CN111710641A - Substrate lifting mechanism, substrate supporter and substrate processing apparatus - Google Patents
Substrate lifting mechanism, substrate supporter and substrate processing apparatus Download PDFInfo
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- CN111710641A CN111710641A CN202010157227.2A CN202010157227A CN111710641A CN 111710641 A CN111710641 A CN 111710641A CN 202010157227 A CN202010157227 A CN 202010157227A CN 111710641 A CN111710641 A CN 111710641A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The invention provides a substrate lifting mechanism, a substrate supporter and a substrate processing apparatus. In the substrate lifting mechanism of one exemplary embodiment, the driving mechanism for lifting the lift pins supports the lift pins in a manner allowing horizontal movement of the lift pins. The plurality of bellows are arranged in a vertical direction so as to surround the lift pin. The plurality of bellows includes a 1 st bellows and a 2 nd bellows. The 1 st bellows is disposed at an uppermost position among the plurality of bellows. The 1 st bellows has an upper end as a fixed end and a lower end horizontally movable together with the lift pin. The 2 nd bellows is provided below the 1 st bellows, and is capable of extending and contracting in the vertical direction in conjunction with the lifting and lowering of the lift pin. The restricting mechanism restricts the vertical expansion and contraction of the 1 st bellows. The invention can allow the horizontal movement of the lifting pin and shorten the total length of a plurality of corrugated pipes sealing the space around the lifting pin.
Description
Technical Field
Exemplary embodiments of the present invention relate to a substrate lifting mechanism, a substrate supporter, and a substrate processing apparatus.
Background
Substrate processing apparatuses are used in the manufacture of electronic devices, such as flat panel displays. A substrate processing apparatus is described in patent document 1. The substrate processing apparatus described in patent document 1 includes a chamber and a substrate mounting mechanism.
The substrate loading mechanism includes a base, a lift pin, and a driving portion. The susceptor is disposed in the chamber and configured to support a substrate placed on the placement surface. The lift pins are configured to support the substrate at the leading ends thereof. The lift pin extends from the inside to the outside of the chamber, and is connected to the driving unit on the outside of the chamber. The drive unit moves the lift pin up and down, and moves the tip of the lift pin between an upper position and a lower position with respect to the mounting surface. The lift pins extend through the through holes of the chamber, providing a flange on the outside of the chamber. In order to ensure airtightness of the inner space of the chamber, a bellows is provided between the flange and the chamber so as to surround the lift pin.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2008-60285
Disclosure of Invention
Technical problem to be solved by the invention
A technique is sought which can allow horizontal movement of the lift pins and shorten the entire length of the plurality of bellows sealing the space around the lift pins.
Technical solution for solving technical problem
In one exemplary embodiment, a substrate lifting mechanism for lifting a substrate with respect to an upper surface of a mounting table provided in a chamber of a substrate processing apparatus is provided. The substrate lifting mechanism comprises a lifting pin, a driving mechanism, a plurality of corrugated pipes and a limiting mechanism. The lift pins are configured to support the substrate at the leading ends thereof. The drive mechanism is configured to support the lift pin so as to allow horizontal movement of the lift pin, and to be capable of lifting the lift pin. The plurality of bellows are arranged in a vertical direction so as to surround the lift pin to seal a space around the lift pin. The plurality of bellows includes a 1 st bellows and a 2 nd bellows. The 1 st bellows is disposed at an uppermost position among the plurality of bellows. The 1 st bellows has an upper end and a lower end. The upper end of the 1 st bellows is a fixed end. The lower end of the 1 st bellows can be horizontally moved together with the lift pin. The 2 nd bellows is arranged below the 1 st bellows. The 2 nd bellows can be expanded and contracted in the vertical direction in conjunction with the lifting and lowering of the lift pin. The restricting mechanism is configured to restrict the expansion and contraction of the 1 st bellows in the vertical direction.
Effects of the invention
According to one exemplary embodiment, it is possible to allow horizontal movement of the lift pin and shorten the entire length of the plurality of bellows sealing the space around the lift pin.
Drawings
Fig. 1 is a diagram schematically showing a substrate processing apparatus according to an exemplary embodiment.
Fig. 2 is a cross-sectional view of a substrate lifting mechanism in an exemplary embodiment.
Fig. 3 is a cross-sectional view of a substrate lifting mechanism in an exemplary embodiment.
Explanation of the drawings
50 … … substrate lifting mechanism
52 … … lifter pin
54 … … driving mechanism
56 … … corrugated pipe
561 … … the 1 st bellows
561a … … upper end
561b … … lower end
562 … … No. 2 bellows
58 … … restraining mechanism.
Detailed Description
Various exemplary embodiments will be described below.
In one exemplary embodiment, a substrate lifting mechanism for lifting a substrate with respect to an upper surface of a mounting table provided in a chamber of a substrate processing apparatus is provided. The substrate lifting mechanism comprises a lifting pin, a driving mechanism, a plurality of corrugated pipes and a limiting mechanism. The lift pins are configured to support the substrate at the leading ends thereof. The drive mechanism is configured to support the lift pin so as to allow horizontal movement of the lift pin, and to be capable of lifting the lift pin. The plurality of bellows are arranged in a vertical direction so as to surround the lift pin to seal a space around the lift pin. The plurality of bellows includes a 1 st bellows and a 2 nd bellows. The 1 st bellows is disposed at an uppermost position among the plurality of bellows. The 1 st bellows has an upper end and a lower end. The upper end of the 1 st bellows is a fixed end. The lower end of the 1 st bellows can be horizontally moved together with the lift pin. The 2 nd bellows is arranged below the 1 st bellows. The 2 nd bellows can be expanded and contracted in the vertical direction in conjunction with the lifting and lowering of the lift pin. The restricting mechanism is configured to restrict the expansion and contraction of the 1 st bellows in the vertical direction.
In the substrate lifting mechanism of the above embodiment, the lower end of the 1 st bellows is horizontally movable with respect to the upper end as the fixed end. Therefore, horizontal movement of the lift pins in the plurality of bellows can be tolerated. In the substrate lifting mechanism according to the above embodiment, since the vertical expansion and contraction of the 1 st bellows are restricted, the vertical expansion and contraction of the bellows group including a plurality of bellows is realized by the 2 nd bellows. Therefore, the 2 nd bellows can be selected irrespective of the stroke length of each pitch in the vertical direction of the 1 st bellows. Therefore, the length of the 2 nd bellows can be shortened, and the entire length of the plurality of bellows can be shortened.
In one exemplary embodiment, the limiting mechanism may include a 1 st stopper and a 2 nd stopper. In this embodiment, the 1 st stopper is provided to restrict the vertical-direction contraction of the 1 st bellows. The 2 nd stopper is provided to restrict elongation in the vertical direction of the 1 st bellows.
In one exemplary embodiment, the lower end of the 1 st bellows includes a flange. The 1 st stopper may also be extended over or above the flange in a manner that limits the vertical contraction of the 1 st bellows. The 2 nd stopper may also extend below or under the flange in such a manner as to limit elongation in the vertical direction of the 1 st bellows.
In an exemplary embodiment, the inner diameter of the 1 st bellows may be larger than the inner diameter of the 2 nd bellows. According to this embodiment, a larger horizontal movement of the lift pin can be tolerated.
In an exemplary embodiment, the outer diameter of the 2 nd bellows may be smaller than the outer diameter of the 1 st bellows. According to this embodiment, the material constituting the 2 nd bellows can be reduced.
In one exemplary embodiment, a part of the lift pin extends through a through hole formed in the chamber and a through hole formed in the stage, and is horizontally movable in conjunction with thermal deformation of the stage. The driving mechanism is fixed to the chamber. The upper end of the 1 st bellows is fixed to the chamber so as to seal a through hole formed in the chamber.
In one exemplary embodiment, the substrate lifting mechanism may further include a pin guide. The pin guide has a cylindrical shape, extends below the mounting table, and provides an inner hole connected to a through hole formed in the mounting table. The pin guide is fixed to the mounting table. A portion of the lift pin extends within the bore of the pin guide.
In one exemplary embodiment, the lift pin may include a pin body and a columnar pin holder. The pin body includes a front end of the lift pin, extending in a vertical direction. The pin holder supports the pin body and extends downward from the pin body.
In an exemplary embodiment, the drive mechanism may also include a centering device, a drive shaft, and a drive device. The centering device supports the lift pin in a manner allowing horizontal movement of the lift pin. The drive shaft extends in a vertical direction below the centering device. The driving device is configured to be capable of lifting the driving shaft.
In one exemplary embodiment, the centering device includes a base and a stage. The base is disposed above the drive shaft and supported by the drive shaft. The stage is supported on the base so as to be horizontally movable. The lower end of the lifting pin is fixed on the bearing table. The lower end of the 2 nd corrugated pipe is fixed to the plummer in a manner of sealing the lower end opening of the 2 nd corrugated pipe.
In another exemplary embodiment, a substrate support is provided. The substrate supporter includes a stage and a substrate lifting mechanism according to any one of the above-described exemplary embodiments. The mounting table is provided in a chamber of the substrate processing apparatus. The substrate lifting mechanism is configured to be capable of lifting and lowering the substrate with respect to the upper surface of the mounting table.
In one exemplary embodiment, the substrate supporter may further include a heater provided in the stage.
In yet another exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes the substrate holder and the chamber of the above-described exemplary embodiment. The stage of the substrate supporter is accommodated in the internal space of the chamber.
In one exemplary embodiment, the substrate processing apparatus may be a film deposition apparatus.
Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, the same or corresponding portions are denoted by the same reference numerals in the respective drawings.
Fig. 1 is a diagram schematically showing a substrate processing apparatus according to an exemplary embodiment. Fig. 1 shows a substrate processing apparatus according to an exemplary embodiment partially in section. The substrate processing apparatus 1 shown in fig. 1 is an apparatus used in substrate processing of a substrate S. In one embodiment, the substrate processing apparatus 1 is a film deposition apparatus. The substrate processing apparatus 1 is used, for example, in the manufacture of flat panel displays. The substrate S can be a substantially rectangular glass substrate, but is not limited thereto.
The substrate processing apparatus 1 includes a chamber 10 and a substrate supporter 12. The chamber 10 is a container providing an inner space. The chamber 10 can have a generally square cylindrical shape. The chamber 10 is formed of, for example, aluminum. The chamber 10 has, for example, an alumite-treated (anodized) surface.
The side wall of the chamber 10 provides an opening 10 p. The substrate S passes through the opening 10p while being transferred between the inner space of the chamber 10 and the outside of the chamber 10. The substrate processing apparatus 1 may further have a gate valve 10 g. The gate valve 10g is disposed along a sidewall of the chamber 10. The gate valve 10g opens and closes the opening 10 p.
In one embodiment, the substrate processing apparatus 1 further comprises a gas shower head 14. The gas shower head 14 is provided to close the upper opening of the chamber 10. The gas shower head 14 provides a gas diffusion chamber 14d inside thereof. The gas diffusion chamber 14d is connected to the gas introduction port 14 i. The gas introduction port 14i is connected to a tube 16. Tube 16 is connected to gas source 18 via valve 20 and flow controller 22. The gas source 18 is a source of gas used for substrate processing in the substrate processing apparatus 1. The flow controller 22 is, for example, a mass flow controller. The gas shower head 14 is also provided with a plurality of gas exhaust holes 14 a. The gas discharge holes 14a extend downward from the gas diffusion chamber 14d and open into the internal space of the chamber 10. In the substrate processing apparatus 1, gas from the gas source 18 is introduced into the gas diffusion chamber 14 d. The gas introduced into the gas diffusion chamber 14d is discharged into the internal space of the chamber 10 through the plurality of gas discharge holes 14 a.
The chamber 10 has a bottom 10 b. The bottom portion 10b is formed with one or more exhaust holes 10 e. The substrate processing apparatus 1 further includes one or more exhaust units 24. In the illustrated example, a plurality of exhaust holes 10e are formed in the bottom portion 10b, and the substrate processing apparatus 1 includes a plurality of exhaust units 24. The one or more exhaust units 24 each include a tube 26, a pressure regulator 28, and an exhaust 30. The tubes 26 are connected to the corresponding exhaust holes 10 e. The pipe 26 is connected to an exhaust 30 via a pressure regulator 28. The pressure regulator 28 is, for example, an automatic pressure regulating valve. The exhaust device 30 includes one or more decompression pumps such as a dry pump and a turbo-molecular pump.
The substrate supporter 12 includes a stage 40 and one or more substrate elevating mechanisms 50. The stage 40 is accommodated in the internal space of the chamber 10. The stage 40 is provided on the bottom of the chamber 10 via a spacer 42. The spacer 42 is formed of an insulator, for example. The mounting table 40 is made of aluminum, for example. The stage 40 has an upper surface on which a substrate is placed. In the substrate processing apparatus 1, the substrate S is processed while being placed on the upper surface of the mounting table 40. In one embodiment, the heater HT may be provided inside the mounting table 40. The heater HT can be a resistive heating element.
The one or more substrate lifting mechanisms 50 are configured to be capable of lifting and lowering the substrate S with respect to the upper surface of the mounting table 40. The one or more substrate lifting mechanisms 50 each have a lift pin 52. The one or more substrate lifting mechanisms 50 each lift the lift pins 52 so that the leading ends (upper ends) of the lift pins 52 move between the 1 st position and the 2 nd position. The 1 st position is a position above the upper surface of the mounting table 40. The 2 nd position is a position at the same level as the upper surface of the table 40 or a position below the upper surface of the table 40. When the leading ends of the lift pins 52 are in the 1 st position, the substrate S is positioned above the upper surface of the stage 40. When the leading ends of the lift pins 52 are at the 1 st position, the substrate S is transferred between the transport device and the leading ends of the lift pins 52. When the leading ends of the lift pins 52 are at the 2 nd position, the substrate S is disposed on the upper surface of the stage 40.
In one embodiment, the substrate processing apparatus 1 further includes a control unit CU. The control unit CU may be a computer device having a processor such as a CPU, a storage device such as a memory, an input device such as a keyboard, and a display device. The control unit CU is configured to be able to execute a control program stored in the storage device by the processor, and control each unit of the substrate processing apparatus 1 according to recipe data stored in the storage device.
In the case where the substrate processing apparatus 1 has a plurality of substrate lifting mechanisms 50, the substrate lifting mechanisms 50 may have the same configuration. Therefore, the substrate lifting mechanism 50 will be described in detail below. In the following description, reference is made to fig. 2 and 3 in addition to fig. 1. Fig. 2 and 3 are each a sectional view of a substrate lifting mechanism of an exemplary embodiment.
The substrate lifting mechanism 50 includes the above-described lift pins 52, a drive mechanism 54, a plurality of bellows 56, and a restraining mechanism 58. The lift pin 52 has a substantially cylindrical shape, extending in the vertical direction. The lift pins 52 are configured to be able to support the substrate S at the leading ends (upper ends) thereof as described above.
In one embodiment, the lift pin 52 includes a pin body 52m and a pin holder 52 a. The pin main body 52m has a substantially cylindrical shape. The pin main body 52m extends in the vertical direction. The pin body 52m provides the front end of the lift pin 52. The pin holder 52a has a substantially cylindrical shape. The pin holder 52 supports the pin body 52m and extends downward from the pin body 52 m.
A through hole 10h extending in the vertical direction is formed in the bottom 10b of the chamber 10. In addition, a through hole 40h extending in the vertical direction is formed in the mounting table 40. In one embodiment, the substrate lift mechanism 50 further includes a pin guide 60. The pin guide 60 is a substantially cylindrical member. The pin guide 60 is fixed to the mounting table 40 such that an inner hole thereof is continuous with the through hole 40 h. The pin guide 60 extends downward from the table 40. For example, the lower end of the pin guide 60 is positioned between the upper and lower opening ends of the through hole 10 h. The through hole 10h has a size set so as not to interfere with the pin guide 60 and the lift pin 52 even if the horizontal movement of the pin guide 60 occurs. Further, the horizontal movement of the pin guide 60 may be generated due to, for example, thermal deformation (e.g., thermal expansion) of the table 40.
A part of the lift pin 52 extends through the through hole 10h and the through hole 40 h. In one embodiment, a portion of the lift pin 52 extends within the pin guide 60. Specifically, the pin body 52m extends in the vertical direction in the through hole 40h and the inner hole of the pin guide 60. The pin body 52m can be lifted and lowered in the through hole 40h and the inner hole of the pin guide 60. The upper end portion of the pin holder 52a extends in the inner bore of the pin guide 60. The pin holder 52a extends below the bottom 10b of the chamber 10. The upper end portion of the pin holder 52a can be lifted and lowered in the inner hole of the pin guide 60.
The driving mechanism 54 is fixed to the chamber 10, for example, the bottom 10 b. The drive mechanism 54 supports the lift pins 52 so as to allow horizontal movement of the lift pins 52. The drive mechanism 54 is configured to be able to raise and lower the lift pins. In one embodiment, the drive mechanism 54 includes a centering device 62, a drive shaft 64, and a drive device 66.
The centering device 62 supports the lower end of the lift pin 52. The centering device 62 supports the lift pins 52 in a manner that allows horizontal movement of the lift pins 52. The centering device 62 includes, for example, a base 62b and a bearing table 62 t. The susceptor 62t is disposed on the base 62 b. The lower ends of the lift pins 52 are fixed to the stage 62 t. The stage 62t is supported on the base 62b so as to be horizontally movable. When a horizontal moving force causing the lift pins 52 is applied to the lift pins 52, horizontal movement of the stage 62t with respect to the reference position on the base 62b is generated in conjunction with the lift pins 52. In the case where the force causing the horizontal movement of the lift pins 52 is not applied to the lift pins 52, the carrier table 62t is restored to the reference position on the base 62 b. The restoration of the stage 62t to the reference position is achieved, for example, by the magnetic force of the magnet and/or the restoring force of the elastic member.
The drive shaft 64 extends in a vertical direction below the base 62b of the centering device 62. The drive shaft 64 supports the centering device 62, specifically the base 62 b. The drive shaft 64 is connected to a drive device 66 disposed therebelow. The driving device 66 is configured to be able to raise and lower the drive shaft 64. The drive device 66 may comprise an electric motor, for example. When the drive device 66 raises and lowers the drive shaft 64, the lift pin 52 is raised and lowered by the centering device 62.
In one embodiment, the drive mechanism 54 may also include a plurality of shafts 68 and a bearing table 70. The plurality of shafts 68 are, for example, linear shafts. The plurality of shafts 68 extend in the vertical direction in parallel with each other. A plurality of shafts 68 are arranged around the lift pins 52. The upper ends of the plurality of shafts 68 are fixed to the bottom 10b of the chamber 10 via a member 72. The member 72 is an annular plate member and is disposed so as to surround the lift pin 52. The lower ends of the plurality of shafts 68 are fixed to the member 74. The member 74 is an annular plate member and is disposed so as to surround the drive shaft 64. The drive 66 is disposed below the member 74.
The carriage 70 is configured to be slidable up and down along the shafts 68. In one embodiment, the carrier 70 may include a plurality of bearings. Each of the plurality of bearings is a sliding bearing or a ball bearing. A portion of each of the plurality of shafts 68 extends in a corresponding bearing. In this embodiment, since the plurality of bearings smoothly move along the plurality of shafts 68, a smooth linear motion of the carrier 70 can be achieved. The centering device 62 is arranged on the carrier 70. The base 62b of the centering device 62 is fixed to the carrier 70. The upper end of drive shaft 64 is secured to carrier 70 via joint 76. The drive shaft 64 extends in the vertical direction below the carrier 70.
A plurality of bellows 56 are disposed below the bottom 10b of the chamber 10. The bellows 56 are arranged vertically so as to surround the lift pin 52 in order to seal the space around the lift pin 52. The bellows 56 seal the through hole 10h of the bottom 10b of the chamber 10, and ensure airtightness of the internal space of the chamber 10. The plurality of bellows 56 includes a 1 st bellows 561 and one or more 2 nd bellows 562. In the illustrated example, the plurality of bellows 56 includes a plurality of 2 nd bellows 562.
The 1 st bellows 561 is provided at the uppermost position among the plurality of bellows 56. The 1 st bellows 561 includes an upper end 561a and a lower end 561 b. The upper end 561a of the 1 st bellows 561 is a fixed end fixed to the bottom 10b of the chamber 10. The upper end 561a of the 1 st bellows 561 is, for example, a flange having an annular shape. An upper end 561a of the 1 st bellows 561 is fixed to the bottom 10b of the chamber 10 so as to seal the through hole 10h of the chamber 10. A sealing member such as an O-ring may be provided between the upper end 561a of the 1 st bellows 561 and the bottom 10b of the chamber 10.
The lower end 561b of the 1 st bellows 561 is horizontally movable together with the lift pin 52. The lower end 561b of the 1 st bellows 561 is, for example, a flange having an annular shape. In one embodiment, the drive mechanism 54 also has a guide 78. The guide 78 has a bearing. The bearings of the guide 78 may be sliding bearings or ball bearings. The lift pin 52, and specifically the pin holder 52a, extends through the bore of the bearing of the guide 78. The lower end 561b of the 1 st bellows 561 is disposed on the guide 78 and fixed to the guide 78. A sealing member such as an O-ring may be provided between the lower end 561b of the 1 st bellows 561 and the guide 78. When the horizontal movement of the lift pins 52 shown in fig. 2 occurs, the horizontal movement of the lower end 561b of the 1 st bellows 561 is generated as shown in fig. 3 together with the lift pins 52 and the guide 78.
One or more 2 nd bellows 562 are disposed below the 1 st bellows 561. As shown in fig. 2 and 3, one or more 2 nd bellows 562 can expand and contract in the vertical direction in conjunction with the up-and-down movement of the up-and-down pin 52. One or more 2 nd bellows 562 are each configured such that the entirety thereof can be horizontally moved together with the lift pin 52. That is, each of the one or more 2 nd bellows 562 can move horizontally without causing a difference in the amount of displacement in the horizontal direction between the upper end and the lower end thereof.
The upper end 562a of one or more 2 nd bellows 562 is fixed to the guide 78. The upper end 562a is, for example, a flange having an annular shape. A sealing member such as an O-ring may be provided between the upper end 562a of the 2 nd bellows 562 and the guide 78. In addition, in the case where the plurality of bellows 56 includes the plurality of 2 nd bellows 562, the upper end 562a is the upper end of the 2 nd bellows disposed at the uppermost position among the plurality of 2 nd bellows 562. In the case where the plurality of corrugated tubes 56 includes a plurality of 2 nd corrugated tubes 562, a guide 562g can be provided between the 2 nd corrugated tubes 562 adjacent in the vertical direction.
The lower end 562b of one or more 2 nd bellows 562 is fixed to the carrier table 62t of the centering device 62 in such a manner as to close the lower end opening thereof. The lower end 562b is, for example, a flange having an annular shape. A sealing member such as an O-ring may be provided between the lower end 562b of the 2 nd bellows 562 and the carrier table 62 t. Further, in a case where the plurality of bellows 56 includes the plurality of 2 nd bellows 562, the lower end 562b is the lower end of the 2 nd bellows disposed at the lowermost position among the plurality of 2 nd bellows 562. In another embodiment, the lower end 562b of the 2 nd bellows 562 may be directly fixed to a member other than the carrier table 62t, or may be indirectly fixed to the carrier table 62t via the member. In the other member, the pin holder 52a is fixed by welding or the like so as to extend vertically. A sealing member such as an O-ring may be disposed between the other member and the lower end 562b of the No. 2 bellows 562. The other part may have a flange shape.
As shown in fig. 2 and 3, in one embodiment, the inner diameter of the 1 st bellows 561 may be larger than the inner diameter of the 2 nd bellows 562. In one embodiment, the outer diameter of the 2 nd bellows 562 may be smaller than the outer diameter of the 1 st bellows 561.
The restricting mechanism 58 is configured to be able to restrict the vertical expansion and contraction of the 1 st bellows 561. In one embodiment, the restraining mechanism 58 may include a 1 st stopper 581 and a 2 nd stopper 582. The 1 st stopper 581 is provided to restrict the vertical shrinkage of the 1 st bellows 561. The 2 nd stopper 582 is provided to restrict the elongation of the 1 st bellows 561 in the vertical direction.
In one embodiment, the 1 st stopper 581 extends over or above the flange of the lower end 561b of the 1 st bellows 561 in a manner that limits the vertical contraction of the 1 st bellows 561. In one example, the 1 st stopper 581 is a columnar member. The upper end of the 1 st stopper 581 is fixed to a flange of the upper end 561a of the 1 st bellows 561. The 1 st stopper 581 extends in a vertical direction in a region lateral to the 1 st corrugated tube 561. The lower end of the 1 st stopper 581 faces or abuts a flange of the lower end 561b of the 1 st bellows 561. Further, the upper end of the 1 st stopper 581 may be fixed to the bottom 10b of the chamber 10. In addition, a ball bearing or a ball transfer unit (ball transfer unit) may be provided at the lower end of the 1 st stopper 581 in order to smoothly move the lower end 561b of the 1 st bellows 561 horizontally with respect to the 1 st stopper 581.
In one embodiment, the 2 nd stopper 582 extends below or below the flange of the lower end 561b of the 1 st bellows 561 in a manner that limits the elongation of the 1 st bellows 561 in the vertical direction. In one example, the 2 nd stopper 582 has an L-shaped cross-sectional shape. The upper end of the 2 nd stopper 582 is directly or indirectly fixed to a flange of the upper end 561a of the 1 st bellows 561. In the illustrated example, the upper end of the 2 nd stopper 582 is fixed to a flange of the upper end 561a of the 1 st bellows 561 via the member 72 and the bottom 10b of the chamber 10. The 2 nd stopper 582 extends in a vertical direction in a region lateral to the 1 st bellows 561, and extends in a horizontal direction below or below a flange of the lower end 561b of the 1 st bellows 561. In one example, the lower end of the 2 nd stopper 582 opposes or abuts the lower surface of the guide 78. For smooth horizontal movement of the lower end 561b of the 1 st bellows 561 or the guide 78 with respect to the 2 nd stopper 582, a ball bearing or a ball-and-socket unit may be provided at the lower end of the 2 nd stopper 582.
In the substrate lifting mechanism 50 described above, the lower end 561b of the 1 st bellows 561 is horizontally movable with respect to the upper end 561a as a fixed end. Therefore, the horizontal movement of the lift pins 52 in the plurality of bellows 56 can be allowed. In addition, in the substrate lifting mechanism 50, since the vertical expansion and contraction of the 1 st bellows 561 can be restricted, the vertical expansion and contraction of the bellows group including the plurality of bellows 56 is realized by the 2 nd bellows 562. Therefore, the 2 nd bellows 562 can be selected regardless of the stroke length of each pitch (pitch) in the vertical direction of the 1 st bellows 561. Therefore, the length of the 2 nd bellows 562 can be shortened, and the entire length of the plurality of bellows 56 can be shortened.
Further, since the entire length of the plurality of bellows 56 can be shortened, the length of each of the plurality of shafts 68 can be shortened. As a result, the rigidity of the plurality of shafts 68 can be improved. Further, since the total length of the plurality of bellows 56 can be shortened, the space occupied by one or more substrate lifting mechanisms 50 is reduced below the bottom 10b of the chamber 10.
Each of the 2 nd bellows 562 is horizontally movable together with the lift pin 52 so that a difference in the amount of displacement in the horizontal direction does not occur between the upper end and the lower end thereof. Therefore, there is no need to consider the relative horizontal movement of the lifter pin 52 inside the 2 nd bellows 562. Therefore, the diameter of the 2 nd bellows 562 can be reduced.
In one embodiment, as described above, the inner diameter of the 1 st bellows 561 is larger than the inner diameter of the 2 nd bellows 562. According to this embodiment, a larger horizontal movement of the lift pin 52 can be allowed.
In one embodiment, as described above, the outer diameter of the 2 nd bellows 562 is smaller than the outer diameter of the 1 st bellows 561. According to this embodiment, the material constituting the 2 nd bellows 562 can be reduced.
Although various exemplary embodiments have been described above, the present invention is not limited to the above exemplary embodiments, and various omissions, substitutions, and changes may be made. In addition, elements in different embodiments may be combined to form another embodiment.
For example, the substrate processing apparatus 1 may be an apparatus configured to be capable of performing other substrate processing. As such a substrate treatment, plasma etching can be exemplified. That is, the substrate processing apparatus 1 may be a plasma etching apparatus. When the substrate processing apparatus is a plasma etching apparatus, the substrate processing apparatus 1 may include a high-frequency power supply and a matching unit electrically connected to the mounting table. In this example, the gas shower head 14 constitutes an upper electrode of the capacitively coupled plasma etching apparatus. In this example, the gas shower head 14 and the chamber 10 can be electrically grounded. In another example, the substrate processing apparatus 1 may be an inductively coupled plasma etching apparatus.
From the foregoing, it will be appreciated that various embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the scope and spirit of the invention. Therefore, it is intended that the various embodiments disclosed in this specification be considered in all respects as illustrative and not restrictive, the true scope and spirit being indicated by the scope of the appended claims.
Claims (14)
1. A substrate lifting mechanism for lifting a substrate with respect to an upper surface of a stage provided in a chamber of a substrate processing apparatus, comprising:
a lift pin configured to be able to support the substrate at a leading end thereof;
a drive mechanism configured to support the lift pin so as to allow horizontal movement of the lift pin, and to be capable of moving the lift pin up and down;
a plurality of bellows arranged in a vertical direction so as to surround the lift pin to seal a space around the lift pin, the plurality of bellows including a 1 st bellows and a 2 nd bellows, the 1 st bellows being disposed at an uppermost position among the plurality of bellows and having an upper end as a fixed end and a lower end horizontally movable together with the lift pin, the 2 nd bellows being disposed below the 1 st bellows and being vertically extendable and retractable in conjunction with the lifting and lowering of the lift pin; and
and a restricting mechanism configured to restrict expansion and contraction of the 1 st bellows in a vertical direction.
2. The substrate lifting mechanism of claim 1, wherein:
the limiting mechanism includes:
a 1 st stopper provided to restrict a vertical direction shrinkage of the 1 st bellows; and
a 2 nd stopper provided to limit elongation in a vertical direction of the 1 st bellows.
3. The substrate lifting mechanism of claim 2, wherein:
the lower end of the 1 st bellows includes a flange,
the 1 st stopper extends above or over the flange in a manner that limits the vertical directional contraction of the 1 st bellows,
the 2 nd stopper extends below or under the flange in such a manner as to limit elongation in the vertical direction of the 1 st bellows,
4. the substrate lifting mechanism according to any one of claims 1 to 3, wherein:
the inner diameter of the 1 st corrugated pipe is larger than that of the 2 nd corrugated pipe.
5. The substrate lifting mechanism of claim 4, wherein:
the outer diameter of the 2 nd bellows is smaller than the outer diameter of the 1 st bellows.
6. The substrate lifting mechanism according to any one of claims 1 to 5, wherein:
a part of the lift pin extends in a through hole formed in the chamber and a through hole formed in the mounting table and is horizontally movable in conjunction with thermal deformation of the mounting table,
the drive mechanism is fixed to the chamber,
the upper end of the 1 st bellows is fixed to the chamber so as to seal the through hole formed in the chamber.
7. The substrate lifting mechanism of claim 6, wherein:
further comprising a pin guide having a cylindrical shape, extending below the table, providing an inner hole connected to the through hole formed in the table,
the pin guide is fixed to the table,
a portion of the lift pin extends within the bore of the pin guide.
8. The substrate lifting mechanism according to any one of claims 1 to 7, wherein:
the lift pin includes a pin body and a cylindrical pin holder,
the pin body includes the front end, extends in a vertical direction,
the pin holder supports the pin body and extends downward from the pin body.
9. The substrate lifting mechanism according to any one of claims 1 to 8, wherein:
the drive mechanism includes:
a centering device for supporting the lift pin in a manner allowing horizontal movement of the lift pin;
a drive shaft extending in a vertical direction below the centering device; and
and a driving device configured to be capable of lifting and lowering the driving shaft.
10. The substrate lifting mechanism of claim 9, wherein:
the centering device includes:
a base provided above the drive shaft and supported by the drive shaft; and
a load-bearing table supported on the base in a horizontally movable manner,
the lower end of the lifting pin is fixed on the bearing table,
the lower end of the 2 nd corrugated pipe is fixed to the plummer in a manner of sealing the lower end opening of the 2 nd corrugated pipe.
11. A substrate support, comprising:
a mounting table disposed in a chamber of a substrate processing apparatus; and
the substrate lifting mechanism according to any one of claims 1 to 10, wherein the substrate can be lifted and lowered with respect to the upper surface of the mounting table.
12. The substrate support of claim 11, wherein:
the heating device further comprises a heater arranged in the carrying table.
13. A substrate processing apparatus, comprising:
the substrate support of claim 11 or 12; and
a chamber receiving the stage of the substrate supporter in an inner space thereof.
14. The substrate processing apparatus according to claim 13, wherein:
the substrate processing apparatus is a film forming apparatus.
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| JP2019-049875 | 2019-03-18 | ||
| JP2019049875A JP7198694B2 (en) | 2019-03-18 | 2019-03-18 | SUBSTRATE LIFT MECHANISM, SUBSTRATE SUPPORTER, AND SUBSTRATE PROCESSING APPARATUS |
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| JP (1) | JP7198694B2 (en) |
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| US20220336258A1 (en) * | 2021-04-16 | 2022-10-20 | Applied Materials, Inc. | Apparatus for controlling lift pin movement |
| CN113471125B (en) * | 2021-06-15 | 2024-03-22 | 杭州大和热磁电子有限公司 | Automatic opening and closing structure of corner leaning tray |
| CN114351122B (en) * | 2021-12-14 | 2023-08-08 | 湖南红太阳光电科技有限公司 | Carrier plate transmission lifting system for heterojunction CVD equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
| JP2006080291A (en) * | 2004-09-09 | 2006-03-23 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| CN102084468A (en) * | 2008-02-08 | 2011-06-01 | 朗姆研究公司 | Adjustable gap capacitively coupled RF plasma reactor including lateral bellows and non-contact particle seal |
| JP2015072961A (en) * | 2013-10-02 | 2015-04-16 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174071A (en) * | 2001-12-06 | 2003-06-20 | Hitachi Kokusai Electric Inc | System for processing substrate |
| JP4574987B2 (en) * | 2002-01-10 | 2010-11-04 | 東京エレクトロン株式会社 | Processing equipment |
| US20060156981A1 (en) * | 2005-01-18 | 2006-07-20 | Kyle Fondurulia | Wafer support pin assembly |
| JP4836512B2 (en) * | 2005-07-29 | 2011-12-14 | 東京エレクトロン株式会社 | Substrate lifting apparatus and substrate processing apparatus |
| JP2008045575A (en) * | 2006-08-10 | 2008-02-28 | Hitachi Constr Mach Co Ltd | Hydraulic drive mechanism for hydraulic shovel |
| JP4795899B2 (en) | 2006-08-31 | 2011-10-19 | 東京エレクトロン株式会社 | Substrate mounting mechanism and substrate delivery method |
| WO2008029943A1 (en) * | 2006-09-08 | 2008-03-13 | Semiconductor & Display Corporation | Lift pin mechanism |
| KR100843107B1 (en) * | 2007-01-31 | 2008-07-03 | 주식회사 아이피에스 | Vacuum processing apparatus |
| JP4951536B2 (en) * | 2007-03-27 | 2012-06-13 | 東京エレクトロン株式会社 | Substrate mounting table and substrate processing apparatus |
| KR100910750B1 (en) * | 2007-09-21 | 2009-08-05 | 주식회사 에이디피엔지니어링 | Lift pin module and device for manufacturing flat display device using the same |
| KR100843106B1 (en) * | 2008-03-14 | 2008-07-03 | 주식회사 아이피에스 | Vacuum processing apparatus |
| JP2010087473A (en) * | 2008-07-31 | 2010-04-15 | Canon Anelva Corp | Substrate alignment apparatus and substrate processing apparatus |
| KR101117188B1 (en) * | 2009-10-26 | 2012-03-09 | 주식회사 테스 | Apparatus for processing a substrate |
-
2019
- 2019-03-18 JP JP2019049875A patent/JP7198694B2/en active Active
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- 2020-03-05 KR KR1020200027767A patent/KR102356931B1/en active IP Right Grant
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
| JP2006080291A (en) * | 2004-09-09 | 2006-03-23 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| CN102084468A (en) * | 2008-02-08 | 2011-06-01 | 朗姆研究公司 | Adjustable gap capacitively coupled RF plasma reactor including lateral bellows and non-contact particle seal |
| JP2015072961A (en) * | 2013-10-02 | 2015-04-16 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus |
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| TW202045848A (en) | 2020-12-16 |
| JP2020155458A (en) | 2020-09-24 |
| JP7198694B2 (en) | 2023-01-04 |
| KR102356931B1 (en) | 2022-01-28 |
| KR20200111102A (en) | 2020-09-28 |
| CN111710641B (en) | 2023-06-20 |
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