CN111684010A - 一种用于超高压器件的液态浇注树脂组合物 - Google Patents

一种用于超高压器件的液态浇注树脂组合物 Download PDF

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Publication number
CN111684010A
CN111684010A CN201880086418.5A CN201880086418A CN111684010A CN 111684010 A CN111684010 A CN 111684010A CN 201880086418 A CN201880086418 A CN 201880086418A CN 111684010 A CN111684010 A CN 111684010A
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resin composition
liquid casting
casting resin
group
filler
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CN201880086418.5A
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CN111684010B (zh
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邱佳浩
敖洲
郑月仓
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Zhejiang Huafei Electronic Base Material Co ltd
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Zhejiang Huafei Electronic Base Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

本发明涉及一种用于超高压器件的液态浇注树脂组合物，其包括树脂和填料，其中，所述填料为球形硅微粉，所述填料占液态浇注树脂组合物的质量百分比为71％‑80％，所述球形硅微粉的比表面积介于0.4‑2.5m2/g之间，所述球形硅微粉包括表面通过硅烷偶联剂处理的活化球形二氧化硅粉末，所述活化球形二氧化硅粉末在所述球形硅微粉中的质量百分比不低于79％，所述硅烷偶联剂为极性硅烷偶联剂。根据本发明的液态浇注树脂组合物，可以根据被浇注器件中的嵌件的热膨胀系数的不同，设定合适的填料占比，得到特定膨胀系数的树脂组合物，使得浇注完成后的电工器件，如固封极柱，具有优异的耐开裂性能。

Description

PCT国内申请，说明书已公开。

Claims (8)

  1. PCT国内申请，权利要求书已公开。
CN201880086418.5A 2018-12-06 2018-12-06 一种用于超高压器件的液态浇注树脂组合物 Active CN111684010B (zh)

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PCT/CN2018/119501 WO2020113507A1 (zh) 2018-12-06 2018-12-06 一种用于超高压器件的液态浇注树脂组合物

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* Cited by examiner, † Cited by third party
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JPH0770282A (ja) * 1994-05-09 1995-03-14 Hitachi Ltd 半導体封止用エポキシ樹脂組成物
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CN108641645A (zh) * 2018-03-29 2018-10-12 江苏矽时代材料科技有限公司 一种半导体密封用封装胶及其制备方法

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JPH0770282A (ja) * 1994-05-09 1995-03-14 Hitachi Ltd 半導体封止用エポキシ樹脂組成物
JPH0834927A (ja) * 1994-07-22 1996-02-06 Siegel:Kk 封止用樹脂組成物
JP2006016433A (ja) * 2004-06-30 2006-01-19 Shin Etsu Chem Co Ltd 半導体封止用液状エポキシ樹脂組成物及びフリップチップ型半導体装置
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WO2020113507A1 (zh) 2020-06-11

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