KR101045247B1 - Lift pin elevating apparatus - Google Patents

Lift pin elevating apparatus Download PDF

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KR101045247B1
KR101045247B1 KR1020080126285A KR20080126285A KR101045247B1 KR 101045247 B1 KR101045247 B1 KR 101045247B1 KR 1020080126285 A KR1020080126285 A KR 1020080126285A KR 20080126285 A KR20080126285 A KR 20080126285A KR 101045247 B1 KR101045247 B1 KR 101045247B1
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lift pin
lift
chamber
sealing member
pin
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KR1020080126285A
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Korean (ko)
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KR20100067758A (en
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정성환
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엘아이지에이디피 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명에 의하면, 챔버 저면에 위치되어 리프트 핀을 승강하게 하는 승강부재; 및 상기 승강부재 일측에 구비되어 리프트 핀을 감싸면 챔버 측과 밀폐시키는 실링부재가 구비된 하우징;을 포함하여 이루어진다.According to the present invention, the elevating member is located on the bottom of the chamber for lifting the lift pin; And a housing provided at one side of the elevating member and surrounding the lift pin to seal the chamber side.

챔버, 리프트 핀, 승강부재, 실링 Chamber, Lift Pins, Elevating Members, Seals

Description

리프트 핀 승강장치{Lift pin elevating apparatus}Lift pin elevating apparatus

본 발명은 리프트 핀 승강장치에 관한 것으로, 더욱 상세하게는 목적은 리프트 핀의 진공 밀폐를 쉽게 실현할 수 있고, 구조가 간단해 유지보수 비용이 최소화할 수 있게 하는 리프트 핀 승강장치에 관한 것이다.The present invention relates to a lift pin lift device, and more particularly, to a lift pin lift device that can easily realize the vacuum sealing of the lift pin, the structure is simple and the maintenance cost can be minimized.

일반적으로 반도체 및 LCD에 이용되는 기판은 진공챔버의 플라즈마 공정처리를 통해서 사진, 에칭, 확산, 화학기상증착, 이온주입, 금속증착 등의 공정을 선택적이고도 반복적으로 수행하게 됨으로써, 이들 공정 중 공정 수행을 목적으로 하는 일 기판에 대하여 에칭, 확산, 화학기상증착 및 이에 부수적으로 수행되는 애싱 등의 공정을 수행하는 진공챔버에는 기판을 고정하기 위한 전극부 상부에 고정 위치시킨 상태에서 공정가스로 하여금 기판 상이 소정부위와 반응토록 함으로써 공정이 진행된다. In general, substrates used in semiconductors and LCDs are subjected to selective and repetitive processes such as photographing, etching, diffusion, chemical vapor deposition, ion implantation, and metal deposition through plasma processing of a vacuum chamber, thereby performing processes during these processes. In the vacuum chamber which performs a process such as etching, diffusion, chemical vapor deposition, and ashing, which is carried out with respect to one substrate for the purpose, the process gas is allowed to be placed on the electrode part for fixing the substrate. The process proceeds by allowing the phase to react with a predetermined site.

이러한 반도체 및 LCD의 진공챔버에 있어서, 기판은 외부로부터 로봇 수단에 의해 공정수행을 전극부의 상측으로 이송되고, 이어 전극부에 안착되어 공정을 수행한 후 다시 전극부로부터 승강 위치된 상태에서 로봇 수단에 인계되어 다음 공정으로 이송되게 된다. 여기서, 상술한 바와 같이, 로봇 수단으로부터 인계하는 과정 을 담당하는 기판 리프팅 장치가 구비되며, 이러한 기판 리프팅 장치에 대한 종래 기술에 대하여 첨부된 도 1을 참조하여 설명하기로 한다.In the vacuum chamber of the semiconductor and the LCD, the substrate is transferred from the outside to the upper part of the electrode by the robot means, and then, the robot is placed on the electrode part to perform the process and then lifted from the electrode part again. It is taken over and transferred to the next process. Here, as described above, there is provided a substrate lifting device that is in charge of the process of taking over from the robot means, with reference to Figure 1 attached to the prior art for such a substrate lifting device.

종래의 진공챔버의 기판 리프팅 장치의 구성을 살펴보면, 도 1에 도시된 바와 같이, 내부의 진공상태에서 공정처리가 이루어지는 진공챔버(10)와, 상기 진공챔버(10)내 상측에 마련되어 외부의 공정 가스가 유입되는 상부전극(12)과, 상기 상부전극(12)과 대향 된 하측에 마련되며 기판(S)이 상면에 적재되는 전극부(20)로 구성된다.Looking at the configuration of the substrate lifting apparatus of the conventional vacuum chamber, as shown in Figure 1, the vacuum chamber 10, the process is performed in a vacuum state inside, and provided in the upper side in the vacuum chamber 10, the external process An upper electrode 12 into which gas is introduced, and an electrode part 20 provided at a lower side facing the upper electrode 12 and loaded on the upper surface of the substrate S is configured.

상기 기판(S)은 정전원리에 의해 상기 전극부(20)의 위치에 고정토록 설치되고, 상기 전극부(20) 상에는 환봉 형상을 갖는 리프트 핀(31)이 다수개로 형성되어 슬라이딩 승·하강 가능하게 관통 설치된다. 또한, 이들 리프트 핀(31)의 하측 단부는 전극부(20)의 내부에 구획 형성된 부위로부터 승·하강 가능하게 설치되는 핀 플레이트(32)에 고정되며, 상기 핀 플레이트(32)의 센터 부위로부터 전극부(20)의 하부로 관통하여 승·하강 가능하게 연장된 형상을 이루는 실린더 축(33)이 고정된다. 그리고 이 실린더 축(33)의 하측에 마련되어 외부의 제어신호에 따라 실린더 축(33)을 승·하강 위치하도록 하는 하나의 구동수단(30)이 구비된다.The substrate S is installed to be fixed at the position of the electrode part 20 by the electrostatic principle, and a plurality of lift pins 31 having an annular shape are formed on the electrode part 20 to slide up and down. It is installed through. In addition, the lower ends of these lift pins 31 are fixed to the pin plates 32 which are installed so as to be able to move up and down from portions formed inside the electrode portion 20, and from the center portions of the pin plates 32. The cylinder shaft 33 which forms the shape which penetrates into the lower part of the electrode part 20, and is extended so that raising and lowering is fixed is fixed. One driving means 30 is provided below the cylinder shaft 33 to raise and lower the cylinder shaft 33 according to an external control signal.

그리고 리프트 핀의 승·하강시 진공챔버와 핀 플레이트 상에 기밀을 유지하기 위한 밸로우즈(40)가 결합 구성되어 있다.And the bellows 40 for holding an airtight on a vacuum chamber and a pin plate at the time of raising and falling of a lift pin is comprised.

그러나 종래의 밸로우즈의 경우 구조가 복잡하고 리프트 핀의 잦은 동작으로 인해 쉽게 손상되는 단점이 있었으며, 이로 인해 밸로우즈 유지보수 비용이 상승하는 문제점이 있었다.However, the conventional bellows has a disadvantage in that the structure is complicated and easily damaged due to the frequent operation of the lift pins, thereby increasing the maintenance cost of the bellows.

본 발명의 목적은 리프트 핀의 진공 밀폐를 쉽게 실현할 수 있고, 구조가 간단해 유지보수 비용이 최소화할 수 있게 하는 리프트 핀 승강장치를 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a lift pin lift device that can easily realize vacuum sealing of a lift pin, and that the structure is simple and the maintenance cost can be minimized.

본 발명의 리프트 핀 승강장치는, 챔버 저면에 위치되어 리프트 핀을 승강하게 하는 승강부재; 및 상기 승강부재 일측에 구비되어 리프트 핀을 감싸면 챔버 측과 밀폐시키는 실링부재가 구비된 하우징;을 포함하여 이루어진다.The lift pin lift apparatus of the present invention includes: a lift member positioned on the bottom of the chamber to lift and lift the lift pin; And a housing provided at one side of the elevating member and surrounding the lift pin to seal the chamber side.

또한 상기 실링부재는 일측 단부에서 타측 단부로 갈수록 점점 확장된 형태로 구비된다.In addition, the sealing member is provided in an increasingly expanded form from one end to the other end.

그리고 상기 실링부재는 일측 단부에서 타측 단부로 갈수록 곡선진 형태로 점점 확장되게 구비되는 것을 특징으로 하는 상기 실링부재는 베어링에 의해 지지된 상태로 구비된다.The sealing member is provided in a state supported by a bearing, characterized in that the sealing member is gradually extended in a curved form from one end to the other end.

또한 상기 실링부재는 베어링에 의해 지지된 상태로 구비되게 하는 것이 바람직하다.In addition, the sealing member is preferably provided to be supported by a bearing.

본 발명에 의하면, 전체 길이가 가변되는 다수개의 부재를 이용해 정반을 쉽게 정렬할 수 있게 함으로써 기판 정렬에 소요되는 시간을 단축하고 유지보수 비용을 절감할 수 있게 하는 효과가 있다.According to the present invention, it is possible to easily align the surface plate using a plurality of members having a variable overall length, thereby reducing the time required for substrate alignment and reducing maintenance costs.

이하, 본 발명의 바람직한 실시예들을 첨부된 도면을 참고하여 더욱 상세히 설명한다. 본 발명의 실시예들은 여러 가지 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 설명하는 실시예들에 한정되는 것으로 해석되어서는 안 된다. 본 실시예들은 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 본 발명을 더욱 상세하게 설명하기 위해서 제공되는 것이다. 따라서 도면에 나타난 각 요소의 형상은 보다 분명한 설명을 강조하기 위하여 과장될 수 있다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments are provided to explain the present invention to a person having ordinary skill in the art to which the present invention belongs. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a more clear description.

도 2는 본 발명의 리프트 핀 승강장치를 나타내는 측면도이며, 도 3는 도 2에 도시된 실링부재를 나타내는 부분 확대 단면도이다.Figure 2 is a side view showing a lift pin lift device of the present invention, Figure 3 is a partially enlarged cross-sectional view showing the sealing member shown in FIG.

도 2 및 도 3에 도시된 바에 의하면, 본 발명의 리프트 핀 승강장치는 유압 또는 공압에 의해 실린더와 실린더 로드가 동작하게 하는 승강부재(110) 내부에 리프트 핀(130) 일측이 인입된 상태로 승강부재(110) 내부에서의 동작에 의해 리프트 핀을 상하 방향으로 승강하게 하는 구조를 갖고 있으며, 상기 승강부재(110) 상단에는 상기 리프트 핀(130)의 승강시 안내하며, 챔버(미도시) 측과 리프트 핀을 밀폐시키게 하는 하우징(120)이 구비된다. 또한 상기 하우징(120) 내부에는 베어링(121)에 의해 지지되고, 리프트 핀(130) 외주면을 감싼 상태로 밀착되게 구비되는 실링부재(122)가 위치하게 되며, 상기 실링부재(122)는 일측 단부에서 타측 단부로 갈수록 점점 확장된 형태로 구비되거나 또는 일측 단부에서 타측 단부로 갈수록 곡선진 형태로 점점 확장되게 구비되는 것을 특징으로 하는 상기 실링부재는 베어링에 의해 지지된 상태로 구비된다.As shown in Figures 2 and 3, the lift pin lifting apparatus of the present invention is lifted in a state in which one side of the lift pin 130 is inserted into the lifting member 110 to operate the cylinder and the cylinder rod by hydraulic or pneumatic pressure. It has a structure to lift and lift the lift pin in the vertical direction by the operation inside the member 110, and guides during the lifting of the lift pin 130 to the upper end of the elevating member 110, the chamber (not shown) side And a housing 120 for sealing the lift pins. In addition, the housing 120 is supported by a bearing 121, the sealing member 122 is provided to be in close contact with the outer peripheral surface of the lift pin 130 is positioned, the sealing member 122 is one end The sealing member is provided in a state that is gradually extended to the other end in the form or is provided to be gradually expanded in a curved form from one end to the other end is provided in a state supported by the bearing.

즉, 상기 리프트 핀(130)은 상기 하우징(120)을 관통 삽입된 상태로 일측이 상기 승강부재(110) 내에 마련되고, 상기 하우징 내에서는 승강시 실링부재에 감싸진 상태로 베어링에 의해 안내되게 된다. 또한 상기 하우징은 챔버 저면 상에 챔버와의 사이를 밀폐시킨 상태로 구비된다. 이때 상기 실링부재는 리프트 핀을 감싼 상태여서 리프트 핀이 승강시 챔버 측과의 진공상태를 유지할 수 있게 된다. 따라서 간단한 구조를 갖고 실링부재 통해 리프프 핀과 챔버 사이를 밀폐시킬 수 있게 함으로써 리프트 핀을 통해 챔버측 진공 누수를 방지할 수 있게 된다.That is, one side of the lift pin 130 is inserted through the housing 120 and is provided in the elevating member 110. do. In addition, the housing is provided in a state in which the chamber is sealed on the bottom of the chamber. At this time, the sealing member is in a state in which the lift pin is wrapped so that the lift pin can maintain the vacuum state with the chamber side when the lift is performed. Therefore, by having a simple structure and sealing between the lift pin and the chamber through the sealing member it is possible to prevent the chamber-side vacuum leakage through the lift pin.

여기서 상기 실링부재는 진공압, 가스, 고저온 등에서 장시간 탄성력을 가진체 형태를 유지할 수 있는 소재를 이용하는 것이 바람직하다. 이러한 소재는 통상 널리 알려진 소재를 이용할 수 있으므로 구체적인 설명은 생략한다.Here, the sealing member is preferably used a material that can maintain the body shape having a long elastic force at a vacuum pressure, gas, high temperature and the like. Since such a material may use a generally known material, a detailed description thereof will be omitted.

본 발명을 바람직한 실시예들을 통하여 상세하게 설명하였으나, 이와 다른 형태의 실시예들도 가능하다. 그러므로, 이하에 기재된 청구항들의 기술적 사상과 범위는 바람직한 실시예들에 한정되지 않는다.Although the present invention has been described in detail by way of preferred embodiments thereof, other forms of embodiment are possible. Therefore, the technical idea and scope of the claims set forth below are not limited to the preferred embodiments.

도 1은 종래의 일반적인 리프트 핀 승강장치가 구비된 챔버를 나타내는 단면도.1 is a cross-sectional view showing a chamber equipped with a conventional general lift pin lifting device.

도 2는 본 발명의 리프트 핀 승강장치를 나타내는 측면도.Figure 2 is a side view showing a lift pin lift device of the present invention.

도 3는 도 2에 도시된 실링부재를 나타내는 부분 확대 단면도.3 is a partially enlarged cross-sectional view showing the sealing member shown in FIG.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

110 : 승강부재 120 : 하우징110: elevating member 120: housing

121 : 베이링 122 : 실링부재121: bearing 122: sealing member

130 : 리프트 핀130: lift pin

Claims (4)

챔버 저면에 위치되어 리프트 핀을 승강하게 하는 승강부재; An elevating member positioned on the bottom of the chamber to elevate the lift pin; 상기 승강부재의 상단에 설치되어, 상기 리프트 핀의 승강을 안내하고 상기 챔버 측과 상기 리프트 핀 사이를 밀폐하는 하우징; 및A housing installed at an upper end of the elevating member to guide the elevating of the lift pin and to seal the space between the chamber side and the lift pin; And 상기 하우징 내부에 설치되며, 상기 리프트 핀의 외주면을 감싸며 일측이 상기 리프트 핀에 밀착되고, 일측 단부에서 타측 단부로 갈수록 확장되는 형태로 구비되어 상기 리프트 핀과 상기 챔버 측을 밀폐하는 실링부재를 포함하는 리프트 핀 승강장치.It is installed inside the housing, surrounding the outer circumferential surface of the lift pin, one side is in close contact with the lift pin, provided in a form extending from one end to the other end to include a sealing member for sealing the lift pin and the chamber side Lift pin lifter. 삭제delete 제 1 항에 있어서,The method of claim 1, 상기 실링부재는 일측 단부에서 타측 단부로 갈수록 곡선진 형태로 점점 확장되게 구비되는 것을 특징으로 하는 리프트 핀 승강장치. The sealing member is lift pin lift apparatus, characterized in that it is provided to gradually expand in a curved form from one end to the other end. 제 1 항 또는 제 3 항에 있어서,The method according to claim 1 or 3, 상기 하우징 내부에는 상기 리프트 핀의 승강을 안내하는 베어링이 더 구비되며, 상기 실링부재는 상기 베어링에 의해 지지된 상태로 구비되게 하는 것을 특징으로 하는 리프트 핀 승강장치.And a bearing for guiding the lifting of the lift pin inside the housing, wherein the sealing member is provided to be supported by the bearing.
KR1020080126285A 2008-12-12 2008-12-12 Lift pin elevating apparatus KR101045247B1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR20170111061A (en) * 2016-03-25 2017-10-12 주식회사 원익아이피에스 Substrate processing apparatus

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KR100578134B1 (en) 2003-11-10 2006-05-10 삼성전자주식회사 Multi chamber system
KR100597495B1 (en) 2004-02-12 2006-07-10 어플라이드 머티어리얼스, 인코포레이티드 Substrate support member
KR100638059B1 (en) 2005-05-26 2006-10-24 주식회사 에이디피엔지니어링 Apparatus for processing substrate with plasma

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KR100578134B1 (en) 2003-11-10 2006-05-10 삼성전자주식회사 Multi chamber system
KR100597495B1 (en) 2004-02-12 2006-07-10 어플라이드 머티어리얼스, 인코포레이티드 Substrate support member
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Publication number Priority date Publication date Assignee Title
KR20170111061A (en) * 2016-03-25 2017-10-12 주식회사 원익아이피에스 Substrate processing apparatus
KR102173657B1 (en) 2016-03-25 2020-11-03 주식회사 원익아이피에스 Substrate processing apparatus

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