GB/T1965-1996《多孔陶瓷弯曲强度试验方法》测量。
实施例1:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土300kg、煅烧铝矾土200kg、矿化剂氟化铝20kg、助烧剂氧化钼18kg和增强剂碳化硅40kg(粒径为10μm)和5kg分散剂，置于球磨罐中，加入水，球磨混合12小时，获得中位径为8.7μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中60％即180kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝38.55％，氧化钛和氧化铁合计0.60％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为20MPa，保压时间为10秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1200℃，时间90分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为15分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为45％，容重为1.45g/cm3，抗折强度为33MPa的轻质高强陶瓷装饰板材。经XRD分析，所制备的轻质高强陶瓷装饰板材的主晶相为莫来石，衍射图谱如图1所示，且莫来石以相互穿插搭接的形态存在于材料内部，如图2中SEM照片所示，大量互相粘接的莫来石晶须赋予了轻质陶瓷板材高的抗折强度，克服了传统轻质瓷砖容重与强度间的矛盾。
实施例2:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土300kg、煅烧铝矾土200kg、矿化剂氟化铝10kg、助烧剂氧化钼18kg和增强剂碳化硅40kg(粒径为10μm)和5kg分散剂，置于球磨罐中，加入水，球磨混合20小时，获得中位径为4.6μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中60％即180kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝38.55％，氧化钛和氧化铁合计0.60％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为30MPa，保压时间为15秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1250℃，时间120分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为10分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为40％，容重为1.53g/cm3，抗折强度为36MPa的轻质高强陶瓷装饰板材。
实施例3:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土300kg、煅烧铝矾土200kg、矿化剂氟化铝25kg、助烧剂氧化钼18kg和增强剂瓷砖抛光废渣60kg和5kg分散剂，置于球磨罐中，加入水，球磨混合15小时，获得中位径为6.7μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中60％即180kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝38.55％，氧化钛和氧化铁合计0.60％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为35MPa，保压时间为6秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1160℃，时间120分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为20分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为35％，容重为1.73g/cm3，抗折强度为42MPa的轻质高强陶瓷装饰板材。
实施例4:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土300kg、煅烧铝矾土200kg、矿化剂氟化铝20kg、助烧剂氧化钼18kg和增强剂碳化硅40kg(粒径为10μm)和5kg分散剂，置于球磨罐中，加入水，球磨混合12小时，获得中位径为8.7μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中80％即240kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝42.67％，氧化钛和氧化铁合计0.72％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为40MPa，保压时间为20秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1180℃，时间60分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为30分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为49％，容重为1.37g/cm3，抗折强度为30MPa的轻质高强陶瓷装饰板材。
实施例5:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土150kg、煅烧铝矾土350kg、矿化剂氟化铝20kg、助烧剂氧化钼18kg和增强剂碳化硅40kg(粒径为10μm)和5kg分散剂，置于球磨罐中，加入水，球磨混合24小时，获得中位径为3.4μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中70％即105kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝44.43％，氧化钛和氧化铁合计0.90％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为20MPa，保压时间为5秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1250℃，时间100分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为12分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为52％，容重为1.45g/cm3，抗折强度为32MPa的轻质高强陶瓷装饰板材。
实施例6:
轻质高强陶瓷装饰板材的制备：
(a)各称量球土175kg、煅烧铝矾土325kg、矿化剂氟化铝20kg、助烧剂氧化铈25kg和增强剂碳化硅40kg(粒径为2μm)和5kg分散剂，置于球磨罐中，加入水与磨球混合12小时，获得中位径为8.7μm的陶瓷浆料，经喷雾塔干燥获得坯体粉料。其中，球土中40％即70kg预先经900℃煅烧2h，煅烧后的球土中含氧化铝53.00％，氧化钛和氧化铁合计2.87％；所用煅烧铝矾土中氧化铝含量为78.50％，氧化钛和氧化铁合计3.75％。
(b)将步骤(a)中获得的坯体粉料经压机压制成陶瓷生坯，压制压力为40MPa，保压时间为20秒；
(c)将步骤(b)中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，温度1150℃，时间120分钟，待冷却后在坯体上表面采用喷墨打印机进行图案打印，然后施加保护釉层，干燥后送入窑炉中进行第二次烧成，烧成温度为1100℃，时间为15分钟；
(d)将步骤(c)中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材，其中所用封孔剂为质量分数50％的甲基硅树脂酒精溶液。
最终，按上述步骤获得了显气孔率为47％，容重为1.65g/cm3，抗折强度为38MPa的轻质高强陶瓷装饰板材。
对比例1:
与实施例1相比，不添加增强剂碳化硅，其它操作与实施例1相同。
最终，获得了显气孔率为50％，容重为1.38g/cm3，抗折强度为18MPa的轻质高强陶瓷装饰板材。
对比例2:
与实施例1相比，球土直接使用，不经过预先900℃煅烧，其它操作与实施例1相同。
最终，获得了显气孔率为40％，容重为1.60g/cm3，抗折强度为28MPa的轻质高强陶瓷装饰板材。
对比例3:
与实施例1相比，在制备原料中，球土100kg、煅烧铝矾土400kg；其它操作与实施例1相同。
最终，获得了显气孔率为55％，容重为1.85g/cm3，抗折强度为22MPa的轻质高强陶瓷装饰板材。
综上所述，当本发明原料中不添加增强剂或者球土不预先煅烧或者球土与煅烧铝矾土的含量比例不在本发明的范围内时，获得的陶瓷装饰板材其强度均显著降低。本发明通过原料的选择和配比，优化多孔陶瓷板材的微观孔结构，利用矿化剂和助烧剂的低温催化作用在陶瓷坯体内部原位生成大量的莫来石晶须，利用增强剂粘接莫来石晶须、提高制品强度，在无造孔剂和发泡剂的情况下低温(<1200℃)制备轻质高强陶瓷板材，具有工艺简单、成本低的优点。
根据上述说明书的揭示和教导，本发明所属领域的技术人员还可以对上述实施方式进行变更和修改。因此，本发明并不局限于上面揭示和描述的具体实施方式，对发明的一些修改和变更也应当落入本发明的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本发明构成任何限制。
Claims (7)
1.一种轻质高强陶瓷装饰板材，其特征在于，包括如下原料制备而成：球土、煅烧铝矾土、矿化剂、助烧剂、增强剂和分散剂，所述球土、煅烧铝矾土质量比为1:0.1～3.0；在所述球土中，40～80wt％的球土经过900℃高温煅烧2小时，所述的增强剂为碳化硅颗粒或瓷砖抛光废渣；
所述的矿化剂为氟化铝，添加量占原料总重的1～5wt％；助烧剂为氧化钼或氧化铈中的一种，添加量占原料总重的3～5wt％；
当选用碳化硅颗粒为坯体增强剂时，其粒径在2～30μm之间，添加量为5～10wt％；当选用瓷砖抛光废渣为坯体增强剂时，添加量为5～20wt％；
所述陶瓷装饰板材的显气孔率为30～55％，容重为1.3～1.8g/cm3，抗折强度高于30MPa；所述陶瓷装饰板材的制备工艺包括球磨、喷雾干燥、压制成型、第一次烧成、喷墨打印及施釉、第二次烧成、抛光和封孔工序；
所述轻质高强陶瓷装饰板材的制备方法，包括以下步骤：
S1.将球土、煅烧铝矾土置于球磨装置内，同时加入矿化剂、助烧剂、增强剂和分散剂，以水为球磨介质球磨12～24小时获得陶瓷浆料，经喷雾干燥获得坯体粉料；
S2.将S1中获得的坯体粉料压制成陶瓷生坯，压制压力在15～40MPa之间；
S3.将S2中获得的陶瓷生坯经干燥后送入窑炉进行第一次烧成，待冷却后在坯体上表面进行图案装饰和施釉操作，干燥后送入窑炉中进行第二次烧成；
S4.将S3中烧制完成的陶瓷制品，经上表面抛光和背面及侧面封孔处理后获得轻质高强陶瓷装饰板材。
2.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，煅烧后的球土的化学组成中Al2O3含量高于35wt％，TiO2和Fe2O3含量合计低于1wt％；所述的煅烧铝矾土的化学组成中Al2O3含量在55～80wt％之间，TiO2和Fe2O3含量合计低于4wt％。
3.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，所述的分散剂主要成分为阴离子型聚合物的盐，分散剂的添加量为2～8wt％。
4.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，S4所述的背面及侧面封孔处理是指将溶有树脂类封孔剂的酒精溶液喷涂于陶瓷制品的背面及侧面，经干燥后在陶瓷制品的背面及侧面的表面形成致密的疏水薄膜。
5.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，S1所述的陶瓷浆料的中位径D50在2～10μm之间，所述的坯体粉料的化学组成中氧化铝质量分数在50％～72％之间。
6.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，S3所述图案装饰和施釉操作是指在坯体表面采用喷墨打印机进行图案打印，然后施加保护釉层，不包含常规的施增白底釉操作。
7.根据权利要求1所述轻质高强陶瓷装饰板材，其特征在于，S3所述的第一次烧成温度依原料配比的不同而控制在1100～1250℃之间，第二次烧成温度控制在1050～1150℃之间。
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Address after: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Applicant after: GUANGDONG SUMMIT CERAMICS Co.,Ltd. Applicant after: GUANGDONG NEWPEARL CERAMIC GROUP Co.,Ltd. Applicant after: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. Address before: 526124 Bai Er Yi, er Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Applicant before: GUANGDONG SUMMIT CERAMICS Co.,Ltd. Applicant before: GUANGDONG NEWPEARL CERAMIC GROUP Co.,Ltd. Applicant before: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. |
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| CB02 | Change of applicant information |
Address after: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Applicant after: GUANGDONG SUMMIT CERAMICS Co.,Ltd. Applicant after: New Pearl Group Co.,Ltd. Applicant after: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. Address before: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Applicant before: GUANGDONG SUMMIT CERAMICS Co.,Ltd. Applicant before: GUANGDONG NEWPEARL CERAMIC GROUP Co.,Ltd. Applicant before: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Patentee after: New Pearl (Guangdong) New Materials Co.,Ltd. Patentee after: New Pearl Group Co.,Ltd. Patentee after: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. Address before: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Patentee before: GUANGDONG SUMMIT CERAMICS Co.,Ltd. Patentee before: New Pearl Group Co.,Ltd. Patentee before: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 526124 Bai Tu Yi and ER Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province Patentee after: New Pearl (Guangdong) New Materials Co.,Ltd. Patentee after: New Pearl Group Co.,Ltd. Patentee after: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. Address before: 526124 Bai Tu Yi and Er Cun, Lubu Town, Gaoyao District, Zhaoqing City, Guangdong Province, China Patentee before: New Pearl (Guangdong) New Materials Co.,Ltd. Patentee before: New Pearl Group Co.,Ltd. Patentee before: Foshan Sanshuiguanzhu Ceramics Co.,Ltd. |