CN111655902B - 用于镀层掩模的可固化组合物、掩模材料、和去除镀层的方法 - Google Patents

用于镀层掩模的可固化组合物、掩模材料、和去除镀层的方法 Download PDF

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Publication number
CN111655902B
CN111655902B CN201980010070.6A CN201980010070A CN111655902B CN 111655902 B CN111655902 B CN 111655902B CN 201980010070 A CN201980010070 A CN 201980010070A CN 111655902 B CN111655902 B CN 111655902B
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China
Prior art keywords
plating
monomer
curable composition
mask
plating layer
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CN201980010070.6A
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English (en)
Chinese (zh)
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CN111655902A (zh
Inventor
安达美规
光田健洋
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4476—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications comprising polymerisation in situ
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
CN201980010070.6A 2018-01-29 2019-01-18 用于镀层掩模的可固化组合物、掩模材料、和去除镀层的方法 Active CN111655902B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-012621 2018-01-29
JP2018012621A JP7008517B2 (ja) 2018-01-29 2018-01-29 めっきマスク用硬化性組成物、マスク材及びめっきの除去方法
PCT/IB2019/050434 WO2019145833A1 (en) 2018-01-29 2019-01-18 Curable composition for plating mask, mask material and removing method of plating

Publications (2)

Publication Number Publication Date
CN111655902A CN111655902A (zh) 2020-09-11
CN111655902B true CN111655902B (zh) 2022-09-02

Family

ID=67395253

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980010070.6A Active CN111655902B (zh) 2018-01-29 2019-01-18 用于镀层掩模的可固化组合物、掩模材料、和去除镀层的方法

Country Status (4)

Country Link
JP (1) JP7008517B2 (ja)
CN (1) CN111655902B (ja)
TW (1) TW201934647A (ja)
WO (1) WO2019145833A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256585A (ja) * 1999-03-11 2000-09-19 Toagosei Co Ltd シャドウマスク製造時の裏止め材用硬化性組成物
JP2002333724A (ja) * 2001-05-11 2002-11-22 Asahi Kasei Corp 精密ふるい板の製造方法
JP2005301101A (ja) * 2004-04-15 2005-10-27 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及びその用途
CN101116034A (zh) * 2005-01-17 2008-01-30 东亚合成株式会社 活性能量射线固化型组合物
CN101875797A (zh) * 2009-04-28 2010-11-03 株式会社日立制作所 抗蚀油墨及通过抗蚀油墨的抗蚀图案形成方法
CN106715607A (zh) * 2014-09-29 2017-05-24 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN107429400A (zh) * 2015-03-31 2017-12-01 富士胶片株式会社 被镀覆层形成用组合物、带被镀覆层前体层的膜、带图案状被镀覆层的膜、导电性膜、触控面板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06282069A (ja) * 1993-03-25 1994-10-07 Asahi Chem Ind Co Ltd 厚膜回路用感光性樹脂組成物
JP4530980B2 (ja) * 2005-08-26 2010-08-25 東京応化工業株式会社 膜形成用材料およびパターン形成方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256585A (ja) * 1999-03-11 2000-09-19 Toagosei Co Ltd シャドウマスク製造時の裏止め材用硬化性組成物
JP2002333724A (ja) * 2001-05-11 2002-11-22 Asahi Kasei Corp 精密ふるい板の製造方法
JP2005301101A (ja) * 2004-04-15 2005-10-27 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及びその用途
CN101116034A (zh) * 2005-01-17 2008-01-30 东亚合成株式会社 活性能量射线固化型组合物
CN101875797A (zh) * 2009-04-28 2010-11-03 株式会社日立制作所 抗蚀油墨及通过抗蚀油墨的抗蚀图案形成方法
CN106715607A (zh) * 2014-09-29 2017-05-24 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN107429400A (zh) * 2015-03-31 2017-12-01 富士胶片株式会社 被镀覆层形成用组合物、带被镀覆层前体层的膜、带图案状被镀覆层的膜、导电性膜、触控面板

Also Published As

Publication number Publication date
JP2019131836A (ja) 2019-08-08
WO2019145833A1 (en) 2019-08-01
CN111655902A (zh) 2020-09-11
JP7008517B2 (ja) 2022-01-25
TW201934647A (zh) 2019-09-01

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