CN218241781U - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN218241781U
CN218241781U CN202221816524.4U CN202221816524U CN218241781U CN 218241781 U CN218241781 U CN 218241781U CN 202221816524 U CN202221816524 U CN 202221816524U CN 218241781 U CN218241781 U CN 218241781U
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door
entrance
exit
processing apparatus
substrate processing
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金东旻
李东华
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KCTech Co Ltd
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KCTech Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molecular Biology (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A substrate processing apparatus is disclosed. A substrate processing apparatus according to one embodiment may include: a processing chamber including a processing space for performing a supercritical processing process on a substrate and an opening surface formed at an outer surface, the processing chamber having an inlet and an outlet communicated with the processing space at the opening surface; a door for opening and closing the entrance and the exit, including a door surface for covering the entrance and the exit surface in a state of closing the entrance and the exit; a sealing part which is installed on the entrance and exit surface and seals the space between the entrance and exit surface and the door surface along the periphery of the entrance and exit with the closed state of the entrance and exit as a reference; and a cover portion which is attached to the entrance and exit surface so as to surround the periphery of the sealing portion, and which pressurizes the sealing portion in the door direction in the process of closing the entrance and exit by the door.

Description

Substrate processing apparatus
Technical Field
The following embodiments relate to a substrate processing apparatus.
Background
Generally, a semiconductor is manufactured by repeating a series of processes such as photolithography, vapor deposition, and etching. Due to the repeated processes, contaminants such as various particles, metal impurities, and organic substances remain on the surface of the substrate constituting the semiconductor. The contaminants remaining on the substrate may degrade the reliability of the semiconductor, and thus, in order to improve this phenomenon, the semiconductor manufacturing process includes a process of cleaning the substrate.
The cleaning process of the substrate is performed in order of drying the substrate after the substrate is cleaned by the detergent. Recently, a process of drying a substrate by a supercritical fluid has also been used. The supercritical fluid is a fluid having both gas and liquid properties at a critical temperature and a critical pressure or higher, and thus has a strong diffusion force and a strong permeation force, a high dissolution force, and a low surface tension, and can be effectively used for drying a substrate. The supercritical processing is performed in a processing space within a chamber that is closed by a door to provide high pressure and high temperature conditions within the processing space.
The above background is owned or grasped by the inventor in deriving the disclosure of the present application, and is not necessarily a known art disclosed to the general public before the present application.
SUMMERY OF THE UTILITY MODEL
An object according to one embodiment is to provide a substrate processing apparatus that can improve a sealing force in a processing space during performing a supercritical processing.
An object according to an embodiment is to provide a substrate processing apparatus that can minimize plastic deformation of a sealing part for sealing a processing space.
A substrate processing apparatus according to one embodiment may include: a processing chamber including a processing space for performing a supercritical processing process on a substrate and an opening surface formed at an outer surface, the processing chamber having an inlet and an outlet communicated with the processing space at the opening surface; a door that opens and closes the doorway and includes a door surface that covers the doorway surface in a state where the doorway is closed; a sealing part which is installed on the entrance and exit surface and seals the space between the entrance and exit surface and the door surface along the periphery of the entrance and exit with the state of closing the entrance and exit as a reference; and a cover portion which is attached to the entrance and exit surface so as to surround the periphery of the sealing portion, and which pressurizes the sealing portion in the door direction in the process of closing the entrance and exit by the door.
The sealing portion includes a contact portion that protrudes in a direction away from the door surface, and the contact portion can bring the end portion into contact with the entrance surface in a state of closing the entrance.
The cover part comprises a pressurizing part which supports the peripheral surface of the sealing part, and the upper surface of the pressurizing part faces the access surface.
The substrate processing apparatus further includes a first elastic member connected to the sealing part, the first elastic member applying an elastic force to the sealing part so as to maintain a relative distance of the contact part with respect to the door surface.
The substrate processing apparatus may further include a second elastic member disposed between the door surface and the cover.
The sealing portion includes: a bottom surface mounted to a door surface; and a side wall including a support portion, a curved portion and a contact portion, wherein the support portion is formed along a circumferential direction of the bottom surface and is protruded in a direction perpendicular to the bottom surface, the curved portion is curved from an end portion of the support portion toward a central axis of the bottom surface, the contact portion is extended from the curved portion in a direction away from the bottom surface, and the contact portion is contactable with the entrance surface in a state where the door closes the entrance.
The cover portion may include: a base portion attached to the door surface along the periphery of the bottom surface; an extension portion protruding from the base portion in one direction so as to be in contact with an outer peripheral surface of the support portion; and a pressing portion extending from an end of the extension portion toward a central axis of the base portion and contacting an outer peripheral surface of the curved portion.
In the process of closing the entrance through the door, the pressurizing part is contacted with the entrance surface and the exit surface, and pressurizes the bending part towards the direction of the bottom surface.
The door is formed with an installation groove forming a step toward the inner side of the door surface, and the bottom surface of the sealing portion and the base portion of the cover portion are attachable to the installation groove.
The substrate processing apparatus further includes a first elastic member disposed on the bottom surface along an inner circumferential surface of the sidewall and applying an elastic force between the bottom surface and the curved portion.
The door further includes a groove formed at a portion of the mounting groove where the base portion is disposed, and a second elastic member disposed at the groove and applying elastic force to the base portion.
In the process of closing the entrance and exit by the door, if the pressurizing part is pressurized by the entrance and exit surface, the second elastic component is compressed and the contact part is pressurized towards the bottom surface, and after the external force is removed, the door returns to the original position by the second elastic component.
The entrance and exit surface is inclined upward toward the outside of the processing chamber, the door surface is formed so as to be inclined downward toward the chamber direction in a manner to engage with the entrance and exit surface in a state where the entrance and exit are closed, and the bottom surface of the sealing portion is arranged so as to be inclined relative to the floor surface in a manner corresponding to the inclination of the door surface.
The substrate processing apparatus further includes: a lifting part which pressurizes the door towards the chamber direction so that the door closes the entrance; and a jig which moves to a jig position surrounding the door and the processing chamber in a state where the door closes the access opening, and fixes a position of the door with respect to the processing chamber, wherein the elevating section is capable of releasing the operation in a state where the jig reaches the clamping position.
The substrate processing apparatus according to one embodiment can improve sealing force in a processing space during performing a supercritical processing process.
The substrate processing apparatus according to one embodiment may minimize plastic deformation of a sealing part for sealing a processing space.
Drawings
The drawings attached to the present specification illustrate a preferred embodiment of the present invention, and together with the detailed description of the present invention, serve to further understand the technical ideas of the present invention, and therefore should not be construed as limiting the present invention to only the items described in the drawings.
Fig. 1 is an exploded cross-sectional view of a substrate processing apparatus according to an embodiment.
Fig. 2 is an assembled sectional view of a substrate processing apparatus according to an embodiment.
FIG. 3 is an enlarged cross-sectional view of a door facing according to one embodiment.
FIG. 4 is a perspective view of a seal according to one embodiment.
Fig. 5 and 6 are diagrams illustrating a process in which a door closes a doorway according to one embodiment.
Description of the reference symbols
100: processing chamber
110: door with a door panel
120: sealing part
130: clamp apparatus
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the drawings. When reference numerals are given to components of respective drawings, it should be noted that the same components are denoted by the same reference numerals as much as possible even if they are denoted by different drawings. In describing the present embodiment, if it is considered that specific description of related known configurations or functions will hinder understanding of the embodiment, detailed description thereof will be omitted.
In addition, in describing the components of the embodiments, terms such as first, second, a, B, (a), (B), and the like may be used. These terms are only used to distinguish one component from another component, and do not limit the nature, order, or steps of the components. When a certain component is described as being "connected," "coupled," or "coupled" to another component, it is to be understood that the component may be directly connected or coupled to the other component, but another component may be "connected," "coupled," or "coupled" between the components.
The components included in one embodiment and the components including a common function are described with the same names in the other embodiment. Unless otherwise stated, the description stated in any one embodiment may be applied to other embodiments as well, and the detailed description is omitted in a range of repetition.
Fig. 1 is an exploded cross-sectional view of a substrate processing apparatus according to an embodiment. Fig. 2 is an assembled sectional view of a substrate processing apparatus according to an embodiment. FIG. 3 is an enlarged cross-sectional view of a door facing according to one embodiment. FIG. 4 is a perspective view of a seal according to one embodiment.
Referring to fig. 1 to 4, the substrate processing apparatus 1 according to one embodiment may perform a process of processing a substrate W, for example, a drying process of drying a cleaning solution on a surface of the substrate W.
Here, the substrate W to be processed by the substrate processing apparatus 1 may be a silicon wafer for a semiconductor device. However, the type of the substrate W is not limited thereto. The substrate W may be a glass type substrate including glass for flat panel display devices (FPDs) such as Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs).
In one embodiment, the substrate processing apparatus 1 may perform a supercritical processing process on the substrate W using a supercritical fluid as a process fluid. A supercritical fluid is a substance that has both gas and liquid properties when reaching a supercritical state exceeding a critical temperature and a critical pressure. The supercritical fluid has the following properties: the supercritical fluid has a molecular density close to that of a liquid and a viscosity close to that of a gas, and thus has such a special property that it has a strong diffusion force, a strong permeation force, and a strong dissolving force, is advantageous for a chemical reaction, and has a characteristic that it does not apply an interfacial tension to the microstructure of the substrate W due to a low surface tension.
The supercritical process is performed by using the characteristics of such a supercritical fluid, and representative examples thereof may include a supercritical drying process and a supercritical etching process. Hereinafter, a case will be described in which the substrate processing apparatus 1 according to one embodiment performs the supercritical drying process on the substrate W. However, this is for convenience of explanation, and the substrate processing apparatus 1 may perform other supercritical processes in addition to the supercritical drying process.
The supercritical drying process may be carried out in the following manner: the supercritical fluid dissolves the organic solvent remaining on the surface of the substrate W, for example, on the circuit pattern formed on the substrate W, and dries the substrate W. The supercritical drying process has advantages in that not only drying efficiency is excellent, but also collapse can be prevented. In addition, of supercritical drying processesThere is an advantage in that particles are prevented from being formed on the surface of the substrate W during the drying process of the substrate W. Although the supercritical fluid used in the supercritical drying process is of various kinds, it may be a substance miscible with an organic solvent, for example, supercritical carbon dioxide (scCO) 2 :supercritical carbon dioxide)。
The substrate processing apparatus 1 according to one embodiment may minimize damage of components occurring during a sealing process and a pressure rising process for a supercritical processing process. For example, the substrate processing apparatus 1 includes the following structures: the sealing part 121 for sealing the processing space 101 in which the supercritical process is performed can be physically prevented from being deformed by the pressure inside the processing space 101, so that fatigue damage due to the deformation of the sealing part 121 can be minimized and the life of the parts can be improved. The substrate processing apparatus 1 according to one embodiment may include a process chamber 100, a door 110, a sealing part 121, a cover part 122, a first elastic member 123, a second elastic member 124, a support member 125, a lifting part, and a clamp 130.
A supercritical processing process may be performed on the substrate W inside the processing chamber 100. A process space 101 for performing a substrate W processing process may be formed inside the process chamber 100. In one embodiment, a mounting part 105 may be provided inside the processing space 101, and the substrate W is mounted to the mounting part 105. The mounting portion 105 may support a lower edge portion of the substrate W in a state where the substrate W is arranged in the processing space 101. In one embodiment, an entrance and exit surface 103 is included, which is formed at an outer surface of the process chamber 100, and an entrance and exit 102 communicating with the process space 101 and through which the substrate W enters and exits may be formed at the entrance and exit surface 103. In one embodiment, the access surface 103 may be formed with an area larger than the access opening 102, and the access opening 102 may be formed at a central portion of the access surface 103.
In one embodiment, the processing chamber 100 may comprise: a supply pipe 1061 for supplying a supercritical fluid to the processing space 101; and an exhaust pipe 1062 for exhausting the used supercritical fluid from the processing space 101. Valves for restricting the flow of the supercritical fluid may be connected to the supply pipe 1061 and the exhaust pipe 1062. The processing space 101 may be in a high pressure and high temperature state during the supercritical processing of the substrate W. In this case, in order to maintain the supercritical state of the supercritical fluid flowing into the inside, the processing space 101 needs to be in a sealed state, for example, the inlet/outlet 102 needs to be in a closed state.
The door 110 is connected to the process chamber 100, and may open and close the door 102 by an opening and closing operation. The door 110 may selectively open or close the doorway 102 according to an operation of an elevating part (not shown) described later. For example, the door 110 is in an open position (for example, fig. 1) so that the entrance 102 is exposed to the outside during the loading and unloading of the substrate W into and from the processing space 101, and is in a closed position (for example, fig. 2) covering the entrance 102 to seal the processing space 101 during the supercritical processing of the substrate W.
In one embodiment, the door 110 may close the doorway 102 in such a manner that the doorway surface 103 is covered by a door surface 113 formed at the outside. Since the door surface 113 is formed in a shape corresponding to the entrance surface 103, the door 110 can be connected to the entrance surface 103 in a snap-fit manner in a state of closing the entrance 102. The door surface 113 may be formed with an installation groove 111 depressed inward in a stepped manner.
In one embodiment, the process chamber 100 and the door 110 may include a shape that is inclined with respect to the floor. In one embodiment, the entrance surface 103 of the processing chamber 100 may be inclined with respect to the floor, for example, inclined upward from the processing space 101 toward the entrance 102 with respect to the floor. In one embodiment, the door surface 113 of the door 110 may include a downwardly sloping configuration, relative to the ground, toward the access surface 103 for engaging the access surface 103. In other words, the entrance and exit surface 103 of the process chamber 100 and the door surface 113 of the door 110 may be formed to have inclinations corresponding to each other. In this case, since the entrance surface 103 and the door surface 113 are connected to each other in a meshing manner, the doors 110 can be brought into close contact with each other while closing the entrance 102.
According to the above-described structure, the door 110 can selectively open and close the entrance 102 only by the lifting operation while maintaining the state in which the door surface 113 is in contact with the entrance surface 103 of the process chamber 100. Therefore, during the opening and closing operation of the door 110, the contact of the access surface 103 and the door surface 113 is kept constant, and therefore the generation of particles due to the opening and closing operation can be minimized. In addition, since the entrance and exit surface 103 of the processing chamber 100 is formed to be inclined downward toward the outside, even if particles are generated due to friction during the opening and closing of the door 110, the generated particles fall down, and thus, the inflow into the processing space 101 through the entrance and exit 102 can be prevented.
In one embodiment, the process chamber 100 and the door 110 may further include a structure for securing a coupled state with each other in a state of enclosing the process space 101. For example, the door 110 may include a protrusion 114 protruding therefrom, and the process chamber 100 may include a recess 104 into which the protrusion 114 is inserted. In this case, the protrusion 114 may comprise at least a portion of the access surface 103, e.g., the upper surface of the access surface 103 may form a portion of the protrusion 114. In this case, since the door 110 can open and close the processing space 101 only by the elevating operation with respect to the processing chamber 100, the door 110 can be structurally prevented from being pushed open in the horizontal direction with respect to the processing chamber 100 even in the case where the pressure inside the processing space 101 increases.
The sealing portion 121 may seal the doorway 102 in a state where the doorway 102 is closed by the door 110. The sealing portion 121 is disposed between the door 110 and the process chamber 100, for example, between the door surface 113 and the entrance surface 103, so as to surround the periphery of the entrance 102 and to seal the entrance 102. The sealing portion 121 may be provided on the door surface 113, and may be provided to be mounted in the mounting groove 111, for example. In one embodiment, seal 121 may include a bottom surface 1211 mounted to door facing 113 and a sidewall formed along a perimeter of bottom surface 1211.
Bottom surface 1211 may be mounted to door facing 113. For example, the bottom 1211 may be mounted to the bottom surface of the mounting groove 111. The bottom surface 1211 may be formed in an elliptical plate shape as shown in fig. 4. However, the form of the bottom surface 1211 is merely an example, and the bottom surface 1211 may be formed in various forms having a plate shape. The bottom 1211 may have a sufficient area to cover the access opening 102 of the processing chamber 100. For example, the bottom surface 1211 may be formed to cover the entire area of the doorway 102, based on a state in which the door 110 closes the doorway 102.
The sidewall may be formed along a circumference of the bottom surface 1211. In this case, the side wall may form a closed loop (closed loop) with reference to a state where the bottom surface 1211 is observed. In a state where the door 110 closes the entrance 102, an end of the side wall may contact the entrance surface 103. In this case, the side wall may surround the periphery of the doorway 102. The bottom 1211 and the side walls may form a sealed space together with the entrance and exit surface 103 in a state where the side walls are in contact with the entrance and exit surface 103. Therefore, the side wall can perform a sealing function in a state where the inlet/outlet 102 is closed by the door 110, so as to prevent the supercritical fluid in the processing space 101 from flowing out through the inlet/outlet 102.
In one embodiment, the sidewall may include a support portion 1212, a curved portion 1213, and a contact portion 1214. The support portion 1212 may protrude in a direction perpendicular to the bottom surface 1211, i.e., the direction of the access surface 103. The bent portion 1213 may be elongated to be bent from the end of the support portion 1212 toward the central axis of the bottom surface 1211. The contact portion 1214 may be elongated from the end of the bent portion 1213 and protrude in a direction away from the bottom surface 1211. In this case, an end of the contact portion 1214 may contact the entrance/exit surface 103 in a state where the entrance/exit 102 is closed.
In one embodiment, the sidewall can maintain the contact state of the contact portion 1214 with respect to the entrance and exit surface 103 during the process of the door 110 closing the processing space 101, i.e., the door surface 113 is pressed to the entrance and exit surface 103. For example, the sidewall can maintain a sealed state with respect to the processing space 101 regardless of a pressurized state of the door 110 with respect to the entrance/exit surface 103 by adjusting an interval between the bottom surface 1211 and the contact portion 1214. In particular, since the bottom surface 1211 is integrally formed, even when the pressure in the processing space 101 is increased, the space 1210 formed by the bottom surface 1211 and the side wall prevents the supercritical fluid from flowing out through the space between the door surface 113 and the entrance and exit surface 103.
The lid portion 122 may support an outer circumferential surface of the sealing portion 121. The lid 122 is attached to the entrance/exit surface 103 so as to surround the periphery of the sealing portion 121, and the sealing portion 121 can be pressed toward the door 110 by the door 110 in the process of closing the entrance/exit 102. In one embodiment, the cover 122 may be formed in a ring shape. The cover 122 may be provided to the mounting groove 111 to surround the outer circumferential surface of the side wall of the sealing part 121. In one embodiment, the cover portion 122 may include a base portion 1221, an extension portion 1222, and a pressing portion 1223.
Base portion 1221 may be disposed on door facing 113 along a perimeter of bottom surface 1211. For example, the base portion 1221 may be installed to contact the bottom surface of the mounting groove 111. The extension 1222 may protrude from the base 1221 in one direction, i.e., in the direction of the entrance/exit surface 103. In this case, the inner circumferential surface of the extension portion 1222 may contact the outer circumferential surface of the support portion 1212. For example, the inner circumferential surface of the extension 1222 may have a cross-sectional shape that engages the outer circumferential surface of the support portion 1212. A pressing portion 1223 may be formed at an end of the extension portion 1222, and the pressing portion 1223 may extend from the end of the extension portion 1222 toward a central axis of the base portion 1221. The pressing portion 1223 may be in contact with an upper surface of the curved portion 1213 toward an outer peripheral surface of the curved portion 1213, i.e., the entrance and exit surface 103. For example, the upper surface of the pressurizing part 1233 may face the entrance surface 103.
In one embodiment, the upper surface of the pressurizing part 1223 may contact the entrance and exit surface 103 during the process of the door 110 closing the entrance and exit 102. The pressing portion 1223 is pressed toward the mounting groove 111 by the entrance/exit surface 103, and the bent portion 1213 in contact with the lower surface can be pressed toward the bottom surface 1211.
In one embodiment, the cover 122 supports the sealing part 121 in a state of being in contact with the outer circumferential surface of the sealing part 121, so that the form of the sealing part 121 can be maintained. In particular, in the process in which the sealing portion 121 is expanded by the pressure in the processing space 101, the sealing portion 121 is effectively prevented from being deformed while being pushed outward.
The first elastic member 123 may be disposed inside the sealing part 121, i.e., in a space formed by the bottom 1211 and the sidewall. The first elastic member 123 may be formed in a ring shape including a hollow, and may be disposed on the bottom surface 1211 in a state of being in contact with an inner circumferential surface of the sidewall. In this case, the first elastic member 123 may be disposed between the bottom surface 1211 and the contact portion 1214 of the sealing portion 121 with reference to the cross section. The first elastic member 123 may apply an elastic force to the sealing portion 121 so as to maintain a relative distance of the contact portion 1214 with respect to the door face 113. The first elastic member 123 applies an elastic force between the bottom surface 1211 and the bent portion 1213, so that the bent portion 1213 may be prevented from being excessively compressed in the direction of the bottom surface 1211, and on the other hand, if the force applied to the bent portion 1213 is removed, an elastic force may be applied in a direction in which the bent portion 1213 is spaced apart from the bottom surface 1211.
The support member 125 may be disposed in an inner space of the sealing part 121 so as to be positioned in a hollow formed by the first elastic member 123. The support member 125 may be formed of a strong material. The support member 125 may play a role of maintaining the position of the first elastic member 123, that is, the arrangement position of the first elastic member 123 with respect to the sealing part 121, during the process of compressing the first elastic member 123. Accordingly, the first elastic member 123 is supported by the support member 125 so as to be positioned between the bottom surface 1211 of the sealing part 121 and the contact part 1214.
The second elastic member 124 may be disposed between the door panel 113 and the cover 122. The second elastic member 124 may be disposed between the base portion 1221 and the mounting groove 111. For example, a ring-shaped groove is formed in the mounting groove 111 for disposing the base 1221, and the second elastic member 124 made of an elastic material may be disposed in the groove. The second elastic member 124 is compressed by the base portion 1221 in the process that the pressing portion 1223 is pressed by the entrance and exit surface 103, and provides an elastic force to push the base portion 1221 when the external force is removed, so that the pressing portion 1223 can be restored to an original position.
The lifter may move the door 110 between the open position and the closed position. For example, the elevating part elevates the door 110 in an elevating direction D1 perpendicular to the ground, thereby selectively opening and closing the doorway 102. In this case, the elevating unit can press the door surface 113 toward the entrance surface 103 to bring the door surface 113 and the entrance surface 103 into close contact with each other in the process of closing the entrance 102.
In a state where the door 110 closes the doorway 102, the clamp 130 moves to a clamping position surrounding the door 110 and the process chamber 100, so that the position of the door 110 with respect to the process chamber 100 may be fixed. The clamp 130 may prevent the door 110 from being pushed out of the closed position when the pressure inside the process chamber 100 increases. When the clamp 130 is moved to the clamping position to fix the closed state of the doorway 102, the operation of the elevating unit, that is, the operation of pressing the door surface 113 in the direction of the doorway surface 103, can be released.
In one embodiment, the jig 130 may be formed in a frame shape forming a hollow 134, wherein the door 110 and a portion of the process chamber 100 combined with each other are inserted into the hollow 134. For example, the clamp 130 can include a lower body 132, an upper body 131, and a side body 133. The lower body 132 may contact the door 110. For example, the lower body 132 may be inserted into a jig insertion groove 115 formed at the door 110. The lower body 132 contacts the lower surface of the door 110 and supports the lower side of the door 110. The upper body 131 is spaced apart from the upper side of the lower body 132, and supports the upper surface of the door 110. The side body 133 may connect both sides of the upper and lower bodies 131 and 132.
Fig. 5 and 6 are diagrams illustrating a process in which the door 110 closes the doorway 102 according to one embodiment.
Referring to fig. 5 and 6, in the process of closing the entrance 102, the door 110 may be pressed toward the entrance surface 103 in a state of being in contact with the entrance surface 103 through the door surface 113. In a state where the door surface 113 is in contact with the entrance/exit surface 103, the contact portion 1214 of the seal portion 121 and the pressing portion 1223 of the cover portion 122 can be in contact with the entrance/exit surface 103 while surrounding the periphery of the entrance/exit 102. As shown in fig. 5, when the door surface 113 is pressed toward the entrance surface 103, the cover 122 can move toward the mounting groove 111 while compressing the second elastic member 124. In this case, the lid 122 is moved in the mounting groove 111 direction, and the curved portion 1213 is pressed in the bottom 1211 direction by the pressing portion 1223. Therefore, the gap G1 between the bent portion 1213 and the bottom surface 1211 may be narrowed. In this case, the first elastic member 123 provides an elastic force between the bent portion 1213 and the bottom surface 1211, so that the contact state of the contact portion 1214 with respect to the entrance and exit surface 103 can be maintained.
In a state where door 110 closes doorway 102, if clamp 130 is moved to the clamping position, the pressing force of door facing 113 against doorway 103 may be released. In this case, the cover 122 is pressed toward the entrance surface 103 by the second elastic member 124, and is returned to the initial position. If the pressing force of the pressing portion 1223 against the bent portion 1213 is reduced, the first elastic member 123 may apply an elastic force in a direction in which the gap G2 between the bottom surface 1211 of the sealing portion 121 and the bent portion 1213 becomes distant, thereby maintaining the contact state of the contact portion 1214 against the entrance and exit surface 103.
With this configuration, even when the pressure in the processing space 101 increases during the supercritical processing, the contact portion 1214 of the seal portion 121 is kept in contact with the entrance/exit surface 103, and therefore the sealed state of the entrance/exit 102 can be kept constant. In particular, since the sealing portion 121 forms a sealed space by the bottom surface 1211 and the side wall and the outer peripheral surface is supported by the lid portion 122, the deformation of the form due to the pressure change can be minimized while securing a sufficient sealing force.
Although the embodiments have been described with reference to a limited number of figures, many modifications and variations are possible in light of the above teaching, as those skilled in the relevant art will recognize. For example, even if the described techniques are executed in a different order from the described method, or the components of the structures, devices, and the like described are combined or combined in a different form from the described method, or replaced or substituted by other components or equivalents, appropriate results can be obtained.

Claims (13)

1. A substrate processing apparatus, comprising:
a processing chamber including a processing space for performing a supercritical processing process on a substrate and an opening surface formed at an outside, an inlet and an outlet communicating with the processing space being located at the opening surface;
a door for opening and closing the entrance and the exit, including a door surface for covering the entrance and the exit surface in a state of closing the entrance and the exit;
a sealing part which is installed on the entrance and exit surface and seals the space between the entrance and exit surface and the door surface along the periphery of the entrance and exit with the closed state of the entrance and exit as a reference; and
and a cover portion which is attached to the entrance and exit surface so as to surround the periphery of the sealing portion and which pressurizes the sealing portion in the door direction in the process of closing the entrance and exit by the door.
2. The substrate processing apparatus according to claim 1,
the sealing portion includes a contact portion projecting in a direction away from the door face,
the contact portion brings the end portion into contact with the entrance surface in a state where the entrance is closed.
3. The substrate processing apparatus according to claim 1,
the cover part comprises a pressurizing part which supports the outer peripheral surface of the sealing part and the upper surface of the pressurizing part faces the access surface,
in the process of closing the doorway through the door,
the pressurizing part contacts with the entrance and exit surface and makes the sealing part move towards the door surface.
4. The substrate processing apparatus according to claim 2,
also comprises a first elastic component which is connected with the sealing part,
the first elastic member applies elastic force to the seal portion so as to maintain a relative distance of the contact portion with respect to the door face.
5. The substrate processing apparatus of claim 1, further comprising:
and a second elastic member disposed between the door surface and the cover.
6. The substrate processing apparatus according to claim 1, wherein the sealing portion comprises:
a bottom surface mounted to a door facing; and
a side wall including a support portion formed along a circumferential direction of the bottom surface and protruding in a direction perpendicular to the bottom surface, a bent portion bent from an end of the support portion toward a central axis of the bottom surface, and a contact portion extended from the bent portion in a direction away from the bottom surface,
the contact portion is in contact with the entrance surface in a state where the door closes the entrance.
7. The substrate processing apparatus according to claim 6, wherein the cover portion comprises:
a base portion attached to the door surface along the periphery of the bottom surface;
an extension portion protruding from the base portion in one direction so as to be in contact with an outer peripheral surface of the support portion; and
and a pressing portion extending from an end of the extension portion toward a center axis of the base portion and contacting an outer peripheral surface of the bending portion.
8. The substrate processing apparatus according to claim 7,
the door is formed with a mounting groove forming a step toward the inner side of the door face, and the bottom face of the sealing portion and the base portion of the cover portion are mounted in the mounting groove.
9. The substrate processing apparatus according to claim 6, further comprising:
and a first elastic member disposed along the inner circumferential surface of the side wall on the bottom surface and applying an elastic force between the bottom surface and the bent portion.
10. The substrate processing apparatus according to claim 8,
the door further includes a groove formed at the mounting groove portion where the base portion is disposed,
and a second elastic member disposed in the groove and applying an elastic force to the base portion.
11. The substrate processing apparatus according to claim 10,
in the process of closing the entrance and exit by the door, if the pressurizing part is pressurized by the entrance and exit surface, the second elastic component is compressed and the contact part is pressurized towards the bottom surface direction, when the external force is removed, the second elastic component returns to the original position.
12. The substrate processing apparatus according to claim 1,
the access surface is upwardly inclined toward the outside of the processing chamber,
the door surface is formed in a manner of engaging with the entrance and exit surface in a state that the entrance and exit are closed and inclined downwards towards the chamber direction,
the bottom surface of the seal portion is disposed obliquely to the floor surface so as to correspond to the inclination of the door surface.
13. The substrate processing apparatus according to claim 1, further comprising:
a lifting part which pressurizes the door towards the direction of the processing chamber so that the door closes the entrance; and
a clamp which moves to a clamping position surrounding the door and the processing chamber in a state that the door closes the access opening, and fixes the position of the door relative to the processing chamber,
the lifting part is released from operation when the clamp reaches the clamping position.
CN202221816524.4U 2021-06-28 2022-06-28 Substrate processing apparatus Active CN218241781U (en)

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Application Number Priority Date Filing Date Title
KR10-2021-0083912 2021-06-28
KR1020210083912A KR20230001246A (en) 2021-06-28 2021-06-28 Substrate processing apparatus

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CN218241781U true CN218241781U (en) 2023-01-06

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