CN218069792U

CN218069792U - Substrate processing apparatus

Info

Publication number: CN218069792U
Application number: CN202221643071.XU
Authority: CN
Inventors: 金东旻; 李东华
Original assignee: KCTech Co Ltd
Current assignee: KCTech Co Ltd
Priority date: 2021-06-28
Filing date: 2022-06-28
Publication date: 2022-12-16
Anticipated expiration: 2032-06-28
Also published as: KR20230001230A

Abstract

A substrate processing apparatus is disclosed. A substrate processing apparatus according to one embodiment includes: a processing chamber in which a processing space for performing a supercritical processing process on a substrate is formed and an inlet and an outlet for allowing the substrate to enter and exit the processing space are formed on an outer surface; a door that opens and closes the doorway through a door face; and a sealing part which is arranged on the door surface, and enables the space between the door and the processing chamber to be closed along the periphery of the access in the state that the access is closed, wherein the sealing part comprises a bottom surface and a side wall which are arranged on the door surface, and the side wall comprises: a support part protruding along the peripheral direction of the bottom surface; a bending part bending from the end of the support part to the central axis of the bottom surface; and a contact portion protruding from the curved portion in a direction away from the bottom surface, wherein the side wall is in close contact with the processing chamber in a manner that the periphery of the access is wrapped by the contact portion in a state where the access is closed.

Description

Substrate processing apparatus

Technical Field

The following embodiments relate to a substrate processing apparatus.

Background

Generally, a semiconductor is manufactured by repeating a series of processes such as photolithography, vapor deposition, and etching. Contaminants such as various particles, metal impurities, and organic substances remain on the surface of a substrate constituting a semiconductor by repeated processes. Since the contamination remaining on the substrate lowers the reliability of the semiconductor, the semiconductor manufacturing process includes a process of cleaning the substrate in order to improve such a situation.

The cleaning process of the substrate is performed in order of drying the substrate after the substrate is washed by the cleaning agent. Recently, a process of drying a substrate by a supercritical fluid is used. The supercritical fluid is a fluid having properties of both gas and liquid at a critical temperature and a critical pressure or higher, and is excellent in diffusibility and permeability, high in solubility, low in surface tension, and effective in drying a substrate. The supercritical processing is performed in a processing space within a chamber, which is sealed by a door in order to provide high pressure and high temperature conditions within the processing space.

The foregoing background is owned or appreciated by the inventors during the prosecution of the present application and is not necessarily a known art that has been disclosed to the general public prior to the prosecution of the present application.

SUMMERY OF THE UTILITY MODEL

An object of one embodiment is to provide a substrate processing apparatus capable of improving a sealing force in a processing space during a supercritical processing.

An object of one embodiment is to provide a substrate processing apparatus that may minimize plastic deformation of a sealing part for sealing a processing space.

A substrate processing apparatus according to one embodiment includes: a processing chamber in which a processing space for performing a supercritical processing process on a substrate is formed and an inlet and an outlet for allowing the substrate to enter and exit the processing space are formed on an outer surface; a door opening and closing the doorway through a door face; and a sealing part which is arranged on the door surface, and enables the space between the door and the processing chamber to be closed along the periphery of the access in the state that the access is closed, wherein the sealing part comprises a bottom surface and a side wall which are arranged on the door surface, and the side wall comprises: a support portion protruding in a circumferential direction of the bottom surface; a bending part bending from the end of the support part to the central axis of the bottom surface; and a contact portion which protrudes from the curved portion in a direction away from the bottom surface, and the side wall can be brought into close contact with the treatment chamber in a manner that the periphery of the access is wrapped by the contact portion in a state where the access is closed.

The spacing between the bottom surface and the contact surface can be adjusted during the opening and closing of the door.

The substrate processing apparatus may further include an elastic member disposed on the bottom surface along an inner circumferential surface of the sidewall.

The elastic member is disposed between the bottom surface of the seal portion and the curved portion with respect to the cross section, and is capable of applying an elastic force to separate the curved portion from the bottom surface.

The elastic member may be formed in a hollow ring shape, and the substrate processing apparatus may further include a support member disposed in the hollow formed by the elastic member to maintain a position of the elastic member with respect to the sealing part.

The door may include a mounting groove depressed toward an inner side of the door face and mounted with a bottom surface of the sealing part.

The process chamber includes an access surface inclined upward toward an outer side and formed with an access opening, the door surface is formed in a downwardly inclined manner toward the chamber in a state of closing the access opening so as to be engaged with the access surface, and a bottom surface of the sealing portion, corresponding to the inclination of the door surface, may be arranged in a manner inclined with respect to the ground.

The substrate processing apparatus further includes an elevating unit configured to elevate the door in an elevating direction perpendicular to the floor surface, and the door surface is configured to selectively cover the inclined surface in accordance with the elevating operation of the door.

The substrate processing apparatus further includes a clamp which is moved to a clamping position for wrapping the door and the processing chamber in a state that the door closes the entrance, so that the position of the door relative to the processing chamber is fixed, and the elevating part can be released from operation in a state that the clamp reaches the clamping position.

When the door is closed, the pressure in the space between the bottom surface of the sealing part and the bending part is increased as the pressure in the processing space is increased, so that the contact surface can be closely attached to the inclined surface.

According to the substrate processing apparatus of one embodiment, the sealing force in the processing space can be improved during the supercritical processing.

According to the substrate processing apparatus of one embodiment, plastic deformation of the sealing part for sealing the processing space can be minimized.

Drawings

The drawings in the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the detailed description of the present invention and the technical idea of the present invention, and the present invention should not be construed as being limited to the items described in the drawings.

Fig. 1 is an exploded cross-sectional view of a substrate processing apparatus according to an embodiment.

Fig. 2 is an assembled sectional view of a substrate processing apparatus according to an embodiment.

FIG. 3 is an enlarged cross-sectional view of a door facing according to one embodiment.

FIG. 4 is a perspective view of a seal according to one embodiment.

Fig. 5 and 6 are diagrams illustrating a process in which a door closes a doorway according to one embodiment.

Description of the reference symbols

100: processing chamber

110: door with a door panel

120: sealing part

130: clamp apparatus

Detailed Description

Hereinafter, each embodiment will be described in detail with reference to the drawings. When reference numerals are given to components in each drawing, it should be noted that the same components may be denoted by the same reference numerals as much as possible even when they are shown in different drawings. In describing the embodiments, it is determined that specific descriptions of related known structures and functions may hinder understanding of the embodiments, and detailed descriptions thereof are omitted.

In addition, in describing the components of the embodiments, terms such as first, second, a, B, (a), (B), and the like may be used. These terms are only used to distinguish one constituent element from another constituent element, and the nature, order, sequence, and the like of the respective constituent elements are not limited by the terms. In the description of the case where a certain component is "connected", "coupled" or "joined" to another component, the component may be directly connected or joined to the other component, but it should be understood that another component may be "connected", "coupled" or "joined" between the components.

In the following description, the constituent elements included in one embodiment and the constituent elements including common functions are described using the same names in other embodiments. Unless otherwise stated, the description given in one embodiment may be applied to other embodiments, and detailed description is omitted insofar as it overlaps.

Fig. 1 is an exploded sectional view of a substrate processing apparatus according to an embodiment, fig. 2 is an assembled sectional view of the substrate processing apparatus according to an embodiment, fig. 3 is an enlarged sectional view of a door surface according to an embodiment, and fig. 4 is a perspective view of a sealing part according to an embodiment.

Referring to fig. 1 to 4, the substrate treatment apparatus 1 according to one embodiment may perform a treatment process of the substrate W, for example, a drying process of drying a cleaning solution on a surface of the substrate W.

Here, the substrate W to be processed by the substrate processing apparatus 1 may be a silicon wafer (silicon wafer) for a semiconductor device. However, the type of the substrate W is not limited thereto. The substrate W may be, for example, a substrate W including glass for flat panel display devices (FPDs) such as LCDs (liquid crystal displays), PDPs (plasma display panels), and the like.

In one embodiment, the substrate processing apparatus 1 may perform a supercritical processing process on the substrate W using a supercritical fluid (supercritical fluid) as a process fluid. A supercritical fluid is a substance that has both properties of a gas (vacuum) and a liquid (liquid) when reaching a supercritical state (supercritical phase) exceeding a critical temperature and a critical pressure. The supercritical fluid has a molecular density close to that of a liquid and a viscosity close to that of a gas, has excellent diffusibility, permeability and dissolving power due to these special properties, is advantageous for chemical reactions, and has a characteristic of not applying interfacial tension to the microstructure of the substrate W due to low surface tension.

The supercritical process is performed by using the characteristics of such a supercritical fluid, and may include a supercritical drying process and a supercritical etching process as representative examples. Hereinafter, a case will be described in which the substrate processing apparatus 1 according to one embodiment performs a supercritical drying process on the substrate W. However, this is for convenience of explanation, and the substrate processing apparatus 1 may perform a supercritical process other than the supercritical drying process.

The supercritical drying process may be performed by dissolving the surface of the substrate W, for example, an organic solvent remaining on the wiring pattern formed on the substrate W, by the supercritical fluid, thereby drying the substrate W. The supercritical drying process has the advantages of excellent drying efficiency and prevention of collapse. In addition, the supercritical drying process has an advantage in that particles can be prevented from being formed on the surface of the substrate W during the drying of the substrate W. The supercritical fluid used in the supercritical drying process may be of various types, but may be an organic solvent or a miscible substance, such as supercritical carbon dioxide (scCO) ₂ ：supercritical carbon dioxide)。

According to the substrate processing apparatus 1 of one embodiment, damage of parts generated during the sealing process and the pressure rising process for the supercritical processing process can be minimized. For example, the substrate processing apparatus 1 includes a structure to physically prevent the sealing part 121 from being deformed by pressure in the processing space 101, and the sealing part 121 is used to hermetically seal the processing space 101 where the supercritical process is performed, so that fatigue damage due to deformation of the sealing part 121 is minimized and the life span of components can be improved. The substrate processing apparatus 1 according to one embodiment may include a process chamber 100, a door 110, a sealing part 121, a covering part 122, an elastic member 123, a second elastic member 124, a supporting member 125, a lifting part, and a jig 130.

A supercritical processing process for the substrate W may be performed inside the processing chamber 100. A process space 101 for performing a process of treating a substrate W may be formed inside the process chamber 100. In one embodiment, a mounting part 105 to mount the substrate W may be provided inside the processing space 101. The mounting portion 105 may support a lower edge portion of the substrate W in a state where the substrate W is aligned in the processing space 101. In one embodiment, an access surface 103 formed at an outer surface of the process chamber 100 is included, and an access port 102 communicating with the process space 101 to allow access of the substrate W may be formed at the access surface 103. In one embodiment, the entrance and exit surface 103 may be formed to have a larger area than the entrance and exit 102, and the entrance and exit 102 may be formed at a central portion of the entrance and exit surface 103.

In one embodiment, the process chamber 100 may include a supply pipe 1061 and an exhaust pipe 1062, wherein the supply pipe 1061 is used to supply the supercritical fluid to the process space 101, and the exhaust pipe 1062 is used to exhaust the used supercritical fluid from the process space 101. Valves for restricting the flow of the supercritical fluid may be connected to the supply pipe 1061 and the exhaust pipe 1062. The processing space 101 may be set to a high pressure and high temperature state during the supercritical processing of the substrate W. At this time, the processing space 101 needs to be in a sealed state in order to maintain the supercritical state of the supercritical fluid flowing into the inside, and for example, the inlet and outlet 102 needs to be in a closed state.

The door 110 is connected to the process chamber 100 and allows the door 102 to be opened and closed by opening and closing actions. The door 110 may selectively open or close the doorway 102 according to an operation of an elevating part (not shown) described later. For example, the door 110 may be disposed at an open position (for example, fig. 1) to expose the access opening 102 to the outside during the process of loading and unloading the substrate W into and from the processing space 101, or may be disposed at a closed position (for example, fig. 2) to cover the access opening 102 in order to seal the processing space 101 during the process of performing the supercritical processing on the substrate W.

In one embodiment, the door 110 may close the entrance 102 in such a manner as to cover the entrance surface 103 with a door surface 113 formed at the outside. The door surface 113 is formed in a shape corresponding to the entrance surface 103 so as to be engaged with the entrance surface 103 in a state where the door 110 closes the entrance 102. The door surface 113 may be formed with an installation groove 111 recessed toward the inner step.

In one embodiment, the process chamber 100 and the door 110 may comprise a shape that is inclined with respect to the ground. In one embodiment, the entrance surface 103 of the processing chamber 100 is inclined with respect to the floor, for example, in a direction from the processing space 101 toward the entrance 102 with respect to the floor. In one embodiment, the door facing 113 of the door 110 may include a downwardly sloping configuration toward the access surface 103 with respect to the ground to engage the access surface 103. In other words, the entrance and exit surface 103 of the process chamber 100 and the door surface 113 of the door 110 may be formed to have a form of inclination corresponding to each other. At this time, the entrance surface 103 and the door surface 113 are engaged with each other, so that the doors 110 can be closely attached to each other in a state where the entrance 102 is closed.

According to such a configuration, the door 110 can selectively open and close the entrance 102 only by the lifting operation while maintaining the state in which the door surface 113 is in contact with the entrance surface 103 of the process chamber 100. Therefore, the contact between the entrance surface 103 and the door surface 113 is maintained constantly during the opening and closing operation of the door 110, and the generation of particles due to the opening and closing operation can be minimized. Further, the entrance and exit surface 103 of the process chamber 100 is formed to be inclined downward toward the outside, and thus even if particles are generated due to friction during the opening and closing of the door 110, the generated particles fall down, and thus the particles can be prevented from flowing into the inside of the process space 101 through the entrance and exit 102.

In one embodiment, the process chamber 100 and the door 110 may further include a structure for making a state of coupling with each other robust in a state where the process space 101 is closed. For example, the door 110 includes a protrusion 114 protruding thereon, and the process chamber 100 may include a recess 104 into which the protrusion 114 is inserted. At this time, the protrusion 114 may include at least a portion of the access surface 103, e.g., an upper surface of the access surface 103 may form a portion of the protrusion 114. At this time, the door 110 may open and close the processing space 101 with respect to the processing chamber 100 only by the elevating operation, and thus in the case where the pressure in the processing space 101 is increased, the door 110 may also be structurally prevented from being pushed away in the horizontal direction with respect to the processing chamber 100.

The sealing portion 121 can seal the doorway 102 in a state where the doorway 102 is closed by the door 110. The sealing portion 121 may be disposed between the door 110 and the process chamber 100, for example, between the door surface 113 and the access surface 103, so as to surround the periphery of the access 102, thereby closing the access 102. The sealing part 121 may be provided on the door surface 113, for example, may be provided in a manner of being mounted in the mounting groove 111. In one embodiment, seal 121 may include a bottom surface 1211 that is mounted to door facing 113, and a sidewall formed along a periphery of bottom surface 1211.

Bottom surface 1211 may be mounted to door facing 113. For example, the bottom surface 1211 may be mounted to the bottom of the mounting groove 111. As shown in fig. 4, the bottom surface 1211 may be formed in an elliptical plate shape. However, the form of the bottom surface 1211 is merely one example, and the bottom surface 1211 may be formed in various forms having a plate shape. The bottom surface 1211 may have a sufficient area to cover the access port 102 of the processing chamber 100. For example, the bottom surface 1211 may be formed to cover the entire area of the doorway 102 with respect to a state where the door 110 closes the doorway 102.

The sidewalls may be formed along a circumferential direction of the bottom surface 1211. At this time, the sidewall may form a closed loop (closed loop) based on a state of surrounding the bottom surface 1211. In a state where the door 110 closes the entrance 102, an end of the side wall may contact the entrance surface 103. At this point, the sidewall may wrap around the doorway 102. The bottom 1211 and the side walls may form a space sealed together with the entrance and exit surface 103 in a state where the side walls are in contact with the entrance and exit surface 103. Therefore, the side wall can perform a sealing function so that the supercritical fluid in the processing space 101 does not leak through the inlet/outlet 102 in a state where the inlet/outlet 102 is closed by the door 110.

In one embodiment, the sidewall may include a support portion 1212, a curved portion 1213, and a contact portion 1214. The support portion 1212 may protrude in a direction perpendicular to the bottom surface 1211, i.e., in a direction of the entrance surface 103. The bent portion 1213 may be elongated to be bent from the end of the support portion 1212 toward the central axis of the bottom surface 1211. The contact portion 1214 may extend from the end of the bent portion 1213, or may protrude in a direction away from the bottom surface 1211. At this time, in a state where the entrance 102 is closed, the end of the contact portion 1214 can contact the entrance surface 103.

In one embodiment, the sidewall can maintain the contact state of the contact portion 1214 to the entrance and exit surface 103 during the process of the door 110 closing the processing space 101, i.e., during the process of the door surface 113 pressing the entrance and exit surface 103. For example, the sidewall adjusts the interval between the bottom 1211 and the contact portion 1214, so that the sealed state of the processing space 101 can be maintained regardless of the pressurized state of the door 110 with respect to the entrance/exit surface 103. In particular, since the bottom 1211 is integrally formed, even when the pressure in the processing space 101 increases, the supercritical fluid can be prevented from leaking through the space between the door surface 113 and the entrance/exit surface 103 by the space 1210 formed by the bottom 1211 and the side wall.

The covering portion 122 may support an outer circumferential surface of the sealing portion 121. The cover 122 is provided on the entrance surface 103 so as to cover the periphery of the sealing portion 121, and can press the sealing portion 121 toward the door 110 when the door 110 closes the entrance 102. In one embodiment, the covering portion 122 may be formed in a ring shape. The covering part 122 may be provided to the mounting groove 111 in a form of wrapping an outer circumferential surface of a sidewall of the sealing part 121. In one embodiment, the covering portion 122 may include a base portion 1221, an extension portion 1222, and a pressurization portion 1223.

Base 1221 may be disposed on door facing 113 along a periphery of bottom surface 1211. For example, the base 1221 may be installed in contact with the bottom surface of the installation groove 111. The extension 1222 may protrude from the base 1221 in one direction, i.e., in the direction of the entrance/exit surface 103. At this time, the inner circumferential surface of the extension portion 1222 may contact the outer circumferential surface of the support portion 1212. For example, the inner circumferential surface of the extension 1222 may have a sectional shape that engages the outer circumferential surface of the support portion 1212. A pressing portion 1223 may be formed at an end of the extension portion 1222, and the pressing portion 1223 may extend from the end of the extension portion 1222 toward a central axis of the base portion 1221. The pressing portion 1223 may contact the outer peripheral surface of the curved portion 1213, i.e., the upper surface of the curved portion 1213 facing the entrance and exit surface 103.

In one embodiment, the upper surface of the pressurizing part 1223 may contact the entrance and exit surface 103 during the process that the door 110 closes the entrance and exit 102. The pressing portion 1223 presses the mounting groove 111 through the entrance/exit surface 103, and the bent portion 1213 contacting the lower surface can be pressed toward the bottom surface 1211.

In one embodiment, the covering part 122 supports the sealing part 121 in a state of being in contact with the outer circumferential surface of the sealing part 121, so that the form of the sealing part 121 can be maintained to a certain extent. In particular, in the process in which the sealing part 121 is expanded by the pressure of the processing space 101, the form deformation of the sealing part 121 while being pushed in the outer direction can be effectively prevented.

The elastic member 123 may be disposed inside the sealing part 121, i.e., in a space formed by the bottom 1211 and the sidewall. The elastic member 123 may be formed to have a hollow ring shape, and may be disposed on the bottom 1211 in a state of being in contact with the inner circumferential surface of the sidewall. At this time, the elastic member 123 may be disposed between the bottom surface 1211 of the sealing portion 121 and the contact portion 1214 with reference to the cross section. The elastic member 123 applies an elastic force between the bottom surface 1211 and the bent portion 1213, thereby preventing the bent portion 1213 from being excessively compressed in the direction of the bottom surface 1211, and in addition, if the force applied at the bent portion 1213 is removed, the elastic force may be provided in a direction in which the bent portion 1213 is spaced apart from the bottom surface 1211.

The support member 125 may be disposed in the inner space of the sealing part 121 so as to be positioned in the hollow formed by the elastic member 123. The support member 125 may be formed of a strong material. The support member 125 may perform an effect of maintaining the position of the elastic member 123, that is, the arrangement position of the elastic member 123 with respect to the sealing part 121, to some extent during the compression of the elastic member 123. Therefore, the elastic member 123 is supported by the support member 125 so as to be positioned between the bottom surface 1211 of the sealing portion 121 and the contact portion 1214.

The second elastic member 124 may be disposed between the base 1221 and the mounting groove 111. For example, an annular groove is formed at the installation groove 111 where the base 1221 is disposed, and the second elastic member 124 made of an elastic material may be disposed in the groove. In the process of pressing the pressing portion 1223 by the entrance and exit surface 103, the second elastic member 124 is compressed by the base portion 1221, and if the external force is removed, an elastic force is provided to push the base portion 1221, so that the pressing portion 1223 returns to the original position.

The lifter may move the door 110 between the open position and the closed position. For example, the elevating part elevates the door 110 in an elevating direction D1 perpendicular to the ground, so that the doorway 102 may be selectively opened and closed. At this time, in the process of closing the entrance 102, the elevating portion presses the door surface 113 in the direction of the entrance surface 103, so that the door surface 113 and the entrance surface 103 can be brought into close contact with each other.

In a state where the door 110 closes the gateway 102, the clamp 130 moves to a clamping position of the packing door 110 and the process chamber 100, so that the position of the door 110 with respect to the process chamber 100 can be fixed. In the event of an increase in pressure inside the process chamber 100, the clamp 130 may prevent the door 110 from being pushed open from the closed position. In a state where the jig 130 is moved to the holding position to fix the closed state of the doorway 102, the operation of the elevating portion, that is, the operation of pressing the door surface 113 in the direction of the doorway surface 103 can be released.

In one embodiment, the jig 130 may be formed in the form of a frame formed with a hollow 134 in which the door 110 and a portion of the process chamber 100 are coupled to each other. For example, the clamp 130 may include a lower body 132, an upper body 131, and a side body 133. The lower body 132 may contact the door 110. For example, the lower body 132 may be inserted into a jig insertion groove 115 formed at the door 110. The lower body 132 is in contact with the lower surface of the door 110 so as to support the lower side of the door 110. The upper body 131 is spaced apart from the lower body 132 at an upper side thereof to support the upper surface of the door 110. The side body 133 may connect both sides of the upper and

lower bodies

131 and 132.

Fig. 5 and 6 are diagrams illustrating a process in which the door 110 closes the doorway 102 according to one embodiment.

Referring to fig. 5 and 6, the door 110 may be pressed toward the entrance surface 103 in a state of being in contact with the entrance surface 103 through the door surface 113 during the closing of the entrance 102. In a state where the door surface 113 is in contact with the entrance surface 103, the contact portion 1214 of the seal portion 121 and the pressing portion 1223 of the cover portion 122 can be in contact with the entrance surface 103 while wrapping the periphery of the entrance 102. As shown in fig. 5, if the door surface 113 is pressed toward the entrance surface 103, the covering portion 122 can move toward the mounting groove 111 while compressing the second elastic member 124. At this time, the bending portion 1213 is pressed toward the bottom surface 1211 by the pressing portion 1223 while the covering portion 122 moves toward the mounting groove 111. Therefore, the distance G1 between the curved portion 1213 and the bottom surface 1211 can be reduced. At this time, the elastic member 123 provides an elastic force between the bent portion 1213 and the bottom surface 1211, so that the contact state with the contact portion 1214 of the entrance and exit surface 130 can be maintained.

When the jig 130 is moved to the clamping position in a state where the door 110 closes the doorway 102, the pressing force on the door surface 113 of the doorway surface 103 can be released. At this time, the covering portion 122 is pressed toward the entrance surface 103 by the second elastic member 124, and can be returned to the initial position. If the pressing force applied to the pressing portion 1223 of the curved portion 1213 is reduced, the elastic member 123 applies an elastic force in a direction in which the gap G2 between the bottom surface 1211 of the sealing portion 121 and the curved portion 1213 becomes farther, so that the contact state with the contact portion 1214 of the entrance and exit surface 103 can be maintained.

With this configuration, even when the pressure in the processing space 101 increases during the supercritical processing, the contact portion 1214 of the sealing portion 121 can be maintained in contact with the entrance/exit surface 103, and thus the sealed state of the entrance/exit 102 can be maintained at a constant level. In particular, the sealing portion 121 forms a sealed space by the bottom surface 1211 and the side wall, and supports the outer peripheral surface by the covering portion 122, so that the deformation of the form due to the pressure change can be minimized while securing a sufficient sealing force.

Although the embodiments have been described with reference to the drawings, it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments without departing from the scope of the invention. For example, the techniques described above may be performed in a different order from the methods described above, or the components of the structures, devices, and the like described above may be combined or combined in a different manner from the methods described above, or other components or equivalents may be substituted or substituted to achieve appropriate results.

Claims

1. A substrate processing apparatus, comprising:

a processing chamber in which a processing space for performing a supercritical processing process on a substrate is formed and an inlet and an outlet for allowing the substrate to enter and exit the processing space are formed on an outer surface;

a door that opens and closes the doorway through a door face; and

a sealing part arranged on the door surface and sealing the space between the door and the processing chamber along the periphery of the entrance under the state that the entrance is closed,

the sealing part comprises a bottom surface and a side wall which are arranged on the door surface,

the side wall includes: a support portion protruding in a circumferential direction of the bottom surface; a bending part bending from the end of the support part to the central axis of the bottom surface; a contact portion protruding from the bent portion in a direction away from the bottom surface,

in a state where the access opening is closed, the side wall is in close contact with the processing chamber so as to wrap the periphery of the access opening by the contact portion.

2. The substrate processing apparatus according to claim 1,

during the process of opening and closing the doorway by the door,

the distance between the bottom surface and the contact portion is adjusted.

3. The substrate processing apparatus according to claim 1,

the elastic member is disposed along the inner circumferential surface of the side wall on the bottom surface.

4. The substrate processing apparatus according to claim 3,

by taking the cross section as a reference,

the elastic member is disposed between the bottom surface of the sealing portion and the curved portion, and applies an elastic force to separate the curved portion from the bottom surface.

5. The substrate processing apparatus according to claim 3,

the elastic member is formed to include a hollow ring shape,

the sealing device further comprises a supporting member which is arranged in the hollow formed by the elastic member and maintains the position of the elastic member relative to the sealing part.

6. The substrate processing apparatus according to claim 1,

the door includes a mounting groove depressed toward an inner side of a door face and mounted with a bottom surface of the sealing portion.

7. The substrate processing apparatus according to claim 1,

the processing chamber includes an access surface inclined upward toward the outside and formed with an access opening,

the door face is formed in a downwardly inclined form toward the chamber in a state of closing the entrance and the exit so as to be engaged with the entrance and the exit face,

the bottom surface of the seal portion is disposed so as to be inclined with respect to the floor surface in accordance with the inclination of the door surface.

8. The substrate processing apparatus according to claim 7,

also comprises a lifting part which enables the door to lift along the lifting direction vertical to the ground,

the door surface selectively covers the inclined surface along with the lifting action of the door.

9. The substrate processing apparatus according to claim 8,

further comprises a clamp which moves to a clamping position of the wrapping door and the processing chamber under the state that the door closes the entrance and the exit, thereby fixing the position of the door relative to the processing chamber,

when the jig reaches the clamping position, the lifting unit is deactivated.

10. The substrate processing apparatus according to claim 1,

in a state where the door closes the entrance and exit,

as the pressure in the processing space increases, the pressure in the space between the bottom surface of the seal portion and the bent portion increases, and the contact surface comes into close contact with the inclined surface.