CN111771177A - 动态随机存取存储器装置 - Google Patents

动态随机存取存储器装置 Download PDF

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Publication number
CN111771177A
CN111771177A CN201980011558.0A CN201980011558A CN111771177A CN 111771177 A CN111771177 A CN 111771177A CN 201980011558 A CN201980011558 A CN 201980011558A CN 111771177 A CN111771177 A CN 111771177A
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CN
China
Prior art keywords
light
piece
heat
circuit substrate
transmitting
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CN201980011558.0A
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CN111771177B (zh
Inventor
郭宗兴
陈文宗
李雨宁
戴子然
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A Data Technology Co Ltd
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A Data Technology Co Ltd
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Publication of CN111771177A publication Critical patent/CN111771177A/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0075—Arrangements of multiple light guides
    • G02B6/0076—Stacked arrangements of multiple light guides of the same or different cross-sectional area
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G02B6/0041—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided in the bulk of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Memories (AREA)
  • Planar Illumination Modules (AREA)

Abstract

本发明公开一种动态随机存取存储器装置，其包括：一电路基板、一发光元件、一第一散热透光件以及一第一遮光件。电路基板上设置有至少一动态随机存取存储器芯片。发光元件设置在电路基板上且耦接于电路基板。第一散热透光件设置在电路基板上。第一遮光件设置于第一散热透光件与电路基板之间，且第一遮光件设置在第一散热透光件上。借此，本发明达到了提升动态随机存取存储器整体的均光效果，并提高动态随机存取存储器的散热效率的功效。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201980011558.0A 2019-01-30 2019-01-30 动态随机存取存储器装置 Active CN111771177B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/073840 WO2020154940A1 (zh) 2019-01-30 2019-01-30 动态随机存取存储器装置

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CN111771177A true CN111771177A (zh) 2020-10-13
CN111771177B CN111771177B (zh) 2022-09-09

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US (1) US11935880B2 (zh)
CN (1) CN111771177B (zh)
WO (1) WO2020154940A1 (zh)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235566A (ja) * 2007-03-20 2008-10-02 Toyoda Gosei Co Ltd 表示装置
CN101335188A (zh) * 2007-06-29 2008-12-31 株式会社半导体能源研究所 Soi基板的制造方法及半导体装置的制造方法
WO2013035664A1 (ja) * 2011-09-06 2013-03-14 シャープ株式会社 表示装置及びテレビ受信装置
CN203378153U (zh) * 2013-07-04 2014-01-01 品安科技股份有限公司 动态随机存取记忆体模组的发光显示装置
CN103502882A (zh) * 2011-05-10 2014-01-08 索尼公司 照明装置和显示单元
WO2015111351A1 (ja) * 2014-01-27 2015-07-30 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
CN205038966U (zh) * 2015-10-15 2016-02-17 宇帷国际股份有限公司 动态随机存取记忆体
CN205122186U (zh) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 电子装置及其动态随机存取记忆体
US20170142827A1 (en) * 2015-11-13 2017-05-18 Avexir Technologies Corporation Electronic device and dynamic random access memory thereof
TW201727297A (zh) * 2016-01-29 2017-08-01 茂林光電科技股份有限公司 區域出光的導光板及其製造方法
CN206471121U (zh) * 2016-10-07 2017-09-05 芝奇国际实业股份有限公司 存储器装置
TWI599872B (zh) * 2016-07-22 2017-09-21 宇瞻科技股份有限公司 具均勻出光之擴充卡及其均光裝置
CN207216545U (zh) * 2017-08-28 2018-04-10 威刚科技股份有限公司 具有散热功能的固态硬盘模块
JP2018060179A (ja) * 2016-09-30 2018-04-12 株式会社半導体エネルギー研究所 表示装置および電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102958B2 (en) 2001-07-20 2006-09-05 Samsung Electronics Co., Ltd. Integrated circuit memory devices that support selective mode register set commands and related memory modules, memory controllers, and methods
CN203134376U (zh) * 2013-02-07 2013-08-14 宇帷国际股份有限公司 动态随机存取记忆体
CN205281332U (zh) * 2015-12-22 2016-06-01 深圳市金邦科技发展有限公司 具有可拆卸式发光模块的内存模块

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235566A (ja) * 2007-03-20 2008-10-02 Toyoda Gosei Co Ltd 表示装置
CN101335188A (zh) * 2007-06-29 2008-12-31 株式会社半导体能源研究所 Soi基板的制造方法及半导体装置的制造方法
CN103502882A (zh) * 2011-05-10 2014-01-08 索尼公司 照明装置和显示单元
WO2013035664A1 (ja) * 2011-09-06 2013-03-14 シャープ株式会社 表示装置及びテレビ受信装置
CN203378153U (zh) * 2013-07-04 2014-01-01 品安科技股份有限公司 动态随机存取记忆体模组的发光显示装置
WO2015111351A1 (ja) * 2014-01-27 2015-07-30 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
CN205038966U (zh) * 2015-10-15 2016-02-17 宇帷国际股份有限公司 动态随机存取记忆体
CN205122186U (zh) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 电子装置及其动态随机存取记忆体
US20170142827A1 (en) * 2015-11-13 2017-05-18 Avexir Technologies Corporation Electronic device and dynamic random access memory thereof
TW201727297A (zh) * 2016-01-29 2017-08-01 茂林光電科技股份有限公司 區域出光的導光板及其製造方法
TWI599872B (zh) * 2016-07-22 2017-09-21 宇瞻科技股份有限公司 具均勻出光之擴充卡及其均光裝置
JP2018060179A (ja) * 2016-09-30 2018-04-12 株式会社半導体エネルギー研究所 表示装置および電子機器
CN206471121U (zh) * 2016-10-07 2017-09-05 芝奇国际实业股份有限公司 存储器装置
EP3306613A1 (en) * 2016-10-07 2018-04-11 G. Skill International Enterprise Co., Ltd. Memory device and assembling method thereof
CN207216545U (zh) * 2017-08-28 2018-04-10 威刚科技股份有限公司 具有散热功能的固态硬盘模块

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US11935880B2 (en) 2024-03-19
WO2020154940A1 (zh) 2020-08-06
CN111771177B (zh) 2022-09-09
US20210035964A1 (en) 2021-02-04

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